JP2018174168A - Component mounting method and component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method and a component mounting device which can improve production efficiency of a mount substrate by inhibiting the occurrence of recognition errors of leads.SOLUTION: A component mounting method comprises the steps of: holding side faces of a body part of a component by a component holding part (step ST1); locating the component holding part which holds a component at a viewing position away from a camera by a preset predetermined distance in a state where the leads of the holding component face the camera (step ST2); subsequently, imaging the leads of the component held by the component holding part which is located on the viewing position by the camera to try recognition to detect the location of the leads based on the acquired image of the leads (step ST3); imaging the leads by changing the distance from the component holding part to the camera and trying recognition of the leads based on the acquired image of the leads in the case where recognition of the leads fails (step ST4); and moving the component holding part based on the previous successful recognition results to mount the component on a substrate (step ST5).SELECTED DRAWING: Figure 7

Description

  The present invention relates to a component mounting method and a component mounting apparatus for mounting a component having a lead on a substrate.

  Conventionally, as a kind of component mounting equipment that mounts components on a board to produce a mounting board, the parts with leads are held and picked up, and the leads are inserted into the board after the leads are imaged and recognized from below What was made to insert in a hole is known. In such a component mounting apparatus, the component is usually supplied in a standing posture with the lead facing downward, and the upper surface of the component is sucked and held by the nozzle, but it is difficult to align the upper surface of the component at the same level. When the component is supplied in a lying position, the upper surface of the component is not attracted, but the side surface of the component is gripped by a pair of finger parts, or the side surface of the component is attracted by a nozzle. . When a component supplied in a lying position is held, the lead is directed downward by raising the component thereafter (for example, Patent Document 1 below).

Japanese Patent Laid-Open No. 2006-58468

  However, as described above, when the component is picked up by grasping the side surface of the component, the position of the lower end of the lead with respect to the imaging unit is not constant. The recognition is not always successful, and there is a problem that a recognition error may occur and the production efficiency of the mounting board may be reduced.

  Accordingly, an object of the present invention is to provide a component mounting method and a component mounting apparatus capable of improving the production efficiency of a mounting board by suppressing the occurrence of a lead recognition error.

  The component mounting method of the present invention is a component mounting method for mounting a component having a lead on a substrate, wherein the component holding unit holds a side surface of the component, and the component lead held in the pickup step An observation position moving step of moving the component holding unit holding the component in a state facing the imaging unit to an observation position separated from the imaging unit by a predetermined distance; and a position at the observation position in the observation position moving step A component recognition step of capturing an image of the lead of the component held by the component holding unit by the imaging unit and trying to recognize the position of the lead based on the obtained image of the lead; and the component recognition When the recognition of the lead fails in the process, the lead is imaged by changing the distance from the component holding unit to the imaging unit, and based on the obtained image of the lead And re-recognition step for trying to recognize the lead, and mounting the component on the substrate by moving the component holding unit based on the component recognition step or the recognition result of the lead succeeded in the re-recognition step. Process.

  A component mounting apparatus according to the present invention is a component mounting apparatus that mounts a component having a lead on a substrate, and includes a substrate holding unit that holds the substrate, a component holding unit that holds a side surface of the component, and the component holding unit. A component mounting head having a component holding unit moving mechanism that moves toward and away from the substrate; a head moving mechanism that moves the component mounting head; and an imaging unit that images the lead of the component held by the component holding unit; The component holding unit holding the component by controlling the head moving mechanism and the component holding unit moving mechanism is moved to an observation position separated from the imaging unit by a predetermined distance, and the imaging unit is moved to the imaging unit at the observation position. An imaging control unit that images the lead, a component recognition unit that tries to recognize the position of the lead based on an image obtained by the imaging unit imaging the lead, and When the component recognition unit fails to recognize the lead, the component holding unit moving mechanism is controlled to change the distance from the component holding unit to the imaging unit, so that the imaging unit images the lead. The head of the component held by the component holding unit by controlling the head moving mechanism and the component holding unit moving mechanism based on the recognition result of the lead succeeded by the control unit and the component recognition unit to the substrate And a mounting control unit that positions the component holding unit close to the substrate and mounts the component on the substrate.

  According to the present invention, it is possible to suppress the occurrence of lead recognition errors and improve the production efficiency of the mounting board.

