JP2018188494A - Encapsulation resin composition and method for manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an encapsulation resin composition that reduces warpage of a substrate in an electronic device and develops adhesiveness and filling property in a balanced manner.SOLUTION: The encapsulation resin composition of the present invention comprises an epoxy resin, a curing agent, a filler, a silane coupling agent and a low-stress agent. The silane coupling agent is represented by general formula (1) below, and the content of the silane coupling agent in the encapsulation resin composition is 0.4 mass% or more and 2.0 mass% or less with respect to the total solid content of the encapsulation resin composition. The content of the low-stress agent is 1.0 mass% or more and 7.0 mass% or less with respect to the total solid content of the encapsulation resin composition. In general formula (1), Rand Reach independently represent an organic group having 1 to 30 carbon atoms; and a plurality of A each independently represents an organic group having 1 to 30 carbon atoms, where the plurality of A may be the same or different from one another, and at least one of the plurality of A is an alkoxy group having 1 to 30 carbon atoms.SELECTED DRAWING: None

Description

  The present invention relates to a sealing resin composition and an electronic device manufacturing method.

  Various techniques have been developed as a resin composition for sealing in order to obtain a cured product that is excellent in moisture resistance even in a high humidity environment without impairing workability. As this type of technology, for example, the technology described in Patent Document 1 can be cited. According to Patent Document 1, it is described that an epoxy resin, an epoxy resin curing agent, N-phenylaminopropyltrimethoxysilane as a surfactant, and a filler are essential components.

Japanese Patent Laid-Open No. 2002-17984

  In the production process of an electronic device, the present inventors sealed an electronic component disposed on a substrate using a sealing resin composition, and further cured the sealing resin composition. The warpage of the base material was examined. As a result, when the sealing resin composition described in Patent Document 1 is used, the warping of the base material is large, and the base material cannot be processed after the sealing resin composition is cured. I found it.

Then, the present inventors examined the component added to the resin composition for sealing, in order to suppress the curvature of a base material. As a result, it has been found that when a low-stress agent such as a silicone compound is added to the sealing resin composition, the warpage of the substrate can be reduced.
However, when a low stress agent is added to the encapsulating resin composition, there is a disadvantage that the adhesion between the encapsulating resin composition and the substrate is lowered. Furthermore, when a low-stress agent is added to the sealing resin composition, for example, when an electronic device in which chips such as a multichip / stacked CPS are stacked in multiple stages is manufactured, the filling property into the gap between the chips is reduced. There was an inconvenience of doing so.
As described above, the reduction in the warpage of the base material in the electronic device and the adhesion and filling properties of the sealing resin composition were in a trade-off relationship. Then, this invention makes it a subject to provide the resin composition for sealing which reduces the curvature of the base material in an electronic device, and expresses adhesiveness and filling property with sufficient balance.

In order to reduce the warpage of the substrate, the present inventors have considered adding a silane coupling agent having a specific structure and a low stress agent to the sealing resin composition within a specific numerical range, respectively. did. As a result, it has been found that the warpage of the substrate can be reduced and the adhesion and filling properties can be expressed in a balanced manner.
As described above, the present inventors have found that a silane coupling agent having a specific structure and a low stress agent are added to a sealing resin composition within a specific numerical range, and the present invention has been completed.

According to the present invention,
Epoxy resin,
A curing agent;
A filler,
A silane coupling agent;
A low stress agent,
The silane coupling agent is represented by the following general formula (1):
Content of the said silane coupling agent in the resin composition for sealing is 0.4 mass% or more and 2.0 mass% or less with respect to the total solid of the resin composition for sealing,
A sealing resin composition is provided in which the content of the low stress agent is 1.0% by mass or more and 7.0% by mass or less with respect to the total solid content of the sealing resin composition.

（上記一般式（１）において、Ｒ^１及びＲ^２は、それぞれ独立して炭素数１以上３０以下の有機基を表す。
複数のＡは、それぞれ独立して炭素数１以上３０以下の有機基を表す。複数のＡは互いに同一でもよく、互いに異なっていてもよい。複数のＡのうち少なくとも一つは炭素数１以上３０以下のアルコキシ基である。）

(In the general formula (1), R ¹ and R ² each independently represents an organic group having 1 to 30 carbon atoms.
A plurality of A each independently represents an organic group having 1 to 30 carbon atoms. A plurality of A may be the same or different from each other. At least one of the plurality of A is an alkoxy group having 1 to 30 carbon atoms. )

According to the present invention,
An arrangement step of arranging electronic components on the substrate;
A method for manufacturing an electronic device is provided, which includes a sealing step of sealing an electronic component using the sealing resin composition.

  ADVANTAGE OF THE INVENTION According to this invention, the resin composition for sealing which reduces the curvature of the base material in an electronic device and expresses adhesiveness and filling property with sufficient balance is provided.

It is sectional drawing which shows an example of the manufacturing method of the electronic device which concerns on this embodiment. It is sectional drawing which shows an example of the manufacturing method of the electronic device which concerns on this embodiment. It is sectional drawing which shows an example of the manufacturing method of the electronic device which concerns on this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components and the description thereof is omitted.

  The sealing resin composition of the present embodiment includes an epoxy resin, a curing agent, a filler, a silane coupling agent, and a low stress agent, and the silane coupling agent has the following general formula (1) The content of the silane coupling agent is 0.4% by mass or more and 2.0% by mass or less with respect to the total solid content of the sealing resin composition, and the content of the low stress agent The amount is 1.0% by mass or more and 7.0% by mass or less with respect to the total solid content of the encapsulating resin composition.

（上記一般式（１）において、Ｒ^１及びＲ^２は、それぞれ独立して炭素数１以上３０以下の有機基を表す。
複数のＡは、それぞれ独立して炭素数１以上３０以下の有機基を表す。複数のＡは互いに同一でもよく、互いに異なっていてもよい。複数のＡのうち少なくとも一つは炭素数１以上３０以下のアルコキシ基である。）

(In the general formula (1), R ¹ and R ² each independently represents an organic group having 1 to 30 carbon atoms.
A plurality of A each independently represents an organic group having 1 to 30 carbon atoms. A plurality of A may be the same or different from each other. At least one of the plurality of A is an alkoxy group having 1 to 30 carbon atoms. )

  For example, in the production process of a wafer level package, the present inventors seal a circuit disposed on a wafer with a sealing resin composition, and cure the wafer when the sealing resin composition is cured. We examined warping. As a result, it has been found that when a conventional sealing resin composition is used, the wafer is warped so that the wafer cannot be processed after the sealing resin composition is cured. Here, it was estimated that the warpage of the wafer was caused by internal stress at the time of curing of the sealing resin composition.

Therefore, the present inventors have examined components added to the sealing resin composition in order to suppress warpage of a substrate such as a wafer in an electronic device formed of the sealing resin composition. As a result, it has been found that the addition of a low stress agent such as a silicone compound has a good effect in reducing the warpage of the substrate.
However, when the low stress agent is added to the sealing resin composition, the low stress agent is dispersed on the surface of the sealing resin composition. Thereby, there existed a problem that the adhesiveness of the resin composition for sealing and a base material will fall.
Furthermore, the low-stress agent is more viscous than components other than the low-stress agent such as an epoxy resin contained in the sealing resin composition. Thereby, when the resin composition for sealing contains a low stress agent, the resin composition for sealing will become high viscosity compared with the case where it does not contain a low stress agent. Here, in an electronic device in which chips such as a multichip / stacked CPS are stacked in multiple stages, a gap between the chips is as narrow as 10 μm, for example. When the sealing resin composition is filled in such a narrow gap, there is a disadvantage that the filling becomes incomplete if the sealing resin composition has a high viscosity.
As described above, the reduction in the warpage of the base material in the electronic device and the adhesion and filling properties of the sealing resin composition were in a trade-off relationship.

