JP2018501654A5 - - Google Patents

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Publication number
JP2018501654A5
JP2018501654A5 JP2017531335A JP2017531335A JP2018501654A5 JP 2018501654 A5 JP2018501654 A5 JP 2018501654A5 JP 2017531335 A JP2017531335 A JP 2017531335A JP 2017531335 A JP2017531335 A JP 2017531335A JP 2018501654 A5 JP2018501654 A5 JP 2018501654A5
Authority
JP
Japan
Prior art keywords
component
detection component
detection
position indicator
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2017531335A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018501654A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/069557 external-priority patent/WO2016093824A1/en
Publication of JP2018501654A publication Critical patent/JP2018501654A/ja
Publication of JP2018501654A5 publication Critical patent/JP2018501654A5/ja
Ceased legal-status Critical Current

Links

JP2017531335A 2014-12-10 2014-12-10 スピンチャックからのウェハ脱落の検出 Ceased JP2018501654A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/069557 WO2016093824A1 (en) 2014-12-10 2014-12-10 Detection of lost wafer from spinning chuck

Publications (2)

Publication Number Publication Date
JP2018501654A JP2018501654A (ja) 2018-01-18
JP2018501654A5 true JP2018501654A5 (cg-RX-API-DMAC7.html) 2019-09-26

Family

ID=56107842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017531335A Ceased JP2018501654A (ja) 2014-12-10 2014-12-10 スピンチャックからのウェハ脱落の検出

Country Status (4)

Country Link
JP (1) JP2018501654A (cg-RX-API-DMAC7.html)
KR (1) KR20170093949A (cg-RX-API-DMAC7.html)
CN (1) CN107112257A (cg-RX-API-DMAC7.html)
WO (1) WO2016093824A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7756571B2 (ja) * 2022-01-19 2025-10-20 株式会社荏原製作所 プッシャ、搬送装置、および基板処理装置
CN115458471B (zh) * 2022-08-31 2024-07-23 北京北方华创微电子装备有限公司 卡盘装置及监测晶圆状态的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
JP2529637Y2 (ja) * 1991-08-30 1997-03-19 大日本スクリーン製造株式会社 基板の回転保持装置
DE4237928C2 (de) * 1992-07-09 1995-01-19 Siemens Ag Mikroschalter mit einem Magnetfeld-Sensor
US6459382B1 (en) * 2001-04-26 2002-10-01 Applied Materials, Inc. Over clamp sensor
US6670807B2 (en) * 2002-01-16 2003-12-30 Applied Materials, Inc. Proximity sensor detecting loss of magnetic field complete
KR100460807B1 (ko) * 2002-07-08 2004-12-09 삼성전자주식회사 반도체소자 제조설비의 웨이퍼 외관 검사장치와 이를이용하는 세정설비 및 그 검사방법
JP5379533B2 (ja) * 2009-03-27 2013-12-25 大日本スクリーン製造株式会社 基板保持機構、およびこの基板保持機構を備える基板処理装置
JP5646528B2 (ja) * 2012-03-09 2014-12-24 東京エレクトロン株式会社 液処理装置
CN102867771B (zh) * 2012-09-18 2015-08-05 北京七星华创电子股份有限公司 具有监测半导体晶片状态功能的夹持装置和方法
US9255894B2 (en) * 2012-11-09 2016-02-09 Kla-Tencor Corporation System and method for detecting cracks in a wafer

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