JP7155365B1 - Dismantling and removal method of PCB processing facility - Google Patents

Dismantling and removal method of PCB processing facility Download PDF

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JP7155365B1
JP7155365B1 JP2021136526A JP2021136526A JP7155365B1 JP 7155365 B1 JP7155365 B1 JP 7155365B1 JP 2021136526 A JP2021136526 A JP 2021136526A JP 2021136526 A JP2021136526 A JP 2021136526A JP 7155365 B1 JP7155365 B1 JP 7155365B1
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智裕 庄
馨 福井
隆宏 梅本
一彦 大井
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Jfe環境テクノロジー株式会社
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

【課題】狭い敷地であっても、搬出口から順に解体して搬出ルートを確保できるPCB処理施設の解体撤去方法を提供すること。【解決手段】PCB処理施設(1)に存在する機器、装置、配管、配線又は建築物を含む全ての解体対象物を解体して撤去する際に、PCB処理施設(1)の建屋(10)内の搬出口(4)付近の非汚染エリア(2)に、解体対象物を解体撤去して、解体対象物を仮置きする仮置きスペース(6)を形成し、仮置きスペース(6)に、解体対象物のうち汚染物に区分された解体対象物を搬出して、所定期間待機させる、ことを特徴とするPCB処理施設(1)の解体撤去方法。【選択図】図2To provide a method for dismantling and removing a PCB processing facility that can secure a carry-out route by dismantling sequentially from a carry-out port even in a narrow site. A building (10) of the PCB processing facility (1) is dismantled and removed when dismantling and removing all objects to be demolished including equipment, devices, pipes, wiring or buildings existing in the PCB processing facility (1). In the non-contaminated area (2) near the exit (4) inside, dismantle and remove the object to be dismantled, form a temporary storage space (6) for temporarily placing the object to be dismantled, and create a temporary storage space (6) 1. A method for dismantling and removing a PCB treatment facility (1), characterized in that the objects to be dismantled that have been classified as contaminants out of the objects to be dismantled are carried out and kept on standby for a predetermined period of time. [Selection drawing] Fig. 2

Description

本発明は、PCB処理施設の解体撤去方法に関し、詳しくは、搬出口に近い方から順に奥側に設置された汚染物を解体撤去するPCB処理施設の解体撤去方法に関する TECHNICAL FIELD The present invention relates to a method for dismantling and removing a PCB processing facility, and more particularly, to a dismantling and removing method for a PCB processing facility that dismantles and removes contaminants installed on the far side in order from the side closest to the outlet.

PCB処理施設の解体撤去工事においては、周辺環境を汚染させることがないように仮設テントや既存建屋などを使って、密閉下での解体撤去工法が必要とされている。 In the dismantling and removal work of PCB processing facilities, a closed dismantling and removal method using temporary tents or existing buildings is required so as not to pollute the surrounding environment.

特許文献1の技術では、PCB除染機能の維持に不要でPCB汚染の可能性を有するエリア、PCB除染機能に必要なエリア、及び解体撤去作業に必要なエリアに区分し、区分したエリアに対して、部屋単位で割り当てて、エリアと部屋の対応関係を構築し、区分したエリアの汚染度の高い順に解体を行う解体撤去方法が開示されている。 In the technique of Patent Document 1, the area is divided into an area that is unnecessary for maintaining the PCB decontamination function and has the possibility of PCB contamination, an area that is necessary for the PCB decontamination function, and an area that is necessary for dismantling and removal work. On the other hand, a dismantling removal method is disclosed in which areas are allocated on a room-by-room basis, a corresponding relationship is established between areas and rooms, and dismantling is performed in descending order of the degree of contamination of the divided areas.

特許第6031406号Patent No. 6031406

しかしながら、特許文献1の工法では、エリアと部屋単位の対応付けがなされ、部屋には、プラント設備や建築設備の汚染物や非汚染物が工程上に混在しているために、非汚染物であっても、汚染物と同等に建屋内での小分けや狭隘な場所での搬出を余儀なくされる。 However, in the construction method of Patent Document 1, areas and rooms are associated with each other. Even if there is, it is unavoidable to subdivide it in the building or to carry it out in a narrow place like polluted matter.

また、特許文献1では、部屋単位で解体すると、その部屋の中にある非汚染物についても同時に解体することになり、狭い搬出ルートや手順に制約が設けられ、効率的でない。 Moreover, in Patent Document 1, dismantling on a room-by-room basis results in the dismantling of non-contaminated materials in the room at the same time, which imposes restrictions on a narrow carrying-out route and procedure, which is inefficient.

さらに、特許文献1では、汚染物は、解体対象になっている高濃度処理施設内で処理するとしているが、現状では、全国に無害化処理施設が多数あるため、低濃度汚染物であれば、無害化処理施設で処理する方がより経済的である。 Furthermore, in Patent Document 1, the pollutants are to be treated in the high-concentration treatment facility that is to be dismantled. , it is more economical to treat at a detoxification facility.

また、非汚染物も一般産業廃棄物又はリサイクル品として処分できるが、部屋毎単位の処理であるため、処理単価の高い無害化処理施設での処理となり不経済である。 Non-contaminated materials can also be disposed of as general industrial waste or recycled products, but since this is done on a room-by-room basis, it is uneconomical to dispose of it in a detoxifying facility with a high unit cost.

さらに又、現在の高濃度処理施設内の除染機能を残しながら解体する場合、解体手順や搬出ルートに制限が出るため、効率的な解体撤去はできない。 Furthermore, when dismantling while maintaining the decontamination function in the current high-concentration treatment facility, there are restrictions on the dismantling procedure and the carrying-out route, so efficient dismantling and removal is not possible.

そこで、本発明の課題は、狭い敷地であっても、搬出口から順に解体して搬出ルートを確保できるPCB処理施設の解体撤去方法を提供することにある。
さらに本発明の他の課題は、以下の記載によって明らかとなる。
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a dismantling and removing method for a PCB treatment facility that can secure a carrying-out route by dismantling in order from the carrying-out port even if the site is narrow.
Furthermore, other objects of the present invention will become clear from the following description.

上記課題は以下の各発明によって解決される。 The above problems are solved by the following inventions.