The principal part block diagram of the components mounting apparatus in one embodiment of this invention The side view of the component supply part with which the component mounting apparatus in one embodiment of this invention is provided The perspective view which shows the state which hold | maintained the component by the component holding part with which the component mounting apparatus in one embodiment of this invention is provided. (A) (b) The figure which shows the state which hold | maintained the component by the component holding part with which the component mounting apparatus in one embodiment of this invention is provided. (A)-(g) The figure which shows a mode that the component holding part was raised / lowered by the component holding part raising / lowering mechanism with which the component mounting apparatus in one embodiment of this invention is provided. The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention Flowchart of a main routine showing an execution procedure of component mounting work by the component mounting device in one embodiment of the present invention The flowchart of the subroutine which shows the execution procedure of the component mounting operation by the component mounting apparatus in one embodiment of this invention (A) (b) The figure which shows the procedure which mounts the component picked up by the component holding part with which the component mounting apparatus in one embodiment of this invention is equipped on a board | substrate. (A) (b) The figure which shows an example of the operation | movement procedure of the component holding part at the time of execution of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention The side view of the component supply part which concerns on the modification with which the component mounting apparatus in one embodiment of this invention is provided. (A) (b) The figure which shows a mode that a component is picked up by the component holding part which concerns on the 1st modification with which the component mounting apparatus in one embodiment of this invention is equipped, and it makes a camera image. (A) (b) The figure which shows a mode that a component is picked up by the component holding part which concerns on the 2nd modification with which the component mounting apparatus in one embodiment of this invention is equipped, and it makes a camera image. (A) (b) The figure which shows the procedure which mounts the component picked up by the component holding part which concerns on the 2nd modification with which the component mounting apparatus in one embodiment of this invention is equipped on a board | substrate.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 is a device that mounts the component 3 on the substrate 2, and includes a substrate holding unit 11 that holds the substrate 2 in a horizontal posture, a component supply unit 12 that supplies the component 3, a component mounting head 13, and a component mounting head 13. A head moving mechanism 14 for moving in a horizontal plane direction, a camera 15 (imaging unit), and an illumination unit 16 are provided.

  In FIG. 2, the component 3 includes a body portion 3B and two leads 3L extending from the body portion 3B (see also FIG. 3). The component supply unit 12 holds the component 3 in a standing posture with the lead 3L facing downward.

  1 and 3, the component mounting head 13 includes a plurality of component holding and lifting units 20. Each component holding elevating unit 20 includes a shaft member 22 that is moved up and down by a component holding unit moving mechanism 21 and a component holding unit 23 attached to the lower end of the shaft member 22. In FIG. 3, the component holding portion 23 includes a holding portion base 31 and a pair of finger portions 32 provided to extend downward from the holding portion base 31. The pair of finger portions 32 can be opened / closed at different intervals by a finger portion drive mechanism 33 provided inside the holding portion base 31, and the part 3 is held by gripping the side surface of the body part 3 </ b> B of the part 3. Can be held.

  When the component holding lift unit 20 holds the component 3 supplied from the component supply unit 12 by the component holding unit 23, the finger unit is driven while the shaft member 22 is lowered by the component holding unit moving mechanism 21 from above the component 3. The mechanism 33 is operated to make the distance between the pair of finger portions 32 larger than the width of the body portion 3B. And a pair of finger part 32 is located in the side of the body part 3B. When the pair of finger portions 32 is positioned on the side of the body portion 3B, the finger portion drive mechanism 33 is operated to narrow the interval between the pair of finger portions 32. As a result, the side surface of the component 3 is gripped by the pair of finger portions 32, and the component 3 is held by the component holding portion 23.

  4A and 4B, the camera 15 has a focal position F on the upper side, and images an object located at the focal position F. For this reason, by positioning the lower end of the lead 3L of the component 3 held by the component holding unit 23 at the focal position F, the lower end of the lead 3L can be imaged by the camera 15. The illumination unit 16 illuminates the vicinity of the focal position F of the camera 15 in a concentrated manner so that a captured image at the focal position F by the camera 15 becomes clear (FIG. 1).

  4A and 4B, when the camera 15 images the lead 3L of the component 3 held by the component holding unit 23, the distance of the component holding unit 23 to the camera 15 (here, the distance in the height direction). And hereinafter referred to as “to-camera distance H”) is first positioned at an observation position separated from the camera 15 by a predetermined distance H0. As can be seen from FIGS. 4A and 4B, even when the component holding unit 23 is located at an observation position where the distance H to the camera is a predetermined distance H0, the component holding unit 23 is The height (lead height J) of the lower end of the lead 3L of the component 3 held with respect to the camera 15 is not necessarily constant, and is different if the location where the component holding unit 23 holds the component 3 is different.

