JP2018204283A - Demolition method of pcb treatment facilities - Google Patents

Abstract

To provide a demolition method of PCB treatment facilities capable of securely performing demolition in a controlled area without causing PCB to flow out.SOLUTION: The present invention relates to a demolition method for PCB treatment facilities X having a first area L3 contaminated with PCB, and a second area L2 partitioned off with walls or a ceiling WL from the first area L3 and having higher PCB concentration than the first area L3. The demolition method comprises: a first pressure adjusting step of adjusting pressure to first pressure while supplying and discharging air to and from the first area L3; a second pressure adjusting step of adjusting pressure to second pressure higher than the first pressure while supplying and discharging air to and from the second area L2; and a boring step of boring the walls or the ceiling WL so as to form opening parts 20 equal to or smaller than a predetermined area one after another.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for dismantling a PCB processing facility.

  PCB (polychlorinated biphenyl), which is a non-flammable insulator, is harmful to the human body. Therefore, “Polychlorinated biphenyl waste” based on Article 6 of the “Special Measures Law for Promotion of Proper Treatment of Polychlorinated Biphenyl Waste” It is stipulated that the detoxification process be performed within the legal period defined in the “Processing Basic Plan”. The PCB contaminated with this PCB is separated and dismantled in a control area (glove box) located at the contamination level 3 of the PCB processing facility and is refilled into a predetermined container, and then the container is plasma-melted. The detoxification process is performed by putting it into a furnace or reducing the PCB concentration by a cleaning process. After detoxification of all PCB contaminants present in Japan, the PCB processing facility will be dismantled. However, because the PCB processing facility management area is contaminated with PCB, the PCB processing facility will be dismantled. Need to be careful.

  Patent Document 1 discloses a method for disassembling a PCB processing facility for preventing PCBs from flowing out. The invention of Patent Document 1 covers the PCB processing facility with a green house, and adheres to the inner surface (foamed concrete) of the outer wall of the PCB processing facility in a state where the space between the green house and the PCB processing facility is maintained at a negative pressure. The PCB contamination layer is peeled off with a flat chisel cutter. According to this, it is described that the volume of PCB contaminants accompanying the dismantling of the PCB processing facility will be reduced.

JP 2011-021406 A

  By the way, the PCB processing facility is composed of a pollution level 3 management area for separating and disassembling PCB contaminants, a pollution level 1-2 management area having a PCB concentration lower than the pollution level 3, and a non-management area. ing. The method for dismantling a PCB processing facility in Patent Document 1 is a technique for removing PCBs attached to an outer wall adjacent to a management area or a non-management area having a contamination level of 1 to 2, and the inner wall or the outer wall itself separating each management area. The dismantling of is not considered.

  In addition, the inner wall of the management area may be configured by combining metal panels, unlike the outer wall, and it is difficult to remove PCB contaminants with a flat chiseled cutter. On the other hand, the PCB concentration can be reduced to some extent by cleaning the surface of the metal panel with a cleaning solution. However, since high-concentration PCB adheres to the joints and screw parts between the metal panels, the PCB is removed from the PCB processing facility to be dismantled. Thus, it is extremely difficult to reduce the PCB concentration to a level that allows detoxification processing at an external PCB processing facility.

  Therefore, there is a demand for a method for dismantling a PCB processing facility that can surely dismantle a management area without causing PCBs to flow out.

  A method for disassembling a PCB processing facility includes: a PCB process having a first area contaminated with PCB; and a second area separated from the first area by a wall or ceiling and having a lower PCB concentration than the first area. A method of dismantling a facility, wherein a first pressure adjusting step of adjusting air to supply a first pressure while supplying and exhausting air in the first area; A second pressure adjusting step for adjusting to a high second pressure and a perforating step for sequentially forming openings having a predetermined area or less by perforating the wall or ceiling.

  As described above, on the wall or ceiling that divides the first area and the second area, there are parts having a high PCB concentration such as joints and screw parts where it is difficult to remove the PCB by the cleaning process. Therefore, in this method, since the opening is formed in the wall or ceiling by the perforation process, the PCB concentration in the first area can be lowered by removing a portion having a high PCB concentration.