First, the present inventors examined the structure and addition amount of a silane coupling agent in order to reduce the warpage of the substrate. As a result, it was found that adding a specific amount of the silane coupling agent having a specific structure represented by the general formula (1) described above is effective in reducing the warpage of the substrate. Furthermore, it has been found that adhesion and filling properties can be expressed in a balanced manner by adding a specific amount of the silane coupling agent having a specific structure. The detailed mechanism is not clear, but the reason is presumed as follows.
It is presumed that the molecular chain of the silane coupling agent having the above specific structure is incorporated into a crosslinked structure formed by the sealing resin composition upon curing. The molecular chain of the silane coupling agent is considered to behave as a flexible segment in the crosslinked structure. Thereby, it is thought that the said flexible segment can relieve | moderate the internal stress which arises when the resin composition for sealing hardens | cures, and can reduce the curvature of a base material.
Moreover, it is thought that the alkoxy silyl group of the said specific silane coupling agent which is not incorporated in the said crosslinked structure among the said specific silane coupling agents and is free is condensed with the hydroxyl group which exists in the base-material surface. Thereby, it is thought that the adhesiveness with respect to the base material of the resin composition for sealing can be improved.
Furthermore, it is estimated that the increase in the viscosity at the time of shaping | molding of the resin composition for sealing can be suppressed because the molecular chain of the said specific silane coupling agent is integrated in the crosslinked structure of the resin composition for sealing. Thereby, it is thought that the filling property of the resin composition for sealing can be improved.

And the present inventors examined using the said specific silane coupling agent and a low stress agent together in order to reduce the curvature of a base material further. As a result, by combining the specific silane coupling agent and the low stress agent, and making the content of the specific silane coupling agent and the low stress agent within a specific numerical range described later, the warpage of the base material is reduced. It was found that adhesion and filling properties can be expressed in a well-balanced manner while further reducing.
From the above, it is presumed that the sealing resin composition according to the present embodiment can reduce the warpage of the substrate in the electronic device and can exhibit the adhesiveness and the filling property in a balanced manner.

  Hereinafter, each component which comprises the resin composition for sealing which concerns on this embodiment is explained in full detail.

(Epoxy resin)
The sealing resin composition according to this embodiment includes an epoxy resin. It is not limited as an epoxy resin, It is possible to use the monomer, oligomer, and polymer in general which have two or more epoxy groups in 1 molecule irrespective of the molecular weight and molecular structure.
Specific examples of the epoxy resin include, for example, biphenyl type epoxy resin; bisphenol type epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin and tetramethylbisphenol F type epoxy resin; stilbene type epoxy resin; phenol novolac type epoxy Resin, novolac epoxy resin such as cresol novolac epoxy resin; polyfunctional epoxy resin such as triphenylmethane epoxy resin exemplified by triphenolmethane epoxy resin, alkyl-modified triphenolmethane epoxy resin, etc .; Phenol aralkyl epoxy resin having phenylene skeleton, naphthol aralkyl epoxy resin having phenylene skeleton, phenol aralkyl epoxy resin having biphenylene skeleton, biphenyl A phenol aralkyl epoxy resin such as a naphthol aralkyl epoxy resin having a skeleton, a dihydroxy naphthalene epoxy resin, a naphthol epoxy resin such as an epoxy resin obtained by glycidyl etherification of a dihydroxy naphthalene dimer, triglycidyl isocyanurate, Examples include triazine nucleus-containing epoxy resins such as monoallyl diglycidyl isocyanurate; and bridged cyclic hydrocarbon compound-modified phenol type epoxy resins such as dicyclopentadiene-modified phenol type epoxy resins. As the epoxy resin, one of these may be used alone, or two or more different types may be used in combination.
As the epoxy resin, it is preferable to use one or more selected from the group consisting of biphenyl type epoxy resin, novolak type epoxy resin and polyfunctional epoxy resin among the above specific examples. It is more preferable to use a functional epoxy resin. Thereby, although a detailed mechanism is not certain, it is estimated that the molecular chain of the silane coupling agent is more appropriately incorporated into the crosslinked structure of the sealing resin composition. Therefore, the warp of the substrate can be reduced and the filling property can be improved.

In the present embodiment, the lower limit of the content of the epoxy resin in the sealing resin composition is, for example, 1% by mass or more with respect to 100% by mass of the total solid content of the sealing resin composition. Preferably, it is 2 mass% or more. Thereby, the fluidity | liquidity of the resin composition for sealing at the time of shaping | molding can be set appropriately. Therefore, the filling property can be improved.
The upper limit value of the content of the epoxy resin in the sealing resin composition is preferably 15% by mass or less, for example, with respect to 100% by mass of the total solid content of the sealing resin composition. The content is more preferably at most 5 mass%, further preferably at most 5 mass%. Although the detailed mechanism is not clear, it is presumed that the linear expansion coefficient can be reduced by this. Therefore, the internal stress when the sealing resin composition is cured can be reduced, and the warpage of the substrate can be reduced.
In the present embodiment, the total solid content of the encapsulating resin composition indicates the total of all the components contained excluding the solvent.

(Curing agent)
The sealing resin composition according to this embodiment includes a curing agent. Specific examples of the curing agent contained in the encapsulating resin composition include a polyaddition type curing agent, a catalyst type curing agent, and a condensation type curing agent.

  Specific examples of the polyaddition type curing agent used as the curing agent include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylylenediamine (MXDA), and diaminodiphenylmethane (DDM). , M-phenylenediamine (MPDA), aromatic polyamines such as diaminodiphenyl sulfone (DDS), polyamine compounds including dicyandiamide (DICY), organic acid dihydrazide, etc .; hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride Acid anhydrides including alicyclic acid anhydrides such as (MTHPA), trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenone tetracarboxylic acid (BTDA); Type Examples include phenolic resin-based curing agents such as diol resins, polyvinylphenols, and aralkyl-type phenolic resins; polymercaptan compounds such as polysulfides, thioesters, and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; and carboxylic acid-containing polyester resins. . As a polyaddition type hardening | curing agent, the 1 type (s) or 2 or more types selected from the said specific example can be included.

  Specific examples of the catalyst-type curing agent used as the curing agent include tertiary amine compounds such as benzyldimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); Examples include imidazole compounds such as methylimidazole and 2-ethyl-4-methylimidazole (EMI24); Lewis acids such as BF3 complex. As a catalyst type hardening | curing agent, the 1 type (s) or 2 or more types selected from the said specific example can be included.

  Specific examples of the condensation type curing agent used as the curing agent include a resol type phenol resin; a urea resin such as a methylol group-containing urea resin; and a melamine resin such as a methylol group-containing melamine resin. As the condensation type curing agent, one type or two or more types selected from the above specific examples can be included.