  For this reason, when the pair of finger portions 32 grips the standard position of the side surface of the component 3, the component holding portion 23 is positioned at the observation position where the distance to the camera H = H0, thereby When the lower end is located at the focal position F of the camera 15 (FIG. 4A), but the finger 32 grips a position that deviates from the standard position on the side surface of the component 3 (position determined from design data). Even if the component holding unit 23 is positioned at the observation position where the distance to the camera H = H0, the lower end of the lead 3L is not positioned at the focal position F of the camera 15 and is shifted in the vertical direction from the focal position F. Will be in position. FIG. 4B shows an observation in which the component holding unit 23 is at a camera distance H = H0 because the finger 32 grasps a position shifted from the standard position on the side surface of the component 3 by the distance Δh toward the lead 3L. Despite being positioned, the lower end of the lead 3L is not positioned at the focal position F of the camera 15 but is positioned above the focal position F by Δh.

  As described above, the camera 15 images the object located at the focal position F. For this reason, the camera 15 can clearly image the lower end of the lead 3L because the finger portion 32 holds the standard position of the side surface of the component 3 and the lower end of the lead 3L is located at the focal position F of the camera 15. Only when you are.

  The component holding / lifting unit 20 provided in the component mounting head 13 raises or lowers the shaft member 22 by the component holding unit moving mechanism 21 to move the component holding unit 23 holding the component 3 close to and away from the substrate 2. Thus, the component 3 can be moved (in this case, moved up and down) with respect to the substrate 2 (FIGS. 5A to 5G). As a result, the lead height J of the lead 3L of the component 3 held by the component holding unit 23 can be positioned at the focal position F or a position close thereto. Here, FIG. 5A shows a case where the component holding unit 23 is positioned at an observation position where the distance to the camera H = H0, and FIG. 5B, FIG. 5C, and FIG. d) shows a state in which the distance H to the camera of the component holding unit 23 is sequentially increased from the predetermined distance H0 (the component holding unit 23 is raised) to be H1, H2, and H3. 5E, FIG. 5F, and FIG. 5G, respectively, decrease the distance H to the camera of the component holding unit 23 from the predetermined distance H0 in order (lower the component holding unit 23) to H4. The state set to H5 and H6 is shown. The distance in the vertical direction when the distance H to the camera of the component holding unit 23 is increased or decreased from the predetermined distance H0 is arbitrary, but increases or decreases in a stepwise manner by a certain distance (for example, 1 mm). It is preferable to be raised or lowered.

  As described above, the value of the predetermined distance H0 is such that the lower end of the lead 3L is positioned at the focal position F of the camera 15 when the finger portion 32 of the component holding unit 23 holds the standard position of the side surface of the component 3. The distance (height) from the camera 15 of the component holding unit 23 to be determined is determined based on the design value of the component mounting apparatus 1 or is determined based on the result of teaching. There may be.

  In FIG. 6, the control unit 40 included in the component mounting apparatus 1 moves the component mounting head 13 by the head moving mechanism 14, moves the component holding unit 23 by the component holding unit moving mechanism 21 (directly the shaft member 22 Control is performed for (lifting / lowering) operation, opening / closing operation of the finger unit 32 by the finger unit driving mechanism 33, and illumination operation (illumination on / off, adjustment of illuminance, etc.) by the illumination unit 16. A camera 15 is connected to the control unit 40, and image data obtained by imaging by the camera 15 is input to the control unit 40.

  In FIG. 6, the control unit 40 includes an imaging control unit 41, a component recognition unit 42, a re-imaging control unit 43, and a mounting control unit 44. The imaging control unit 41 controls the head moving mechanism 14 and the component holding unit moving mechanism 21 to move the component holding unit 23 holding the component 3 to the observation position, and causes the camera 15 to image the lead 3L at the observation position. The component recognition unit 42 tries to recognize the lead 3L based on an image obtained by the camera 15 imaging the lead 3L. When the component recognizing unit 42 fails to recognize the lead 3L, the re-imaging control unit 43 controls the component holding unit moving mechanism 21 to change the distance H to the camera of the component holding unit 23, and attaches the lead 3L to the camera 15. Let's take an image. The mounting control unit 44 controls the head moving mechanism 14 and the component holding unit moving mechanism 21 based on the successful recognition result of the lead 3L in the component recognizing unit 42, and determines the lead 3L of the component 3 held in the component holding unit 23. While aligning with respect to the board | substrate 2, the component holding part 23 is made to approach the board | substrate 2, and the component 3 is mounted in the board | substrate 2. FIG. The alignment of the lead 3L with respect to the substrate 2 includes the alignment in the rotational direction around the axis (vertical axis) of the shaft member 22 in addition to the alignment of the tip of the lead 3L with respect to the substrate 2 in the height direction.