  Moreover, in this method, it is supposed that an opening part is formed in the wall or ceiling which divides both areas in the state which set the 1st pressure of the 1st area lower than the 2nd pressure of the 2nd area. As a result, an air flow from the second area to the first area is generated, so that inconveniences such as high concentration PCB in the first area flowing out to the second area when the opening is formed can be prevented. Then, if the part with high PCB density | concentration which obstruct | occluded the opening part is removed sequentially, the PCB density | concentration of the whole 1st area will fall, and a 1st area can be disassembled safely.

  On the other hand, by forming the opening, the first area and the second area have the same pressure, and the high-concentration PCB in the first area may flow out to the second area. However, since the opening of the present method is configured to have a predetermined area or less, the pressure increase in the first area is suppressed, and the first area and the second area are unlikely to have the same pressure. It can be surely confined inside.

  In this way, a method for dismantling a PCB processing facility that can surely dismantle a management area without causing PCBs to flow out can be provided.

  As another method, the perforating step is to form a new opening after closing the opening with a blocking member not contaminated with PCB.

  If the opening formed by removing a portion having a high PCB concentration is closed with a blocking member that is not contaminated with PCB as in this method, the PCB concentration in the first area can be reduced. By repeating this, the PCB concentration in the entire first area decreases, so that the wall or ceiling of the first area can be detoxified in the external PCB processing facility after being removed from the PCB processing facility to be dismantled.

  As another method, the perforating step is to perforate the opening from the second area side.

  If the opening is perforated from the second area side where the pressure is relatively high as in the present method, the portion having a high PCB concentration that has blocked the opening falls to the first area. As a result, it is possible to prevent the high concentration PCB in the first area from flowing into the second area.

  As another method, the drilling step is to set an opening area of the opening based on a PCB concentration in the first area.

  If the opening area of the opening is set based on the PCB concentration in the first area as in the present method, for example, when the PCB concentration in the first area is high, the opening area can be reduced. As a result, the flow rate of air from the second area toward the first area can be increased, and the outflow of the high-concentration PCB in the first area can be reliably prevented.

  Another method is that the perforating step sets an opening area of the opening based on an exhaust amount of air from the first area.

  If the opening area of the opening is set based on the amount of air exhausted from the first area as in this method, the opening area can be reduced when the amount of air exhausted from the first area is small, for example. It becomes. As a result, even when the differential pressure between the first zone and the second zone is small, the flow rate of air from the second zone to the first zone is secured, and the high concentration PCB existing in the first zone is moved to the second zone. Can be reliably prevented.

  Another method is that the first pressure adjusting step changes the air supply amount while maintaining the exhaust amount at a predetermined value to maintain the first pressure.

  The exhaust gas from the first zone contains PCB and needs to be detoxified in an activated carbon tank, for example. For this reason, if the displacement is increased in order to create the negative pressure in the first zone, the processing capacity of the activated carbon tank may be exceeded. However, with this method, it is possible to create a negative pressure in the first zone by reducing the air supply amount without changing the exhaust amount. As a result, the exhaust gas containing PCB can be reliably detoxified while maintaining the negative pressure in the first zone.

It is a schematic side view which shows the management area of a PCB processing facility. It is explanatory drawing which pierces the inner wall of the management area which concerns on 1st embodiment. It is explanatory drawing which pierces the outer wall which concerns on 2nd embodiment. It is a flowchart which disassembles a PCB processing facility. It is explanatory drawing of a drilling operation | work.

  Hereinafter, an embodiment of a PCB processing facility dismantling method according to the present invention will be described with reference to the drawings. In the present embodiment, as an example of a method of dismantling the PCB processing facility X, a case will be described in which an inner wall WL (an example of a wall or a ceiling) or an outer wall WO (an example of a wall) of a management area L contaminated with PCB is disassembled. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the invention.

