JP2018509747A5 - - Google Patents

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Publication number
JP2018509747A5
JP2018509747A5 JP2017521584A JP2017521584A JP2018509747A5 JP 2018509747 A5 JP2018509747 A5 JP 2018509747A5 JP 2017521584 A JP2017521584 A JP 2017521584A JP 2017521584 A JP2017521584 A JP 2017521584A JP 2018509747 A5 JP2018509747 A5 JP 2018509747A5
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JP
Japan
Prior art keywords
injection
conductor traces
intermediate structure
solution
predefined locations
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JP2017521584A
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English (en)
Japanese (ja)
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JP2018509747A (ja
JP6505220B2 (ja
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Priority claimed from PCT/US2015/057114 external-priority patent/WO2016065260A1/en
Publication of JP2018509747A publication Critical patent/JP2018509747A/ja
Publication of JP2018509747A5 publication Critical patent/JP2018509747A5/ja
Application granted granted Critical
Publication of JP6505220B2 publication Critical patent/JP6505220B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017521584A 2014-10-23 2015-10-23 ３次元製造構造のための構造内導体トレースおよびインターコネクトの製作 Expired - Fee Related JP6505220B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462067674P 2014-10-23 2014-10-23
US62/067,674 2014-10-23
PCT/US2015/057114 WO2016065260A1 (en) 2014-10-23 2015-10-23 Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

Publications (3)

Publication Number Publication Date
JP2018509747A JP2018509747A (ja) 2018-04-05
JP2018509747A5 true JP2018509747A5 (https=) 2018-09-06
JP6505220B2 JP6505220B2 (ja) 2019-04-24

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ID=55761628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017521584A Expired - Fee Related JP6505220B2 (ja) 2014-10-23 2015-10-23 ３次元製造構造のための構造内導体トレースおよびインターコネクトの製作

Country Status (11)

