JP2018134846A - Resin supply device, resin supply method and resin molding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of preventing troubles such as air trapping in a resin.SOLUTION: A resin supply device (10) includes: a chamber lid (31) and a chamber body (32) constituting a chamber (30); a seal ring (33) provided at an opening edge (32a) of the chamber body (32) to seal between the chamber lid (31) and the chamber body (32); and a load receiver (37) provided on the chamber body (32) along the seal ring (33) and receiving a load between the chamber lid (31) and chamber body (32).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin supply technique and a resin molding technique.

  Japanese Unexamined Patent Application Publication No. 2012-126075 (hereinafter referred to as “Patent Document 1”) describes a liquid resin supply apparatus. This liquid resin supply apparatus discharges and supplies liquid resin with which the syringe was filled to a workpiece | work from a tube nozzle.

JP 2012-126075 A

  When resin molding is performed on an object to be supplied (for example, a workpiece or a film), the liquid resin can be supplied onto the object to be supplied using the liquid resin supply device described in Patent Document 1. However, for example, when a liquid resin is supplied to a workpiece that is a substrate on which a plurality of chip components (chip-shaped electronic components) are mounted as an article to be supplied, the liquid resin that covers the plurality of chip components may form a drop-like lump. is there. In this case, there is a problem that air remains between the substrate and the liquid resin, and as a result, the molded product is likely to be unfilled. Furthermore, there is a possibility that so-called underfill is not properly performed on a chip component flip-chip connected on a substrate as a workpiece.

  An object of the present invention is to provide a technique capable of preventing problems such as air entrapment in a resin. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A resin supply apparatus according to one solution of the present invention is a resin supply apparatus that supplies a liquid resin to an object to be supplied in a vacuumed chamber, wherein the chamber lid and the chamber main body constituting the chamber, A seal ring which is provided at an opening edge of the chamber body and seals between the chamber lid and the chamber body; and is provided in the chamber body along the seal ring, between the chamber lid and the chamber body. And a weighted receiver for receiving the weight. According to this, resin can be supplied in the vacuum state from which air was removed. In addition, the weight ring can prevent the seal ring from being crushed and ensure the sealing performance to make the chamber in a vacuum state.

  In the resin supply device, it is more preferable that the seal ring is higher than the load receiver in a height from the chamber main body to the chamber lid when the chamber is open. According to this, when the chamber is closed, a sealing property can be ensured and the chamber can be brought into a vacuum state.

  More preferably, the resin supply device further includes a lid driving unit that moves the chamber lid with respect to the chamber body in a state where the chamber is closed. According to this, the chamber lid can be moved in a vacuum state.

  In the resin supply apparatus, it is more preferable that the weighted receiver has a configuration in which a plurality of ball rollers are provided. According to this, the chamber lid can be easily moved in a vacuum state.

  More preferably, the resin supply device further includes a weigh scale provided in the chamber and on which the supply object is set. According to this, the amount of resin supplied to the supply object can be measured in real time.

  More preferably, the resin supply apparatus further includes a set table provided in the chamber and on which the material to be supplied is set, and a table driving unit that rotates the set table. According to this, since the moving range of the resin supply side (chamber lid) can be reduced and the capacity of the chamber can be reduced, a vacuum state of a predetermined pressure can be achieved in a short time or, for example, a high suction force Manufacturing costs can be reduced without using a vacuum pump.

  In the resin supply apparatus, it is preferable that the resin supply apparatus further includes a weighing scale that is provided outside the chamber and in which the supply object is set via a pin that penetrates the chamber main body. According to this, it is possible to measure the amount of resin supplied to the supply object without providing a weigh scale in the chamber.

  A resin molding apparatus according to an embodiment of the present invention includes the resin supply apparatus, and a mold having a cavity and thermally curing the resin in the cavity. According to this, molding defects such as unfilling can be prevented.

  A resin supply method according to an embodiment of the present invention is a resin supply method for supplying a liquid resin to a supply having a narrow portion, and (a) a step of setting the supply in a chamber; (B) After the step (a), the step of decompressing the inside of the chamber; (c) After the step (b), supplying the resin so as to hang over the narrow portion; and (d) the step (C) After the step, the step of pressurizing the inside of the chamber is included. According to this, the pressurized resin can be injected into the narrowed portion that has been decompressed.

  In the resin supply method, it is more preferable that the chamber is in a vacuum state in the step (b), and the chamber is opened to the atmosphere in the step (d). According to this, resin can be more inject | poured into a narrow part.

  In the resin supply method, it is more preferable that a carrier to which a chip component is flip-chip connected is the supply target, and the narrow portion is between the carrier and the chip component. According to this, underfill can be easily performed.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the solution means of the present invention, problems such as air entrapment in the resin can be prevented.

It is a figure for demonstrating the resin supply apparatus which concerns on one Embodiment of this invention, and shows the state by which a to-be-supplied material is supplied to a chamber. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. 1, and shows the state by which the chamber was closed. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. 2, and shows the state which is supplying resin. It is a figure for demonstrating the application | coating pattern of the resin to a disk-shaped to-be-supplied material, FIG. 4A shows a spiral, FIG. 4B shows the state of a grating | lattice. It is a figure for demonstrating the application | coating pattern of the resin to a panel-shaped to-be-supplied object, FIG. 5A is a center dot, FIG. 5B is many points, FIG. 5C is a big spiral, FIG. 5D is a small spiral, FIG. 5F shows a lattice, and FIG. 5G shows the state of radiation. FIG. 6A is a diagram for explaining a resin application pattern to a main part (chip component) of an object to be supplied. FIG. 6A is an entire periphery application of a chip component, and FIG. 6B is an application without covering between adjacent chip components. 6C shows a state of coating between adjacent chip parts. It is a figure for demonstrating the resin supply apparatus which concerns on other embodiment of this invention, and shows the state which measures weight. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. 7, and shows the state which apply | coats resin. It is a figure for demonstrating the resin molding method which concerns on one Embodiment of this invention, FIG. 9A is the state in which resin was supplied to the to-be-supplied object, FIG. 9B is the state in which the to-be-supplied object was set to the molding die, FIG. 9C shows a state in which the inside of the molding die is decompressed, FIG. 9D shows a state in which the material to be supplied is clamped, and FIG. 9E shows a state in which the resin is thermally cured in the cavity. FIG. 10A is a view for explaining a resin molding method according to another embodiment of the present invention, FIG. 10A is a state in which resin is supplied to the supply object, FIG. 10B is a state in which underfill is applied to the supply object, and FIG. 10C shows a state where an object to be supplied is set in the molding die, FIG. 10D shows a state where the pressure inside the molding die is reduced, and FIG. 10E shows a state where the resin is thermally cured in the cavity. It is a figure for demonstrating the resin molding method which concerns on other embodiment of this invention, and shows the state of the to-be-supplied object before resin is supplied. It is a figure for demonstrating the resin shaping | molding method following FIG. 11, and shows the state of the to-be-supplied object after resin was supplied spirally. It is a figure for demonstrating the resin molding method following FIG. 12, and shows the state of the to-be-supplied object by which resin is compressed. It is a figure for demonstrating the resin molding method following FIG. 13, and shows the state of the to-be-supplied material by which resin was shape | molded. It is a figure for demonstrating the resin molding method which concerns on other embodiment of this invention, and shows the state of the to-be-supplied object after thinning a part of spiral shape and resin was supplied. It is a figure for demonstrating the resin shaping | molding method which concerns on other embodiment of this invention, and shows the state of the to-be-supplied object after resin was supplied to the spiral shape, making it interrupt. It is a figure for demonstrating the resin molding method which concerns on other embodiment of this invention, and shows the state of the to-be-supplied object after resin was supplied to linear form, making it interrupt. It is a figure for demonstrating the resin molding method which concerns on other embodiment of this invention, and shows the state of the to-be-supplied object after resin is supplied by multiple points between chip components. It is a figure for demonstrating the resin molding apparatus which concerns on one Embodiment of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin supply apparatus 10 (writing dispenser) according to an embodiment of the present invention will be described mainly with reference to FIGS. 1-3 is a figure for demonstrating the resin supply apparatus 10 which concerns on resin supply operation | movement. The resin supply apparatus 10 includes a supply unit 20 (discharge unit) and a chamber 30, and supplies (applies) the liquid resin R from the supply unit 20 to the workpiece W (supplied object) in the vacuum chamber 30. To do. In the present embodiment, the resin supply device 10 is described as being in a three-dimensional (XYZ) orthogonal coordinate system, and the vertical direction (vertical direction) shown in FIG. (Horizontal direction) is a direction parallel to the X axis and the Y axis.