  As shown in FIG. 1, the PCB processing facility X includes a management area L in which a PCB contamination level is set and a non-management area L0 in which no PCB is handled. Further, the PCB processing facility X includes a cleaning facility (not shown), a plasma melting furnace, an activated carbon tank, and the like.

  The management area L includes a high concentration management area L3 having a PCB contamination level 3, a medium concentration management area L2 having a PCB contamination level 2, and a low concentration management area L1 having a PCB contamination level 1. The high concentration management area L3 of PCB contamination level 3 is an area that requires high level management because there is a possibility of contamination of the work environment by PCB under normal operation. The medium concentration control area L2 of the PCB contamination level 2 is a target in which the PCB is not contaminated by the work environment under normal operation, but the PCB in the process is indirectly handled (or the PCB is almost removed). This is an area that requires appropriate management in order to handle items in the work environment. The PCB contamination level 1 low concentration control area L1 is an area where PCB in the process is sealed in the equipment, so that there is no contamination of the work environment by PCB under normal operation, and can be handled with minimum management. .

  In the high-concentration management area L3, after separating the PCB contaminants by type, the electrical equipment is disassembled in the glove box, for example, into a container (not shown) composed of a washing basket, a drum can or a pail can. Refill. Then, this container is put into a cleaning facility or a plasma melting furnace to make PCB contaminants harmless. PCB contaminants are composed of electrical equipment (stabilizers, transformers, capacitors, etc.), operating waste (work clothes, rubber gloves, wastes, etc.), pressure-sensitive copying paper, sludge, insulating oil, and the like.

  In the middle concentration management area L2, the outside of the glove box (inside, the high concentration management area L3), piping through which air and liquid containing PCB circulate, equipment with low PCB concentration, and the like are arranged. In the low concentration management area L1, a sealing device, piping, or the like that encloses a liquid containing PCB is disposed. The non-management area L0 includes an attic or a space between the management area L and the outer wall WO.

  The non-management area L0, the low concentration management area L1, the medium concentration management area L2, and the high concentration management area L3 are each partitioned by the inner wall WL, and the non-management area L0 and the outside are partitioned by the outer wall WO. In addition, although the low concentration management area L1 and the medium concentration management area L2 and the outside may be partitioned by the outer wall WO, in this embodiment, the case where the non-management area L0 and the outside are partitioned by the outer wall WO will be described. To do.

  The inner walls WL, such as the walls and ceilings that define each non-management area L0 and the management areas L1, L2, and L3, have corners that are screwed with a building material board, lightweight foam concrete (ALC), and a urethane layer sandwiched between a pair of iron plates. It consists of wall materials and ceiling materials such as a plurality of sandwich panels that are stopped. Joint portions of the respective wall materials and ceiling materials are filled with joint materials such as packing and sealing materials, and the plurality of wall materials and ceiling materials are integrated to form an inner wall WL. The surface of the wall material and ceiling material can be removed from the PCB processing facility X by washing and the PCB concentration can be lowered to a level at which it can be rendered harmless at the external PCB processing facility. It is difficult to reduce the PCB concentration of the joints, screw parts, and the like by washing. For this reason, although details will be described later, in the present embodiment, the opening 20 is formed by drilling a part where a screw part or joint exists in the inner wall WL.

  As disclosed in JP 2011-021406 A, the outer wall WO is configured by assembling a plurality of lightweight foamed concrete (ALC) panels in which reinforcing bars are embedded. There is a possibility that PCB is infiltrated into this lightweight foamed concrete, and it cannot be completely removed only by peeling off with a cutting tool. For this reason, although details will be described later, in this embodiment, the opening 20 is formed by perforating the outer wall WO.