Among the curing agents, the sealing resin composition according to the present embodiment preferably includes a phenol resin curing agent.
As the phenol resin-based curing agent, monomers, oligomers and polymers in general having two or more phenolic hydroxyl groups in one molecule can be used, and the molecular weight and molecular structure are not limited.
Specific examples of the phenol resin-based curing agent used as the curing agent include novolak type phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol novolak, and phenol-biphenyl novolak resin; polyvinyl phenol; triphenylmethane type phenol resin, and the like. Polyfunctional phenolic resin; modified phenolic resin such as terpene modified phenolic resin, dicyclopentadiene modified phenolic resin; phenol aralkyl resin having phenylene skeleton and / or biphenylene skeleton, naphthol aralkyl resin having phenylene and / or biphenylene skeleton, etc. Phenol aralkyl type phenol resin; Bisphenol compounds such as bisphenol A, bisphenol F, and the like. As a phenol resin hardening | curing agent, the 1 type (s) or 2 or more types selected from the said specific example can be included.
As a phenol resin type hardening | curing agent, it is preferable to include the 1 type (s) or 2 or more types selected from the group which consists of a novolak type phenol resin and a polyfunctional type phenol resin among the said specific examples.
Moreover, as a novolak-type phenol resin, it is preferable to use a phenol novolak resin among the said specific examples. Among the specific examples, the polyfunctional phenol resin preferably includes a triphenylmethane phenol resin. Thereby, the fluidity | liquidity at the time of shaping | molding can be improved. Therefore, the filling property can be improved.

In the present embodiment, the upper limit value of the content of the curing agent in the sealing resin composition is preferably 10.0% by mass or less with respect to the total solid content of the sealing resin composition, for example. More preferably, it is 7.0 mass% or less, More preferably, it is 5.0 mass% or less, More preferably, it is 3.0 mass% or less. Thereby, the fluidity | liquidity at the time of shaping | molding can be improved. Therefore, the filling property can be improved.
Moreover, it is preferable that the lower limit of content of the hardening | curing agent in the resin composition for sealing is 0.3 mass% or more with respect to the total solid of the resin composition for sealing, for example, 0.5 The content is more preferably at least mass%, and further preferably at least 1.0 mass%. Thereby, the cure rate of the sealing resin composition can be adjusted appropriately. Therefore, it is possible to suppress an increase in internal stress due to the progress of the local curing reaction.

(Filler)
As the filler, an appropriate filler can be selected according to the mechanical characteristics required for the electronic device.
Specific examples of the filler include an inorganic filler and an organic filler. Among the above specific examples, the filler preferably includes an inorganic filler. Thereby, the thermal expansion coefficient of the resin composition for sealing can be reduced.

Specific examples of the inorganic filler include silica such as fused crushed silica, fused spherical silica, crystalline silica, secondary agglomerated silica, and finely divided silica; alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, carbonized Metal compounds such as silicon, aluminum hydroxide, magnesium hydroxide and titanium white; talc; clay; mica; glass fiber and the like. As an inorganic filler, it can use 1 type or in combination of 2 or more types among the said specific examples.
Among the above specific examples, the inorganic filler preferably contains one or more selected from the group consisting of fused spherical silica, fused crushed silica, crystalline silica, talc, titanium white, silicon nitride, and alumina. It is more preferable to use one or more selected from the group consisting of fused spherical silica, fused crushed silica, and crystalline silica. As a result, the detailed mechanism is not clear, but it is presumed that the silane coupling agent interacts suitably with the inorganic filler, and the dispersibility of the silane coupling agent in the sealing resin composition can be improved. . Therefore, the molecular chain of the silane coupling agent is more appropriately incorporated into the crosslinked structure, and the internal stress can be reduced. As described above, the warpage of the substrate can be reduced.

  Specific examples of the organic filler include organosilicone powder and polyethylene powder. As an organic filler, it can use 1 type or in combination of 2 or more types among the said specific examples.

The lower limit of the content of the filler in the encapsulating resin composition is preferably 60% by mass or more, for example, 70% by mass with respect to 100% by mass of the total solid content of the encapsulating resin composition. More preferably, it is preferably 80% by mass or more. Thereby, contribution of a filler can be enlarged among contribution of each component in the resin composition for sealing with respect to physical properties, such as a thermal expansion coefficient of a resin composition for sealing, and a bending elastic modulus. That is, the sealing resin composition can reflect the physical properties of the filler. Therefore, an increase in the flexural modulus can be suppressed while reducing the thermal expansion coefficient. Therefore, an increase in internal stress can be suppressed and warpage of the substrate can be reduced.
The upper limit of the content of the filler in the encapsulating resin composition is preferably 95% by mass or less, for example, with respect to 100% by mass of the total solid content of the encapsulating resin composition. The content is more preferably at most mass%, and preferably at most 93 mass%. Thereby, it can suppress that the viscosity of the resin composition for sealing raises too much, and can improve filling property.

The upper limit value of the volume-based cumulative 50% particle size D ₅₀ of the filler is, for example, preferably 10.0 μm or less, more preferably 7.0 μm or less, and further preferably 5.0 μm or less. preferable. Thereby, it can suppress that a coarse filler fills the chip | tip stacked in multiple stages, for example, and a filling property falls.
Further, the lower limit of the volume-based cumulative 50% particle size D ₅₀ of the filler is preferably 0.1 μm or more, more preferably 0.5 μm or more, and further preferably 1.0 μm or more. preferable. Thereby, it can suppress that particle | grains aggregate and form a coarse filler.
This is because, in the case of a filler having the same volume and the same shape, the specific surface area increases as the particle size of the filler decreases, and the particles easily increase.
The volume-based cumulative 50% particle size D ₅₀ of the filler is, for example, based on the particle size distribution of the particles using a commercially available laser diffraction particle size distribution measuring device (for example, SALD-7000, manufactured by Shimadzu Corporation). And can be determined by the cumulative 50% particle size.

(Silane coupling agent)
A silane coupling agent is a compound having a hydrolytic group such as an alkoxy group and containing a silicon atom.
The structural formula of the silane coupling agent according to this embodiment is represented by the following general formula (1).

（上記一般式（１）において、Ｒ^１及びＲ^２は、それぞれ独立して炭素数１以上３０以下の有機基を表す。
複数のＡは、それぞれ独立して炭素数１以上３０以下の有機基を表す。複数のＡは互いに同一でもよく、互いに異なっていてもよい。複数のＡのうち少なくとも一つは炭素数１以上３０以下のアルコキシ基である。）

(In the general formula (1), R ¹ and R ² each independently represents an organic group having 1 to 30 carbon atoms.
A plurality of A each independently represents an organic group having 1 to 30 carbon atoms. A plurality of A may be the same or different from each other. At least one of the plurality of A is an alkoxy group having 1 to 30 carbon atoms. )

The organic group constituting R ¹ and R ² may include, for example, atoms other than hydrogen and carbon in the structure of the organic group.
Specific examples of atoms other than hydrogen and carbon include an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a fluorine atom, and a chlorine atom. As atoms other than hydrogen and carbon, one or more of the above specific examples can be included.

In the general formula (1), R ¹ is hydrogen or an organic group having 1 to 30 carbon atoms, preferably hydrogen or an organic group having 1 to 15 carbon atoms, and hydrogen or 1 to 10 carbon atoms. More preferably, the organic group is hydrogen or an organic group having 1 to 6 carbon atoms. As a result, although the detailed mechanism is not clear, it is presumed that the energy constraint due to the coordination of molecules around the alkoxysilyl group is reduced. Thereby, it is thought that the alkoxy silyl group of a silane coupling agent and the hydroxyl group of the base-material surface can condense more suitably. Therefore, adhesion can be improved.
R ¹ is a monovalent organic group. Here, the monovalent organic group means a valence. That is, R ¹ has ^one bond that bonds to another atom.