  In the present embodiment, for example, a disk-shaped carrier 101 (for example, a semiconductor wafer) in which a plurality of chip components 100 (for example, semiconductor chips) are flip-chip connected (bump connected) in a matrix is applied as the workpiece W. For this reason, the workpiece W has a narrow portion 102 (between the chip component 100 and the carrier 101). In the present embodiment, a liquid thermosetting resin (including a molten state) such as a silicone resin or an epoxy resin is applied as the resin R. For the workpiece W supplied with such resin R, resin molding in a molding process called eWLB (Embedded Wafer Level Ballgrid-Array Package), for example, is performed using a molding die 91 (see FIG. 9). .

  In configuring the supply unit 20, the resin supply device 10 includes a syringe 21 in which the liquid resin R is stored, a nozzle 22 (tube nozzle) that discharges the resin R provided at the tip of the syringe 21, and the syringe 21. And a plunger 23 for pressing the resin R. The syringe 21 is housed in a syringe case 25 (cartridge holder). Thereby, the syringe 21 can be easily replaced. Further, the plunger 23 can be moved up and down (reciprocating) in the Z-axis direction by the drive unit 80 (Z-axis drive mechanism). Thereby, the resin R pressed by the plunger 23 can be discharged from the nozzle 22. The syringe case 25 can be moved up and down (reciprocating) in the Z-axis direction by the drive unit 70 (Z-axis drive mechanism). Thereby, the nozzle 22 can move to a Z-axis direction via the syringe case 25 and the syringe 21, and the below-mentioned liquid draining can be performed. In addition, as the drive units 70 and 80, those provided with an arbitrary moving structure such as a slider that moves on a rail by a motor or a multi-indirect robot using a link structure can be used.

  In addition, the resin supply device 10 is provided so as to grip a nozzle 22 (tube nozzle) made of, for example, an elastic body, a pinch valve 24 that opens and closes the nozzle 22, and a valve drive unit 26 that drives the pinch valve 24. (For example, driven by an air cylinder). The pinch valve 24 is provided in the valve drive unit 26, and the valve drive unit 26 is provided in the syringe case 25. In the resin supply device 10, the resin R is discharged from the nozzle 22 by causing the plunger 23 to move downward in the state in which the pinch valve 24 is opened and causing the resin R in the syringe 21 to flow in the pushing direction. On the other hand, the downward movement of the plunger 23 is stopped and the pinch valve 24 is closed, and the discharge of the resin R from the nozzle 22 is stopped.

  After the discharge is stopped, the liquid resin R is drained to prevent the resin R from dripping from the nozzle 22. The drainage of the resin R is when the resin R is discharged downward from the nozzle 22 and supplied to the workpiece W, and the resin R is stretched without being separated from the nozzle 22 by its own weight (drawing state). It means to cut off from the nozzle 22. In the present embodiment, a method is assumed in which the nozzle 22 that has finished discharging the resin R is moved up and down repeatedly to repeatedly expand and contract the distance from the workpiece W and separate from the nozzle 22. By removing the liquid with the chamber 30 closed, it is possible to prevent entrainment of dust and the like. Note that the method for removing liquid is not limited to this, and a method for physically cutting from the tip of the nozzle 22 or a method for introducing and separating air through a path branched to communicate with the nozzle 22 may be used.

  The resin supply apparatus 10 includes a chamber 30 (for example, made of steel) having a pair of chamber portions 31 and 32 (one is a chamber lid 31 and the other is a chamber body 32). In the resin supply apparatus 10, the liquid resin R is discharged and supplied to the workpiece W set in the chamber 30 from the nozzle 22 provided on the chamber lid 31 side. Moreover, the resin supply apparatus 10 may be provided with a temperature adjustment unit (for example, a heater or a cooler) to adjust the internal temperature of the chamber 30 or the temperature of the supplied resin R.

  The chamber lid 31 can reciprocate in the XYZ axis directions by a lid driving unit 50 (XYZ axis driving mechanism). As the lid drive unit 50, the one-axis (Z-axis) drive units 70 and 80 described above corresponding to the three axes (XYZ axes) can be used. Accordingly, the chamber 30 can be opened and closed by moving the chamber lid 31 up and down (approaching or moving away) in the direction along the Z axis (vertical direction) with respect to the chamber body 32. As will be described later, the lid driving unit 50 can move (horizontally move) the chamber lid 31 with respect to the chamber main body 32 with the chamber 30 closed. According to this, even when the chamber 30 is in a vacuum state, the chamber lid 31 and the nozzle 22 provided thereon can be moved. That is, the resin R can be supplied into the surface of the workpiece W at an arbitrary discharge position in a vacuum state.

  The resin supply device 10 is provided on an opening edge 32a (for example, a circular shape in a top view, a rectangular shape in a top view, or a polygonal shape in a top view) of a chamber body 32 (for example, a container constituting a bottomed cylindrical body), A seal ring 33 (for example, an O-ring) that seals between the chamber lid 31 and the chamber body 32 is provided. As a result, the chamber lid 31 and the chamber body 32 are in contact with each other via the seal ring 33, and the chamber 30 is closed (the inside is sealed). An adjustment member (for example, a plate or a sheet) may be provided under the seal ring 33 in order to adjust the height of the seal ring 33.

  By the way, the resin supply device 10 discharges and supplies the liquid resin R to the workpiece W from the nozzle 22 toward the workpiece W in the vacuum chamber 30. Therefore, the resin supply device 10 is configured such that the nozzle 22 is provided in the chamber 30. Specifically, the resin supply device 10 includes a holding part 34 (recessed part) and a seal ring 36 (O-ring). The holding portion 34 is provided to be recessed from the surface 31 a of the chamber lid 31 (the surface 31 a on the chamber body 32 side) so as to accommodate the nozzle 22 in the central portion of the chamber lid 31, and the syringe case 25 penetrating the chamber lid 31. Hold. The seal ring 36 seals between the syringe case 25 and the holding portion 34 (chamber lid 31). Thereby, even if the syringe case 25 is moved up and down by the drive unit 70 in a state where the chamber 30 is closed, the inside of the chamber 30 can be sealed.