  Next, the execution procedure (component mounting method) of the component mounting operation performed by the component mounting apparatus 1 will be described based on the flowcharts shown in FIGS. FIG. 7 is a flowchart of a main routine of control executed by the control unit 40, and FIG. 8 is a flowchart of a subroutine in the main routine of FIG. In the component mounting operation, first, the head moving mechanism 14 moves the component mounting head 13 to position each component holding lift unit 20 above the component supply unit 12. And each component holding | maintenance raising / lowering unit 20 lowers | hangs the shaft member 22 with the component holding part moving mechanism 21, moves the component holding part 23, and opens / closes the finger part 32 with the finger part drive mechanism 33, and thereby the component holding part 23. Thus, the component 3 supplied by the component supply unit 12 is held.

  When each component holding elevating unit 20 holds the component 3 by the component holding portion 23, the component holding portion moving mechanism 21 raises the shaft member 22 to move the component holding portion 23 to move the component 3 gripped by the finger portion 32. The component 3 is picked up from the component supply unit 12 (pickup step in FIG. 7). Here, as described above, since the component supply unit 12 holds the component 3 in a standing posture, the component supply unit 12 is directly extracted from the component supply unit 12 with the lead 3L facing downward.

  When each component holding / lifting unit 20 extracts the component 3 from the component supply unit 12, the component mounting head 13 moves above the camera 15 and causes the camera 15 to image each component 3 (FIG. 1). At this time, the component mounting head 13 moves the component holding unit 23 holding the component 3 to the observation position (that is, moves the component holding unit 23 to a position where the camera distance H becomes the predetermined distance H0) (observation position moving step of step ST2). ). When the component holding unit 23 is positioned at the observation position, the camera 15 images the lead 3L of the component 3 held by the component holding unit 23, and the component recognizing unit 42 reads the lead 3L based on the obtained image of the lead 3L. The recognition which detects the position of is tried (part recognition process of step ST3). When the component recognition unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not the recognition of the lead 3L has succeeded in all of the picked-up components 3 (step ST4).

  If the result of the determination in step ST4 is that the lead 3L has been successfully recognized for all the components 3 that have been picked up, the mounting control unit 44 recognizes the lead 3L of each component 3 that has succeeded in the component recognition process in step ST3. Based on the result, the component holding portion 23 (the component mounting head 13) is moved, and the tip of the lead 3L of each component 3 held by the component holding portion 23 is aligned with the insertion hole 2H of the substrate 2 (lead alignment step). ). Then, the component holding unit 23 is brought close to the substrate 2 and the lead 3L is inserted into the insertion hole 2H of the substrate 2 (lead insertion step), whereby the component 3 is mounted on the substrate 2 (mounting step of step ST5). 9 (a) → FIG. 9 (b)).

  On the other hand, as a result of the determination in step ST4, when there is a component 3 that has failed to recognize the lead 3L, the re-imaging control unit 43 executes a re-recognition process (re-recognition step) in step ST6. In the re-recognition process, first, the camera distance H of the component holder 23 is changed to H1 (step ST11 in FIG. 8). In this case, the camera-to-camera distance H may be changed for all the component holding units 23 included in the component mounting head 13, or the camera-to-camera distance H only for the component holding unit 23 that holds the component 3 that has failed to recognize the lead 3L. May be changed (the same applies when the distance H to the camera of the component holding unit 23 thereafter is changed). When the distance H to the camera of the component holding unit 23 is changed to H1, the camera 15 tries to recognize the lead 3L again for the component 3 that has failed to recognize the lead 3L (step ST12). When the component recognizing unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all the retried leads 3L have been successfully recognized (step ST13).

  As a result of the determination in step ST13, if all of the retried leads 3L have been successfully recognized, the process returns to the main routine. And the mounting control part 44 performed the lead alignment process which moves the component holding part 23 based on the recognition result of the lead 3L of each component 3 succeeded in the component recognition process of step ST3 and the re-recognition process of step ST6. After that, the component holding part 23 is brought close to the substrate 2 to execute a lead insertion step of inserting the lead 3L into the insertion hole 2H, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

  Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H1). Is a correction (changed distance) based on the changed distance (here, | H1−H0 |) for the amount of movement Dm (FIG. 9A) that causes the component holding portion 23 to approach the substrate 2 in the lead insertion step. To reflect).