  The non-management area L0 communicates with the outside through a ventilation port 10 having a valve V0 composed of a damper or the like. Air supply passages 11a, 12a, and 13a to which air is supplied by an air supply fan (not shown) are connected to the respective management areas L1, L2, and L3, and exhaust air from which air is discharged by an exhaust fan (not shown). The paths 11b, 12b, and 13b are connected. The air supply passages 11a, 12a, and 13a communicate with the outside, and are configured to take outside air into the management areas L1, L2, and L3 by an air supply fan. The exhaust passages 11b, 12b, and 13b communicate with an exhaust treatment facility such as an activated carbon tank, and are configured such that air containing PCB is sent to the exhaust treatment facility and purified by an exhaust fan. The air supply fan may be an individual pump for each of the air supply paths 11a, 12a, 13a, or the air supply paths 11a, 12a communicating with the plurality of management areas L1, L2, L3 having the same PCB contamination level. , 13a may be a common pump. Similarly, the exhaust fan may be an individual pump for each of the exhaust passages 11b, 12b, and 13b, or the exhaust passages 11b, 12b, and 13b communicating with the plurality of management areas L1, L2, and L3 having the same PCB contamination level. It may be a common pump.

  A first air supply valve V1a composed of a damper or the like is provided in the air supply path 11a of the low concentration management area L1, and a first air valve composed of a damper or the like is provided in the exhaust path 11b of the low concentration management area L1. One exhaust valve V1b is provided. The air supply passage 12a in the medium concentration management area L2 is provided with a second air supply valve V2a configured by a damper or the like, and the exhaust passage 12b in the medium concentration management area L2 is provided with a first damper configured by a damper or the like. Two exhaust valves V2b are provided. The air supply passage 13a in the high concentration management area L3 is provided with a third air supply valve V3a constituted by a damper or the like, and the exhaust passage 13b in the high concentration management area L3 is provided by a damper or the like. Three exhaust valves V3b are provided. The supply valves V1a, V2a, and V3a may be provided for each of the management areas L1, L2, and L3, or the supply paths 11a and 12a of the plurality of management areas L1, L2, and L3 having the same PCB contamination level. , 13a may be provided at the junction. Similarly, each of the exhaust valves V1b, V2b, V3b may be provided for each of the management areas L1, L2, L3, or the exhaust passages 11b, 12b of the plurality of management areas L1, L2, L3 having the same PCB contamination level. You may provide in the junction part of 13b.

  Each management area L1, L2, L3 is adjusted to a pressure lower than the atmospheric pressure by adjusting the opening degree of the supply valves V1a, V2a, V3a and the exhaust valves V1b, V2b, V3b. The low concentration management area L1, the medium concentration management area L2, and the high concentration management area L3 are adjusted so that the pressure decreases in this order. Each non-management area L0 and management areas L1, L2, and L3 are provided with pressure sensors S that measure pressure. Note that the pressure sensor S may be omitted. Moreover, you may adjust the pressure adjustment of each management area L1, L2, L3 with the output of an air supply fan or an exhaust fan.

  As an example of a method for dismantling the PCB processing facility X according to the present embodiment, a method for dismantling the inner wall WL or the outer wall WO of the management area L contaminated with PCB will be described with reference to FIGS. Hereinafter, of any two adjacent management areas L1, L2, and L3, a management area having a relatively high PCB concentration is defined as a first area, and a management area having a relatively low PCB concentration is defined as a second area. ing. That is, in the example of FIG. 2, the high concentration management area L3 is the first area, and the medium concentration management area L2 is the second area. In the example of FIG. 3, the low concentration management area L1 or the non-management area L0 is the first area, and the non-management area L0 or the outside is the second area.

  As shown in FIGS. 2 and 4, the method for dismantling the PCB processing facility X according to this embodiment includes a high concentration management area L3 (an example of a first area) contaminated with PCB, a high concentration management area L3, and an inner wall. A method of dismantling a PCB processing facility X having a medium concentration management area L2 (an example of a second area) separated by WL and having a PCB concentration lower than that of the high concentration management area L3, the high concentration management area L3 A first pressure adjusting step for adjusting the first pressure lower than the atmospheric pressure while supplying / exhausting the air, and a second lower than the atmospheric pressure and higher than the first pressure while supplying / exhausting the air in the medium concentration management zone L2 A second pressure adjusting step for adjusting the pressure, a perforating step for sequentially forming the opening 20 having a predetermined area or less by perforating the inner wall WL, and a low concentration for reducing the concentration of the portion that has blocked the opening 20 And processing step . In the perforating process, the opening 20 is closed with a closing member 30 such as an iron plate not contaminated with PCB, and then a new opening 20 is formed.