Specific examples of R ¹ in the general formula (1) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, Alkyl groups such as pentyl, neopentyl, hexyl, heptyl, octyl, nonyl and decyl; alkenyl such as allyl, pentenyl and vinyl; alkynyl such as ethynyl; methylidene and ethylidene Alkylidene groups such as; aryl groups such as tolyl, xylyl, phenyl, naphthyl and anthracenyl; aralkyl groups such as benzyl and phenethyl; cycloalkyl such as adamantyl, cyclopentyl, cyclohexyl and cyclooctyl Groups; alkaryl groups such as tolyl and xylyl groups It is.
R ¹ is preferably an aryl group among the above specific examples. R ¹ is preferably a phenyl group among the aryl groups. Thereby, although the detailed mechanism is not clear, when the epoxy resin has an aromatic ring such as a benzene ring, the phenyl group of R ¹ and the aromatic ring of the epoxy resin are appropriately coordinated, It is assumed that the silane coupling agent has an attractive interaction. Thereby, the interaction which adhere | attaches between an epoxy resin and the hydroxyl group of a base material expresses via a silane coupling agent, and can improve adhesiveness.

R ² in the general formula (1) is hydrogen or an organic group having 1 to 30 carbon atoms, preferably hydrogen or an organic group having 1 to 10 carbon atoms, and hydrogen or 1 to 6 carbon atoms. More preferably, the organic group is hydrogen or an organic group having 1 to 3 carbon atoms. Thereby, although a detailed mechanism is not certain, it is estimated that the free volume of the molecular chain of a silane coupling agent can be reduced. Therefore, the curvature of a base material can be reduced by reducing the linear expansion coefficient below the glass transition temperature and reducing the internal stress when the encapsulating resin composition is cured.
R ² is a divalent organic group. Here, the divalent organic group indicates a valence. That is, R ² has ^two bonds for bonding with other atoms.

Specific examples of R ² in the above formula (2) include an alkylene group and an arylene group.
The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decanylene group, a trimethylene group, and a tetramethylene group. , Pentamethylene group, hexamethylene group and the like. Specific examples of the branched chain alkylene group include —C (CH ₃ ) ₂ —, —CH (CH ₃ ) —, —CH (CH ₂ CH ₃ ) —, —C (CH ₃ ) (CH ₂ ). _{CH 3) -, - C (} CH 3) (CH 2 CH 2 CH 3) -, - C (CH 2 CH 3) 2 - alkyl methylene group, such _{as; -CH (CH 3) CH 2} -, - CH ( _{CH 3) CH (CH 3)} -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 CH 2 - alkyl ethylene group, such as Etc.
Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthrylene group, and a group in which two or more arylene groups are bonded to each other.
Among the above specific examples, R ² is preferably, for example, an alkylene group. R ² is more preferably a linear alkylene group among the alkylene groups. Thereby, a suitable softness | flexibility can be provided to a crosslinked structure. Therefore, the thermal expansion coefficient below the glass transition temperature can be reduced while suppressing an increase in the flexural modulus during curing of the sealing resin composition. Therefore, internal stress can be reduced and the warpage of the substrate can be reduced.

In the general formula (1), the plurality of A are each independently an organic group having 1 to 30 carbon atoms, preferably an organic group having 1 to 10 carbon atoms, and preferably 1 to 3 carbon atoms. The organic group is more preferably an organic group having 1 to 2 carbon atoms. Thereby, it is considered that the molecular chain of the silane coupling agent is easily incorporated into the crosslinked structure. Therefore, the curvature of the substrate can be reduced.
A is a monovalent organic group. Here, the monovalent organic group means a valence. That is, A indicates that there is one bond that bonds with another atom.

  In the general formula (1), a plurality of A may be the same as or different from each other. The plurality of A are preferably the same as each other, for example. Thereby, the molecular chain of the silane coupling agent is uniformly introduced into the crosslinked structure. Therefore, the thermal expansion coefficient below the glass transition temperature can be reduced while suppressing an increase in the flexural modulus during curing of the sealing resin composition. Therefore, internal stress can be reduced and the warpage of the substrate can be reduced.

  In the general formula (1), A may be at least one alkoxy group having 1 to 10 carbon atoms, and preferably two or more of A are alkoxy groups having 1 to 10 carbon atoms. , A is more preferably an alkoxy group having 1 to 10 carbon atoms. Thereby, it is estimated that the molecular chains of a silane coupling agent couple | bond together and it becomes easy to oligomerize. Therefore, a flexible molecular chain having a more appropriate shape can be formed. As mentioned above, the raise of the bending elastic modulus at the time of hardening of the resin composition for sealing can be suppressed, and the curvature of a base material can be reduced.

In the general formula (1), A other than the alkoxy group having 1 to 10 carbon atoms can be specifically the same as the specific example of R ¹ described above.

Specific examples of the silane coupling agent represented by the general formula (1) include N-phenylaminopropyltrimethoxysilane, N-mercaptopropyltrimethoxysilane, and glycidoxypropylmethyldimethoxysilane. .
As the silane coupling agent, among the above specific examples, for example, N-phenylaminopropyltrimethoxysilane is more preferably used.

The lower limit of the content of the silane coupling agent in the sealing resin composition is preferably 0.4% by mass or more, for example, with respect to 100% by mass of the total solid content of the sealing resin composition. More preferably, it is 0.5% by mass or more, and preferably 0.6% by mass or more. Thereby, the molecular chain of a silane coupling agent can be appropriately introduced with respect to the crosslinked structure of the sealing resin composition. Therefore, the thermal expansion coefficient below the glass transition temperature can be reduced while suppressing an increase in the flexural modulus during curing of the sealing resin composition. Therefore, internal stress can be reduced and the warpage of the substrate can be reduced.
Moreover, the upper limit of content of the silane coupling agent in the resin composition for sealing shall be 2.0 mass% or less with respect to 100 mass% of total solid content of the resin composition for sealing, for example. Is preferable, it is more preferable that it is 1.5 mass% or less, and it is preferable that it is 1.2 mass% or less. Thereby, it can suppress that the silane coupling agent which could not contribute to a crosslinked structure disperse | distributes excessively in the resin composition for sealing, and adhesiveness and a filling property fall.

The lower limit of the content of the silane coupling agent in the sealing resin composition is preferably, for example, 5.5% by mass or more, based on 100% by mass of the low stress agent described later, and 8.0% by mass. %, More preferably 10.0% by mass or more, still more preferably 11.0% by mass or more, and even more preferably 12.0% by mass or more. Thereby, a silane coupling agent and a low stress agent act suitably as a flexible segment in the resin composition for sealing. Further, although the detailed mechanism is not clear, it is assumed that the silane coupling agent behaves as if the low stress agent is trapped in the silane coupling agent by interacting with the low stress agent. Thereby, the fall of adhesiveness by addition of a low stress agent can be suppressed.
The upper limit of the content of the silane coupling agent in the encapsulating resin composition is preferably 35% by mass or less and preferably 30% by mass or less with respect to 100% by mass of the low stress agent described later. More preferably, it is more preferably 27% by mass or less, still more preferably 25% by mass or less, and particularly preferably 23% by mass or less. Thus, although the detailed mechanism is not clear, it is presumed that the thermal expansion coefficient can be lowered while forming an appropriate cross-linked structure and suppressing the increase in flexural modulus. Therefore, internal stress can be reduced and the warpage of the substrate can be reduced.

