JP2018522743A5 - - Google Patents

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Publication number
JP2018522743A5
JP2018522743A5 JP2017559041A JP2017559041A JP2018522743A5 JP 2018522743 A5 JP2018522743 A5 JP 2018522743A5 JP 2017559041 A JP2017559041 A JP 2017559041A JP 2017559041 A JP2017559041 A JP 2017559041A JP 2018522743 A5 JP2018522743 A5 JP 2018522743A5
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JP
Japan
Prior art keywords
polishing
substrate
polishing pad
major surface
carrier assembly
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Application number
JP2017559041A
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English (en)
Japanese (ja)
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JP2018522743A (ja
JP6789982B2 (ja
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Priority claimed from PCT/US2016/031723 external-priority patent/WO2016183126A1/en
Publication of JP2018522743A publication Critical patent/JP2018522743A/ja
Publication of JP2018522743A5 publication Critical patent/JP2018522743A5/ja
Application granted granted Critical
Publication of JP6789982B2 publication Critical patent/JP6789982B2/ja
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JP2017559041A 2015-05-13 2016-05-11 研磨パッド、並びに当該研磨パッドを使用するためのシステム及び方法 Active JP6789982B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562161022P 2015-05-13 2015-05-13
US62/161,022 2015-05-13
PCT/US2016/031723 WO2016183126A1 (en) 2015-05-13 2016-05-11 Polishing pads and systems for and methods of using same

Publications (3)

Publication Number Publication Date
JP2018522743A JP2018522743A (ja) 2018-08-16
JP2018522743A5 true JP2018522743A5 (es) 2019-06-13
JP6789982B2 JP6789982B2 (ja) 2020-11-25

Family

ID=57248396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017559041A Active JP6789982B2 (ja) 2015-05-13 2016-05-11 研磨パッド、並びに当該研磨パッドを使用するためのシステム及び方法

Country Status (5)

Country Link
US (1) US10556316B2 (es)
JP (1) JP6789982B2 (es)
KR (1) KR20180008555A (es)
CN (1) CN107614200B (es)
WO (1) WO2016183126A1 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
KR20180112004A (ko) * 2016-02-16 2018-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 시스템 및 그의 제조 방법 및 사용 방법
CN106319524A (zh) * 2016-08-27 2017-01-11 宁波市鄞州伴佰精密机械有限公司 不锈钢零件抛光液的制备方法
US20200164484A1 (en) * 2017-08-04 2020-05-28 3M Innovative Properties Company Microreplicated polishing surface with enhanced co-planarity
US20200171619A1 (en) * 2017-08-25 2020-06-04 3M Innovative Properties Company Surface projection polishing pad
CN109749630B (zh) * 2017-11-06 2021-05-25 蓝思科技（长沙）有限公司 一种微米级碳化硼粗磨液、其制备方法及其应用
WO2019164722A1 (en) * 2018-02-20 2019-08-29 Engis Corporation Fixed abrasive three-dimensional lapping and polishing plate and methods of making and using the same
US20200009701A1 (en) * 2018-07-09 2020-01-09 Arizona Board Of Regents On Behalf Of The University Of Arizona Polishing protocol for zirconium diboride based ceramics to be implemented into optical systems
CN109015204B (zh) * 2018-08-29 2020-11-27 包头市利晨科技有限公司 一种适用于cr39树脂镜片的抛光方法
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
CN111775071B (zh) * 2020-07-17 2022-03-15 大连理工大学 一种用于加工硬脆材料的抛光轮及其制备方法
CN112025469B (zh) * 2020-09-10 2022-06-10 西安奕斯伟材料科技有限公司 一种用于角抛光硅片样品的装置、设备及方法
CN114951840B (zh) * 2022-06-02 2023-04-28 西南交通大学 一种齿轮数控化学机械抛光装置及方法
CN115157111B (zh) * 2022-07-13 2024-03-15 安徽禾臣新材料有限公司 一种玻璃加工用抛光垫及其制备方法

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KR20120125612A (ko) * 2009-12-30 2012-11-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 상-분리 중합체 블렌드를 포함하는 폴리싱 패드 및 이의 제조 및 사용 방법
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CN103182687B (zh) * 2011-12-30 2016-03-02 陈炤彰 电场辅助化学机械抛光系统及其方法
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WO2015048011A1 (en) 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads

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