  In the first pressure adjusting step, the third air supply is performed in a state in which the opening of the third exhaust valve V3b is kept constant in order to suppress the pressure increase in the high concentration management area L3 due to the opening 20 being formed. Control is performed so that the opening degree of the valve V3a is reduced. That is, since the exhaust amount of air from the high concentration management area L3 is maintained within the range of the processing capacity of the activated carbon tank or the like, the PCB concentration of the exhaust discharged to the outdoors can be surely within the reference value.

  In the second pressure adjusting step, in order to suppress the pressure drop in the medium concentration management zone L2 due to the formation of the opening 20, the opening of the second air supply valve V2a is increased, or the second exhaust valve Control is performed so that the opening degree of V2b is reduced. As a result, when the opening 20 is formed, an air flow from the medium concentration management area L2 to the high concentration management area L3 is formed, so that the high concentration PCB in the high concentration management area L3 is controlled by the medium concentration management area L3. Outflow to the area L2 is prevented.

  In the drilling step, as described above, the opening 20 is formed in a portion of the inner wall WL where a screw portion or joint having a high PCB concentration exists. Specifically, after a corner portion where the opening 20 is to be formed is drilled with a hole saw or the like, the corner 20 is cut with a cutting device to form a rectangular or circular opening 20. At this time, in the present embodiment, the opening 20 is perforated from the medium concentration management area L2 side having a relatively high pressure toward the high concentration management area L3 side. As a result, the portion with a high PCB concentration that has blocked the opening 20 falls into the high concentration management area L3. As a result, it is possible to prevent the high concentration PCB in the high concentration management area L3 from flowing out to the medium concentration management area L2.

The opening 20 formed in the drilling process has an opening area set to a predetermined area or less so that the first pressure in the high concentration management area L3 can be kept lower than the second pressure in the medium concentration management area L2. Yes. This predetermined area (m ² ) may be set based on the PCB concentration (μg / m ³ ) in the air in the high concentration management area L3 or the PCB concentration (μg / 100 cm ² ) adhering to the wall surface. Alternatively, it may be set based on the exhaust amount (m ³ / h) of air from the high concentration management area L3.

  When the opening area of the opening 20 is set based on the PCB concentration of the high concentration management area L3, the opening area × PCB concentration ≦ predetermined value A (μg / m) is set. That is, the higher the PCB concentration in the high concentration management area L3, the smaller the opening area of the opening 20 is set. As a result, the higher the PCB concentration in the high concentration management area L3, the higher the flow rate of air from the medium concentration management area L2 to the high concentration management area L3, thus reliably preventing the high concentration PCB from flowing out of the high concentration management area L3. can do.

  When the opening area of the opening 20 is set based on the exhaust amount of air from the high concentration management area L3, the exhaust amount of air from the high concentration management area L3 / opening area ≧ predetermined value B (m / h). Is set as follows. That is, the smaller the amount of air exhausted from the high concentration management area L3, the smaller the opening area of the opening 20 is set. Thereby, even when the differential pressure between the high concentration management area L3 and the medium concentration management area L2 is small, the flow rate of air from the medium concentration management area L2 to the high concentration management area L3 is secured, and the high concentration management area L3 Outflow of high concentration PCB can be reliably prevented.

  In the concentration reduction processing step, the site where the opening 20 is blocked is subjected to decontamination work such as cleaning, and the PCB concentration is lowered from the PCB processing facility X to a PCB concentration that can be rendered harmless at the external PCB processing facility. In addition, you may process the site | part which obstruct | occluded the opening part 20 to below graduation judgment reference value with the washing | cleaning equipment etc. in the PCB processing facility X.