  On the other hand, as a result of the determination in step ST13, if there is a component 3 for which re-recognition of the lead 3L has failed, the camera distance H of the component holding unit 23 is changed to H2 (step ST14). When the distance H to the camera of the component holding unit 23 is changed to H2, the camera 15 tries to recognize the lead 3L again for the component 3 that has failed to recognize the lead 3L (step ST15). When the component recognizing unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all of the retried leads 3L have been successfully recognized (step ST16).

  As a result of the determination in step ST16, if all of the retried leads 3L have been successfully recognized, the process returns to the main routine. And the mounting control part 44 performed the lead alignment process which moves the component holding part 23 based on the recognition result of the lead 3L of each component 3 succeeded in the component recognition process of step ST3 and the re-recognition process of step ST6. After that, the component holding part 23 is brought close to the substrate 2 to execute a lead insertion step of inserting the lead 3L into the insertion hole 2H, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

  Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H2). Is a correction (changed distance) based on the changed distance (here, | H2−H0 |) for the movement amount Dm (FIG. 9A) that causes the component holding portion 23 to approach the substrate 2 in the lead insertion step. To reflect).

  On the other hand, as a result of the determination in step ST16, if there is a component 3 for which re-recognition of the lead 3L has failed, the camera distance H of the component holding unit 23 is changed to H3 (step ST17). When the distance H to the camera of the component holding unit 23 is changed to H3, the camera 15 tries to recognize the lead 3L again for the component 3 that has failed to recognize the lead 3L (step ST18). When the component recognizing unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all of the retried leads 3L have been successfully recognized (step ST19).

  As a result of the determination in step ST19, if all of the retried leads 3L have been successfully recognized, the process returns to the main routine. And the mounting control part 44 performed the lead alignment process which moves the component holding part 23 based on the recognition result of the lead 3L of each component 3 succeeded in the component recognition process of step ST3 and the re-recognition process of step ST6. After that, the component holding part 23 is brought close to the substrate 2 to execute a lead insertion step of inserting the lead 3L into the insertion hole 2H, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

  Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H3). Is a correction (changed distance) based on the changed distance (here, | H3−H0 |) for the movement amount Dm (FIG. 9A) that causes the component holding portion 23 to approach the substrate 2 in the lead insertion step. To reflect).

  On the other hand, as a result of the determination in step ST19, if there is a component 3 for which re-recognition of the lead 3L has failed, the camera distance H of the component holding unit 23 is changed to H4 (step ST20). When the distance H to the camera of the component holding unit 23 is changed to H4, the camera 15 tries to recognize the lead 3L again for the component 3 that has failed to recognize the lead 3L (step ST21). When the component recognizing unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all of the retried leads 3L have been successfully recognized (step ST22).

  As a result of the determination in step ST22, if all of the retried leads 3L have been successfully recognized, the process returns to the main routine. And the mounting control part 44 performed the lead alignment process which moves the component holding part 23 based on the recognition result of the lead 3L of each component 3 succeeded in the component recognition process of step ST3 and the re-recognition process of step ST6. After that, the component holding part 23 is brought close to the substrate 2 to execute a lead insertion step of inserting the lead 3L into the insertion hole 2H, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

  Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H4). Is a correction (changed distance) based on the changed distance (here, | H4−H0 |) for the amount of movement Dm (FIG. 9A) that causes the component holding portion 23 to approach the substrate 2 in the lead insertion step. To reflect).

  On the other hand, as a result of the determination in step ST22, if there is a component 3 for which re-recognition of the lead 3L has failed, the camera distance H of the component holding unit 23 is changed to H5 (step ST23). When the distance H to the camera of the component holding unit 23 is changed to H5, the camera 15 tries to recognize the lead 3L again for the component 3 that has failed to recognize the lead 3L (step ST24). When the component recognizing unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all of the retried leads 3L have been successfully recognized (step ST25).

  As a result of the determination in step ST25, if all of the retried leads 3L have been successfully recognized, the process returns to the main routine. And the mounting control part 44 performed the lead alignment process which moves the component holding part 23 based on the recognition result of the lead 3L of each component 3 succeeded in the component recognition process of step ST3 and the re-recognition process of step ST6. After that, the component holding part 23 is brought close to the substrate 2 to execute a lead insertion step of inserting the lead 3L into the insertion hole 2H, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

  Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H5). Is a correction (changed distance) based on the changed distance (here, | H5−H0 |) for the amount of movement Dm (FIG. 9A) that causes the component holding portion 23 to approach the substrate 2 in the lead insertion step. To reflect).