Country Link
US (1) US10039195B2 (https=)
EP (1) EP3209488B1 (https=)
JP (1) JP6505220B2 (https=)
KR (1) KR101988874B1 (https=)
CN (1) CN107107492B (https=)
AU (1) AU2015335727B2 (https=)
BR (1) BR112017008391A2 (https=)
CA (1) CA2965190A1 (https=)
IL (1) IL251758A0 (https=)
MX (1) MX365712B (https=)
WO (1) WO2016065260A1 (https=)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156205B2 (en) * 2013-03-22 2015-10-13 Markforged, Inc. Three dimensional printer with composite filament fabrication
US9579851B2 (en) 2013-03-22 2017-02-28 Markforged, Inc. Apparatus for fiber reinforced additive manufacturing
US9688028B2 (en) 2013-03-22 2017-06-27 Markforged, Inc. Multilayer fiber reinforcement design for 3D printing
US10682844B2 (en) 2013-03-22 2020-06-16 Markforged, Inc. Embedding 3D printed fiber reinforcement in molded articles
US10953609B1 (en) 2013-03-22 2021-03-23 Markforged, Inc. Scanning print bed and part height in 3D printing
US9186846B1 (en) 2013-03-22 2015-11-17 Markforged, Inc. Methods for composite filament threading in three dimensional printing
US9694544B2 (en) 2013-03-22 2017-07-04 Markforged, Inc. Methods for fiber reinforced additive manufacturing
US11237542B2 (en) 2013-03-22 2022-02-01 Markforged, Inc. Composite filament 3D printing using complementary reinforcement formations
US9126365B1 (en) 2013-03-22 2015-09-08 Markforged, Inc. Methods for composite filament fabrication in three dimensional printing
US9186848B2 (en) 2013-03-22 2015-11-17 Markforged, Inc. Three dimensional printing of composite reinforced structures
US11981069B2 (en) 2013-03-22 2024-05-14 Markforged, Inc. Three dimensional printing of composite reinforced structures
CA3121870A1 (en) 2013-03-22 2014-09-25 Markforged, Inc. Three dimensional printing
US9815268B2 (en) 2013-03-22 2017-11-14 Markforged, Inc. Multiaxis fiber reinforcement for 3D printing
US9149988B2 (en) 2013-03-22 2015-10-06 Markforged, Inc. Three dimensional printing
CN107953572A (zh) 2013-06-05 2018-04-24 马克弗巨德有限公司 用于纤维增强添加制造的方法
US20170072640A1 (en) * 2015-09-11 2017-03-16 Caterpillar Inc. 3D Printing Portal for Crowd-Sourced Designs
WO2017074397A1 (en) * 2015-10-29 2017-05-04 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3d) printed electronics
HUE058865T2 (hu) * 2016-05-24 2022-09-28 Divergent Tech Inc Rendszerek és módszerek az adalékanyagok
WO2018017096A1 (en) * 2016-07-21 2018-01-25 Hewlett-Packard Development Company, L.P. Additively formed 3d object with conductive channel
US20190232552A1 (en) * 2016-10-24 2019-08-01 Signify Holding B.V. 3d printing method and product
US10457033B2 (en) 2016-11-07 2019-10-29 The Boeing Company Systems and methods for additively manufacturing composite parts
US11440261B2 (en) 2016-11-08 2022-09-13 The Boeing Company Systems and methods for thermal control of additive manufacturing
US10766241B2 (en) 2016-11-18 2020-09-08 The Boeing Company Systems and methods for additive manufacturing
US10843452B2 (en) * 2016-12-01 2020-11-24 The Boeing Company Systems and methods for cure control of additive manufacturing
US10135159B1 (en) 2017-05-22 2018-11-20 Rosemount Aerospace Inc. Board-to-board connectors and mounting structure
WO2019117967A1 (en) 2017-12-15 2019-06-20 Hewlett-Packard Development Company, L.P. Three-dimensional printing
US11267981B2 (en) * 2018-04-03 2022-03-08 Massachusetts Institute Of Technology 3-D printed devices formed with conductive inks and method of making
EP3562285A1 (de) * 2018-04-25 2019-10-30 Siemens Aktiengesellschaft Verbinden elektrischer bauelemente
CN110843206A (zh) * 2018-07-25 2020-02-28 中国科学院金属研究所 一种三维电子器件的制备方法和应用
US11426818B2 (en) 2018-08-10 2022-08-30 The Research Foundation for the State University Additive manufacturing processes and additively manufactured products
CN109618487B (zh) * 2019-01-22 2022-07-29 张雯蕾 带有内埋电路的立体基件及其制备方法
KR102179070B1 (ko) * 2019-04-10 2020-11-16 서울대학교 산학협력단 줄열 직접 가열을 이용한 전도성 섬유 복합재의 선택적 가열 경화 방법 및 이를 위한 장치
EP3962715A4 (en) 2019-04-29 2022-12-07 Hewlett-Packard Development Company, L.P. THREE-DIMENSIONAL PRINCIPAL PRESSURE ELEMENTS
WO2020227093A1 (en) 2019-05-06 2020-11-12 Massachusetts Institute Of Technology 3-d printed devices formed with magnetic inks and methods of making graded index structures
US12409496B2 (en) 2022-04-27 2025-09-09 The Boeing Company Pre-heating methods for performing electron beam powder bed fusion
US12485621B2 (en) 2022-08-25 2025-12-02 The Boeing Company Methods of additively manufacturing a manufactured component and systems that perform the methods
US12343933B2 (en) 2022-08-25 2025-07-01 The Boeing Company Methods of additively manufacturing a manufactured component and systems that perform the methods
US20250280500A1 (en) * 2024-03-01 2025-09-04 PCB Automation Inc. Methods and systems for configuring conductive paths in a printed circuit board assembly (pcba) for enhanced power distribution

