JP2018509747A5 - - Google Patents

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Publication number
JP2018509747A5
JP2018509747A5 JP2017521584A JP2017521584A JP2018509747A5 JP 2018509747 A5 JP2018509747 A5 JP 2018509747A5 JP 2017521584 A JP2017521584 A JP 2017521584A JP 2017521584 A JP2017521584 A JP 2017521584A JP 2018509747 A5 JP2018509747 A5 JP 2018509747A5
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JP
Japan
Prior art keywords
injection
conductor traces
intermediate structure
solution
predefined locations
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JP2017521584A
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English (en)
Japanese (ja)
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JP6505220B2 (ja
JP2018509747A (ja
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Priority claimed from PCT/US2015/057114 external-priority patent/WO2016065260A1/en
Publication of JP2018509747A publication Critical patent/JP2018509747A/ja
Publication of JP2018509747A5 publication Critical patent/JP2018509747A5/ja
Application granted granted Critical
Publication of JP6505220B2 publication Critical patent/JP6505220B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017521584A 2014-10-23 2015-10-23 ３次元製造構造のための構造内導体トレースおよびインターコネクトの製作 Expired - Fee Related JP6505220B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462067674P 2014-10-23 2014-10-23
US62/067,674 2014-10-23
PCT/US2015/057114 WO2016065260A1 (en) 2014-10-23 2015-10-23 Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

Publications (3)

Publication Number Publication Date
JP2018509747A JP2018509747A (ja) 2018-04-05
JP2018509747A5 true JP2018509747A5 (enExample) 2018-09-06
JP6505220B2 JP6505220B2 (ja) 2019-04-24

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Family Applications (1)

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JP2017521584A Expired - Fee Related JP6505220B2 (ja) 2014-10-23 2015-10-23 ３次元製造構造のための構造内導体トレースおよびインターコネクトの製作

Country Status (11)

Country Link
US (1) US10039195B2 (enExample)
EP (1) EP3209488B1 (enExample)
JP (1) JP6505220B2 (enExample)
KR (1) KR101988874B1 (enExample)
CN (1) CN107107492B (enExample)
AU (1) AU2015335727B2 (enExample)
BR (1) BR112017008391A2 (enExample)
CA (1) CA2965190A1 (enExample)
IL (1) IL251758A0 (enExample)
MX (1) MX365712B (enExample)
WO (1) WO2016065260A1 (enExample)

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US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
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KR102179070B1 (ko) * 2019-04-10 2020-11-16 서울대학교 산학협력단 줄열 직접 가열을 이용한 전도성 섬유 복합재의 선택적 가열 경화 방법 및 이를 위한 장치
EP3962715A4 (en) 2019-04-29 2022-12-07 Hewlett-Packard Development Company, L.P. Three-dimensional printing conductive elements
WO2020227093A1 (en) 2019-05-06 2020-11-12 Massachusetts Institute Of Technology 3-d printed devices formed with magnetic inks and methods of making graded index structures
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