(請求項1)
PCB処理施設(1)に存在する機器、装置、配管、配線又は建築物を含む全ての解体対象物を解体して撤去する際に、
PCB処理施設(1)の建屋(10)内の搬出口付近の非汚染エリア(2)に、前記解体対象物を解体撤去して、前記解体対象物を仮置きする仮置きスペース(6)を形成し、
前記仮置きスペース(6)に、解体対象物のうち汚染物に区分された解体対象物を搬出して、所定期間待機させ、
前記仮置きスペース(6)は、非汚染エリア(2)の一部のエリア(6a)と、除染処理により非汚染レベルまで低減したエリア(6b)とを含む、
ことを特徴とするPCB処理施設の解体撤去方法。
(請求項2)
解体対象物のうち非汚染物に区分された解体対象物は、前記汚染物の搬出に邪魔な前記非汚染物を搬出口に向かう通路から離れた位置に移動させた後、解体対象物のうち汚染物に区分された解体対象物を前記仮置きスペース(6)に搬出する、
ことを特徴とする請求項記載のPCB処理施設の解体撤去方法。
(請求項3)
解体対象物のうち非汚染物に区分された解体対象物のうち前記汚染物の搬出口に向かう通路の邪魔にならない前記非汚染物は残置し、前記仮置きスペース(6)に解体対象物のうち前記汚染物に区分された解体対象物を搬出する、
ことを特徴とする請求項1又は2記載のPCB処理施設の解体撤去方法。
(請求項4)
前記仮置きスペース(6)の一部に、出入口が同時に開かない仮設扉が設けられたラッピング室(62)を設ける、
ことを特徴とする請求項記載のPCB処理施設の解体撤去方法。
(請求項5)
前記ラッピング室(62)は、前記除染処理により非汚染レベルまで低減したエリア(6b)に設けられる、
ことを特徴とする請求項記載のPCB処理施設の解体撤去方法。
(請求項6)
前記ラッピング室(62)には、ラッピングマシーンが設けられ、該ラッピングマシーンにより前記汚染物に区分された解体対象物をラッピングする、
ことを特徴とする請求項4又は5記載のPCB処理施設の解体撤去方法。
(請求項7)
PCB処理施設(1)全体を覆う上屋テント(8)を設置せず、既設の換気・排気設備(9)を使用し、汚染エリア(3)の汚染度の高いエリアを負圧にして、それ以外のエリアとの室圧差を形成し、前記汚染物に区分された解体対象物を解体撤去する、
ことを特徴とする請求項1~6の何れかに記載のPCB処理施設の解体撤去方法。
(請求項8)
PCB処理施設(1)全体を覆う上屋テント(8)を設置せず、既設の換気・排気設備(9)を使用し、前記ラッピング室(62)を負圧にし、該ラッピング室(62)以外のエリアとの室圧差を形成し、前記汚染物に区分された解体対象物をラッピングする、
ことを特徴とする請求項4、5又は6記載のPCB処理施設の解体撤去方法。
(Claim 1)
When dismantling and removing all objects to be dismantled including equipment, devices, pipes, wiring or buildings existing in the PCB processing facility (1),
A temporary storage space (6) is provided in a non-contaminated area (2) in the vicinity of the carry-out exit in the building (10) of the PCB processing facility (1) by dismantling and removing the object to be dismantled and temporarily placing the object to be dismantled. form,
out of the objects to be dismantled, the objects to be dismantled classified as contaminants are carried out to the temporary storage space (6) and kept on standby for a predetermined period of time ;
The temporary storage space (6) includes a partial area (6a) of the non-contaminated area (2) and an area (6b) reduced to a non-contaminated level by decontamination treatment,
A method for dismantling and removing a PCB processing facility, characterized by:
(Claim 2)
Among the objects to be demolished, the objects to be demolished classified as non-contaminated objects are removed from the objects to be demolished after the non-contaminated objects that hinder the carrying out of the contaminated objects are moved to a position away from the passage leading to the outlet. Carrying out the objects to be dismantled classified as contaminants to the temporary storage space (6);
The method for dismantling and removing a PCB processing facility according to claim 1 , characterized in that:
(Claim 3)
Of the objects to be dismantled classified as non-contaminated objects, the non-contaminated objects that do not interfere with the passage leading to the discharge port for the contaminated objects are left, and the objects to be dismantled are placed in the temporary storage space (6). Out of which, the object to be dismantled classified as the contaminant is carried out,
The method for dismantling and removing a PCB processing facility according to claim 1 or 2 , characterized in that:
(Claim 4)
A wrapping room (62) provided with a temporary door that does not open at the same time is provided in a part of the temporary storage space (6).
The method for dismantling and removing a PCB processing facility according to claim 1 , characterized in that:
(Claim 5)
The lapping chamber (62) is provided in an area (6b) reduced to a non-contaminated level by the decontamination treatment,
The method for dismantling and removing a PCB processing facility according to claim 4 , characterized in that:
(Claim 6)
A lapping machine is provided in the lapping chamber (62), and the lapping machine wraps the objects to be dismantled classified as the contaminants.
The method for dismantling and removing a PCB treatment facility according to claim 4 or 5 , characterized in that:
(Claim 7)
A roof tent (8) that covers the entire PCB processing facility (1) is not installed, and the existing ventilation and exhaust equipment (9) is used to create a negative pressure in the highly contaminated area (3). Forming a room pressure difference with other areas to dismantle and remove the objects to be dismantled classified as contaminants;
The method for dismantling and removing a PCB processing facility according to any one of claims 1 to 6 , characterized in that:
(Claim 8)
The existing ventilation/exhaust equipment (9) is used without installing a shed tent (8) that covers the entire PCB processing facility (1), and the wrapping room (62) is made negative pressure, and the wrapping room (62) is forming a room pressure difference with an area other than the above, and wrapping the demolition object classified as the contaminant;
The method for dismantling and removing a PCB processing facility according to claim 4, 5 or 6 , characterized in that:

本発明によれば、狭い敷地であっても、排出口から順に解体して搬出ルートを確保できるPCB処理施設の解体撤去方法を提供することができる。 According to the present invention, it is possible to provide a method for dismantling and removing a PCB treatment facility that can secure a carry-out route by dismantling in order from the outlet even if the site is narrow.

本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図Schematic plan view showing an example of a method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図Schematic plan view showing an example of a method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の他の一例を示す概略平面図Schematic plan view showing another example of the method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図Schematic plan view showing an example of a method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図Schematic plan view showing an example of a method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図Schematic plan view showing an example of a method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図Schematic plan view showing an example of a method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の他の好ましい態様を示す図A diagram showing another preferred embodiment of the method for dismantling and removing a PCB processing facility according to the present invention. 本発明のPCB処理施設の解体撤去方法の他の好ましい態様を示す図A diagram showing another preferred embodiment of the method for dismantling and removing a PCB processing facility according to the present invention. 従来例を示す概略平面図Schematic plan view showing a conventional example 本発明のPCB処理施設の解体撤去方法のさらに他の好ましい態様を示す図A diagram showing still another preferred embodiment of the method for dismantling and removing a PCB processing facility according to the present invention.

以下、本発明を実施の形態について図面に基づいて説明する。
まず、本発明の実施形態が実施される場面では、予め、高濃度PCBが洗浄等により除去されている状態であり、全ての解体対象物は、低濃度に分類される汚染物であるか、非汚染物の状態であることが前提となっている。低濃度に分類される汚染物(低濃度汚染物)に関しては後述する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, when the embodiment of the present invention is carried out, high-concentration PCBs are removed in advance by washing or the like, and all objects to be dismantled are contaminants classified as low-concentration, It is assumed to be in a non-contaminated state. Contaminants classified as low concentration (low concentration contaminants) will be described later.

したがって、PCB処理施設に存在する機器、装置、配管、配線又は建築物を含む解体対象物において、非汚染物に区分される解体対象物と、汚染物に区分される解体対象物とが混在している場合、これらを解体して撤去する際に、搬出するスペースを確保しながら搬出口に近い方から順に奥側に設置された前記解体対象物を解体撤去していく方が、効率的に作業を進めることができる。 Therefore, among the objects to be dismantled, including equipment, devices, pipes, wiring, or buildings, which are present in PCB processing facilities, there is a mixture of objects to be dismantled that are classified as non-contaminated substances and objects that are classified as contaminated substances. When dismantling and removing these, it is more efficient to dismantle and remove the above-mentioned objects to be dismantled that are installed on the far side in order from the one closest to the exit while securing the space to carry them out. work can proceed.

本発明においては、搬出口付近の解体対象物が撤去されていき、搬出口の近い場所には大きなスペースが生まれるため、建屋内の搬出口付近で、搬出時に有利な仮置きスペースとして利用することができる。また、大きな仮置きスペースが形成されているため、このスペースを、汚染物搬送に必要なラッピング又はシート養生エリアとしても有効活用することができる。 In the present invention, the objects to be dismantled near the exit are removed, and a large space is created near the exit. can be done. In addition, since a large temporary storage space is formed, this space can be effectively used as a wrapping or sheet curing area necessary for transporting contaminants.

本実施形態においては、解体撤去作業前に、予め、PCB処理施設に存在する機器、装置、配管、配線又は建築物を含む解体対象物の汚染度を、例えば、分析しておき、汚染物と、非汚染物とに区分しておくことで、より迅速、かつ安定した解体撤去する方法を実現できる。ここで、解体対象物を汚染物と非汚染物に分類する方法における前提としては、各解体対象物に対して、環境省が定める低濃度汚染物「低濃度PCB該当性判断基準」に規定された分析方法で分析することを基本とする。 In this embodiment, before the dismantling and removal work, the degree of contamination of objects to be dismantled, including equipment, devices, pipes, wiring, or buildings existing in the PCB treatment facility, is analyzed in advance, and , and non-contaminated items, a more rapid and stable method of dismantling and removal can be realized. Here, the premise of the method of classifying objects to be dismantled into pollutants and non-contaminants is that each object to be dismantled is defined by the Ministry of the Environment as a low-concentration contaminant "low-concentration PCB eligibility criteria". In principle, analysis should be performed using the analysis method described above.