  Here, the sizes of the chamber lid 31 and the chamber body 32 will be described. In order to make the chamber 30 closed, the opening of the chamber main body 32 (inside the opening edge 32a) is closed (covered) by the chamber lid 31. That is, the size of the chamber lid 31 is larger than the opening of the chamber body 32 in plan view (top view). Specifically, the size of the chamber lid 31 is such that the chamber lid 31 can be moved horizontally with respect to the chamber body 32 while the chamber 30 is kept closed. In other words, the size of the chamber lid 31 is such that the nozzle 22 can be moved from one end to the other end of the workpiece W while maintaining a vacuum in the Y-axis direction and the X-axis direction. For this reason, as shown in FIG. 3, when the position of the nozzle 22 reaches the outermost periphery of the workpiece W set in the chamber body 32, the chamber lid 31 protrudes greatly in the Y-axis direction and the X-axis direction.

  In addition, the resin supply device 10 includes a pressure adjusting unit 41 that adjusts the internal pressure of the chamber 30 and a path 42 that communicates with the pressure adjusting unit 41 (for example, a hole that passes through the bottom of the chamber body 32). And comprising. In the resin supply device 10, the inside of the chamber 30 in a closed state (sealed state) is brought into a vacuum state (depressurized state) by discharging air, for example, by a pressure adjusting unit 41 including a vacuum pump. Thus, since the chamber 30 can be in a vacuum state in which air is discharged, it is possible to prevent a problem that air is held in the resin R when the resin R is supplied to the workpiece W.

  In addition, the resin supply device 10 includes a load receiver 37 (for example, made of steel) that receives a load between the chamber lid 31 and the chamber body 32. The weight receiver 37 is provided in the chamber body 32 along the circular seal ring 33 to prevent the seal ring 33 from being excessively crushed. For example, a plurality of weight receivers 37 may be provided in the chamber body 32 along the circular seal ring 33. In this case, the chamber lid 31 is positioned at an arbitrary height on the chamber main body 32 while supporting the atmospheric pressure applied to the chamber lid 31 by the plurality of weight receivers 37. Thereby, excessive crushing of the seal ring 33 can be prevented, friction due to contact between the chamber lid 31 and the chamber main body 32 can be prevented, sealing performance can be ensured, and the chamber 30 can be in a vacuum state. Further, since the chamber lid 31 is received at multiple points by the plurality of weight receivers 37, the weights can be dispersed. Further, since the plurality of weight receivers 37 are provided outside the seal ring 33, that is, the plurality of weight receivers 37 are not provided in the chamber 30, air in the chamber 30 can be easily removed. When the chamber 30 is open, the seal ring 33 is higher than the load receiver 37 in the height from the chamber body 32 toward the chamber lid 31. In other words, the seal ring 33 is disposed at a position closer to the chamber lid 31 than the load receiver 37 with the chamber 30 opened. According to this, in a state in which the chamber 30 is closed, the chamber lid 31 can be reliably in contact with the seal ring 33, and the chamber 30 can be in a vacuum state while ensuring sealing performance.

  By the way, in the resin supply apparatus 10, the chamber lid 31 (syringe 21 with respect to the workpiece W) moves in the horizontal direction with respect to the chamber body 32 in a state where the chamber 30 is closed (a state where the chamber structure is held). It is configured as follows. Specifically, a ball roller is used as the weighted receiver 37. The ball roller includes, for example, a free rotating sphere and a sphere receiver (sitting) that rotates and holds the free rotating sphere in a state in which the free rotating sphere partially protrudes (which contacts the chamber lid 31). According to this, even when atmospheric pressure is applied to the chamber lid 31 by making the inside of the chamber 30 a vacuum state, for example, a sliding method can be achieved by adopting a weighted receiving structure in a rolling manner in a ball roller that is a moving body. The chamber lid 31 can be moved in the horizontal direction very smoothly as compared with the weight receiving structure in FIG.

  In particular, when the workpiece W is enlarged and the chamber body 32 needs to be enlarged, the force applied to the chamber lid 31 by the atmospheric pressure increases, so that the force applied to the load receiver 37 also increases. For this reason, by providing the number of weight receivers 37 corresponding to the force applied to the weight receivers 37, the force applied to each of the weight receivers 37 can be dispersed and reduced so that the chamber lid 31 can be moved smoothly. . In addition, as the load receiver 37, a sliding load receiver as well as a rolling load receiver such as a ball roller can be used depending on the chamber lid 31. Note that a lubricant may be applied between the seal ring 33 and the weighted receiver 37 to ensure ease of sliding with respect to the chamber lid 31.

  In addition, the resin supply device 10 includes a weighing scale 40 provided in the chamber 30. In the resin supply apparatus 10, the workpiece W is set on the weighing scale 40, and the weighing scale 40 measures the weight of the workpiece W. The weight scale 40 measures the weight of the resin R discharged to the workpiece W in a state where the workpiece W is set. According to this, the resin R discharged and supplied to the workpiece W in the vacuum chamber 30 can be measured in real time.

  The resin supply device 10 is provided through the bottom of the chamber main body 32, and is moved up and down (reciprocating) in the Z-axis direction by the drive unit 44 (see FIG. 7). And a seal ring 45 (see FIG. 7) that seals between the two. This pin 43 is used for delivery of the workpiece W to the transport device. When receiving the workpiece W from the transfer device, the pin 43 moves upward and the tip protrudes from the chamber body 32 (see FIG. 1). When setting the workpiece W from the pin 43 to the weighing scale 40, the pin 43 moves downward and retracts to the bottom side of the chamber body 32 (see FIG. 2).

  Next, an operation method (which becomes a resin supply method) of the resin supply apparatus 10 will be described. The resin supply device 10 includes a CPU (Central Processing Unit) and a control unit (not shown) having a storage unit such as a ROM and a RAM. When the CPU reads out and executes various control programs recorded in the storage unit, the operation of each unit (mechanism) constituting the resin supply device 10 is controlled. The operation of each part is the operation of the resin supply device 10. In addition, when the resin supply apparatus 10 is incorporated in the resin molding apparatus, the resin supply apparatus 10 may be controlled by a control unit of the resin molding apparatus.

  The resin supply apparatus 10 shown in FIG. 1 is in a state before the workpiece W is supplied to the chamber 30. Here, the chamber 30 is open, the nozzle 22 of the syringe 21 is closed by the pinch valve 24, and the plunger 23 is waiting upward. In the state where the chamber 30 is open as described above, for example, a workpiece W transferred by a transfer device or an operator is set in the chamber 30. In this embodiment, the transfer device delivers the workpiece W to the pin 43, and the pin 43 that has received the workpiece W moves downward, so that the workpiece W is set on the weighing scale 40 (see FIG. 2).

  Subsequently, as shown in FIG. 2, the chamber 30 is closed, and the air inside the chamber 30 is discharged to be in a vacuum state. Specifically, first, the chamber lid 31 is moved downward by the lid driving unit 50, so that the chamber 30 closes the chamber 30 by contacting the load receiver 37 while crushing the seal ring 33. Next, the inside of the chamber 30 is depressurized by the pressure adjusting unit 41 to obtain a vacuum state with a predetermined pressure. Here, it is possible to prevent the seal ring 33 from being crushed by supporting the chamber lid 31 with the weight receiver 37. In addition, before or in parallel with the operation of making the vacuum state, by controlling a temperature adjusting unit (not shown) so that the internal temperature of the chamber 30 becomes a predetermined value, The influence of heat can be suppressed.

