JP2018508871A5 - - Google Patents

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Publication number
JP2018508871A5
JP2018508871A5 JP2017537486A JP2017537486A JP2018508871A5 JP 2018508871 A5 JP2018508871 A5 JP 2018508871A5 JP 2017537486 A JP2017537486 A JP 2017537486A JP 2017537486 A JP2017537486 A JP 2017537486A JP 2018508871 A5 JP2018508871 A5 JP 2018508871A5
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JP
Japan
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phy
signal
general purpose
memory
phys
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JP2017537486A
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Japanese (ja)
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JP2018508871A (ja
JP6710689B2 (ja
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Priority claimed from US14/598,528 external-priority patent/US9324397B1/en
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JP2017537486A 2015-01-16 2016-01-07 最小限のパッケージングの複雑性で異なる外部メモリタイプをサポートするための共通のダイ Active JP6710689B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/598,528 US9324397B1 (en) 2015-01-16 2015-01-16 Common die for supporting different external memory types with minimal packaging complexity
US14/598,528 2015-01-16
PCT/US2016/012511 WO2016114975A1 (en) 2015-01-16 2016-01-07 A common die for supporting different external memory types with minimal packaging complexity

Publications (3)

Publication Number Publication Date
JP2018508871A JP2018508871A (ja) 2018-03-29
JP2018508871A5 true JP2018508871A5 (enExample) 2019-01-24
JP6710689B2 JP6710689B2 (ja) 2020-06-17

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ID=55272647

Family Applications (1)

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JP2017537486A Active JP6710689B2 (ja) 2015-01-16 2016-01-07 最小限のパッケージングの複雑性で異なる外部メモリタイプをサポートするための共通のダイ

Country Status (5)

Country Link
US (1) US9324397B1 (enExample)
EP (1) EP3245594A1 (enExample)
JP (1) JP6710689B2 (enExample)
CN (1) CN107209735B (enExample)
WO (1) WO2016114975A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543129B2 (ja) 2015-07-29 2019-07-10 ルネサスエレクトロニクス株式会社 電子装置
US11468925B2 (en) 2018-12-03 2022-10-11 Rambus Inc. DRAM interface mode with improved channel integrity and efficiency at high signaling rates
US10671551B1 (en) * 2019-02-20 2020-06-02 Intel Corporation Selective data lane interface mapping
US11288222B1 (en) 2020-09-28 2022-03-29 Xilinx, Inc. Multi-die integrated circuit with data processing engine array
KR20240157385A (ko) 2023-04-25 2024-11-01 삼성전자주식회사 메모리 장치 및 이를 포함하는 전자 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6460120B1 (en) * 1999-08-27 2002-10-01 International Business Machines Corporation Network processor, memory organization and methods
CN101702947B (zh) * 2007-04-12 2017-02-15 拉姆伯斯公司 具有点对点请求互连的存储器系统、存储器控制器及方法
US8356138B1 (en) * 2007-08-20 2013-01-15 Xilinx, Inc. Methods for implementing programmable memory controller for distributed DRAM system-in-package (SiP)
EP2529312A4 (en) * 2010-01-28 2013-07-03 Hewlett Packard Development Co INTERFACE METHOD AND DEVICE FOR MEMORY DEVICES
US20130194881A1 (en) * 2010-11-09 2013-08-01 Steven C. Woo Area-efficient multi-modal signaling interface
US20120185663A1 (en) 2011-01-14 2012-07-19 Satoshi Yokoya Memory Interface Converter
US8446903B1 (en) 2012-05-22 2013-05-21 Intel Corporation Providing a load/store communication protocol with a low power physical unit
US8972640B2 (en) 2012-06-27 2015-03-03 Intel Corporation Controlling a physical link of a first protocol using an extended capability structure of a second protocol
US9697111B2 (en) 2012-08-02 2017-07-04 Samsung Electronics Co., Ltd. Method of managing dynamic memory reallocation and device performing the method
US8680900B2 (en) * 2012-08-10 2014-03-25 Arm Limited Self-initializing on-chip data processing apparatus and method of self-initializing an on-chip data processing apparatus
CN102929828B (zh) * 2012-10-18 2016-01-06 广东欧珀移动通信有限公司 同时支持标准和非标准i2c接口的数据传输方法及装置
WO2014133527A1 (en) 2013-02-28 2014-09-04 Intel Corporation Leveraging an enumeration and/or configuration mechanism of one interconnect protocol for a different interconnect protocol
KR102029682B1 (ko) * 2013-03-15 2019-10-08 삼성전자주식회사 반도체 장치 및 반도체 패키지
US9123408B2 (en) * 2013-05-24 2015-09-01 Qualcomm Incorporated Low latency synchronization scheme for mesochronous DDR system
US9430434B2 (en) * 2013-09-20 2016-08-30 Qualcomm Incorporated System and method for conserving memory power using dynamic memory I/O resizing

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