本発明のPCB処理施設の解体撤去方法は、汚染物に区分された解体対象物を解体して撤去する際に、どのように撤去するかを提案するものである。 A method for dismantling and removing a PCB processing facility according to the present invention proposes how to dismantle and remove objects to be dismantled classified as contaminants.

本発明のPCB処理施設の解体撤去方法は、PCB管理区域に区分されたエリアによらず、搬出するスペースを確保しながら搬出口に近い方から順に奥側に設置された汚染物を解体撤去していくことを特徴とする。 The method for dismantling and removing a PCB processing facility according to the present invention dismantles and removes contaminants installed in order from the side closest to the outlet while securing the space for carrying out regardless of the area divided into the PCB management area. It is characterized by going.

ここで、「PCB管理区域に区分されたエリアによらず」というのは、施設全体を非管理区域、管理区域に区分けし、管理区域は、PCB処理施設において、PCBを処理していた際の扱っていたPCB濃度が低い順に、レベル1エリア、レベル2エリア、レベル3エリアに区分けされており、PCB濃度の汚染度の違いにより区分されたレベル1エリア、レベル2エリア、レベル3エリアの順番に拘束されないという意味である。
つまり、本発明では、汚染度の違いにより区分されたレベル1エリア、レベル2エリア、レベル3エリアの順番に拘束されずに、搬出するスペースを確保しながら搬出口に近い方から順に奥側に設置された汚染物を解体撤去していくのである。
Here, "regardless of the area divided into PCB controlled areas" means that the entire facility is divided into non-controlled areas and controlled areas. It was divided into level 1 area, level 2 area and level 3 area in descending order of the PCB concentration handled, and the order of level 1 area, level 2 area and level 3 area was divided according to the difference in the degree of contamination of PCB concentration. It means that it is not constrained by
In other words, in the present invention, without being constrained in the order of level 1 area, level 2 area, and level 3 area classified by the difference in degree of contamination, while securing a space for carrying out, the area nearer to the carry-out port is moved to the far side in order. Contaminants that have been installed will be dismantled and removed.

図1~図7は、本発明のPCB処理施設の解体撤去方法の一例を示す概略平面図である。 1 to 7 are schematic plan views showing an example of the method for dismantling and removing a PCB processing facility according to the present invention.

図1において、1はPCB処理施設である。PCB処理施設1は、非汚染エリア2と、非汚染エリア2の内側の汚染エリア3に区分される。 In FIG. 1, 1 is a PCB processing facility. A PCB processing facility 1 is divided into a non-contaminated area 2 and a contaminated area 3 inside the non-contaminated area 2 .

本態様の汚染エリア3は、汚染レベルがL1<L2<L3の順に高くなる場合を示している。 Contaminated area 3 of this embodiment shows a case where the contamination level increases in the order of L1<L2<L3.

図示のように、最外側にレベル1エリアL1、その内側にレベル2エリアL2、最内側にレベル3エリアL3が各々配置されている。図において、4は汚染物を解体して搬出する際の搬出口である。本態様では、搬出口4は、PCB処理施設1の建屋10の図面上右側に位置している。 As shown, a level 1 area L1 is arranged on the outermost side, a level 2 area L2 is arranged on the inner side, and a level 3 area L3 is arranged on the innermost side. In the figure, 4 is an outlet for dismantling and carrying out the contaminants. In this embodiment, the outlet 4 is located on the right side of the building 10 of the PCB processing facility 1 in the drawing.

レベルエリアの順番に拘束されずに、搬出するスペースを確保しながら搬出口に近い方から順に奥側に設置された汚染物を解体撤去していく際の第1段階について図2に基づいて説明する。 Explanation based on Fig. 2 on the first stage when dismantling and removing contaminated objects installed in the back side in order from the side closest to the exit while securing the space to carry out without being constrained by the order of the level area. do.

第1段階は、PCB処理施設1の建屋10内の搬出口4に近い、非汚染エリア2の一部エリア6aに存在する解体対象物を解体撤去することによって、仮置きスペース6を形成することである。この非汚染エリア2の一部エリア6aは、元から非汚染エリアであるため、除染の必要もなく、このエリアの解体対象物を撤去することによって、建屋10内の搬出口4付近に、広いスペースが生まれる。この広いスペースが、仮置きスペース6として機能する。この仮置きスペース6を形成することで、建屋10内には、搬出口4に付近で、搬出する際に、搬出効率の良い作業スペースが形成されるのである。 The first step is to form a temporary storage space 6 by dismantling and removing objects to be dismantled existing in a partial area 6a of the non-contaminated area 2 near the carry-out exit 4 in the building 10 of the PCB processing facility 1. is. Since the partial area 6a of the non-contaminated area 2 is originally a non-contaminated area, there is no need for decontamination. Creates a large space. This wide space functions as a temporary storage space 6. - 特許庁By forming this temporary storage space 6 , a work space is formed in the building 10 in the vicinity of the carry-out port 4 , which is efficient for carry-out.

この仮置きスペース6は、建屋10内に形成されるため、汚染物に区分された解体対象物を雨水などにさらすことがなく、環境への汚染の懸念がない。また、解体対象物の搬出調整などの一時的な貯留スペースとして機能させることもできる。さらに、払出のために、PCB汚染度の分析に要する期間の待機スペースとしても機能させることができる。これらは、搬出口4付近で実施されることによって、作業効率を格段に上昇させることができる。 Since this temporary storage space 6 is formed within the building 10, the objects to be dismantled classified as contaminants are not exposed to rainwater or the like, and there is no concern about pollution to the environment. In addition, it can also function as a temporary storage space for adjusting the carry-out of objects to be demolished. Furthermore, for dispensing purposes, it can also function as a waiting space during the period required for analysis of the degree of PCB contamination. By carrying out these operations near the carry-out port 4, the work efficiency can be significantly improved.

また、図3に示すように、仮置きスペース6には、非汚染エリア2の一部エリア6aに加えて、汚染エリアのレベル1エリアL1の搬出口4に近いエリアを、除染処理により非汚染レベルまで低減したエリア6bを含めることも好ましい。これにより、搬出口4付近に、更に大きな作業スペースを確保することができる。 Further, as shown in FIG. 3, in the temporary storage space 6, in addition to a partial area 6a of the non-contaminated area 2, an area near the exit 4 of the level 1 area L1 of the contaminated area is decontaminated. It is also preferred to include an area 6b that has been reduced to a level of contamination. As a result, a larger working space can be secured in the vicinity of the carry-out port 4 .

次に、解体撤去していく際の第2段階について図4に基づいて説明する。
図4に示すように、汚染エリア3のレベル1エリアL1の上部側、レベル1エリアL1の下部側、レベル2エリアL2の右側を、レベル3エリアL3の右端に達する部位に相当する解体部61を解体撤去する。
Next, the second stage of dismantling and removal will be described with reference to FIG.
As shown in FIG. 4, the top side of the level 1 area L1, the bottom side of the level 1 area L1, and the right side of the level 2 area L2 of the contaminated area 3 are the dismantling section 61 corresponding to the part reaching the right end of the level 3 area L3. be dismantled and removed.

この解体撤去される解体部61に存在する解体対象物は、解体され、仮置きスペース6に搬送される。この際、非汚染物に区分される解体対象物は、汚染物に区分される解体対象物の搬送に邪魔になる場合には、汚染物に区分される解体対象物の搬出口に向かう通路を避けるように移動させ、邪魔にならない場合には、残置することが好ましい。 The object to be dismantled existing in the dismantling section 61 to be dismantled and removed is dismantled and transported to the temporary storage space 6 . At this time, if the objects to be dismantled classified as non-contaminant interfere with the transportation of the objects to be dismantled classified as contaminated, the passage leading to the exit for the objects to be dismantled classified as contaminated It is preferable to move it so as to avoid it, and to leave it if it does not get in the way.