(Low stress agent)
Specific examples of the low stress agent include silicone compounds different from the above-mentioned silane coupling agents such as silicone oil and silicone rubber; polybutadiene compounds; acrylonitrile butadiene copolymer compounds. As the low stress agent, one or more of the above specific examples can be used in combination.
As the low stress agent, among the above specific examples, for example, it is preferable to use a silicone compound different from the silane coupling agent. Moreover, it is preferable to use a silicone oil as a silicone compound different from a silane coupling agent.
Specific examples of the silicone oil include organopolysiloxane. Here, as the organopolysiloxane, an epoxy group, an amino group, a methoxy group, a phenyl group, a carboxyl group, a hydroxyl group, an alkyl group, a vinyl group, a mercapto group, or the like introduced into the structure is used. Also good. As the functional group introduced into the structure of the organopolysiloxane, for example, a carboxyl group, an epoxy group, and a polyether group are preferable. Examples of the commercially available silicone oil include FZ-3730 and BY-750 manufactured by Toray Dow Corning.

The lower limit of the content of the low stress agent in the sealing resin composition is preferably 1.0% by mass or more, for example, with respect to 100% by mass of the total solid content of the sealing resin composition, It is more preferably 2.0% by mass or more, and preferably 3.0% by mass or more. Thereby, the internal stress of the resin composition for sealing can be moderated appropriately. Therefore, the curvature of the substrate can be reduced.
Moreover, the upper limit of content of the low stress agent in the resin composition for sealing shall be 7.0 mass% or less with respect to 100 mass% of total solid content of the resin composition for sealing, for example. Preferably, it is 6.0 mass% or less, and it is preferable that it is 5.0 mass% or less. Thereby, it can suppress that adhesiveness and a filling property fall, and can express the reduction of the curvature of a base material, and adhesiveness and a filling property with sufficient balance.

(Other ingredients)
In the sealing resin composition, one or more of various additives such as a fluidity-imparting agent, a release agent, an ion scavenger, a curing accelerator, a colorant, and a flame retardant are added as necessary. It can mix | blend suitably.

(Fluidity imparting agent)
The fluidity imparting agent can suppress the reaction of a curing accelerator having no latency such as a phosphorus atom-containing curing accelerator during melt kneading of the resin composition. Thereby, productivity of the resin composition for sealing can be improved.
As the fluidity-imparting agent, specifically, two or more constituting an aromatic ring such as catechol, pyrogallol, gallic acid, gallic acid ester, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and derivatives thereof A compound in which a hydroxyl group is bonded to each adjacent carbon atom.

(Release agent)
Specific examples of the release agent include natural waxes such as carnauba wax; synthetic waxes such as montanic acid ester wax and polyethylene oxide wax; higher fatty acids such as zinc stearate and metal salts thereof, paraffin and the like. As a mold release agent, 1 type (s) or 2 or more types can be mix | blended among the said specific examples.

(Ion scavenger)
Specific examples of the ion scavenger include hydrotalcites; hydrous oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium. As an ion trapping agent, 1 type (s) or 2 or more types can be mix | blended among the said specific examples.

(Curing accelerator)
Specific examples of the curing accelerator include diazabicycloalkenes such as 1,8-diazabicyclo [5.4.0] undecene-7 and derivatives thereof; amine compounds such as tributylamine and benzyldimethylamine; Imidazole compounds such as methylimidazole; organic phosphines such as triphenylphosphine and methyldiphenylphosphine; tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / tetrabenzoic acid borate, tetraphenylphosphonium / tetranaphthoic acid borate, tetraphenylphosphonium・ Tetra-substituted phosphonium such as tetranaphthoyloxyborate and tetraphenylphosphonium ・ tetranaphthyloxyborate ・ tetra-substituted borate; adduct benzoquinone Such as triphenylphosphine and the like. As a hardening accelerator, 1 type (s) or 2 or more types can be mix | blended among the said specific examples.

(Coloring agent)
Specific examples of the colorant include carbon black, bengara, and titanium oxide. As a coloring agent, 1 type (s) or 2 or more types can be mix | blended among the said specific examples.

(Flame retardants)
Specific examples of the flame retardant include aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate, phosphazene, and carbon black. As a flame retardant, 1 type (s) or 2 or more types can be mix | blended among the said specific examples.

(Method for producing resin composition for sealing)
Next, the manufacturing method of the resin composition for sealing concerning this embodiment is demonstrated.
The method for producing a sealing resin composition according to the present embodiment includes, for example, a mixing step (S1) in which the above-described raw material components are mixed to produce a mixture, and then a molding step (S2) in which the mixture is molded. Including.

(Mixing step (S1))
The mixing process is a process for preparing a mixture by mixing raw material components. The method of mixing is not limited, and a known method can be used depending on the components used.
Specifically, as the mixing step, the raw material components contained in the above-described sealing resin composition are uniformly mixed using a mixer or the like. Next, the mixture is melt-kneaded with a kneader such as a roll, a kneader or an extruder to prepare a mixture.

(Molding process (S2))
Next to the mixing step (S1) described above, a forming step (S2) for forming the mixture is performed.
It does not limit as a method to shape | mold, A well-known method can be used according to the shape of the resin composition for sealing. Examples of the shape of the sealing resin composition include a granule shape, a powder shape, a tablet shape, and a sheet shape.

Examples of the molding step for producing the sealing resin composition in the form of granules include a step of pulverizing the cooled mixture after melt-kneading. For example, the size of the granules may be adjusted by sieving the sealing resin composition in the form of granules. Further, for example, the resin composition for sealing in the form of granules may be processed by a method such as a centrifugal milling method or a hot cut method to prepare the degree of dispersion or fluidity.
In addition, as a molding process for producing a sealing resin composition in powder form, for example, the mixture is pulverized to obtain a granular sealing resin composition, and then the granular sealing resin composition is used. Furthermore, the process of grind | pulverizing is mentioned.
In addition, as a molding process for producing a tablet-shaped sealing resin composition, for example, the mixture is pulverized to form a granular-shaped sealing resin composition, and then the granular-shaped sealing resin composition is used. The process of tableting molding is mentioned.
Moreover, as a shaping | molding process which produces the resin composition for sealing in the shape of a sheet | seat, the process of extruding or calendering the mixture after melt-kneading is mentioned, for example.

(Resin composition for sealing)
For a cured product obtained by heat-treating the sealing resin composition according to the present embodiment at 175 ° C. for 120 seconds and then heat-treating at 175 ° C. for 4 hours, the bending elastic modulus at 25 ° C. of the cured product is E [GPa The stress index is calculated by the following (formula) when the linear expansion coefficient at a temperature not higher than the glass transition temperature of the cured product is α1 [10 ⁻⁵ / ° C.].
(Expression) (Stress Index) = (Linear Expansion Coefficient α1 Below Glass Transition Temperature) × (Bending Elastic Modulus E)
The upper limit of the stress index is, for example, preferably 25 [10 ⁻⁵ × GPa / ° C.] or less, more preferably 15 [10 ⁻⁵ × GPa / ° C.] or less, and 5 [10 ^−5]. XGPa / ° C.] or less. Thereby, although the detailed mechanism is not clear, the curvature of a base material can be reduced.
The lower limit value of the stress index is, for example, 2 [10 ⁻⁵ × GPa / ° C.] or more and 3 [10 ⁻⁵ × GPa / ° C.] or more. Thereby, an appropriate mechanical strength is maintained when the encapsulating resin composition is cured.

