JP2018517237A - パターニングされた透明導電膜及び透明導電膜の製造方法 - Google Patents

パターニングされた透明導電膜及び透明導電膜の製造方法 Download PDF

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Publication number
JP2018517237A
JP2018517237A JP2017554261A JP2017554261A JP2018517237A JP 2018517237 A JP2018517237 A JP 2018517237A JP 2017554261 A JP2017554261 A JP 2017554261A JP 2017554261 A JP2017554261 A JP 2017554261A JP 2018517237 A JP2018517237 A JP 2018517237A
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Japan
Prior art keywords
region
layer
ink
transparent conductive
electrically conductive
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Pending
Application number
JP2017554261A
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English (en)
Japanese (ja)
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JP2018517237A5 (enExample
Inventor
レイチェル チャン，ルーイ
レイチェル チャン，ルーイ
カナリアン，ガロ
ディーチュ，ハーフェ
エー． グリゴレンコ，ニコライ
エー． グリゴレンコ，ニコライ
エンガー，オリフィアー
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BASF SE
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BASF SE
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Application filed by BASF SE filed Critical BASF SE
Publication of JP2018517237A publication Critical patent/JP2018517237A/ja
Publication of JP2018517237A5 publication Critical patent/JP2018517237A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/14—Printing inks based on carbohydrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Laminated Bodies (AREA)
JP2017554261A 2015-04-16 2016-04-14 パターニングされた透明導電膜及び透明導電膜の製造方法 Pending JP2018517237A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562148207P 2015-04-16 2015-04-16
US62/148,207 2015-04-16
PCT/EP2016/058180 WO2016166190A1 (en) 2015-04-16 2016-04-14 Process for producing a patterned transparent conductive film and a transparent conductive film

Publications (2)

Publication Number Publication Date
JP2018517237A true JP2018517237A (ja) 2018-06-28
JP2018517237A5 JP2018517237A5 (enExample) 2019-05-16

Family

ID=55910918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017554261A Pending JP2018517237A (ja) 2015-04-16 2016-04-14 パターニングされた透明導電膜及び透明導電膜の製造方法

Country Status (5)

Country Link
US (1) US10800940B2 (enExample)
JP (1) JP2018517237A (enExample)
KR (1) KR20170137796A (enExample)
TW (1) TWI719976B (enExample)
WO (1) WO2016166190A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7005809B1 (ja) 2021-06-30 2022-01-24 東京インキ株式会社 抗菌オーバープリントニス、抗菌印刷物、および抗菌印刷物の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020038641A1 (en) 2018-08-20 2020-02-27 Basf Se Transparent electroconductive films and ink for production thereof
KR102461794B1 (ko) * 2020-08-13 2022-11-02 한국과학기술연구원 은 나노와이어 메쉬 전극 및 이의 제조방법
KR20220161883A (ko) * 2021-05-31 2022-12-07 솔브레인 주식회사 투명한 니켈 착화합물 잉크 조성물 및 이의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090068241A1 (en) * 2006-09-15 2009-03-12 David Alexander Britz Deposition of metals onto nanotube transparent conductors
US20140004371A1 (en) * 2011-01-26 2014-01-02 Inktec Co., Ltd. Method of Manufacturing a Transparent Conductive Layer and Transparent Conductive Layer Manufactured by Same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569331B2 (en) 2005-06-01 2009-08-04 Hewlett-Packard Development Company, L.P. Conductive patterning
US7645497B2 (en) * 2005-06-02 2010-01-12 Eastman Kodak Company Multi-layer conductor with carbon nanotubes
EP1965438A3 (en) 2005-08-12 2009-05-13 Cambrios Technologies Corporation Nanowires-based transparent conductors
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
JP5664119B2 (ja) 2010-10-25 2015-02-04 ソニー株式会社 透明導電膜、透明導電膜の製造方法、光電変換装置および電子機器
KR20140109965A (ko) 2011-12-21 2014-09-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090068241A1 (en) * 2006-09-15 2009-03-12 David Alexander Britz Deposition of metals onto nanotube transparent conductors
US20140004371A1 (en) * 2011-01-26 2014-01-02 Inktec Co., Ltd. Method of Manufacturing a Transparent Conductive Layer and Transparent Conductive Layer Manufactured by Same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7005809B1 (ja) 2021-06-30 2022-01-24 東京インキ株式会社 抗菌オーバープリントニス、抗菌印刷物、および抗菌印刷物の製造方法
JP2023006814A (ja) * 2021-06-30 2023-01-18 東京インキ株式会社 抗菌オーバープリントニス、抗菌印刷物、および抗菌印刷物の製造方法

Also Published As

Publication number Publication date
TW201704380A (zh) 2017-02-01
TWI719976B (zh) 2021-03-01
KR20170137796A (ko) 2017-12-13
WO2016166190A1 (en) 2016-10-20
US20180134908A1 (en) 2018-05-17
US10800940B2 (en) 2020-10-13

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