次に、解体撤去していく際の第3段階について図5に基づいて説明する。
図5に示すように、汚染エリア3のエリアL1の上部側、レベル1エリアL1の下部側、エリアL2の上部側、エリアL2の下部側、レベル3エリアL3の部位に相当する解体部61を解体撤去していく。
Next, the third stage of dismantling and removal will be described with reference to FIG.
As shown in FIG. 5, the dismantled section 61 corresponding to the top side of the area L1, the bottom side of the level 1 area L1, the top side of the area L2, the bottom side of the area L2, and the level 3 area L3 of the contaminated area 3 is provided. Dismantle and remove.

この解体撤去される解体部61に存在する解体対象物は、ほとんどが汚染物に区分される解体対象物であるため、これらの解体対象物は解体され、仮置きスペース6に搬送される。 Most of the objects to be dismantled existing in the dismantling section 61 to be dismantled and removed are objects to be dismantled that are classified as contaminants.

次に、解体撤去していく際の第4段階について図6に基づき説明する。
図6に示すように、汚染エリア3のレベル1エリアL1の上部側、レベル1エリアL1の下部側、レベル2エリアL2の左側の部位に相当する解体部61を解体撤去していく。
Next, the fourth stage of dismantling and removal will be described with reference to FIG.
As shown in FIG. 6, the dismantled parts 61 corresponding to the upper part of the level 1 area L1, the lower part of the level 1 area L1, and the left part of the level 2 area L2 of the contaminated area 3 are dismantled and removed.

次に、解体撤去していく際の第5段階について図7に基づき説明する。
図7に示すように、汚染エリア3のレベル1エリアL1の左側に相当する解体部61を解体撤去していく。
Next, the fifth stage of dismantling and removal will be described with reference to FIG.
As shown in FIG. 7, the dismantled section 61 corresponding to the left side of the level 1 area L1 of the contaminated area 3 is dismantled and removed.

このレベル1エリアL1は、汚染物に区分される解体対象物と、非汚染物に区分される解体対象物が混在していることがある。このため、非汚染物に区分される解体対象物は、汚染物に区分される解体対象物の搬送に邪魔になる場合には、汚染物を搬送するための、搬出口4に向かう通路を避けるように移動させ、邪魔にならない場合には、残置することができる。 In this level 1 area L1, objects to be dismantled that are classified as pollutants and objects to be dismantled that are classified as non-contaminants are mixed in some cases. For this reason, if objects to be dismantled classified as non-contaminated materials interfere with the transportation of objects to be dismantled classified as contaminated materials, avoid the passage toward the carry-out port 4 for conveying contaminated materials. You can move it around and leave it if it doesn't get in the way.

このように、本発明は、まず、仮置きスペース6を建屋10内に確保した上で、図4~図7のように、搬出口4に近い方から順次解体撤去していく。この結果、搬出するスペースを確保しながら搬出口に近い方から順に奥側に設置された前記解体対象物を解体撤去していく方が、効率的に作業を進めることができる。 As described above, according to the present invention, the temporary storage space 6 is first secured in the building 10, and then dismantled and removed sequentially from the side closer to the carry-out port 4 as shown in FIGS. As a result, it is possible to proceed with the work more efficiently by dismantling and removing the objects to be dismantled placed on the far side in order from the one closest to the outlet while securing the space for carrying them out.

上記説明では、図4~図7の各段階を分けて解体撤去する例を説明したが、これに限定されない。本実施形態においては、建屋内の解体対象物を、搬出口4に近い方から解体撤去できればよく、例えば、図4と図5の解体部61を同時に解体撤去してもよいし、図4~図6、図4~図7までを同時に行ってもよい。 In the above description, an example of dismantling and removing each stage of FIGS. 4 to 7 was described, but the present invention is not limited to this. In this embodiment, it is only necessary to dismantle and remove the object to be dismantled in the building from the side closer to the outlet 4. For example, the dismantling section 61 in FIGS. 6 and 4 to 7 may be performed simultaneously.

また、本実施形態においては、図4~図7に示す汚染エリア3のレベル1エリアL1、レベル2エリアL2、及びレベル3エリアL3の境界となる壁は原則的に残す。しかしながら必要に応じて、取り除くようにしてもよい。この際、後述する各汚染エリア3において、室圧差を設ける場合には、室圧差のコントロールを阻害しないように汚染された壁を取り除くことが好ましい。 In addition, in this embodiment, in principle, walls that serve as boundaries between the level 1 area L1, the level 2 area L2, and the level 3 area L3 of the contaminated area 3 shown in FIGS. 4 to 7 are left. However, it may be removed if desired. At this time, if a chamber pressure difference is provided in each contaminated area 3, which will be described later, it is preferable to remove the contaminated walls so as not to hinder the control of the chamber pressure difference.

次に、本発明の好ましい他の態様を図8、図9に基づき説明する。
低濃度PCB汚染物は、運搬ガイドラインに従い、密閉容器のラッピングの着脱、ラッピング、シート養生などで漏洩防止することが義務付けられている。このため、場外への汚染物を搬出するためには、建屋内に搬入搬出側に扉を設けた気密性を確保した空間を形成して、漏洩防止を行う必要がある。
ラッピングする方法としては、例えば、ラッピングをするためのラッピングマシーンを用いて、密閉容器のラッピング、汚染物を直接ラッピングすることができる。
Another preferred embodiment of the present invention will now be described with reference to FIGS. 8 and 9. FIG.
Low-concentration PCB contaminants must be prevented from leaking by removing the wrapping of closed containers, wrapping, covering sheets, etc., in accordance with transportation guidelines. For this reason, in order to carry out contaminated materials to the outside, it is necessary to form an airtight space with a door on the loading/unloading side of the building to prevent leakage.
As a wrapping method, for example, a wrapping machine for wrapping can be used to wrap a sealed container or directly wrap a contaminant.

汚染物であってもラッピング、シート養生をすることによって、PCBの漏洩防止やコンタミの心配がなくなる。このため、形成された仮置きスペース6への仮置きが可能となり、仮置きスペース6の汚染を防ぐことができる。 Even if it is a contaminant, by wrapping and covering it with a sheet, there is no need to worry about PCB leakage or contamination. As a result, temporary placement in the formed temporary placement space 6 becomes possible, and contamination of the temporary placement space 6 can be prevented.

本発明においては、例えば、汚染エリア3のエリアL1の右側部分を、ラッピング室62として設け、このラッピング室62内で、密閉容器のラッピングの着脱、ラッピング、シート養生などを行うことが好ましい。汚染エリア3のエリアL1は、非汚染エリア2との境界に位置し、気密性を確保できる扉が設けられていると共に、レベルの異なるエリアの境界にも、汚染拡大を防ぐために、気密性を確保できる扉が設けられているため、このエリアL1の右側の部位は、ラッピング室62を設ける場所として好ましい。 In the present invention, for example, the right side of the area L1 of the contaminated area 3 is preferably provided as a wrapping room 62, in which wrapping, wrapping, sheet curing, etc. of the closed container are preferably performed. The area L1 of the contaminated area 3 is located at the boundary with the non-contaminated area 2, and is provided with a door that can ensure airtightness. Since a secure door is provided, the right portion of the area L1 is preferable as a place for the wrapping chamber 62 to be provided.

ラッピング室62内での密閉容器に汚染物を封入する場合、密閉容器を汚染エリア3に搬送し、汚染エリア3内で、汚染物を密閉容器に封入して、汚染物が封入された密閉容器をラッピング室62に搬送する。 When enclosing the contaminants in a closed container in the wrapping chamber 62, the closed container is transported to the contaminated area 3, and in the contaminated area 3, the contaminants are enclosed in the closed container, and the closed container in which the contaminants are enclosed is produced. is transported to the wrapping chamber 62 .