  Subsequently, the supply of the resin R to the workpiece W is started in the chamber 30 in a vacuum state. Specifically, the chamber 30 is continuously evacuated by the pressure adjusting unit 41. Then, the pinch valve 24 is driven by the valve driving unit 26 to open the nozzle 22, and the plunger 23 is moved downward by the driving unit 80 to discharge the resin R from the nozzle 22, thereby supplying the resin R to the workpiece W. Make it possible. At this time, the resin R is supplied while measuring the weight of the workpiece W, that is, the weight of the resin R in real time by the weight meter 40.

  Subsequently, as illustrated in FIG. 3, the resin R is discharged from the nozzle 22 while moving the nozzle 22 so that the nozzle 22 faces a predetermined position of the workpiece W. Specifically, the chamber 30 is continuously evacuated by the pressure adjusting unit 41. Then, while moving the chamber lid 31 horizontally by the lid driving unit 50 and moving the nozzle 22 provided in the chamber lid 31, the plunger 23 is further moved downward by the driving unit 80 to discharge the resin R from the nozzle 22. At this time, the moving range of the nozzle 22 is smaller than the inner diameter of the seal ring 33 so that the sealed state (vacuum state) is maintained by the seal ring 33 even when the nozzle 22 reaches the outermost periphery of the workpiece W. Here, the resin R is supplied (applied) so as to be applied to the narrow portion 102 (between the chip component 100 and the carrier 101) of the workpiece W.

  In this way, the resin R can be supplied (applied) to the surface of the workpiece W so as to have a predetermined application pattern. As an application pattern, as shown in FIG. 4, for example, the entire surface of the workpiece W can be formed in a spiral shape or a lattice shape. Here, FIG. 4 is a figure for demonstrating the application pattern of resin R to the disk-shaped workpiece | work W, FIG. 4A shows a spiral, FIG. 4B shows the state of a grating | lattice. In supplying a predetermined amount of resin R, for example, the resin R is supplied only to the center of the surface of the workpiece W by supplying the resin R to the entire surface of the workpiece W while moving the chamber lid 31 provided with the nozzle 22. Compared with the method of performing the above, when the resin R is compressed in the cavity C using the molding die 91 (see FIG. 9), the distance that the resin R flows (time during which heat is applied) can be made comparable. , Air can be prevented from being carried.

  Moreover, it is good also as an application | coating pattern shown in FIG. 4B which covers the side surface of the chip component 100 with the resin R, and it is good also as a grid | lattice-like chip component regardless of whether the side surface of the chip component 100 is covered with the resin R. Resin R can also be supplied to the entire surface of 100. Here, when the coating pattern shown in FIG. 4B is formed such that the side surface of the chip component 100 is covered with the resin R, the resin R is quickly injected into the narrow portion 102 by atmospheric pressure in a process to be described later, so-called capillary underfill. Equivalent). Further, when resin molding is performed in the mold, the underfill can be more reliably performed by compression (pressing by the molding die 91) in the mold by appropriately discharging air in the narrow portion 102. it can. If the resin R can be supplied to the entire periphery of the chip component 100 without filling the space between the chip components 100 as shown in FIG. 4B and supplying the resin R, the line width (chip) of the resin R shown in FIG. It is also possible to supply the resin R with a line width narrower than the (interval width).

  In addition, various types of resin R coating patterns are possible. FIG. 5 illustrates a resin R coating pattern (including a discharge path of the nozzle 22 facing the workpiece W) on a panel-shaped (rectangular) workpiece W having chip portions (not shown) mounted thereon and having a narrow portion. FIG. FIG. 5A shows a state in which the resin R is applied in a dot shape (one point) (center dot) to the center of the workpiece W. Even with such a simple coating pattern, for example, after the resin R is supplied in a vacuum atmosphere, the work W is placed in an air atmosphere, so that the resin R is injected into the narrow portion due to the pressure difference. be able to. Moreover, the application time can be shortened. FIG. 5B shows a state in which the resin R is applied in a multipoint manner on the surface of the workpiece W. In this state, compared to the center dot, air can be easily discharged, and the distance through which the resin R flows when the resin R is compressed in the cavity C can be made approximately the same.

  FIG. 5C shows a state in which the resin R is applied in a spiral shape in a substantially cavity size within the surface of the workpiece W, for example. In this state, air can be easily discharged in a spiral shape and applied to the cavity size, so that when the resin R is compressed in the cavity C, the distance through which the resin R flows can be made approximately the same. FIG. 5D shows a state where the height of the resin R is made lower than that of the center dot (FIG. 5A) (the center dot is made shorter) and is applied in a small spiral with a small range of motion. In this state, by delaying the timing at which the resin R comes into contact with the mold surface, the time during which the air can be discharged in the mold closing operation can be lengthened to facilitate the air discharge. In addition, when the resin R is applied from one point, it may be difficult to apply a uniform shape because the resin R applied in a linear shape is applied while being stacked unevenly due to high viscosity. Although it is conceivable, it can be applied in a suitable circular shape by applying it in a small spiral shape. In addition, it is possible to prevent the occurrence of problems such as holding air when the resin R at a high position is compressed and moves to a low position.

  FIG. 5E shows a state where the coating is applied in a spiral shape so that a corner is formed in accordance with the corner of the rectangular workpiece W. In this state, air can be easily discharged in a spiral shape according to the shape of the workpiece W. FIG. 5F shows a state in which it is applied in a grid pattern with a single stroke according to the rectangular workpiece W. In this state, the resin R can be applied with a uniform width according to the shape of the workpiece W. FIG. 5G shows a state in which the resin R is applied radially in the plane of the workpiece W from the central portion to the outer peripheral portion (a dotted line indicates a path without discharge from the nozzle 22). In this state, when the resin R is compressed in the cavity, air can be discharged from the central portion to the outer peripheral portion.

  Various types of application patterns of the resin R to the chip component 100 are also conceivable. FIG. 6 is a diagram for explaining a coating pattern of the resin R on the main part (chip component 100) of the workpiece W. FIG. 6A shows a state in which the resin R is applied with a single stroke over the entire periphery of the chip component 100. FIG. 6B shows a state in which the resin R is applied only with a single stroke without covering between adjacent chip components 100. FIG. 6C shows a state in which the resin R is applied between the adjacent chip components 100 (part of the resin R is on the chip components 100). As shown in FIG. 6, by making the coating pattern annular, the resin R can be easily injected into the narrow portion 102 inside thereof.

  Thus, after a predetermined amount of the resin R is supplied (that is, after the coating pattern is completed), the discharge of the resin R from the nozzle 22 is stopped. Specifically, the downward movement of the plunger 23 by the driving unit 80 is stopped, and the nozzle 22 is closed by the pinch valve 24 to stop the discharge of the resin R. Alternatively, the plunger 23 may be pulled back to assist in stopping the discharge of the resin R.