  FIG. 4 is a flow diagram for explaining a series of these steps. In dismantling the inner wall WL of the management area L, air in the medium concentration management area L2 and the high concentration management area L3 is set so that the second pressure in the medium concentration management area L2 is higher than the first pressure in the high concentration management area L3. Adjust the air supply / exhaust amount. Then, the opening area of the opening 20 to be formed on the inner wall WL is set. As described above, the opening area is set based on the PCB concentration in the high concentration management area L3 and the exhaust amount of air from the high concentration management area L3.

  Next, while the differential pressure between the first pressure and the second pressure is monitored by the perforation process, it is divided into several degrees with an area that is a fraction of the set opening area (for example, 1 m wide × 0.5 m long). To perforate the inner wall WL. Specifically, as shown in FIG. 5, the set opening area of the opening 20 is divided into a plurality of parts in the longitudinal direction (three divisions in FIG. 5), and divided parts A1 to A3 are set. And a some hole is formed in the corner | angular part of division | segmentation part A1-A3 using a hole saw. Next, a plurality of hole portions (corner portions) of the first divided portion A1 are cut with a cutting device to form the first perforated port 20a. By forming the first perforation port 20a in the inner wall WL, an air flow from the medium concentration management area L2 to the high concentration management area L3 is formed. At this time, in this embodiment, since the holes are gradually perforated in a fraction of the set opening area, the differential pressure between the first pressure in the high concentration management area L3 and the second pressure in the medium concentration management area L2 ( The value obtained by subtracting the first pressure from the second pressure is maintained at a reference value (for example, 5 mmAq) or more. When the absolute value of the differential pressure between the first pressure in the high concentration management area L3 and the second pressure in the medium concentration management area L2 measured by the pressure sensor S is lower than the reference value, the medium concentration management area L2 or The intake / exhaust amount of air in the high concentration management area L3 may be adjusted. Specifically, the first pressure is lowered by reducing the opening of the third air supply valve V3a in the high concentration management area L3. Further, the second pressure in the intermediate concentration management area L2 is increased by increasing the opening of the second supply valve V2a in the intermediate concentration management area L2 or decreasing the opening of the second exhaust valve V2b. This pressure adjustment may be executed by changing any one of the valve openings, or may be executed by changing any two or more valve openings.

  Next, if the differential pressure between the first pressure and the second pressure measured by the pressure sensor S (a value obtained by subtracting the first pressure from the second pressure) is equal to or greater than a reference value, a plurality of holes in the second divided portion A2 The portion (corner portion) is cut with a cutting device to form the second perforation port 20b. On the other hand, if the differential pressure between the first pressure and the second pressure measured by the pressure sensor S is lower than the reference value, the first perforation port 20a is closed with the member 30 and then the second perforation port 20b is formed. . Similarly, the third perforation port 20c is formed in the third divided portion A3, and these series of perforation operations are repeated. Returning to FIG. 4, when the area of the opening 20 that is the sum of the plurality of punching holes 20 a to 20 c becomes the set opening area, the punching operation is stopped, and the blocking member 30 that is not contaminated with PCB. Then, the opening 20 is closed (see FIG. 2). And the decontamination work, such as washing | cleaning, is performed about the site | part which obstruct | occluded the opening part 20. FIG. In this way, if the opening 20 formed by removing a portion having a high PCB concentration is closed with the blocking member 30 that is not contaminated with PCB, the PCB concentration in the high concentration management area L3 can be lowered. And the operation | work mentioned above is repeated until it finishes removing all the parts with high PCB density | concentration among the inner walls WL. Eventually, when the PCB concentration in the air of the high concentration management area L3 falls below a predetermined value (for example, the same PCB concentration as the low concentration management area L1), all the inner walls WL of the high concentration management area L3 are dismantled And an area integrated with the medium concentration management area L2. If all the inner walls WL that divide the respective management areas L1, L2, and L3 are removed in the same manner, the management areas L1, L2, and L3 of the PCB processing facility X are surrounded only by the inner wall WL adjacent to the outer wall WO. This is one area with a very low PCB concentration (low concentration management area L1).