The stress index described above is a parameter defined by the present inventors in order to define the degree of internal stress, and is a parameter determined by the types and blending amounts of the epoxy resin and the curing agent. And as a result of studying the control of the stress index, the present inventors have found that when the amount of the conventional silane coupling agent in the sealing resin composition is increased, the cross-linked structure increases, so that the glass transition temperature or lower. It has been found that the flexural modulus E is increased, although the linear expansion coefficient α1 of is decreased. On the other hand, when the addition amount of the conventional silane coupling agent in the sealing resin composition is reduced, the bending elastic modulus E decreases, but it has been found that the linear expansion coefficient α1 below the glass transition temperature increases. That is, the linear expansion coefficient α1 below the glass transition temperature, which is an element of the stress index, and the flexural modulus E were in a trade-off relationship.
Therefore, the present inventors have studied a method for reducing the stress index within the specific numerical range described above on the premise that the adhesiveness is maintained for the sealing resin composition according to the present embodiment. . As a result, by appropriately selecting the amount of the silane coupling agent having the specific structure described above contained in the sealing resin composition, while suppressing an increase in the flexural modulus E, the glass transition temperature or lower It has been found that the linear expansion coefficient α1 can be reduced, that is, the value of the stress index can be reduced.

(Use)
The sealing resin composition according to the present embodiment is used for a sealing member for sealing an electronic component disposed on a substrate in an electronic device. That is, the electronic device according to the present embodiment is an electronic device that includes an electronic component disposed on a base material and a sealing member that seals the electronic component, and the sealing member is described above. It is comprised with the hardened | cured material of the resin composition for sealing.

  Specific examples of the electronic component described above include an electronic circuit and a semiconductor element. Specific examples of the semiconductor element include an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, and a solid-state imaging element.

  Specific examples of the above-mentioned base material include inorganic base materials such as ceramic base materials, glass base materials, and silicon wafers; metal base materials such as copper base materials and aluminum base materials whose surfaces are insulated; prepregs And organic base materials such as As a base material, 1 type (s) or 2 or more types can be laminated | stacked and used among the said specific examples.

Specifically, the types of electronic devices according to the present embodiment include WLP (Wafer Level Package), MAP (Mold Array Package), QFP (Quad Flat Package), SOP (Small Outline Package), and QFN (Quad Flat N). -Leaded Package), SON (Small Outline Non-Leaded Package), BGA (Ball Grid Array), LF-BGA (Lead Frame BGA), FCBGA (Flip Chip BGA), MAPBGA (Molded ArrayB) -Level BGA), Fan-In type eWLB, Fan-Out type eWL B etc. are mentioned.
Since the sealing resin composition according to the present embodiment can reduce the warpage of the base material, among the above specific examples, the sealing resin composition can be suitably used for WLP or MAP using a large-area base material, and more preferably by WLP. Can be used.

(Electronic device manufacturing method)
A method for manufacturing an electronic device according to this embodiment will be described.
The manufacturing method of the electronic device according to the present embodiment includes, for example, a disposing step of disposing the electronic component on the base material and a sealing step of sealing the electronic component using the above-described sealing resin composition. And including.

(Installation process)
In the arranging step, an electronic component is arranged on the base material.
The number of electronic components arranged in the arranging step is not limited. For example, one electronic component may be arranged on the base material, or a plurality of electronic components may be arranged on the base material. Good.
In the disposing step, for example, an electronic component such as an electronic circuit may be formed on a substrate such as a wafer, or an electronic component such as a semiconductor element may be disposed on a substrate such as an organic substrate.
Since the sealing resin composition according to the present embodiment is excellent in filling properties, it can be suitably used, for example, when a plurality of chips are stacked.

(Sealing process)
In the sealing step, the electronic component is sealed using the above-described sealing resin composition. Thereby, the sealing member mentioned above can be formed with the hardened | cured material of the resin composition for sealing.
Specific examples of the sealing method include transfer molding, compression molding, and injection molding. By these methods, the sealing member can be formed by molding and curing the sealing resin composition. The encapsulating resin composition of the present embodiment can be suitably used when encapsulating a large area substrate.

Hereinafter, a specific electronic device and a manufacturing method thereof will be described.
FIG. 1 shows an example of a method for manufacturing an electronic device of Wafer Level Package (: WLP).
FIG. 2 is an example of a method for manufacturing an electronic device of Mold Array Package (: MAP).
FIG. 3 is an example of a method for manufacturing a Fan-Out Package electronic device.

As a manufacturing method of an electronic device of Wafer Level Package (: WLP), for example, in the above-described disposing step, a plurality of electronic components are disposed on a substrate to form a circuit surface. In the sealing step, sealing is performed using the sealing resin composition so as to cover the circuit surface, and further, after the sealing step, the sealing resin composition covering the circuit surface of the base material, and the base material And an individualization step for separating the electronic device into individual pieces.
In addition, as an arrangement | positioning process, you may form a bump on a circuit surface, for example. Further, as the sealing step, the sealing material layer may be scraped to expose the bumps from the sealing material layer. Furthermore, solder balls may be connected to the bumps as a wiring process after the sealing process.

A method for manufacturing an electronic device of Wafer Level Package (: WLP) will be described in detail together with the steps shown in FIGS.
First, as an arrangement step, for example, as shown in FIG. 1A, a plurality of electronic components (not shown) are arranged on a substrate 10 such as a wafer. Thereby, the circuit surface 21 is formed. Next, for example, as illustrated in FIG. 1B, bumps 22 such as metal posts are formed on the circuit surface 21 in order to electrically connect solder balls described later and electronic components.
Next, as a sealing step, for example, as illustrated in FIG. 1C, sealing is performed using the sealing resin composition so as to cover the circuit surface 21 described above, and the sealing material layer 30 is formed. Next, for example, as illustrated in FIG. 1D, the bump 22 is exposed from the sealing material layer 30 by cutting the sealing material layer 30. When forming the sealing material layer 30, as shown in FIG. 1D, when the sealing material layer 30 is formed so that the bumps 22 are exposed, the sealing material layer 30 does not have to be cut. Good.
Next, as a wiring process, for example, as shown in FIG. 1 (e), solder balls 96 are connected to the bumps 22.
Next, as an individualization step, for example, as shown in FIG. 1 (f), the sealing material layer 30 and the substrate 10 are cut with a dicing blade, a laser, or the like to obtain the electronic device 50. The number of bumps 22 and solder balls 96 connected to the electronic device 50 to be singulated is not limited, and can be set according to the type of the electronic device 50.

  As a method of manufacturing an electronic device of Mold Array Package (: WLP), for example, in the above-described disposing step, a plurality of electronic components are disposed on the base material so as to be separated from each other, and further, the above-described sealing is performed. In the process, a gap existing between adjacent electronic components is buried, and further, the electronic component is sealed with a sealing resin composition so as to cover the surface of all the electronic components. And the sealing resin composition in which the gap is embedded, and a singulation step of cutting the substrate to divide the electronic device into pieces.