  Subsequently, the discharge of air from the chamber 30 is stopped. Specifically, the vacuum state at a predetermined pressure in the chamber 30 is released by stopping the discharge of air by the pressure adjusting unit 41. By stopping the pressure adjusting unit 41, the inside of the chamber 30 is pressurized from a predetermined pressure in a vacuum state. Thereby, for example, when there is a narrowed portion 102 (a space to be filled with the resin R) below the resin R supplied onto the workpiece W, the ambient atmosphere in the narrowed portion 102 decompressed so as to be underfilled Resin R pressurized at a pressure of is injected.

  Subsequently, the nozzle 22 is moved up and down (raised and lowered) in the chamber 30 in a closed state. Specifically, the nozzle 22 is moved up and down via the syringe case 25 (syringe 21) by the driving unit 70 in a state where the chamber 30 is closed without moving the chamber lid 31. In this manner, a liquid draining operation is performed in which the vertical movement of the nozzle 22 is repeated a predetermined number of times. In the present embodiment, the liquid is removed (the nozzle 22 moves up and down) while the chamber 30 is closed and the inside is formed.

  Subsequently, the chamber 30 is opened. Specifically, by moving the chamber lid 31 upward by the lid driving unit 50, the chamber lid 31 moves away from the chamber body 32 (the weighted receiver 37 and the seal ring 33), and the chamber 30 is opened. (See FIG. 1). As a result, the atmosphere R is opened, and atmospheric pressure is applied from around the resin R, whereby the resin R is injected (filled) into the narrow portion 102. As in the present embodiment, when the chip component 100 is mounted on the carrier 101 as the workpiece W by flip chip connection, the resin R is injected and filled between a large number of bumps connecting the chip component 100 and the carrier 101. It is possible to suppress air entrainment (a region without the resin R in the narrow portion 102). Even when the chip component 100 is mounted on the work W by a method other than flip-chip connection on the carrier 101, the space between the corners formed by the side surfaces of the chip component 100 and the main surface of the carrier 101 is not limited. The resin R can be filled even when air accumulates.

  Note that the process of closing the chamber 30 again and making the inside of the chamber 30 in a vacuum state (depressurized) and then opening the chamber 30 to release to the atmosphere (pressurization) may be repeated. According to this, the resin R can be more reliably injected into the narrow portion 102. The pressurization in the chamber 30 can be performed even when the chamber 30 is closed as long as the pressure adjusting unit 41 includes a pressurizing device such as a compressor. The resin R can be more reliably injected into the narrow portion 102 by pressing.

  Thereafter, in a state where the chamber 30 is open, for example, the workpiece W (the one supplied with the resin R) is taken out by the transfer device. At this time, the workpiece W set on the weight scale 40 is supported (ejected) by the pin 43 that has moved upward, and is transferred to the conveying device. Thereafter, the workpiece W supplied with the resin R is conveyed and set to a molding die 91 (see FIG. 9), for example. Next, the resin R is compressed in the cavity C formed by the molding die 91, and the resin R is thermally cured. By the resin R being pressurized by this compression and injected into the narrow portion 102, the underfill can be more reliably performed. As described above, since problems such as air entrapment are prevented by using the above-described resin supply method, a molded product in which molding defects such as unfilling in the narrow portion 102 are suppressed is manufactured.

(Embodiment 2)
A resin supply apparatus 10A according to an embodiment of the present invention will be described mainly with reference to FIGS. 7 and 8 are views for explaining the resin supply apparatus 10A related to the resin supply operation. In the present embodiment, the chamber lid 31 can be made smaller than in the first embodiment, and is different in that the apparatus can be miniaturized. Therefore, this point will be mainly described below. In the resin supply apparatus 10A as well, the chamber 30 is evacuated using the pressure adjusting unit 41 (see FIG. 1) as in the first embodiment, but the pressure adjusting unit 41 is omitted in FIGS. ing. Further, in order to facilitate the explanation, some parts are hatched.

  The resin supply apparatus 10A includes a lid driving unit 50A (XZ axis driving mechanism or YZ axis driving mechanism) that moves the chamber lid 31, a set base 51 that is provided in the chamber 30 and on which the workpiece W is set, and a set base 51 A table drive unit 52 (rotation drive mechanism). As the lid drive unit 50A, the one-axis (Z-axis) drive unit 70, 80 described above corresponding to each of the two axes (XZ-axis or YZ-axis) can be used. The chamber lid 31 (nozzle 22) can be moved in the Y-axis direction) and the vertical direction (Z-axis direction). Further, as the table driving unit 52, a rotary shaft 53 attached to the set table 51 can be driven to rotate by a motor 55 via a belt 54, and the set table 51 is moved in the rotation direction (horizontal direction). be able to. Further, since the rotation shaft 53 is provided through the bottom of the chamber body 32, the resin supply device 10 </ b> A includes a seal ring 57 that seals between the rotation shaft 53 and the chamber body 32.

  According to this, even when the chamber 30 is in a vacuum state, the chamber lid 31 and the nozzle 22 provided thereon can be moved relative to the workpiece W. That is, the resin R can be supplied into the surface of the workpiece W at an arbitrary discharge position. Moreover, by providing the set base 51 that rotates on the work set side, the moving range (movable range) of the chamber lid 31 on which the nozzle 22 is provided on the resin supply side can be reduced. Specifically, the moving range in the horizontal direction of the chamber lid 31 is the X-axis and Y-axis directions in the first embodiment, whereas in this embodiment, the radius in either the Y-axis direction or the X-axis direction. Just minutes away. That is, the resin R can be spirally applied to the entire surface of the workpiece W by rotating the workpiece W in parallel with the operation of moving the nozzle 22 from the center to one end of the workpiece W. In such a configuration, by combining the forward / backward movement of the nozzle 22 and the rotation of the workpiece W, it is possible to apply an arbitrary straight or curved radial pattern on the workpiece W. For this reason, in this embodiment, the chamber lid 31 can be made smaller than in the first embodiment. Further, since the chamber lid 31 is small, the footprint of the entire resin supply device 10A can be reduced (space saving).

  Further, the resin supply apparatus 10A includes a chuck 56 that is provided on the set base 51 and is fixed so as to sandwich the workpiece W, for example. According to this, even when the resin R discharged from the nozzle 22 to the workpiece W is sticky and the rotation of the workpiece W is blocked by the resin R, the workpiece is synchronized with the rotation of the set table 51. W can be rotated stably.

  Further, the resin supply apparatus 10A is provided outside the chamber 30, and a weight scale 60 on which a workpiece W is set via a pin 61 penetrating the chamber body 32, a pin 61 provided upright on the weight scale 60, Is provided. The weigh scale 60 and the pin 61 can be moved up and down (reciprocating) in the Z-axis direction by the drive unit 63 (Z-axis drive mechanism). According to this, the amount of resin supplied to the workpiece W can be measured without being provided in the chamber 30 as in the weighing scale 40 of the first embodiment. For this reason, the capacity of the chamber 30 can be reduced. In addition, since the weigh scale 60 is provided outside the chamber 30, measurement can be performed without waiting until the chamber 30 is in a stable state that can be measured after the inside of the chamber 30 is in a vacuum state. In consideration of this point, in the first embodiment, the weighing scale 40 that can be measured even in a vacuum state is used. However, since it is expensive, in this embodiment, the inexpensive weighing scale 60 is used to manufacture the resin supply device 10A. Cost can be reduced. Moreover, the load concerning the vacuum pump as the pressure adjustment part 41 can be suppressed, for example because the capacity | capacitance of the chamber 30 becomes small.