  On the other hand, as a result of the determination in step ST25, if there is a component 3 for which re-recognition of the lead 3L has failed, the camera distance H of the component holding unit 23 is changed to H6 (step ST26). When the distance H to the camera of the component holding unit 23 is changed to H6, the camera 15 tries to recognize the lead 3L again for the component 3 that has failed to recognize the lead 3L (step ST27). When the component recognizing unit 42 tries to recognize the lead 3L, the control unit 40 determines whether or not all of the retried leads 3L have been successfully recognized (step ST28).

  As a result of the determination in step ST28, if all of the retried leads 3L have been successfully recognized, the process returns to the main routine. And the mounting control part 44 performed the lead alignment process which moves the component holding part 23 based on the recognition result of the lead 3L of each component 3 succeeded in the component recognition process of step ST3 and the re-recognition process of step ST6. After that, the component holding part 23 is brought close to the substrate 2 to execute a lead insertion step of inserting the lead 3L into the insertion hole 2H, and each component 3 is mounted on the substrate 2 (mounting step of step ST5).

  Here, in the mounting process of step ST5, when the distance from the component holding unit 23 to the camera 15 is changed in the re-recognition process of step ST6 (here, the distance H to the camera of the component holding unit 23 is changed to H6). Is a correction (changed distance) based on the changed distance (here, | H6−H0 |) for the amount of movement Dm (FIG. 9A) that causes the component holding portion 23 to approach the substrate 2 in the lead insertion step. To reflect).

  On the other hand, as a result of the determination in step ST28, if there is a part 3 for which re-recognition of the lead 3L has failed, the process returns to the main routine. Then, the component 3 for which the lead 3L has been recognized so far is mounted on the board 2, and the component 3 for which the lead 3L has failed to be recognized is discarded or collected (step ST8).

  When executing the mounting process of step ST5 described above, information on the amount of change from the predetermined distance H0 to the camera distance H of the component holding unit 23 that has been clarified in the component recognition process or the re-recognition process performed so far. The distance (in this case, the height from the camera 15) of each component 3 with respect to the component holding unit 23 is grasped based on the above, and the pressing amount of the component 3 against the board 2 is adjusted with reference to the grasped distance of the component 3 It is preferable to make it. Thereby, when the component 3 is mounted on the substrate 2, it is difficult to cause the component 3 to be pressed too much on the substrate 2 or insufficiently pressed, and the occurrence of defective mounting of the component 3 can be suppressed.

  In the component mounting apparatus 1 (component mounting method) in the present embodiment, the side surface of the body 3B of the component 3 is held by the component holding unit 23 (pickup process), and the lead 3L of the held component 3 is an imaging unit. After the component holding unit 23 holding the component 3 in the state facing the camera 15 is positioned at an observation position separated from the camera 15 by a predetermined distance H0 (observation position moving step), the component holding at the observation position is held. The lead 3L of the component 3 held by the unit 23 is imaged by the camera 15, and the recognition for detecting the position of the lead 3L based on the obtained image of the lead 3L is tried (component recognition step). If the lead 3L recognition fails, the distance from the component holder 23 to the camera 15 (to the camera distance H) is changed to image the lead 3L, and the lead 3L is read based on the obtained image of the lead 3L. 3L recognition is tried (re-recognition step), and the component holding unit 23 is moved based on the recognition result that has been successful so far (that is, in the component recognition step or re-recognition step), and the component 3 is mounted on the board 2. (Mounting process). For this reason, even if the recognition of the lead 3L fails based on the image of the lead 3L captured with the component holding unit 23 positioned at the observation position, the distance H to the camera of the component holding unit 23 is changed. There is a possibility that the lead 3L can be successfully recognized based on the captured image of the lead 3L, and the generation efficiency of the mounting board can be improved by suppressing the occurrence of a recognition error of the lead 3L.

  In the above-described example, the order in which the camera-to-camera distance H of the component holding unit 23 is changed from the predetermined distance H0 in the re-recognition process in step ST6 is H0 → H1 → H2 → H3 → H4 → H5 → H6 (FIG. 10 ( a)). The order of changing the distance H to the camera of the component holding unit 23 is merely an example, and other orders may be used. The re-recognition of the lead 3L is terminated when the recognition of the lead 3L is successful, and when the component holding unit 23 is located at a distance where the distance H between the component holding unit 23 and the camera is a predetermined distance H0. Even if the lower end of the lead 3L does not coincide with the focal position F, it should be located in the vicinity thereof. From this, the order of H0 → H1 → H4 → H5 → H2 → H3 → H6 is set (FIG. 10B), and the recognition of the lead 3L is tried from a distance as close to the predetermined distance H0 as possible. It may be.