The details of the method for manufacturing the electronic device of Mold Array Package (: MAP) will be described together with the steps shown in FIGS.
First, as an arrangement step, for example, as shown in FIG. 2A, a substrate 10 such as a wafer is prepared. Next, for example, as illustrated in FIG. 2B, the plurality of electronic components 20 are disposed on the base material 10 so as to be separated from each other. In addition, as a method of arrangement | positioning, the well-known method according to the kind of electronic component 20 can be used, for example, you may arrange | position using an adhesive agent.
Next, as a sealing step, for example, as shown in FIG. 2 (c), a gap existing between adjacent electronic components is buried, and further, a sealing resin composition is formed so as to cover the surfaces of all the electronic components. The electronic component is sealed using an object, and the sealing material layer 30 is formed.
Next, as an individualization step, for example, as shown in FIG. 2D, the sealing material layer 30 and the base material 10 existing in the gap between the electronic components 20 are cut with a dicing blade, a laser, etc. Get. Note that the number of electronic components 20 connected to the electronic device 50 to be singulated is not limited, and can be set according to the type of the electronic device 50.

As a manufacturing method of an electronic device of Fan-Out Package, first, a base material 10 provided with a release layer 71 is prepared as a sacrificial material 70. Then, in the disposing step described above, a plurality of electronic components are disposed on the release layer of the base material so as to be separated from each other, and in the sealing step described above, gaps existing between adjacent electronic components are embedded. Furthermore, the sealing resin composition is used to seal the electronic component using the sealing resin composition so as to cover the surface of the release layer and all the electronic components, and the sealing resin covers the electronic component and the release layer after the sealing step. A peeling step of peeling the release layer from the composition.
Note that a wiring process for forming a rewiring insulating resin layer, a via hole, a via, a rewiring circuit, a solder ball, a solder resist layer, and the like may be performed after the peeling process. Further, after the wiring process, an individualization process for cutting the sealing material layer and individualizing the electronic device may be performed.

  Specifically, a heat-foamable pressure-sensitive adhesive or the like can be used as the release layer. That is, in the manufacturing method of the Fan-Out Package electronic device, for example, a sacrificial material including a release layer with low adhesive strength is used. Here, the sacrificial material may be formed of only a release layer, or a laminate of the release layer and the above-described metal substrate, inorganic substrate, organic substrate, or the like may be used.

The manufacturing method of the electronic device of the Fan-Out type package will be described in detail together with the steps described in FIGS.
First, as an arranging step, for example, as shown in FIG. 3A, a plurality of electronic components 20 are arranged on the release layer 71 of the sacrificial material 70 so as to be separated from each other. As the release layer 71, for example, an adhesive having a low adhesive force may be used, or a resin containing a foaming agent may be used. Thereby, the peeling layer 71, the electronic component 20, and the sealing material layer 30 can be peeled in the peeling process mentioned later.
Next, as a sealing step, for example, as shown in FIG. 3B, a gap existing between adjacent electronic components is buried, and further, the surface of the release layer 71 and all the electronic components 20 is covered. The electronic component is sealed using the sealing resin composition, and the sealing material layer 30 is formed.
Next, as the peeling step, for example, as shown in FIG. 3C, the peeling layer 71 is peeled off. The peeling method can be performed by foaming the peeling layer 71 made of a heat-foamable pressure-sensitive adhesive by, for example, heat treatment, electron beam irradiation, ultraviolet irradiation, or the like. Moreover, when the peeling layer 71 consists of an adhesive agent with a low adhesive color, a peeling process can be performed without performing foaming.
Next, as a wiring process, as shown in FIG. 3D, for example, a rewiring insulating resin layer 80 made of polyimide resin, polybenzooxide resin, benzocyclobutene resin, or the like is formed. The rewiring insulating resin layer 80 is formed by forming a pattern using a photolithography method or the like and performing a curing process. A via hole 82 may be formed in the rewiring insulating resin layer 80.
Further, as a wiring process, for example, as shown in FIG. 3E, a power supply layer is formed on the entire surface of the rewiring insulating resin layer 80 by a method such as sputtering, and then a resist layer is formed on the power supply layer. Then, after exposure and development in a predetermined pattern, vias 92 and rewiring circuits 94 are formed by electrolytic copper plating. Next, the resist layer is peeled off and the power feeding layer is etched. Further, for example, as shown in FIG. 3F, solder balls 96 are mounted on the rewiring circuit 94 as a wiring process. Next, a solder resist layer 98 is formed so as to cover a part of the rewiring circuit 94 and the solder balls 96.
Next, as an individualization step, for example, as shown in FIG. 3G, the electronic device 50 is individualized by cutting the sealing material layer 30, the rewiring insulating resin layer 80 and the solder resist layer 98. A singulation process may be performed. Here, the number of the electronic components 20 included in the electronic device 50 is not limited, and can be set according to the type of the electronic device 50.

  It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example, this invention is not limited to description of these Examples at all.

  The detail of each raw material component used for each Example and each comparative example is demonstrated. As raw materials, an epoxy resin, a curing agent, a filler, a silane coupling agent, and a low stress agent were used.

(Epoxy resin)
Epoxy resin 1: biphenyl type epoxy resin (Mitsubishi Chemical Corporation YX-4000K)
Epoxy resin 2: triphenylmethane type epoxy resin (E-1032H60, manufactured by Mitsubishi Chemical Corporation)

(Curing agent)
Curing agent 1: Triphenylmethane type phenol resin modified with 2-hydroxybenzaldehyde and formaldehyde represented by the following formula (C1) (HE910-20, manufactured by Air Water)
Curing agent 2: phenol novolac resin (manufactured by Sumitomo Bakelite, PR-55617)

（上記式（Ｃ１）において、ｍ／ｎ＝１／１）

(In the above formula (C1), m / n = 1/1)

(Filler)
Filler 1: fused spherical silica (manufactured by Tatsumori, MUF-4V, volume-based cumulative 50% particle size D ₅₀ : 3.8 μm)

(Silane coupling agent)
Silane coupling agent 1: N-phenylaminopropyltrimethoxysilane represented by the following formula (S1) (CF-4083, manufactured by Toray Dow Corning)

(Low stress agent)
Low stress agent 1: Silicone oil represented by the following formula (L1) (FZ-3730, manufactured by Toray Dow Corning)

(Example 1-2, sealing resin composition of Comparative Example 1)
For each example and comparative example, a sealing resin composition was prepared as follows.
First, according to the formulation shown in Table 1, each component was pulverized and mixed with a mixer, and then roll kneaded at 80 ° C. for 5 minutes. Next, this was cooled and pulverized to obtain a sealing resin composition.
Details of each component in Table 1 are as described above. In addition, all the mixture ratios of each component shown in Table 1 indicate parts by mass.

(Cured product)
Hardened | cured material was produced about the resin composition for sealing of each Example and a comparative example.
First, using a transfer molding machine, a sealing resin composition was injection molded at a mold temperature of 175 ° C., an injection pressure of 9.8 MPa, and a curing time of 3 minutes, and a test piece of length 80 mm × width 10 mm × thickness 4 mm was obtained. Obtained. Subsequently, the obtained test piece was heat-treated at 175 ° C. for 4 hours to produce a cured product.

<Linear expansion coefficient α1 below glass transition temperature Tg>
About the resin composition for sealing of each Example and a comparative example, linear expansion coefficient (alpha) 1 below glass transition temperature (Tg) was evaluated. The evaluation method will be described below.
The cured product described above was measured using a thermomechanical analyzer (manufactured by Seiko Denshi Kogyo Co., Ltd., TMA100) under conditions of a temperature range of 0 ° C. to 320 ° C. and a rate of temperature increase of 5 ° C./min. The linear expansion coefficient α1 below the temperature Tg was evaluated. The unit of the linear expansion coefficient α1 below the glass transition temperature Tg is [10 ⁻⁵ / ° C.]. The evaluation results are shown in Table 1 below.