  The resin supply device 10 </ b> A includes a shutter 62 that closes the hole 32 b of the chamber body 32 through which the pin 61 has passed in a state where the pin 61 is retracted out of the chamber 30. As the shutter 62, for example, a shutter slidable by a drive unit (not shown) can be used. By closing (sealing) the hole 32b with the shutter 62 while the chamber 30 is closed, the inside of the chamber 30 can be sealed.

  The shutter 62 includes a hole 62 a for penetrating the pin 61 and a hole 62 b for penetrating the rotating shaft 53. The shutter 62 moves (positions) so that the hole 32b and the hole 62a communicate with each other in a state where the weight of the workpiece W is measured. Further, the shutter 62 moves (positions) between the state in which the workpiece W is measured and the state in which the resin R is supplied, but the size is such that the rotating shaft 53 does not contact the shutter 62 during this time. A hole 62a is formed.

  By the way, at the time of resin supply, it is conceivable that the pin 61 remains in the chamber 30 without being retracted out of the chamber 30. In this case, in order to seal the inside of the chamber 30, it is necessary to provide a seal ring that seals between the chamber main body 32 and the pin 61 in the hole 32b. For this reason, there is a possibility that measurement by the weighing scale 60 through the pin 61 cannot be performed accurately. In this regard, in the present embodiment, a shutter 62 is provided instead of using a seal ring for sealing in the hole 32b. Thereby, even if it is the structure which provides the weighing scale 60 out of the chamber 30, it can measure a weight correctly. Since the diameter of the hole 32b or the hole 62a is larger than the diameter of the pin 61, the weight of the workpiece W is measured by the weigh scale 60 via the pin 61 without the pin 61 coming into contact with the chamber body 32.

  Next, an operation method (to be a resin supply method) of the resin supply apparatus 10A will be described. In addition, the process which overlaps with the said Embodiment 1 is demonstrated roughly.

  First, as shown in FIG. 7, the weight of the workpiece W before the resin R is supplied is measured, and then the workpiece W is set on the set stand 51. Specifically, with the chamber 30 open, the weight unit 60 and the pin 61 are moved up by the drive unit 63 in advance so that the tip of the pin 61 is positioned higher than the set base 51. In this state, for example, the workpiece W conveyed by the conveyance device or the operator is set on the pin 61, and the weight of the workpiece W before the resin R is supplied is measured by the weigh scale 60. Then, the weigh scale 60 and the pin 61 are moved downward by the drive unit 63 and the workpiece W is transferred from the pin 61 to the set table 51, and then the workpiece W is fixed and set to the set table 51 by the chuck 56.

Subsequently, after retracting the pin 61 from the chamber body 32, the shutter 62 is slid to close the hole 32b through which the pin 61 has passed (the shutter 62 is in a closed state). Thereafter, the chamber 30 is closed, and the pressure adjusting unit 41 starts to discharge the air in the chamber 30 to make a vacuum state (depressurized state).

  Subsequently, as shown in FIG. 8, the resin R is discharged and supplied from the nozzle 22 while moving the nozzle 22 relative to the workpiece W in the vacuum chamber 30. Specifically, the chamber 30 is continuously evacuated by the pressure adjusting unit 41. The chamber lid 31 is horizontally moved by the lid driving unit 50A while the workpiece W set on the set platform 51 is moved by rotating (horizontal movement) the set platform 51 by the platform driving unit 52, and the chamber lid 31 is provided. The nozzle 22 is moved. At this time, unlike the first embodiment, the chamber lid 31 moves horizontally in either the Y-axis direction or the X-axis direction. The pinch valve 24 is driven by the valve driving unit 26 to open the nozzle 22, and the plunger 23 is moved downward by the driving unit 80, whereby the resin R is discharged from the nozzle 22 and supplied to the workpiece W. The resin R can be supplied (applied) to the surface of the workpiece W so as to have a spiral or radial coating pattern among the predetermined coating patterns described in the first embodiment.

  Subsequently, the discharge of air from the chamber 30 is stopped. Specifically, the vacuum state at a predetermined pressure in the chamber 30 is released by stopping the discharge of air by the pressure adjusting unit 41. Thereby, the resin R pressurized with the pressure of the surrounding atmosphere is inject | poured into the pressure-reduced narrow part 102. FIG. Further, the nozzle 22 is repeatedly moved up and down a predetermined number of times to perform liquid removal.

  Subsequently, the supply amount of the resin R is measured in the closed chamber 30. Specifically, the shutter 62 is slid to connect the hole 32b and the hole 62a (the shutter 62 is in an open state). Thereby, the chamber 30 is opened to the atmosphere, and injection (filling) of the resin R into the narrow portion 102 is promoted. Further, the pin 61 can enter the chamber 30. Then, the weighing unit 60 and the pin 61 are moved up by the driving unit 63, and the workpiece W is lifted by the pin 61 penetrating the chamber body 32. Thereby, the supply amount of the resin R can be measured by measuring the weight of the workpiece W with the weigh scale 60 and comparing it with the weight before the resin supply. If the resin supply amount does not reach the predetermined amount, the workpiece W is set on the set stand 51, and the resin R is supplied again in the vacuum chamber 30.

  After a predetermined amount of the resin R is supplied, the chamber 30 is opened. Specifically, by moving the chamber lid 31 upward by the lid driving unit 50A, the chamber lid 31 moves away from the chamber main body 32 and the chamber 30 is opened. Thereafter, the workpiece W (the one supplied with the resin R) is taken out by, for example, a conveying device, and conveyed to, for example, a molding die 91 (see FIG. 9). At this time, the workpiece W set on the setting table 51 is supported (ejected) by the pin 43 moved upward after the chuck 56 is released, and is transferred to the conveying device. After that, the workpiece W supplied with the resin R is set in the molding die 91, and the resin R is thermally cured in the cavity C of the molding die 91. Since problems such as air entrapment are prevented by using the above-described resin supply method, a molded product in which molding defects such as unfilling in the narrow portion 102 are suppressed is manufactured.

(Embodiment 3)
First, a resin molding apparatus 90 according to an embodiment of the present invention will be described mainly with reference to FIGS. 9 and 19. FIG. 9 is a diagram (cross-sectional view) for explaining the resin molding method (resin molding apparatus 90). FIG. 19 is a diagram (schematic configuration diagram) for explaining the resin molding apparatus 90.

  The resin molding apparatus 90 includes, as an automatic machine, a supply unit 97, a press unit 98, a storage unit 99, and a conveyance device 104 (conveyance unit) that conveys the workpiece W and the resin R therebetween. The supply unit 97 includes the resin supply device 10 described above, and performs preparations for supplying the workpiece W and the resin R to the press unit 98. The press unit 98 includes a molding die 91 having a cavity C, and the resin R is thermally cured in the cavity C. The molding die 91 includes a pair of molds (one is an upper die 92 and the other is a lower die 93) that can be opened and closed by a known press mechanism, and a workpiece W is set on the lower die 93, and the upper die A cavity C (concave portion) is provided at 92 to perform “upper cavity molding”. It is also possible to adopt a mold configuration in which the workpiece W is set on the upper die 92 and the cavity C (concave portion) is provided on the lower die 93 to perform “lower cavity molding”. The storage unit 99 prepares for storing a resin-molded workpiece W (molded product). The resin molding device 90 includes a control unit 105 that controls each unit, and this control unit 105 is also used as a control unit for the resin supply devices 10 and 10A, but may be used separately.