  In the above-described embodiment, the component supply unit 12 is configured to hold the component 3 in a standing posture with the leads 3L facing downward. However, like the component supply unit 12 illustrated in FIG. There may be a case where the component 3 is laid sideways and supplied in a posture by TR. In this case, as shown in FIGS. 12A and 12B, a component having a configuration in which a pair of finger portions 32 that grip the side surface of the component 3 is swingable about a horizontal swing axis YJ. A holding unit 23 (a first modification of the component holding unit 23) may be used. Alternatively, as shown in FIGS. 13A and 13B, the component holding portion 23 (second deformation) having a configuration in which the nozzle 32N that sucks the side surface of the component 3 is swingable about the horizontal swing axis YJ. A component holding part 23) according to an example may be used.

  In the case of the component holding unit 23 having the above-described configuration, even if the component 3 is supplied in a horizontal position and is held by the pair of finger portions 32 and the lead 3L is oriented substantially in the horizontal direction, the component 3 is After gripping or adsorbing, the lead 3L can be directed downward by swinging the pair of finger portions 32 or the nozzle 32N around the swing axis YJ to raise the component 3, and the component 3 is attached to the camera 15. Images can be taken (FIG. 12 (a) → FIG. 12 (b), FIG. 13 (a) → FIG. 13 (b)).

  Here, FIGS. 13A and 13B show an example in which the lead 3L of the component 3 has a shape for surface mounting. In this case, in the mounting process in step ST5 described above, the component holding unit 23 is moved based on the recognition result of the lead 3L succeeded in the component recognition step (step ST3) or the re-recognition step (step ST6) to hold the component. Successful lead alignment process (FIG. 14A) for aligning the lead 3L of the component 3 held by the part 23 with the electrode 2D of the substrate 2 supplied with the solder paste Pst, and the component recognition process or re-recognition process A lead contact process (FIG. 14B) in which the component holding portion 23 is brought close to the substrate 2 based on the recognition result of the lead 3L and the lead 3L of the component 3 held by the component holding portion 23 is brought into contact with the solder paste Pst. Consists of. When the distance from the component holding unit 23 to the camera 15 (distance H to the component holding unit 23) is changed in the re-recognition process (step ST6), the component holding unit 23 is attached to the substrate 2 in the lead contact process. The moving amount Dm to be approached (FIG. 14A) is corrected (calculated by reflecting the changed distance) based on the changed distance (| H−H0 |).

  12A and 12B, the component holding part 23 according to the first modification shown in FIGS. 12A and 12B holds the component 3 having the lead 3L of the type that is surface-mounted on the substrate 2, and this is mounted on the substrate 2. You can also. Similarly, the component 3 having the lead 3L of the type to be inserted into the substrate 2 is held by the component holding portion 23 according to the second modification shown in FIGS. 13A and 13B, and this is mounted on the substrate 2. You can also.

  Although the present embodiment has been described so far, the present invention is not limited to the above-described one. For example, in the above-described embodiment, the method of moving the component holding unit 23 holding the component 3 up and down from the observation position where the distance H to the camera is H = H0 is 3 steps in the upward direction and 3 steps in the downward direction. However, this is merely an example, and the method of raising and lowering the component holding unit 23 from the observation position is completely arbitrary. The width of the increase / decrease (distance) is also completely arbitrary in each step. In the above-described embodiment, the observation position of the lead 3L is regarded as the height from the camera 15 (position in the height direction). However, the observation position of the lead 3L is not limited to the height from the camera 15, It is possible to use a camera other than the camera 15 as a reference, or capture from a direction other than the height direction (such as an oblique direction).

  In the above-described embodiment, the side of the component 3 is gripped by the pair of finger portions 32 or the side of the component 3 is sucked by the nozzle 32N as the component holding portion 23. May be used as long as the lead 3L can be directed downward while holding. In addition, the camera 15 as the imaging unit in the above-described embodiment may be any camera that images the lead 3L of the component 3 held by the component holding unit 23 from below, and in addition to the line scanner type and the area imaging type, other It may be of the type.

  In addition, the component recognition process in step ST3 is supplied by the component supply unit 12 based on the information on the amount of change from the predetermined distance H0 of the distance to the camera H of the component holding unit 23, which has become apparent in the re-recognition process in step ST6. Lead 3L at a predetermined distance H0 as much as possible by estimating the variation in the arrangement (height etc.) of the parts 3 to be performed and adjusting the camera distance H of the part holder 23 to the parts 3 when the parts 3 are picked up next time. It is preferable to have a function that enables the recognition of the above to succeed. Furthermore, it is preferable that this function can be turned on / off according to the package of the component 3.