この場合、まず、ラッピング室62で、空の密閉容器にラッピングをし、ラッピングされた空の密閉容器を、汚染エリア3に搬送し、汚染エリア3内で、密閉容器に汚染物を封入する。この汚染物が封入された密閉容器をラッピング室62に搬送し、密閉容器のラッピングを取り除くことによって、密閉容器は汚染物に晒されていない状態となる。これによって、密閉容器は、ラッピング室62から外部に搬出し、必要であれば、仮置きスペース6に仮置きすることができる。密閉容器への汚染物の収納は、解体場所の付近で行われる場合が多いため、上述のようにすることにより、外部から持ち込まれる密閉容器が、汚染エリアで汚染するのを防ぐことができる。 In this case, first, an empty airtight container is wrapped in the wrapping chamber 62, the wrapped empty airtight container is transported to the contaminated area 3, and the contaminants are enclosed in the airtight container within the contaminated area 3. By conveying the sealed container containing the contaminants to the wrapping chamber 62 and removing the wrapping of the sealed container, the sealed container is not exposed to the contaminants. As a result, the closed container can be taken out of the wrapping chamber 62 and temporarily placed in the temporary storage space 6 if necessary. Since contaminants are often stored in closed containers near the dismantling site, the above-described arrangement can prevent the closed containers brought in from the outside from being contaminated in the contaminated area.

図8は、搬入扉620と搬出扉621とを備えるラッピング室62が設けられた場合における、図4に示す解体部61を解体撤去する段階を示す図であり、図9は、図5に示す解体部を解体撤去する段階を示す図である。 FIG. 8 is a diagram showing a stage of dismantling and removing the dismantling section 61 shown in FIG. 4 in the case where the wrapping chamber 62 having the loading door 620 and the unloading door 621 is provided, and FIG. 9 is a diagram shown in FIG. It is a figure which shows the stage which dismantles and removes a dismantling part.

ラッピング室62の搬入扉620は、レベル2エリアL2とレベル1エリアL1との境界の扉であり、搬出扉621は、汚染エリア3のエリアL1と非汚染エリア2との境界の扉である。これらの扉は気密性を確保できると共に、一方の扉が閉まらない限り、他方の扉は必ず閉まっている状態であり開かない、すなわち、両方同時に開放された状態にならない仕組みが構築されていることが好ましい。汚染の拡大を防ぐためである。 The carry-in door 620 of the wrapping chamber 62 is the border door between the level 2 area L2 and the level 1 area L1, and the carry-out door 621 is the border door between the contaminated area 3 area L1 and the non-contaminated area 2. These doors must be able to ensure airtightness, and unless one door is closed, the other door will always be closed and will not open. is preferred. This is to prevent the spread of contamination.

本実施形態においては、ラッピング室62の出入口となる搬入扉620、搬出扉621は、既存の扉を用いて、既存の扉のある仮置きスペース6の一部をラッピング室62として利用してもよいし、搬入扉620、搬出扉621を、仮設扉として形成して、ラッピング室62を設けることもできる。 In this embodiment, the loading door 620 and the loading door 621 serving as the entrance to the wrapping room 62 may be existing doors, and a part of the temporary storage space 6 with the existing doors may be used as the wrapping room 62. Alternatively, the loading door 620 and the loading door 621 may be formed as temporary doors to provide the wrapping chamber 62 .

また、後述する既存の換気設備を利用して、汚染拡大を防ぐ観点から、汚染エリア3、ラッピング室62、ラッピング室62以外の仮置きスペース6の順に室圧差を形成し、汚染エリア3を最も負圧にすることが好ましい。さらに、搬入扉、及び搬出扉を備えたラッピング室を設けると共に、後述する既存の換気設備を利用することにより、汚染拡大をより確実に防ぐことができる。 In addition, from the viewpoint of preventing the spread of contamination, using the existing ventilation equipment described later, the room pressure difference is formed in the order of the contaminated area 3, the wrapping room 62, and the temporary storage space 6 other than the wrapping room 62, and the contaminated area 3 is the most Negative pressure is preferred. Furthermore, by providing a wrapping room equipped with a carry-in door and a carry-out door and using existing ventilation equipment to be described later, it is possible to more reliably prevent the spread of contamination.

これにより、外部への空気の流出が防げるため、汚染エリア3からのラッピング室62への汚染拡大を防止でき、また、仮にラッピング室62が汚染された場合であっても、ラッピング室からのラッピング室62以外の仮置きスペース6への汚染拡大を防ぐことができる。 As a result, the outflow of air to the outside can be prevented, so the spread of contamination from the contaminated area 3 to the wrapping chamber 62 can be prevented. Contamination expansion to the temporary storage space 6 other than the chamber 62 can be prevented.

図8に示す解体部61の解体対象物のうち、汚染物に区分された解体対象物は、ラッピング室62に搬送され、密閉容器のラッピングの取り外し、ラッピング、シート養生等で汚染の拡大を防止するように処理される。図8において、非汚染物に区分された解体対象物は、汚染物に区分される解体対象物の搬送に邪魔になる場合には、汚染物に区分される解体対象物の搬出口に向かう通路を避けるように移動させ、邪魔にならない場合には、残置することが好ましい。 Of the objects to be dismantled in the dismantling section 61 shown in FIG. 8, the objects to be dismantled that have been classified as contaminants are transported to the wrapping chamber 62, and the expansion of contamination is prevented by removing the wrapping of the sealed container, wrapping, sheet curing, etc. is processed to In FIG. 8, if the objects to be dismantled classified as non-contaminant interfere with the transportation of the objects to be dismantled classified as contaminated, the path toward the exit for the objects to be dismantled classified as contaminated is It is preferable to move it so as to avoid it and leave it if it does not get in the way.

具体的には、図9に示すように、例えば、汚染物に区分された解体対象物610を、搬入扉620からラッピング室62へ搬送する際、図9の前段階である図8の段階では、残置された非汚染物に区分された解体対象物63が、搬出口へ向かう通路上に、残置されている場合、汚染物に区分された解体対象物610の搬送の邪魔になる場合がある。 Specifically, as shown in FIG. 9, for example, when an object to be dismantled 610 classified as contaminants is transported from the carry-in door 620 to the wrapping chamber 62, in the stage of FIG. If the uncontaminated dismantling objects 63 are left on the path leading to the outlet, the dismantling objects 610 classified as contaminants may be hindered from being transported. .

この場合、汚染物に区分された解体対象物610の搬送前に、予め汚染物に区分された解体対象物610のラッピング室62への搬送の邪魔になる非汚染物に区分された解体対象物63を、例えば、図示のように、搬出口へ向かう通路を避けるように移動させておく。これにより、汚染物に区分された解体対象物610の搬送をスムーズに行えるようにする。この結果、ラッピング作業や搬送作業をスムーズに行うことができる。 In this case, before transporting the demolition object 610 classified as contaminants, the demolition object classified as non-contaminant that interferes with the transportation of the demolition object 610 preliminarily classified as contaminant to the wrapping chamber 62 63 is moved, for example, so as to avoid the passage leading to the outlet as shown. As a result, the objects to be demolished 610 classified as contaminants can be smoothly transported. As a result, lapping work and transport work can be performed smoothly.

ここで、図10に基づいて、特許文献1の解体撤去方法について説明し、本発明の優位性を明らかにする。
特許文献1では、部屋単位で解体するとしており、管理区域レベルが高い方から、低い方の順に解体するとしている。
Here, based on FIG. 10, the dismantling removal method of patent document 1 is demonstrated, and the superiority of this invention is clarified.
In Patent Document 1, the buildings are dismantled on a room-by-room basis, and are dismantled in descending order of management area level.

