JP2014508650A5 - - Google Patents
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- Publication number
- JP2014508650A5 JP2014508650A5 JP2013551260A JP2013551260A JP2014508650A5 JP 2014508650 A5 JP2014508650 A5 JP 2014508650A5 JP 2013551260 A JP2013551260 A JP 2013551260A JP 2013551260 A JP2013551260 A JP 2013551260A JP 2014508650 A5 JP2014508650 A5 JP 2014508650A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- flexible backing
- replicated microstructure
- abrasive article
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005296 abrasive Methods 0.000 claims 14
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive Effects 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 239000011230 binding agent Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 230000000717 retained Effects 0.000 claims 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161436407P | 2011-01-26 | 2011-01-26 | |
US61/436,407 | 2011-01-26 | ||
PCT/US2012/022142 WO2012102978A1 (en) | 2011-01-26 | 2012-01-23 | Abrasive article with replicated microstructured backing and method of using same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014508650A JP2014508650A (ja) | 2014-04-10 |
JP2014508650A5 true JP2014508650A5 (es) | 2015-02-12 |
Family
ID=45755505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013551260A Pending JP2014508650A (ja) | 2011-01-26 | 2012-01-23 | 複製されたミクロ構造を有する裏材を備える研磨物品、及びこれを使用する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130295821A1 (es) |
JP (1) | JP2014508650A (es) |
KR (1) | KR20140018880A (es) |
CN (1) | CN103328158A (es) |
SG (1) | SG191978A1 (es) |
TW (1) | TW201238716A (es) |
WO (1) | WO2012102978A1 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015100220A1 (en) * | 2013-12-23 | 2015-07-02 | 3M Innovative Properties Company | A coated abrasive article maker apparatus |
CN104369120B (zh) * | 2014-09-15 | 2016-11-09 | 西安德谦新材料科技发展有限公司 | 一种基于磨削单元植入的金刚石或cbn磨具制备方法 |
WO2016085791A1 (en) * | 2014-11-26 | 2016-06-02 | 3M Innovative Properties Company | Abrasive articles, assemblies, and methods with gripping material |
CN104403575B (zh) * | 2014-12-23 | 2016-09-21 | 包头市华辰稀土材料有限公司 | 一种高精度氧化铝抛光粉的制备方法 |
WO2016209651A1 (en) * | 2015-06-22 | 2016-12-29 | 3M Innovative Properties Company | Abrasive articles, assemblies, and methods with gripping material |
CN105500186A (zh) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | 晶片抛光用抛光垫及抛光垫的自吸附方法 |
CN105751090A (zh) * | 2016-04-15 | 2016-07-13 | 常州市金牛研磨有限公司 | 防滑强化砂带 |
US10849660B2 (en) * | 2017-02-21 | 2020-12-01 | Diamabrush Llc | Sanding screen device |
JP7165719B2 (ja) * | 2017-08-04 | 2022-11-04 | スリーエム イノベイティブ プロパティズ カンパニー | 平坦性が向上された微細複製研磨表面 |
TWI674947B (zh) * | 2018-04-19 | 2019-10-21 | 智勝科技股份有限公司 | 研磨墊、研磨墊的製造方法及研磨方法 |
CN108747876B (zh) * | 2018-06-11 | 2021-03-19 | 河北思瑞恩新材料科技有限公司 | 一种漆面研磨砂碟的制备方法 |
US10954803B2 (en) * | 2019-01-17 | 2021-03-23 | Rolls-Royce Corporation | Abrasive coating for high temperature mechanical systems |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318083A (en) * | 1976-08-04 | 1978-02-18 | Sankyo Rikagaku Co | Grinding instruments of multiilayer structure |
US4629473A (en) * | 1985-06-26 | 1986-12-16 | Norton Company | Resilient abrasive polishing product |
US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
CA2113318A1 (en) * | 1993-01-28 | 1994-07-29 | Robert J. Jantschek | Abrasive attachment system for rotative abrading applications |
US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
DE60022099T2 (de) * | 2000-04-28 | 2006-06-01 | 3M Innovative Properties Co., Saint Paul | Schleifmittel und verfahren zum schleifen von glas |
US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
US6838142B2 (en) * | 2001-05-18 | 2005-01-04 | 3M Innovative Properties Company | Specular laminates |
US6846232B2 (en) * | 2001-12-28 | 2005-01-25 | 3M Innovative Properties Company | Backing and abrasive product made with the backing and method of making and using the backing and abrasive product |
CN1411038A (zh) * | 2002-05-30 | 2003-04-16 | 株式会社日立制作所 | 抛光方法和设备 |
US6755878B2 (en) * | 2002-08-02 | 2004-06-29 | 3M Innovative Properties Company | Abrasive articles and methods of making and using the same |
WO2008079708A1 (en) * | 2006-12-20 | 2008-07-03 | 3M Innovative Properties Company | Coated abrasive disc and method of making the same |
EP2101952B1 (en) * | 2006-12-21 | 2013-02-13 | Saint-Gobain Abrasives, Inc. | Abrasive article with cured backsize layer |
US20100022174A1 (en) * | 2008-07-28 | 2010-01-28 | Kinik Company | Grinding tool and method for fabricating the same |
-
2012
- 2012-01-23 KR KR1020137022016A patent/KR20140018880A/ko not_active Application Discontinuation
- 2012-01-23 US US13/979,233 patent/US20130295821A1/en not_active Abandoned
- 2012-01-23 WO PCT/US2012/022142 patent/WO2012102978A1/en active Application Filing
- 2012-01-23 CN CN2012800056627A patent/CN103328158A/zh active Pending
- 2012-01-23 JP JP2013551260A patent/JP2014508650A/ja active Pending
- 2012-01-23 SG SG2013054051A patent/SG191978A1/en unknown
- 2012-01-30 TW TW101102916A patent/TW201238716A/zh unknown
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