  In addition, as another structure of the resin molding apparatus 90 which is an automatic machine, the supply part 97 which can accommodate the workpiece | work W, the supply part of the resin R provided with the above-mentioned resin supply apparatus 10, the press part 98, and between these It is good also as a structure provided with the conveying apparatus 104 (conveyance part) which conveys the workpiece | work W and resin R. The supply unit 97 prepares to supply the workpiece W to the press unit 98 and stores the molded workpiece W. Further, the resin R supply unit can arbitrarily supply the resin R to the workpiece W or the release film.

  The molding die 91 includes a cavity piece 94 (first mold block) and a clamper 95 (second mold block) surrounding the cavity piece 94 (first mold block) in order to form a cavity C (concave portion). In the molding die 91, since the cavity C is provided in the upper die 92, the bottom of the cavity C is constituted by the lower surface of the cavity piece 94, and the side portion of the cavity C is constituted by the inner wall surface of the clamper 95. The molding die 91 includes a seal ring 96 (for example, an O-ring) that seals between the upper die 92 and the lower die 93 (inside the die). Although not shown, the resin molding apparatus 90 includes a pressure adjusting unit (for example, a vacuum pump) that adjusts the internal pressure of the molding die 91 and a temperature adjusting unit (for example, a heater) that adjusts the internal temperature (molding temperature).

  Next, a resin molding method (which is an operation method of the resin molding apparatus 90) will be described. First, for example, the resin R is supplied onto the workpiece W using the above-described resin supply apparatus 10 (FIG. 9A). Subsequently, the workpiece W supplied with the resin R is carried by the transfer device 104 from the resin supply device 10 to the molding die 91 in a mold open state, and the workpiece W is molded into the mold C with the chip part 100 facing the cavity C side. It is set on the mold 91 (the upper surface of the lower mold 93) (FIG. 9B).

  Subsequently, the molding die 91 is closed, and the cavity C is brought into a reduced pressure (vacuum) state (FIG. 9C). Specifically, the lower die 93 is brought closer to the upper die 92 by a press mechanism. As a result, the seal ring 96 provided on the lower die 93 touches the clamper 95 of the upper die 92, and the chip component 100 and the resin R on the workpiece W (carrier 101) are accommodated in the cavity C. At this time, the inside of the mold can be brought into a reduced pressure state by discharging air by a pressure adjusting unit (not shown).

  Subsequently, by further closing the mold 91, the workpiece W (carrier 101) is clamped between the upper mold 92 and the lower mold 93 (FIG. 9D), and compression molding is performed (FIG. 9E). At this time, since the molding die 91 is heated to the molding temperature by the temperature adjusting unit (not shown), the resin R is thermally cured (heated and cured) in the cavity C. The resin R is compressed (pressurized) and injected into the narrow portion 102. However, problems such as air entrapment are prevented by using the above-described resin supply method, so that the narrow portion 102 is not filled. A molded product (work W) in which the molding defects are suppressed is formed. Thereafter, the molding die 91 is opened, and the workpiece W (molded product) is taken out from the molding die 91 by the conveying device 104 and is carried out to the storage unit 99.

  In the present embodiment, air is prevented from being mixed between the workpiece W and the resin R by the above-described resin supply method before resin molding. For this reason, generation | occurrence | production of the void by air mixing can be suppressed in the resin molding part of the workpiece | work W (molded article). Further, in the workpiece W, since air is suppressed from being mixed even in the narrow portion 102, generation of voids is suppressed and underfill is performed.

(Embodiment 4)
First, a resin molding apparatus 90A according to an embodiment of the present invention will be described mainly with reference to FIG. FIG. 10 is a diagram (sectional view) for explaining the resin molding method (resin molding apparatus 90A). The schematic configuration of the resin molding apparatus 90A is the same as the resin molding apparatus 90 (FIG. 19) described above.

  The molding die 91A provided in the resin molding apparatus 90A includes a pair of molds (one is an upper die 92 and the other is a lower die 93) that can be opened and closed by a known press mechanism. The lower mold 93 is provided with a cavity C (concave portion) to perform “lower cavity molding”. The present embodiment is different from the third embodiment in that “lower cavity molding” is performed, and molding is performed using two different types of resins R and Ra. Therefore, this point will be mainly described below.

  Next, a resin molding method (an operation method of the resin molding apparatus 90A) will be described. First, for example, the resin R is supplied onto the workpiece W using the above-described resin supply apparatus 10 (FIG. 10A). Furthermore, according to the resin supply apparatus 10, the resin R pressurized with the pressure of the surrounding atmosphere can be injected into the narrowed portion 102 whose pressure has been reduced (FIG. 10B). Here, since the narrow portion 102 of the workpiece W is filled with the resin R, the connecting portion between the chip component 100 and the carrier 101 is sealed, and thus the molding may be completed.

  However, when the outer periphery of the chip component 100 is preferably sealed by resin sealing to maintain mechanical strength, or the outer periphery of the chip component 100 is preferably covered by resin sealing, the following steps are performed. Specifically, the workpiece W supplied with the resin R is carried by the transport device 104 from the resin supply device 10 to the molding die 91A in a mold open state, and the workpiece W is directed toward the cavity C side. It is set on the molding die 91A (the lower surface of the upper die 92) (FIG. 10C). The workpiece W is sucked and held on the lower surface of the upper die 92 by a suction device through a path (hole) opened on the lower surface of the upper die 92, for example. Further, a resin Ra different from the resin R supplied to the workpiece W is supplied into the cavity C. Here, the different resin Ra is supplied in a process different from the process using the resin supply apparatus 10 and may be the same or different. Moreover, although the resin R in the resin supply apparatus 10 was liquid, the resin Ra may be liquid, granular, powdery, or sheet-like. The resin Ra can be transported by an appropriate transport device 104. For example, the resin Ra is supplied into the cavity C in a state where the resin Ra is mounted on a release film that covers the mold surface and prevents contact between the mold surface and the resin Ra. can do.

  Subsequently, the molding die 91A is closed, and the cavity C is brought into a reduced pressure (vacuum) state (FIG. 10D). As a result, the seal ring 96 provided on the upper die 92 touches the clamper 95 of the lower die 93, and the chip component 100 and the resins R and Ra are accommodated in the cavity C.

  Subsequently, by further closing the molding die 91A, the workpiece W (carrier 101) is clamped between the upper die 92 and the lower die 93, and compression molding is performed (FIG. 10E). At this time, since the molding die 91A is heated to the molding temperature by the temperature adjusting unit (not shown), the resins R and Ra are thermally cured (heated and cured) in the cavity C. Since problems such as air entrapment are prevented using the resin supply method described above, a molded product (work W) in which molding defects such as unfilling in the narrow portion 102 are suppressed is formed. Further, for example, a molded product can be formed using a resin R suitable for filling the narrow portion 102 and a resin Ra excellent in heat dissipation and shielding properties and suitable for sealing the chip component 100. Thereafter, the molding die 91A is opened, and the workpiece W (molded product) is taken out from the molding die 91A by the conveying device 104 and carried out to the storage unit 99.