管理区域レベルは、図10に示すように、汚染度の違いにより、レベル1エリア、レベル2エリア、レベル3エリアに区分けされる。図示の例では、汚染レベルがL1<L2<L3の順に高くなる。
従って、管理区域レベルは、汚染レベルに応じて、レベル3エリアL3>レベル2エリアL2>レベル1エリアL1の順になる。
As shown in FIG. 10, the management area level is divided into level 1 area, level 2 area, and level 3 area depending on the degree of contamination. In the illustrated example, the contamination level increases in the order of L1<L2<L3.
Therefore, the management area levels are in the order of level 3 area L3>level 2 area L2>level 1 area L1 according to the contamination level.

特許文献1では、汚染物の処理を所内処理しながら、施設を解体していく方法である。つまり、処理の過程で処理の順番に沿って、管理区域レベルが高い方から、低い方の順に解体するため、最初の第1段階は、レベル3エリアL3(エリアA)を解体撤去する。次いで第2段階は、レベル2エリアL2(エリアB)を解体撤去する。最後の第3段階は、レベル1エリアL1(エリアC)を解体撤去する。 Patent Literature 1 discloses a method of dismantling facilities while treating pollutants in-house. That is, in order to dismantle in the order of processing from the highest management area level to the lowest management area level in the process of processing, the first step is to dismantle and remove the level 3 area L3 (area A). In the second stage, the level 2 area L2 (area B) is then dismantled. The third and final step is to dismantle the level 1 area L1 (area C).

これに対して、本発明の解体撤去工法は、PCB管理区域に区分されたエリアによらず、搬出口の付近に解体対象物を搬出する仮置きスペースを形成するため、スペースを確保しながら搬出口に近い方から順に奥側に設置された前記汚染物を解体撤去していく。すなわち、搬出口(排出ルート)から順に荷捌きスペースを確保しながら奥へ向かって解体していくことになる。 On the other hand, the dismantling and removal construction method of the present invention forms a temporary storage space for unloading the dismantled object near the exit regardless of the area divided into the PCB management area. The contaminants installed on the far side are dismantled and removed in order from the one closest to the exit. In other words, dismantling is carried out from the carry-out port (discharge route) toward the back while securing the handling space in order.

本発明では、PCB汚染物の外部へ漏洩を防止しながら、解体撤去していくことが好ましい。そのために、従来の管理レベルに関係なく、例えば、屋外から建屋内非汚染エリアまでを第1段階とし(図2参照)、これに続く、建屋内非汚染エリアから汚染エリアまでを第2段階~第5段階とし(図4~図7参照)、エリア管理区分にて解体工事を進めることも好ましい。 In the present invention, it is preferable to dismantle and remove PCB contaminants while preventing leakage to the outside. For that reason, regardless of the conventional management level, for example, the first stage is from the outside to the non-contaminated area inside the building (see Figure 2), and the second stage is from the non-contaminated area inside the building to the contaminated area. In the fifth stage (see FIGS. 4 to 7), it is also preferable to proceed with the dismantling work according to the area management divisions.

建物内部に汚染物がなくなれば、存在しないことを確認後、従前の一般建物解体方法で解体することもできる。 If there is no contaminant inside the building, it can be demolished by the conventional general building demolition method after confirming that there is no contaminant.

本発明において、汚染物だけでなく、足場共通で一緒に解体できるのであれば、非汚染物も解体する方が合理的である。そうすれば排出スペースが広くでき、ストック量を多く滞留できる。このため搬出調整待ちによる手持ちがなくなり、継続的な解体工事が可能となる効果がある。またスペースが広くなることにより、これに接する解体工事が各所で可能になり、工事量の増大による工程の短縮が可能になる。 In the present invention, it is more rational to dismantle non-contaminated materials as well as contaminants if common scaffolding can be dismantled together. By doing so, the discharge space can be widened, and a large amount of stock can be retained. Therefore, there is no need to wait for carry-out adjustment, and continuous dismantling work is possible. In addition, since the space is widened, it is possible to carry out demolition work in various places in contact with it, and it is possible to shorten the process due to the increase in the amount of work.

特許文献1の解体撤去工法と、本発明の作用効果の差異を整理すると、以下のように表すこともできる。 The difference between the dismantling and removal construction method of Patent Document 1 and the effects of the present invention can be summarized as follows.

第1に、特許文献1の解体撤去工法では、高濃度PCBが存在している状態で、管理区域の汚染度の高い区域から、低い区域に向かって、除染をしながら解体撤去するのに対して、本発明では、高濃度PCBはすでに除染されて、低濃度PCBの汚染物、若しくは非汚染物になっている状態で、搬出口側から奥に向かって解体撤去するので、結果として、管理区域の汚染度の低い方から高い方に向かって搬出することになるので、搬出作業の安全性が確保される。さらに、本発明は、高濃度PCBが無い状態での解体物の取扱いになり、コンタミ防止が可能になる。 First, in the dismantling and removal method of Patent Document 1, in the state where high-concentration PCB exists, it is difficult to dismantle and remove while decontaminating from the high-contaminated area of the controlled area toward the low-contaminated area. On the other hand, in the present invention, high-concentration PCBs are already decontaminated and are dismantled and removed from the carry-out port toward the back in a state of being contaminated or non-contaminated with low-concentration PCBs. , the safety of the unloading work is ensured because the unloading is carried out from the area with the lowest contamination to the highest in the controlled area. Furthermore, the present invention enables the handling of dismantled objects in the absence of high-concentration PCBs, making it possible to prevent contamination.

第2に、特許文献1の解体撤去工法では、搬出ルート、搬出サイズが限定されるのに対して、本発明では、搬出ルート、搬出サイズは自由で制限がない効果がある。 Secondly, in the dismantling and removal method of Patent Document 1, the carry-out route and carry-out size are limited.

第3に、特許文献1の解体撤去工法では、搬出ストック空き地がないのに対して、本発明では、搬出口側(出口側)に大きなスペースを確保できる効果がある。 Thirdly, in the dismantling and removal method of Patent Document 1, there is no vacant land for carry-out stock, but in the present invention, there is an effect that a large space can be secured on the carry-out side (exit side).

第4に、特許文献1の解体撤去工法では、空き地は高濃度区域から空いてくるのに対して、本発明では、空地が多く、貯留でき、搬出調整ができ、搬出時の手待ちの発生がない効果がある。 Fourthly, in the dismantling and removal method of Patent Document 1, vacant lots are vacant from high-concentration areas, whereas in the present invention, there are many vacant lots, storage is possible, carrying out can be adjusted, and waiting time occurs at the time of carrying out. There is no effect.

第5に、特許文献1の解体撤去工法では、汚染物の処理は所内処理が前提であるのに対して、本発明では、無害化処理施設送りが前提である。 Fifthly, in the dismantling and removal method of Patent Document 1, in-house treatment is the premise for the treatment of contaminated matter, whereas in the present invention, it is premised to be sent to a detoxification treatment facility.

第6に、特許文献1の解体撤去工法では、管理区分ごとに段階踏んで解体撤去していくのに対して、本発明では、管理区分によらず、同時に複数個所の解体ができ、汚染物搬出が短期で済む効果がある。 Sixthly, in the dismantling and removal method of Patent Document 1, dismantling and removal are performed step by step for each management division, whereas in the present invention, multiple locations can be dismantled at the same time regardless of the management division, and contaminants can be removed. There is an effect that the transportation can be completed in a short period of time.

第7に、特許文献1の解体撤去工法では、汚染物の除染から解体までを所内処理で行っており、結果として、解体対象物の搬送作業の手間がかかる工法にならざるを得ないため、解体工程が長いのに対して、本発明では、解体工程が短期で済む効果がある。 Seventhly, in the dismantling and removal method of Patent Document 1, everything from decontamination of contaminants to dismantling is carried out in-house, and as a result, the method inevitably takes time and effort to transport the dismantled object. In contrast to the long dismantling process, the present invention has an effect that the dismantling process can be completed in a short period of time.

次に本発明の他の好ましい態様を説明する。
他の好ましい態様は、PCB処理施設全体を覆う上屋テントを設置せず、既設の換気・排気設備を使用しながら前記汚染物を解体撤去することである。この態様を図11に示す。
Another preferred embodiment of the present invention will now be described.
Another preferred mode is to dismantle and remove the contaminants while using the existing ventilation and exhaust equipment without installing a shed tent covering the entire PCB processing facility. This aspect is shown in FIG.