  Provided are a component mounting method and a component mounting apparatus capable of improving the production efficiency of a mounting board by suppressing occurrence of a lead recognition error.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 2H Insertion hole 2D Electrode 3 Parts 3L Lead 11 Board | substrate holding part 13 Component mounting head 14 Head moving mechanism 15 Camera (imaging part)
21 Component holding unit moving mechanism 23 Component holding unit 32 Finger unit 41 Imaging control unit 42 Component recognition unit 43 Re-imaging control unit 44 Mounting control unit Pst Solder paste

Claims (9)

A component mounting method for mounting a component having a lead on a substrate,
A pick-up step for holding the side surface of the component by the component holding portion;
An observation position moving step of moving the component holding unit holding the component in a state where the lead of the component held in the pickup step is directed to the imaging unit to an observation position separated from the imaging unit by a predetermined distance;
Recognition in which the lead of the component held by the component holding unit positioned at the observation position in the observation position moving step is imaged by the imaging unit and the position of the lead is detected based on the obtained image of the lead Component recognition process to try,
When the lead recognition fails in the component recognition step, the lead is imaged by changing the distance from the component holding unit to the imaging unit, and the lead is recognized based on the obtained lead image. A re-recognition process to try;
A component mounting method including: a mounting step of moving the component holding unit based on a result of recognition of the lead succeeded in the component recognition step or the re-recognition step and mounting the component on the substrate.   2. The component mounting method according to claim 1, wherein in the pickup step, a side surface of the component is held by being gripped by a pair of finger portions included in the component holding portion or adsorbed by a nozzle. The component is mounted in a state where the lead is inserted into the insertion hole of the substrate,
The mounting process includes
A lead position for moving the component holding portion based on the lead recognition result successful in the component recognition step or the re-recognition step and aligning the tip of the lead of the component held by the component holding portion with the insertion hole The component mounting method according to claim 1, further comprising: an alignment step; and a lead insertion step of inserting the lead into the insertion hole with the component holding portion approaching the substrate.   When the distance from the component holding unit to the imaging unit is changed in the re-recognition step, the amount of movement that causes the component holding unit to approach the substrate in the lead insertion step is calculated by reflecting the changed distance. The component mounting method according to claim 3. The component is mounted on a solder paste supplied with the lead on the electrode of the substrate,
The mounting process includes
A lead alignment step of moving the component holding unit based on the recognition result of the lead succeeded in the component recognition step or the re-recognition step, and aligning the lead of the component held by the component holding unit with the electrode; ,
Lead contact that brings the component holding part closer to the substrate based on the result of the lead recognition successful in the component recognition step or the re-recognition step, and makes the lead of the component held by the component holding unit contact the solder paste The component mounting method of Claim 1 or 2 including a process.   When the distance from the component holding unit to the imaging unit is changed in the re-recognition step, the amount of movement that causes the component holding unit to approach the substrate in the lead contact step is calculated by reflecting the changed distance. The component mounting method according to claim 5. A component mounting apparatus for mounting a component having a lead on a substrate,
A substrate holder for holding the substrate;
A component mounting head having a component holding portion that holds the side surface of the component and a component holding portion moving mechanism that moves the component holding portion closer to and away from the substrate;
A head moving mechanism for moving the component mounting head;
An imaging unit for imaging the lead of the component held by the component holding unit;
The component holding unit holding the component by controlling the head moving mechanism and the component holding unit moving mechanism is moved to an observation position separated from the imaging unit by a predetermined distance, and the imaging unit is moved to the imaging unit at the observation position. An imaging control unit for imaging the lead;
A component recognition unit that tries to recognize the position of the lead based on an image obtained by the imaging unit imaging the lead; and
When the component recognition unit fails in recognizing the lead, the component holding unit moving mechanism is controlled to change the distance from the component holding unit to the imaging unit, so that the imaging unit images the lead. A control unit;
The head of the component held by the component holding unit is aligned with the substrate by controlling the head moving mechanism and the component holding unit moving mechanism based on the result of the successful lead recognition in the component recognition unit. A component mounting apparatus comprising: a mounting control unit configured to bring the component holding unit closer to the substrate and mount the component on the substrate.   The component mounting apparatus according to claim 7, wherein the component holding unit holds a side surface of the component by holding it with a pair of finger portions or adsorbing it with a nozzle.   When the recognition result is obtained after the re-imaging control unit changes the distance from the component holding unit to the imaging unit, the mounting control unit causes the component holding unit to approach the substrate. The component mounting apparatus according to claim 7, wherein the movement amount is calculated by reflecting the changed distance.

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