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1834123A (en) * 1930-06-25 1931-12-01 Anstenal Lab Inc Method of making swaged denture-bases and dies for the same
JPS61145889A (ja) * 1984-12-19 1986-07-03 アロン化成株式会社 プリント基板の製造方法
US6100178A (en) 1997-02-28 2000-08-08 Ford Motor Company Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
JP2001156414A (ja) * 1999-11-30 2001-06-08 Yazaki Corp 導電性ペースト及び回路形成方法
TW507514B (en) 2000-11-27 2002-10-21 Matsushita Electric Works Ltd Multilayer circuit board and method of manufacturing the same
US6784656B2 (en) * 2001-08-30 2004-08-31 Teradyne, Inc. Hybrid conductor-board for multi-conductor routing
KR20050058404A (ko) * 2002-08-20 2005-06-16 익스트루드 혼 코포레이션 주조 공정 및 이를 수행하기 위한 물품
EP1897426A2 (en) 2005-05-18 2008-03-12 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
JP4744200B2 (ja) * 2005-06-20 2011-08-10 シーメット株式会社 平滑化した造形端面を有する立体造形物
US7520740B2 (en) 2005-09-30 2009-04-21 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7516437B1 (en) 2006-07-20 2009-04-07 Xilinx, Inc. Skew-driven routing for networks
DE102006037927A1 (de) * 2006-08-11 2008-02-14 Karl Hehl Verfahren und Vorrichtung zur Herstellung eines dreidimensionalen Gegenstandes sowie Verwendung einer kunststofftechnischen Einheit zu dessen Herstellung
CN101952196A (zh) * 2008-02-20 2011-01-19 新加坡科技研究局 制造具有嵌入金属化的多层衬底的方法
CN102982716B (zh) * 2008-03-28 2015-01-21 泰尔茂株式会社 生物体组织立体模型及其制造方法
US8033014B2 (en) 2008-07-07 2011-10-11 Unimicron Technology Corp. Method of making a molded interconnect device
US8770260B2 (en) * 2008-07-09 2014-07-08 Borg Warner Inc. Method for rapid generation of multiple investment cast parts such as turbine or compressor wheels
US8298914B2 (en) 2008-08-19 2012-10-30 International Business Machines Corporation 3D integrated circuit device fabrication using interface wafer as permanent carrier
TWI394506B (zh) 2008-10-13 2013-04-21 Unimicron Technology Corp 多層立體線路的結構及其製作方法
JP2012028545A (ja) * 2010-07-23 2012-02-09 Ngk Spark Plug Co Ltd 配線基板の製造方法
US20120065755A1 (en) 2010-08-13 2012-03-15 Sensable Technologies, Inc. Fabrication of non-homogeneous articles via additive manufacturing using three-dimensional voxel-based models
US8668859B2 (en) 2010-08-18 2014-03-11 Makerbot Industries, Llc Automated 3D build processes
US8916085B2 (en) * 2011-06-02 2014-12-23 A. Raymond Et Cie Process of making a component with a passageway
US10518490B2 (en) * 2013-03-14 2019-12-31 Board Of Regents, The University Of Texas System Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices
US9308726B2 (en) * 2012-02-16 2016-04-12 Xerox Corporation Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes
US20150077215A1 (en) * 2012-04-26 2015-03-19 Northeastern University Device and Method to Additively Fabricate Structures Containing Embedded Electronics or Sensors
US9026962B2 (en) 2012-05-30 2015-05-05 Gumstix, Inc. Integrated electronic design automation system
CN103568323A (zh) * 2012-08-09 2014-02-12 上海科斗电子科技有限公司 光固化三维打印机及其打印方法
US8816513B2 (en) 2012-08-22 2014-08-26 Texas Instruments Incorporated Electronic assembly with three dimensional inkjet printed traces
US9216544B2 (en) 2012-12-21 2015-12-22 Stratasys, Inc. Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof
DE102013203936A1 (de) * 2013-03-07 2014-09-11 Airbus Operations Gmbh Generatives Schichtaufbauverfahren zur Herstellung eines dreidimensionalen Objekts und dreidimensionales Objekt
US9406969B2 (en) 2013-03-15 2016-08-02 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form three-dimensional biocompatible energization elements
CN103495734B (zh) * 2013-09-03 2015-07-22 广州中国科学院先进技术研究所 一种基于3d打印技术具有环形水路的冷却装置
WO2015077262A1 (en) * 2013-11-19 2015-05-28 Guill Tool & Engineering Coextruded, multilayered and multicomponent 3d printing inputs
JP2017515678A (ja) 2014-02-20 2017-06-15 ディーエムジー モリ アドバンスト ソリューションズ デベロップメントＤｍｇ Ｍｏｒｉ Ａｄｖａｎｃｅｄ Ｓｏｌｕｔｉｏｎｓ Ｄｅｖｅｌｏｐｍｅｎｔ ハイブリッド付加・除去加工センタの処理ヘッド
CN103847102B (zh) * 2014-03-05 2017-01-18 大连理工大学 一种覆膜粉末材料激光壳型失效快速成型方法
JP6298343B2 (ja) * 2014-04-01 2018-03-20 日本特殊陶業株式会社 配線基板の製造方法

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