PCBの外部漏洩を防止するため、図11の左図のように、上屋テントを設置するケースがある。図11の左図は、建物7の上部に、上屋テント8を設置した態様で、仮設設置型である。9は換気排気設備である。 In order to prevent PCB from leaking to the outside, there is a case where a shed tent is installed as shown in the left diagram of FIG. The left figure of FIG. 11 shows a mode in which a shed tent 8 is installed on top of a building 7, which is a temporary installation type. 9 is ventilation exhaust equipment.

しかし、建物外壁が堅固なものであり気密性が保たれた場合には、建物外壁での気密性保持が可能であり、上屋テント8は不要である。図11の右図は、建物外壁が堅固なものであり気密性が保たれているので、建物外壁での気密性保持が可能であり、上屋テント8は省略されている。この態様は、既設流用型と称される。 However, if the outer wall of the building is solid and airtight, it is possible to maintain airtightness at the outer wall of the building, and the roof tent 8 is unnecessary. In the right view of FIG. 11, since the outer wall of the building is solid and airtight, it is possible to maintain the airtightness at the outer wall of the building, and the roof tent 8 is omitted. This mode is called an existing diversion type.

図11の左図に示すような、解体時に新たな仮設の換気排気設備を設けて解体工事を行う場合に比べ、図11の右図に示す態様では、既設を流用し、建屋内の負圧管理を行うので、上屋テントの設置工事が不要であり、工期の短縮及び経済的に有利である。 Compared to the case where a new temporary ventilation and exhaust system is installed at the time of demolition, as shown in the left diagram of FIG. 11, in the mode shown in the right diagram of FIG. Since it is managed, there is no need to install a shed tent, which is advantageous for shortening the construction period and economically.

既設流用型の図11の右図のように、既設の換気排気を24時間稼働しながらの汚染物解体を行う。この際、仮設の換気排気設備は不要である。
この態様では、建物7内の換気排気設備9に導入する各室から吸引ダクト類90や排出ダクト類91も既設を流用でき、新たなダクト類を仮設することも不要になる。
As shown in the right figure of Fig. 11, the existing equipment is reused. In this case, no temporary ventilation and exhaust equipment is required.
In this embodiment, existing suction ducts 90 and discharge ducts 91 can be reused from each room introduced into the ventilation exhaust system 9 in the building 7, and temporary installation of new ducts is unnecessary.

なお、管理区域が異なる部屋の解体工法においては、それぞれの制御室圧が同じになるように設定すれば、間仕切壁撤去に伴う気流によるPCB汚染物の再飛散などを防止でき、コンタミ防止に役立つ。 In the demolition method for rooms with different management areas, if the control room pressure is set to be the same for each control room, it is possible to prevent re-scattering of PCB contaminants due to the air currents associated with the removal of partition walls, which is useful for preventing contamination. .

本発明の好ましい態様によれば、PCB処理施設全体を覆う上屋テントを設置せず、既設の換気・排気設備を使用しながら汚染物を解体撤去することである。 According to a preferred aspect of the present invention, the contaminants are dismantled and removed while using the existing ventilation and exhaust equipment without installing a shed tent covering the entire PCB processing facility.

この態様の作用効果を概略説明すると、第1に、既設の換気排気装置を使うことで、汚染物解体時での建物からの有害物質の飛散はなく、近隣への環境汚染は防止できる効果がある。 To briefly explain the effects of this mode, firstly, by using the existing ventilation exhaust system, there is no scattering of harmful substances from the building when dismantling pollutants, and there is an effect of preventing environmental pollution to the neighborhood. be.

また第2に、上屋テント設置の場合、上屋テント用に新たに仮設の換気排気装置を設置する必要があるが、この態様では、上屋テントを設置しないので、仮設の換気排気装置を設置する必要がない。 Secondly, in the case of installing a shed tent, it is necessary to newly install a temporary ventilation and exhaust system for the shed tent. No need to install.

さらに第3に、堅牢な気密性を有する既設建物の外壁を用いることにより、上屋テントを設置したと同じ効果を得ることができる。 Furthermore, thirdly, by using the outer wall of the existing building having strong airtightness, it is possible to obtain the same effect as installing a shed tent.

更に又、第4に、上屋テントの設置工事が大工事であるだけでなく、上屋テント基礎工事は、杭を数十本打設しなければならないのに対して、本発明ではテント用基礎工事を省略できる。また、上屋テント自体が汚染され、汚染廃棄物となるような事態を避けることができる。 Fourthly, not only is the installation work of a shed tent a large-scale construction work, but also dozens of piles must be driven for the shed tent foundation work. Foundation work can be omitted. Also, it is possible to avoid a situation in which the shed tent itself becomes contaminated and becomes contaminated waste.

更に第5に、本発明では、汚染物解体期間であっても、既設の居室は使用が可能である。 Furthermore, fifthly, according to the present invention, the existing living room can be used even during the pollutant dismantling period.

更に第6に、工事期間中で作業員が一番多い時期は、汚染物解体期間であるから、この時、既設を流用できれば、工事用仮設ハウスが小規模で済む。 Sixthly, since the period during which the number of workers is the greatest during the construction period is during the period of dismantling the polluted materials, if the existing facilities can be used at this time, the temporary construction house can be small.

更に第7に、汚染物の解体撤去が終了後には、汚染物が全て搬出され、残りは非汚染物の建物、設備になるので、一般の建築物の解体と、同じ工法で解体できる。 Furthermore, seventhly, after the dismantling and removal of the pollutants is completed, all the pollutants are carried out, and the remaining buildings and facilities become non-polluted buildings, so that they can be demolished by the same method as the demolition of general buildings.

以上のような効果に加え、既存の換気設備を利用し、汚染エリア3の汚染度の高いエリアを負圧にして、それ以外のエリアとの室圧差を形成する仕組みを構築することにより、汚染物解体時での汚染エリア3から非汚染エリア2への有害物質の飛散がなくなり、外部への環境汚染を確実に防止することができる。 In addition to the above effects, by using the existing ventilation equipment and creating a mechanism to create a room pressure difference between the highly contaminated area of the contaminated area 3 and the other areas by creating a negative pressure, the contamination Hazardous substances do not scatter from the contaminated area 3 to the non-contaminated area 2 during the dismantling of objects, and environmental pollution to the outside can be reliably prevented.

さらに、上述した図9、図10のように、ラッピング室62を設けた場合には、ラッピング室62は、仮置きスペース6の一部に設置されるため、非汚染エリア3と汚染エリア2との境界に形成され、これに既存の換気設備を利用することが好ましい。 Furthermore, as shown in FIGS. 9 and 10 described above, when the wrapping room 62 is provided, the wrapping room 62 is installed in a part of the temporary storage space 6. is formed at the boundary of the , and preferably utilizes existing ventilation facilities for this.

ラッピング室62と、汚染エリア3と非汚染エリア2との間で、既存の換気設備を利用することにより、汚染エリア3が最も負圧にし、、ラッピング室62、非汚染エリア2の順に圧力を高くし、室圧差を形成する。 By using the existing ventilation equipment between the lapping room 62 and the contaminated area 3 and the non-contaminated area 2, the contaminated area 3 has the most negative pressure, and the pressure is increased in the order of the lapping room 62 and the non-contaminated area 2. high to form a chamber pressure difference.

さらに、非汚染エリア2と大気との間でも、大気側に気流が発生しないように、大気よりも非汚染エリアを負圧にする。具体的には、非汚染エリアに形成した仮置きスペース6は、搬出口4を介して、大気との境界となるため、仮置きスペース6についても、外部(大気)との室圧差を設け、仮置きスペース6を、大気よりも負圧になるように設定しておくことが好ましい。これにより、汚染物質の大気への流出をより確実に防ぐことができる。 Furthermore, the non-polluted area is made to have a lower pressure than the atmosphere so that an air current is not generated between the non-polluted area 2 and the atmosphere. Specifically, since the temporary storage space 6 formed in the non-contaminated area becomes a boundary with the atmosphere via the outlet 4, the temporary storage space 6 is also provided with a room pressure difference with the outside (atmosphere), It is preferable to set the temporary storage space 6 so that the pressure is lower than the atmospheric pressure. This makes it possible to more reliably prevent pollutants from leaking into the atmosphere.