  FIG. 3 shows a method of dismantling the outer wall WO of the PCB processing facility X. As described above, the space between the inner wall WL (outermost wall of the management area L) adjacent to the outer wall WO and the outer wall WO is designated as the non-management area L0. Although the PCB concentration in the management area L is extremely low by the disassembling method of FIG. 2, it is not preferable to discharge a small amount of PCB to the outside. Therefore, in the present embodiment, when disassembling the inner wall WL or the outer wall WO adjacent to the outer wall WO, a method similar to the dismantling method described above is used.

  Specifically, when disassembling the inner wall WL adjacent to the outer wall WO, the first area is the low concentration management area L1, and the second area is the non-management area L0. Further, when dismantling the outer wall WO, the non-management area L0 is set as the first area and the outside is set as the second area.

  When disassembling the inner wall WL adjacent to the outer wall WO, the low concentration management area L1 is set to a negative pressure while the non-management area L0 communicating with the outside is maintained at atmospheric pressure. Then, the opening 20 is formed by the disassembling method described above, and the opening 20 is closed by the blocking member 30 that is not contaminated with PCB, and the screw portion and joints of the inner wall WL adjacent to the outer wall WO are removed. To do. As a result, the PCB concentration in the low concentration management area L1 can be reduced to the same level as the PCB concentration in the non-management area L0.

  Then, in a state where all the inner walls WL are disassembled to form only the outer wall WO, the scaffold 40 is formed along the outer wall WO, and the opening 20 is formed in the outer wall WO from the outside. The opening 20 is formed between the joint between the lightweight foamed concrete panels of the outer wall WO and between the reinforcing bars embedded in the lightweight foamed concrete. Next, the opening 20 is closed with a closing member 30 that is not contaminated with PCB from the outside of the outer wall WO, and the same operation is repeated. At this time, the inside of the outer wall WO is set to a negative pressure, and an air flow from the outside toward the non-management area L0 is formed. As a result, it is possible to prevent the PCB having a very low concentration from flowing out.

[Other Embodiments]
(1) The closing member 30 is not limited to an iron plate, and may be formed of a resin panel or a glass plate. Further, a sealing member may be provided at a contact portion between the closing member 30 and the opening 20. The closing member 30 may be omitted, and the opening 20 may be formed while sequentially increasing the differential pressure.
(2) The method of drilling the opening 20 is not limited to the above-described method using the hole saw or the cutting device, and may be drilled with a drill, for example, and is not particularly limited.

  The present invention can be used in a method for dismantling a wall or ceiling of a PCB processing facility.

20 opening 30 closing member L3 high concentration management area (first area)
L2 medium concentration management area (second area)
WL inner wall (wall, ceiling)
X PCB processing facility

Claims (6)

A method of dismantling a PCB processing facility having a first area contaminated with PCB and a second area separated from the first area by a wall or ceiling and having a lower PCB concentration than the first area. ,
A first pressure adjusting step of adjusting the first pressure while supplying and exhausting air in the first zone;
A second pressure adjusting step of adjusting the second pressure higher than the first pressure while supplying and exhausting air in the second area;
A method of disassembling a PCB processing facility, comprising: a perforating step that sequentially forms openings having a predetermined area or less by perforating the wall or ceiling.   2. The method for disassembling a PCB processing facility according to claim 1, wherein, in the punching step, the opening is newly formed after the opening is closed with a closing member not contaminated with PCB.   The method for disassembling a PCB processing facility according to claim 1 or 2, wherein the perforating step perforates the opening from the second area side.   The method for disassembling a PCB processing facility according to any one of claims 1 to 3, wherein the perforating step sets an opening area of the opening based on a PCB concentration in the first area.   4. The method for disassembling a PCB processing facility according to claim 1, wherein in the drilling step, an opening area of the opening is set based on an exhaust amount of air from the first area.   The dismantling of the PCB processing facility according to any one of claims 1 to 5, wherein the first pressure adjusting step changes the air supply amount while maintaining the exhaust amount at a predetermined value to maintain the first pressure. Method.

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