TWI775845B - 雷射軟焊方法及裝置 - Google Patents

雷射軟焊方法及裝置 Download PDF

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Publication number
TWI775845B
TWI775845B TW107114545A TW107114545A TWI775845B TW I775845 B TWI775845 B TW I775845B TW 107114545 A TW107114545 A TW 107114545A TW 107114545 A TW107114545 A TW 107114545A TW I775845 B TWI775845 B TW I775845B
Authority
TW
Taiwan
Prior art keywords
laser
laser light
soldering
irradiation
mentioned
Prior art date
Application number
TW107114545A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842999A (zh
Inventor
生島和正
Original Assignee
日商武藏工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商武藏工業股份有限公司 filed Critical 日商武藏工業股份有限公司
Publication of TW201842999A publication Critical patent/TW201842999A/zh
Application granted granted Critical
Publication of TWI775845B publication Critical patent/TWI775845B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
TW107114545A 2017-04-28 2018-04-27 雷射軟焊方法及裝置 TWI775845B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-090417 2017-04-28
JP2017090417A JP6913350B2 (ja) 2017-04-28 2017-04-28 レーザーはんだ付け方法および装置

Publications (2)

Publication Number Publication Date
TW201842999A TW201842999A (zh) 2018-12-16
TWI775845B true TWI775845B (zh) 2022-09-01

Family

ID=63919878

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107114545A TWI775845B (zh) 2017-04-28 2018-04-27 雷射軟焊方法及裝置

Country Status (12)

Country Link
US (1) US11453076B2 (enExample)
EP (1) EP3616819B1 (enExample)
JP (1) JP6913350B2 (enExample)
KR (1) KR102490907B1 (enExample)
CN (1) CN110621432B (enExample)
HU (1) HUE067023T2 (enExample)
MY (1) MY200262A (enExample)
PH (1) PH12019550234B1 (enExample)
PL (1) PL3616819T3 (enExample)
SG (1) SG11201909904XA (enExample)
TW (1) TWI775845B (enExample)
WO (1) WO2018199086A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10556284B2 (en) * 2015-08-24 2020-02-11 Seagate Technology Llc Method of forming electrical connections with solder dispensing and reflow
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
US10964867B2 (en) * 2018-10-08 2021-03-30 Facebook Technologies, Llc Using underfill or flux to promote placing and parallel bonding of light emitting diodes
US11929334B2 (en) 2020-03-17 2024-03-12 STATS ChipPAC Pte. Ltd. Die-beam alignment for laser-assisted bonding
CN113042922B (zh) * 2021-05-17 2023-01-13 深圳市艾雷激光科技有限公司 一种激光焊的方法
WO2022254807A1 (ja) * 2021-06-02 2022-12-08 ソニーグループ株式会社 レーザーはんだ装置、制御装置及びレーザーはんだ付け方法
JP2023128986A (ja) * 2022-03-04 2023-09-14 株式会社ディスコ レーザリフロー方法
KR102840683B1 (ko) 2022-11-30 2025-07-31 한국생산기술연구원 홀 드릴링 패턴을 이용한 접합소재 레이저 솔더링 접합방법 및 이에 사용되는 접합물 구조체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180666A (ja) * 1984-02-29 1985-09-14 Canon Inc レ−ザ−はんだ付け方法及びこれに用いるはんだ付け装置
JP2007067165A (ja) * 2005-08-31 2007-03-15 Matsushita Electric Ind Co Ltd 光照射条件抽出方法および光照射条件抽出装置およびはんだ付け装置
JP2008173659A (ja) * 2007-01-17 2008-07-31 Japan Unix Co Ltd はんだ付け用レーザーヘッド
TW201431612A (zh) * 2007-02-21 2014-08-16 Musashi Engineering Inc 噴墨頭塗佈控制方法及裝置
US20160089749A1 (en) * 2014-09-30 2016-03-31 Fanuc Corporation Laser processing apparatus capable of increasing focused beam diameter

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150665A (ja) * 1983-02-03 1984-08-28 Toshiba Corp はんだ付け方法
JPH0744332B2 (ja) * 1985-05-17 1995-05-15 株式会社日立製作所 端子接続方法および装置
JPH0818125B2 (ja) * 1989-10-03 1996-02-28 日本電気株式会社 レーザはんだ付け装置
JP3246189B2 (ja) 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
US6278078B1 (en) * 1999-06-02 2001-08-21 Lockheed Martin Corporation Laser soldering method
JP2006156446A (ja) * 2004-11-25 2006-06-15 Shinka Jitsugyo Kk 半田付け方法及び装置
CN101428372B (zh) * 2008-11-26 2011-05-25 深圳市大族激光科技股份有限公司 一种半导体激光焊接方法
JP5495574B2 (ja) * 2009-01-16 2014-05-21 パナソニック株式会社 レーザはんだ付け方法
JP5294916B2 (ja) * 2009-02-17 2013-09-18 パナソニック株式会社 レーザはんだ付け装置
US8760665B2 (en) * 2009-02-27 2014-06-24 Georgia Tech Research Foundation High speed autofocus interferometric inspection systems and methods
CN102139412B (zh) * 2011-03-18 2014-10-01 宁波镭基光电技术有限公司 一种激光焊接方法
JP6294084B2 (ja) * 2014-01-10 2018-03-14 株式会社アマダミヤチ レーザ溶接方法及びレーザ溶接システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180666A (ja) * 1984-02-29 1985-09-14 Canon Inc レ−ザ−はんだ付け方法及びこれに用いるはんだ付け装置
JP2007067165A (ja) * 2005-08-31 2007-03-15 Matsushita Electric Ind Co Ltd 光照射条件抽出方法および光照射条件抽出装置およびはんだ付け装置
JP2008173659A (ja) * 2007-01-17 2008-07-31 Japan Unix Co Ltd はんだ付け用レーザーヘッド
TW201431612A (zh) * 2007-02-21 2014-08-16 Musashi Engineering Inc 噴墨頭塗佈控制方法及裝置
US20160089749A1 (en) * 2014-09-30 2016-03-31 Fanuc Corporation Laser processing apparatus capable of increasing focused beam diameter

Also Published As

Publication number Publication date
CN110621432A (zh) 2019-12-27
JP6913350B2 (ja) 2021-08-04
US20200094336A1 (en) 2020-03-26
WO2018199086A1 (ja) 2018-11-01
TW201842999A (zh) 2018-12-16
PH12019550234B1 (en) 2024-03-20
US11453076B2 (en) 2022-09-27
MY200262A (en) 2023-12-18
SG11201909904XA (en) 2019-11-28
EP3616819B1 (en) 2024-04-03
EP3616819A4 (en) 2021-02-17
KR20200002812A (ko) 2020-01-08
PL3616819T3 (pl) 2024-06-24
CN110621432B (zh) 2021-10-26
PH12019550234A1 (en) 2020-07-06
HUE067023T2 (hu) 2024-09-28
JP2018187638A (ja) 2018-11-29
KR102490907B1 (ko) 2023-01-19
EP3616819A1 (en) 2020-03-04

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