このように室圧差を形成する仕組みを構築しておくことにより、これらの室圧差を適切にコントロールでき、どのような状況でも、大気への汚染物質の流出を防ぐことができ、環境汚染をより確実に防止することができる。 By constructing a mechanism that creates a difference in room pressure in this way, it is possible to appropriately control these differences in room pressure, prevent pollutants from leaking into the atmosphere under any circumstances, and reduce environmental pollution. can be reliably prevented.

1 :PCB処理施設
2 :非汚染エリア
3 :汚染エリア
4 :搬出口
6 :仮置きスペース
6a :非汚染エリアの一部エリア
6b :除染処理により非汚染レベルまで低減したエリア
7 :建物
8 :上屋テント
9 :換気排気設備
90 :吸引ダクト類
91 :排出ダクト類
10 :建屋
61 :解体部
610 :解体対象物
62 :ラッピング室
620 :搬入扉
621 :搬出扉
63 :解体対象物
1: PCB processing facility 2: Non-contaminated area 3: Contaminated area 4: Unloading exit 6: Temporary storage space 6a: Part of non-contaminated area 6b: Area reduced to non-contaminated level by decontamination treatment 7: Building 8: Shed tent 9: Ventilation and exhaust equipment 90: Suction ducts 91: Exhaust ducts 10: Building 61: Dismantling section 610: Object to be dismantled 62: Wrapping room 620: Carry-in door 621: Carry-out door 63: Object to be dismantled

Claims (8)

PCB処理施設に存在する機器、装置、配管、配線又は建築物を含む全ての解体対象物を解体して撤去する際に、
PCB処理施設の建屋内の搬出口付近の非汚染エリアに、前記解体対象物を解体撤去して、前記解体対象物を仮置きする仮置きスペースを形成し、
前記仮置きスペースに、解体対象物のうち汚染物に区分された解体対象物を搬出して、所定期間待機させ、
前記仮置きスペースは、非汚染エリアの一部のエリアと、除染処理により非汚染レベルまで低減したエリアとを含む、
ことを特徴とするPCB処理施設の解体撤去方法。
When dismantling and removing all objects to be dismantled, including equipment, devices, pipes, wiring, or buildings existing in the PCB processing facility,
Dismantling and removing the object to be dismantled to form a temporary storage space for temporarily placing the object to be dismantled in a non-contaminated area near the exit in the building of the PCB processing facility;
out of the objects to be dismantled, the objects to be dismantled classified as contaminants into the temporary storage space, and waiting for a predetermined period of time ;
The temporary storage space includes a part of the non-contaminated area and an area reduced to a non-contaminated level by decontamination treatment,
A method for dismantling and removing a PCB processing facility, characterized by:
解体対象物のうち非汚染物に区分された解体対象物は、前記汚染物の搬出に邪魔な前記非汚染物を搬出口に向かう通路から離れた位置に移動させた後、解体対象物のうち汚染物に区分された解体対象物を前記仮置きスペースに搬出する、
ことを特徴とする請求項記載のPCB処理施設の解体撤去方法。
Among the objects to be demolished, the objects to be demolished classified as non-contaminated objects are removed from the objects to be demolished after the non-contaminated objects that hinder the carrying out of the contaminated objects are moved to a position away from the passage leading to the outlet. Carrying out the objects to be dismantled classified as contaminants to the temporary storage space;
The method for dismantling and removing a PCB processing facility according to claim 1 , characterized in that:
解体対象物のうち非汚染物に区分された解体対象物のうち前記汚染物の搬出口に向かう通路の邪魔にならない前記非汚染物は残置し、前記仮置きスペースに解体対象物のうち前記汚染物に区分された解体対象物を搬出する、
ことを特徴とする請求項1又は2記載のPCB処理施設の解体撤去方法。
Among the objects to be dismantled classified as non-contaminated objects, the non-contaminated objects that do not interfere with the passage leading to the discharge port for the contaminated objects are left, and the contaminated objects among the objects to be dismantled are placed in the temporary storage space. Carrying out the objects to be dismantled that have been classified into objects,
The method for dismantling and removing a PCB processing facility according to claim 1 or 2 , characterized in that:
前記仮置きスペースの一部に、出入口が同時に開かない仮設扉が設けられたラッピング室を設ける、
ことを特徴とする請求項記載のPCB処理施設の解体撤去方法。
In a part of the temporary storage space, a wrapping room provided with a temporary door that does not open at the same time is provided.
The method for dismantling and removing a PCB processing facility according to claim 1 , characterized in that:
前記ラッピング室は、前記除染処理により非汚染レベルまで低減したエリアに設けられる、
ことを特徴とする請求項記載のPCB処理施設の解体撤去方法。
The lapping room is provided in an area reduced to a non-contaminated level by the decontamination treatment,
The method for dismantling and removing a PCB processing facility according to claim 4 , characterized in that:
前記ラッピング室には、ラッピングマシーンが設けられ、該ラッピングマシーンにより前記汚染物に区分された解体対象物をラッピングする、
ことを特徴とする請求項4又は5記載のPCB処理施設の解体撤去方法。
A lapping machine is provided in the lapping chamber, and the lapping machine wraps the objects to be dismantled classified as the contaminants.
The method for dismantling and removing a PCB treatment facility according to claim 4 or 5 , characterized in that:
PCB処理施設全体を覆う上屋テントを設置せず、既設の換気・排気設備を使用し、汚染エリアの汚染度の高いエリアを負圧にして、それ以外のエリアとの室圧差を形成し、前記汚染物に区分された解体対象物を解体撤去する、
ことを特徴とする請求項1~6の何れかに記載のPCB処理施設の解体撤去方法。
Instead of installing a roof tent that covers the entire PCB processing facility, use the existing ventilation and exhaust equipment, create a negative pressure in the highly contaminated area of the contaminated area, and create a room pressure difference with other areas. Dismantling and removing the objects to be dismantled classified as the pollutants;
The method for dismantling and removing a PCB processing facility according to any one of claims 1 to 6 , characterized in that:
PCB処理施設全体を覆う上屋テントを設置せず、既設の換気・排気設備を使用し、前記ラッピング室を負圧にし、該ラッピング室以外のエリアとの室圧差を形成し、前記汚染物に区分された解体対象物をラッピングする、
ことを特徴とする請求項4、5又は6記載のPCB処理施設の解体撤去方法。
Instead of installing a shed tent that covers the entire PCB processing facility, the existing ventilation and exhaust equipment is used, the pressure in the wrapping room is set to negative pressure, and a room pressure difference with the area other than the wrapping room is formed to prevent the contaminants from Wrapping the classified dismantling objects,
The method for dismantling and removing a PCB processing facility according to claim 4, 5 or 6 , characterized in that:
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JP2018204283A (en) 2017-06-02 2018-12-27 株式会社神鋼環境ソリューション Demolition method of pcb treatment facilities
JP2021026643A (en) 2019-08-08 2021-02-22 株式会社東芝 Process control system and process control method

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JP2013139689A (en) 2012-01-05 2013-07-18 Taisei Corp Splash prevention structure and method for removing outside sprayed object
JP6031406B2 (en) 2013-05-09 2016-11-24 新日鉄住金エンジニアリング株式会社 Dismantling and removal method for PCB waste disposal facilities
JP2018204283A (en) 2017-06-02 2018-12-27 株式会社神鋼環境ソリューション Demolition method of pcb treatment facilities
JP2021026643A (en) 2019-08-08 2021-02-22 株式会社東芝 Process control system and process control method

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