JP2018187638A5 - - Google Patents

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Publication number
JP2018187638A5
JP2018187638A5 JP2017090417A JP2017090417A JP2018187638A5 JP 2018187638 A5 JP2018187638 A5 JP 2018187638A5 JP 2017090417 A JP2017090417 A JP 2017090417A JP 2017090417 A JP2017090417 A JP 2017090417A JP 2018187638 A5 JP2018187638 A5 JP 2018187638A5
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JP
Japan
Prior art keywords
laser
diameter
soldering
automatic soldering
irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017090417A
Other languages
English (en)
Japanese (ja)
Other versions
JP6913350B2 (ja
JP2018187638A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2017090417A external-priority patent/JP6913350B2/ja
Priority to JP2017090417A priority Critical patent/JP6913350B2/ja
Priority to SG11201909904X priority patent/SG11201909904XA/en
Priority to PL18790294.5T priority patent/PL3616819T3/pl
Priority to CN201880028068.7A priority patent/CN110621432B/zh
Priority to PCT/JP2018/016599 priority patent/WO2018199086A1/ja
Priority to HUE18790294A priority patent/HUE067023T2/hu
Priority to MYPI2019006334A priority patent/MY200262A/en
Priority to EP18790294.5A priority patent/EP3616819B1/en
Priority to PH1/2019/550234A priority patent/PH12019550234B1/en
Priority to KR1020197029708A priority patent/KR102490907B1/ko
Priority to US16/607,922 priority patent/US11453076B2/en
Priority to TW107114545A priority patent/TWI775845B/zh
Publication of JP2018187638A publication Critical patent/JP2018187638A/ja
Publication of JP2018187638A5 publication Critical patent/JP2018187638A5/ja
Publication of JP6913350B2 publication Critical patent/JP6913350B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017090417A 2017-04-28 2017-04-28 レーザーはんだ付け方法および装置 Active JP6913350B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2017090417A JP6913350B2 (ja) 2017-04-28 2017-04-28 レーザーはんだ付け方法および装置
PH1/2019/550234A PH12019550234B1 (en) 2017-04-28 2018-04-24 Laser soldering method and device
US16/607,922 US11453076B2 (en) 2017-04-28 2018-04-24 Laser soldering method and device
CN201880028068.7A CN110621432B (zh) 2017-04-28 2018-04-24 激光焊接方法及装置
PCT/JP2018/016599 WO2018199086A1 (ja) 2017-04-28 2018-04-24 レーザーはんだ付け方法および装置
HUE18790294A HUE067023T2 (hu) 2017-04-28 2018-04-24 Eljárás és eszköz lézeres forrasztáshoz
MYPI2019006334A MY200262A (en) 2017-04-28 2018-04-24 Laser soldering method and device
EP18790294.5A EP3616819B1 (en) 2017-04-28 2018-04-24 Laser soldering method and device
SG11201909904X SG11201909904XA (en) 2017-04-28 2018-04-24 Laser soldering method and device
KR1020197029708A KR102490907B1 (ko) 2017-04-28 2018-04-24 레이저 납땜 방법 및 장치
PL18790294.5T PL3616819T3 (pl) 2017-04-28 2018-04-24 Sposób lutowania laserowego i urządzenie
TW107114545A TWI775845B (zh) 2017-04-28 2018-04-27 雷射軟焊方法及裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017090417A JP6913350B2 (ja) 2017-04-28 2017-04-28 レーザーはんだ付け方法および装置

Publications (3)

Publication Number Publication Date
JP2018187638A JP2018187638A (ja) 2018-11-29
JP2018187638A5 true JP2018187638A5 (enExample) 2020-05-28
JP6913350B2 JP6913350B2 (ja) 2021-08-04

Family

ID=63919878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017090417A Active JP6913350B2 (ja) 2017-04-28 2017-04-28 レーザーはんだ付け方法および装置

Country Status (12)

Country Link
US (1) US11453076B2 (enExample)
EP (1) EP3616819B1 (enExample)
JP (1) JP6913350B2 (enExample)
KR (1) KR102490907B1 (enExample)
CN (1) CN110621432B (enExample)
HU (1) HUE067023T2 (enExample)
MY (1) MY200262A (enExample)
PH (1) PH12019550234B1 (enExample)
PL (1) PL3616819T3 (enExample)
SG (1) SG11201909904XA (enExample)
TW (1) TWI775845B (enExample)
WO (1) WO2018199086A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10556284B2 (en) * 2015-08-24 2020-02-11 Seagate Technology Llc Method of forming electrical connections with solder dispensing and reflow
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
US10964867B2 (en) * 2018-10-08 2021-03-30 Facebook Technologies, Llc Using underfill or flux to promote placing and parallel bonding of light emitting diodes
US11929334B2 (en) 2020-03-17 2024-03-12 STATS ChipPAC Pte. Ltd. Die-beam alignment for laser-assisted bonding
CN113042922B (zh) * 2021-05-17 2023-01-13 深圳市艾雷激光科技有限公司 一种激光焊的方法
JPWO2022254807A1 (enExample) * 2021-06-02 2022-12-08
JP2023128986A (ja) * 2022-03-04 2023-09-14 株式会社ディスコ レーザリフロー方法
KR102840683B1 (ko) 2022-11-30 2025-07-31 한국생산기술연구원 홀 드릴링 패턴을 이용한 접합소재 레이저 솔더링 접합방법 및 이에 사용되는 접합물 구조체

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150665A (ja) * 1983-02-03 1984-08-28 Toshiba Corp はんだ付け方法
JPS60180666A (ja) * 1984-02-29 1985-09-14 Canon Inc レ−ザ−はんだ付け方法及びこれに用いるはんだ付け装置
JPH0744332B2 (ja) * 1985-05-17 1995-05-15 株式会社日立製作所 端子接続方法および装置
JPH0818125B2 (ja) * 1989-10-03 1996-02-28 日本電気株式会社 レーザはんだ付け装置
JP3246189B2 (ja) 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
US6278078B1 (en) * 1999-06-02 2001-08-21 Lockheed Martin Corporation Laser soldering method
JP2006156446A (ja) * 2004-11-25 2006-06-15 Shinka Jitsugyo Kk 半田付け方法及び装置
JP2007067165A (ja) 2005-08-31 2007-03-15 Matsushita Electric Ind Co Ltd 光照射条件抽出方法および光照射条件抽出装置およびはんだ付け装置
JP2008173659A (ja) * 2007-01-17 2008-07-31 Japan Unix Co Ltd はんだ付け用レーザーヘッド
CN102717596B (zh) * 2007-02-21 2015-05-27 武藏工业株式会社 喷墨制膜方法
CN101428372B (zh) * 2008-11-26 2011-05-25 深圳市大族激光科技股份有限公司 一种半导体激光焊接方法
JP5495574B2 (ja) * 2009-01-16 2014-05-21 パナソニック株式会社 レーザはんだ付け方法
JP5294916B2 (ja) * 2009-02-17 2013-09-18 パナソニック株式会社 レーザはんだ付け装置
WO2010098921A2 (en) * 2009-02-27 2010-09-02 Georgia Tech Research Corporation High speed autofocus interferometric inspection systems & methods
CN102139412B (zh) * 2011-03-18 2014-10-01 宁波镭基光电技术有限公司 一种激光焊接方法
JP6294084B2 (ja) * 2014-01-10 2018-03-14 株式会社アマダミヤチ レーザ溶接方法及びレーザ溶接システム
JP5941113B2 (ja) * 2014-09-30 2016-06-29 ファナック株式会社 集光径を拡大できるレーザ加工装置

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