<Bending elastic modulus E>
The bending elastic modulus E was evaluated about the resin composition for sealing of each Example and a comparative example. The evaluation method will be described below.
About the hardened | cured material mentioned above, the bending elastic modulus E in 25 degreeC was evaluated according to JISK6911 using the Tensilon tester. The unit of the flexural modulus E is GPa. The evaluation results are shown in Table 1 below.

<Stress index>
About the resin composition for sealing of each Example and a comparative example, the stress index was computed by the following formula from the linear expansion coefficient (alpha) 1 below the glass transition temperature Tg, and the bending elastic modulus E. The calculated stress index is shown in Table 1 below. The unit of the stress index is [10 ⁻⁵ × GPa / ° C.].
(Expression) (Stress Index) = (Linear Expansion Coefficient α1 Below Glass Transition Temperature Tg) × (Bending Elastic Modulus E)

<Warpage amount>
About the resin composition for sealing of each Example and a comparative example, the curvature amount at the time of sealing a silicon wafer was evaluated. The evaluation method will be described below.
A sealing resin composition having a molding resin thickness of 0.8 mm on a circuit surface of a silicon wafer having a thickness of 0.7 mm and a diameter of 200 mm under conditions of a mold temperature of 150 ° C., a molding pressure of 6 MPa, and a curing time of 5 minutes. Was compression molded to obtain a wafer level package (WLP). The obtained wafer level package was placed on a flat surface so that the resin surface was up, and the difference in height between the highest position and the lowest position of the wafer level package was evaluated. Here, the difference in height when the angle of the wafer level package was adjusted so that the difference in height became the minimum value was taken as the amount of warpage. The evaluation results are shown in Table 1 below. The unit of warpage is mm.

<Adhesion strength>
About the resin composition for sealing of each Example and a comparative example, the adhesive strength with respect to a base material was evaluated. The evaluation method will be described below.
First, using a transfer molding machine, a sealing resin composition was injection molded at a mold temperature of 175 ° C., an injection pressure of 9.8 MPa, and a curing time of 3 minutes, and on a silicon (Si) thin plate and silicon nitride (SiN) An adhesion strength test piece having a length of 4 mm, a width of 4 mm, and a thickness of 4 mm was prepared on the thin plate. Next, the substrate was fixed using an automatic shear strength measuring apparatus (manufactured by DAGE, PC2400), and the shear stress when the adhesion strength test piece was peeled from the substrate was evaluated as the adhesion strength. The evaluation results are shown in Table 1 below.
The evaluation was performed under conditions of a temperature of 25 ° C. and a temperature of 260 ° C., respectively. The unit of adhesion strength is N / mm ² .

<Fillability>
Fillability was evaluated about the resin composition for sealing of each Example and a comparative example. The evaluation method will be described below.
Using a low-pressure transfer molding machine (KTS-15, manufactured by Kotaki Seiki Co., Ltd.) for insert molding, a spiral flow measurement mold conforming to ANSI / ASTM D 3123-72, temperature 175 ° C., injection pressure 6.9 MPa, The sealing resin composition was injected under the condition of a holding time of 120 seconds, and the flow length was measured. The unit of spiral flow in Table 1 is cm.
The spiral flow is a parameter of fluidity, and the larger the value, the better the fluidity.

  As shown in Table 1 above, the encapsulating resin composition of each example reduces the warpage of the substrate in the electronic device as compared with the encapsulating resin composition of the comparative example, and has adhesion and fillability. Was confirmed to be expressed in a well-balanced manner.

DESCRIPTION OF SYMBOLS 10 Base material 20 Electronic component 21 Circuit surface 22 Bump 30 Sealing material layer 50 Electronic device 70 Sacrificial material 71 Peeling layer 80 Redistribution insulating resin layer 82 Via hole 92 Via 94 Rewiring circuit 96 Solder ball 98 Solder resist layer

Claims (9)

Epoxy resin,
A curing agent;
A filler,
A silane coupling agent;
A low stress agent,
The silane coupling agent is represented by the following general formula (1):
Content of the said silane coupling agent in the resin composition for sealing is 0.4 mass% or more and 2.0 mass% or less with respect to the total solid of the resin composition for sealing,
The resin composition for sealing whose content of the said low stress agent is 1.0 mass% or more and 7.0 mass% or less with respect to the total solid of the resin composition for sealing.

(In the general formula (1), R ¹ and R ² each independently represents an organic group having 1 to 30 carbon atoms.
A plurality of A each independently represents an organic group having 1 to 30 carbon atoms. A plurality of A may be the same or different from each other. At least one of the plurality of A is an alkoxy group having 1 to 30 carbon atoms. ) The sealing resin composition according to claim 1,
For the cured product obtained by heat-treating the sealing resin composition at 175 ° C. for 120 seconds and then heat-treating at 175 ° C. for 4 hours, the bending elastic modulus at 25 ° C. of the cured product is E [GPa], When the linear expansion coefficient at a temperature not higher than the glass transition temperature of the cured product is α1 [10 ⁻⁵ / ° C.], the stress index calculated by the following (formula) is 2 [10 ⁻⁵ × GPa / ° C.] or more and 25 [ 10 ⁻⁵ × GPa / ° C.] or less.
(Expression) (Stress Index) = (Linear Expansion Coefficient α1 Below Glass Transition Temperature) × (Bending Elastic Modulus E) The sealing resin composition according to claim 1 or 2,
The sealing resin composition, wherein the low stress agent is a silicone compound different from the silane coupling agent. It is the resin composition for sealing according to any one of claims 1 to 3,
The resin composition for sealing whose content of the said filler in the resin composition for sealing is 60 mass% or more and 95 mass% or less with respect to the total solid of the resin composition for sealing. It is the resin composition for sealing according to any one of claims 1 to 4,
The sealing resin composition includes one or more selected from the group consisting of fused spherical silica, fused crushed silica, crystalline silica, talc, titanium white, silicon nitride, and alumina. An arrangement step of arranging electronic components on the substrate;
A method for manufacturing an electronic device, comprising: a sealing step of sealing an electronic component using the sealing resin composition according to any one of claims 1 to 5. A method of manufacturing an electronic device according to claim 6,
In the arranging step, the plurality of electronic components are arranged on the base material so as to be separated from each other,
In the sealing step, a gap existing between the adjacent electronic components is embedded, and the electronic component is sealed with the sealing resin composition so as to cover the surfaces of all the electronic components. And
The manufacturing method of an electronic device including the individualization process which cut | disconnects the said resin composition for sealing which embedded the said gap | interval after the said sealing process, and the said base material, and separates an electronic device. A method of manufacturing an electronic device according to claim 6,
In the arranging step, a circuit surface is formed by arranging a plurality of electronic components on the base material,
In the sealing step, sealing with the sealing resin composition so as to cover the circuit surface,
An electronic device comprising: the sealing resin composition covering the circuit surface of the base material after the sealing step; and an individualization step of cutting the base material into individual electronic devices. Production method. A method of manufacturing an electronic device according to claim 6,
The substrate includes a release layer,
In the arranging step, a plurality of the electronic components are arranged on the release layer of the base material so as to be separated from each other,
In the sealing step, the gap between the adjacent electronic components is embedded, and further, the electrons are formed using the sealing resin composition so as to cover the release layer and the surfaces of all the electronic components. Sealing the parts,
After the said sealing process, the peeling process which peels a peeling layer from the resin composition for sealing which covers the said electronic component and the said peeling layer is included, The manufacturing method of an electronic device.

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