JP2018530674A - ウェブ基材処理システム - Google Patents
ウェブ基材処理システム Download PDFInfo
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- JP2018530674A JP2018530674A JP2018515016A JP2018515016A JP2018530674A JP 2018530674 A JP2018530674 A JP 2018530674A JP 2018515016 A JP2018515016 A JP 2018515016A JP 2018515016 A JP2018515016 A JP 2018515016A JP 2018530674 A JP2018530674 A JP 2018530674A
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- Prior art keywords
- web substrate
- rotating drum
- module
- substrate processing
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
- 処理されるウェブ基材(W)が巻き取られるローディングローラー(100)と、
前記ウェブ基材(W)を支持しながら、回転して前記ローディングローラー(100)から巻き出された前記ウェブ基材(W)を搬送するように構成された、少なくとも1つの回転ドラム(200)と、
前記回転ドラム(200)を通って処理された前記ウェブ基材(W)が巻き取られるアンローディングローラー(300)と、
前記回転ドラム(200)の周方向に沿って配置され、前記回転ドラム(200)の外周面で支持されながら回転する前記ウェブ基材(W)を処理する基材処理ユニット(500)と
を備える、ウェブ基材処理システム。 - 前記ローディングローラー(100)、前記アンローディングローラー(300)、および前記回転ドラム(200)のそれぞれが、地面に対して垂直または水平に設けられた回転軸を有する、請求項1に記載のシステム。
- 複数の回転ドラム(200)と、
前記ウェブ基材(W)が前記回転ドラム(200)の外周面と密接している状態を保つように、前記回転ドラム(200)の直径より小さい距離だけ間隔を空けて配置され、前記ローディングローラー(100)または前記アンローディングローラー(300)と前記回転ドラム(200)との間、ならびに前記回転ドラム(200)同士の間に据え付けられる1対の加圧ローラー(460)と
を備える、請求項1に記載のシステム。 - 前記ウェブ基材(W)を取り替えるように構成されたロードロックチャンバ(410)と、
基材処理を実施するように構成されたプロセスチャンバ(420)とを備え、
前記ローディングローラー(100)および前記アンローディングローラー(300)が、前記ロードロックチャンバ(410)内に据え付けられ、前記回転ドラム(200)および前記基材処理ユニット(500)が、前記プロセスチャンバ(420)内に据え付けられる、
請求項1に記載のシステム。 - 前記プロセスチャンバ(420)の気密性を保ちながら前記ウェブ基材(W)が出し入れされ得るように、前記ロードロックチャンバ(410)と前記プロセスチャンバ(420)が、これらの間に設けられた隔壁(450)で互いから隔てられ、前記隔壁が、前記ウェブ基材(W)と密接しながら、前記ウェブ基材(W)が前記ロードロックチャンバ(410)または前記プロセスチャンバ(420)を通過することを可能にするように構成された封止ローラー(440)を含む、請求項1に記載のシステム。
- 前記基材処理ユニット(500)のそれぞれが、スパッタリングプロセス用のスパッターモジュール、原子層堆積プロセス用の原子層堆積モジュール、蒸着堆積プロセス用の蒸着モジュール、単分子層堆積プロセス用の単分子層堆積モジュール、CVDプロセス用のCVDモジュール、およびICPプロセス用のICPモジュールのうちの少なくとも1つを含む、請求項1から5のいずれか一項に記載のシステム。
- 前記基材処理ユニット(500)のそれぞれが、スパッタリングプロセス用の前記スパッターモジュール、原子層堆積プロセス用の前記原子層堆積モジュール、蒸着堆積プロセス用の前記蒸着モジュール、単分子層堆積プロセス用の前記単分子層堆積モジュール、CVDプロセス用の前記CVDモジュール、およびICPプロセス用の前記ICPモジュールのうちの少なくとも2つのモジュールを含み、前記少なくとも2つのモジュールが、前記回転ドラム(200)の前記周方向に沿って配置される、請求項1から5のいずれか一項に記載のシステム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2015/009875 WO2017051935A1 (ko) | 2015-09-21 | 2015-09-21 | 웹기판처리시스템 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018530674A true JP2018530674A (ja) | 2018-10-18 |
Family
ID=58386037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018515016A Pending JP2018530674A (ja) | 2015-09-21 | 2015-09-21 | ウェブ基材処理システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US20190062903A1 (ja) |
JP (1) | JP2018530674A (ja) |
CN (1) | CN108431296A (ja) |
WO (1) | WO2017051935A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58218177A (ja) * | 1982-06-11 | 1983-12-19 | Semiconductor Energy Lab Co Ltd | 半導体装置作製方法 |
JP2006049892A (ja) * | 2004-08-02 | 2006-02-16 | Toray Saehan Inc | 真空蒸着によって金属メッキ層を形成するフレキシブル回路基板用積層構造体の製造方法およびその装置 |
JP2008280569A (ja) * | 2007-05-09 | 2008-11-20 | Toppan Printing Co Ltd | 真空成膜装置、ならびにそれを用いて成膜した積層体 |
JP2009270145A (ja) * | 2008-05-02 | 2009-11-19 | Fujifilm Corp | 成膜装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004197146A (ja) * | 2002-12-17 | 2004-07-15 | Sony Corp | 薄膜形成方法及び薄膜製造装置 |
KR100998057B1 (ko) * | 2008-10-13 | 2010-12-03 | 지 . 텍 (주) | 일체형 롤-투-롤 스퍼터 챔버 |
CN202610319U (zh) * | 2012-04-20 | 2012-12-19 | 北京七星华创电子股份有限公司 | 用于实现原子层沉积工艺的设备 |
KR20130125900A (ko) * | 2012-05-10 | 2013-11-20 | 삼성코닝정밀소재 주식회사 | 롤투롤 스퍼터링 장치 |
KR101686058B1 (ko) * | 2014-03-26 | 2016-12-13 | (주)브이앤아이솔루션 | 웹기판처리시스템 |
-
2015
- 2015-09-21 WO PCT/KR2015/009875 patent/WO2017051935A1/ko active Application Filing
- 2015-09-21 CN CN201580083262.1A patent/CN108431296A/zh active Pending
- 2015-09-21 JP JP2018515016A patent/JP2018530674A/ja active Pending
- 2015-09-21 US US15/761,780 patent/US20190062903A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58218177A (ja) * | 1982-06-11 | 1983-12-19 | Semiconductor Energy Lab Co Ltd | 半導体装置作製方法 |
JP2006049892A (ja) * | 2004-08-02 | 2006-02-16 | Toray Saehan Inc | 真空蒸着によって金属メッキ層を形成するフレキシブル回路基板用積層構造体の製造方法およびその装置 |
JP2008280569A (ja) * | 2007-05-09 | 2008-11-20 | Toppan Printing Co Ltd | 真空成膜装置、ならびにそれを用いて成膜した積層体 |
JP2009270145A (ja) * | 2008-05-02 | 2009-11-19 | Fujifilm Corp | 成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017051935A1 (ko) | 2017-03-30 |
CN108431296A (zh) | 2018-08-21 |
US20190062903A1 (en) | 2019-02-28 |
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