(Embodiment 5)
The resin molding method according to the embodiment of the present invention will be described mainly with reference to FIGS. FIGS. 11-14 is a figure (perspective view) for demonstrating the resin molding method. In the present embodiment, for example, the above-described resin supply devices 10 and 10A can be used for supplying the resin R to the workpiece W, and the above-described resin molding devices 90 and 90A can be used for resin molding. For resin molding, a resin molding apparatus 90 that performs “upper cavity molding” is preferable.

  First, a workpiece W (supplied object) before the resin R is supplied is prepared (FIG. 11). As the workpiece W, a disk-shaped carrier 101 (for example, a semiconductor wafer, a glass plate on which a wiring layer is formed) in which a plurality of chip parts 100 (for example, semiconductor chips) are flip-chip connected (bumped) in a matrix form. Apply.

  Subsequently, the resin R is supplied onto the workpiece W using, for example, the resin supply device 10 (FIG. 12). Here, the chip part 100 covered with the resin R on the workpiece W is removed by supplying the liquid resin R in a spiral shape with a gap provided across the entire surface of the workpiece W (carrier 101).

  Subsequently, after setting the workpiece W supplied with the resin R to the molding die 91 that has been opened, the molding die 91 is closed so that the seal ring 96 is touched to the clamper 95 and further the workpiece W is clamped. . At this time, the inside of the mold including the closed cavity C is decompressed. In this way, by reducing the ambient atmosphere, the air between the chip component 100 and the carrier 101 (the narrow portion 102 shown in FIG. 1) is discharged, and generation of voids in the underfilled resin R is prevented. Can do. In order to enhance the air discharge effect, it is preferable that the resin R is supplied to the workpiece W at such a height that the resin R does not contact the lower surface of the cavity piece 94 when the seal ring 96 touches ( FIG. 9C).

  Further, by closing the mold, the liquid resin R is compressed (FIG. 13), and the resin R filled in the cavity C is thermoset and molded (FIG. 14). The liquid resin R applied in a spiral shape (a plurality of linear shapes) is spread by the molding die 91 and flows by the distance between the adjacent linear resins R. For example, the application time is shortened. Therefore, the flow distance of the resin R can be reduced as compared with the case where the resin R that is supplied at one point in the center of the workpiece W flows to the outer periphery. Thereby, generation | occurrence | production of malfunctions, such as a chip shift by the resin flow of resin which flows while hardening progresses by a crosslinking reaction, can be prevented. In addition, the generation of flow marks caused by resin flow can be reduced. Further, it is possible to prevent the resin R from being hardened by heat reception during flow when the distance is long, and to improve the underfill property on the outer periphery of the workpiece W.

  By the way, when the resin R is simply applied in a spiral shape and supplied to the workpiece W, when the resin R is compressed by the molding die 91, the adjacent linear resins R are joined together. If this is not sufficient, air may be trapped at the junction. Therefore, for example, as shown in FIGS. 15 to 18, by applying a coating pattern in which air can flow out at a predetermined location on the workpiece W, air is discharged when the resin R is compressed by the molding die 91. It is sufficient to prevent molding defects. In addition, when resin R is supplied to the workpiece W using the resin supply devices 10 and 10A, application of the resin R that can prevent problems such as air entrapment in the resin R without setting the chamber 30 in a vacuum state. This will be described as a pattern.

  FIG. 15 shows the state of the workpiece W after the resin R is supplied by narrowing a part of the spiral shape (predetermined position 103). Here, when the liquid resin R is supplied in a spiral shape, the resin R is applied to the surface of the work W at a predetermined direction (predetermined position 103) such as the cross direction shown in FIG. The height is lowered or the resin R is reduced. As such a resin supply method, for example, by increasing the moving speed of the nozzle 22, the coating amount at that position can be reduced as compared with other positions. As another method, the application amount of the resin R from the nozzle 22 can be reduced. For example, a method of lowering the opening of the nozzle 22 (picking the nozzle 22) or a method of slowing the operation speed of the plunger 23 can be considered. Thus, when the resin R is compressed by the molding die 91, air can pass through the predetermined position 103, so that the air can be discharged smoothly and the generation of voids can be prevented.

  FIG. 16 shows a state of the workpiece W after the resin R is supplied in a spiral shape while being interrupted. Here, in order to provide a space in which air can flow, a method that is applied to multiple points is used. In this case, in the nozzle 22 moving so as to form a spiral coating pattern, the operation is such that the resin R is discharged when the nozzle 22 is brought close to the workpiece W, and the discharged resin R is separated when the nozzle 22 is moved apart. To repeat. Thereby, the movement to the next discharge point can be immediately performed by moving to the next discharge point without completely ending the application. Accordingly, since the resin R can be repeatedly discharged at high speed when the discharge point is reached and brought close to the workpiece W, the resin R can be supplied at high speed. In addition, air can flow between the points where the resin R is applied, and generation of voids can be prevented. Further, since the resin R is gradually discharged from the nozzle 22, the resin R can be applied to the entire surface of the workpiece W until a predetermined supply amount is reached. According to this, since it is possible to apply, for example, spiral lines arranged at a high density, it is possible to reduce the flow amount of the resin R and reduce the flow marks.

  FIG. 17 shows the state of the workpiece W after the resin R is supplied linearly while being interrupted. Here, using the method described with reference to FIG. 16, in order to provide a space through which air can flow, a linear application pattern that is applied to a plurality of points is used. Further, by supplying the resin R in a straight line, it can be applied to the case where the resin R is supplied between the chips. For example, as shown in FIG. 6B, the resin R is applied between a plurality of chips that are finally separated as one package region. It can also be applied to

  FIG. 18 shows the state of the workpiece W after the resin R is supplied at multiple points between the chip components 100. Here, when the resin R is compressed by the molding die 91 by applying the resin R between, for example, four adjacent chip components 100 using the method described with reference to FIG. The resin R can be easily filled in the cavity C while ensuring.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, various resin supply methods as shown in FIGS. 5 and 15 to 18 include not only the carrier 101 on which the chip component 100 is mounted as the work W but also a flat work or lower cavity molding as shown in FIG. It can also be applied to a release film used for the purpose of ensuring separation and preventing resin leakage.

  In the above-described embodiment, the configuration in which the position of the nozzle 22 that discharges the resin R after the pressure is reduced has been described, but the present invention is not limited to this. For example, the resin R may be supplied without reducing the pressure in the configuration in which the resin R is applied in an arbitrary shape on the workpiece W or the release film by moving the position of the nozzle 22 that discharges the resin R. In addition, for example, the resin R can be applied in an arbitrary shape on the release film. However, the air sandwiched between the release film and the resin R or the air in the resin R can be discharged. Moreover, it is good also as a structure which shortens application | coating time as a structure provided with two or more syringes 21 and nozzles 22. FIG.

  Further, for example, various resin supply methods as shown in FIGS. 15 to 18 and the like are application patterns in which air can flow out at a predetermined location on the workpiece W, and the pressure is reduced when discharging the resin R. Even without this, for example, molding can be performed while preventing generation of voids by molding while the air flows out (discharges) in a mold that is decompressed.

  In the above-described embodiment, the ball roller is used as the weighted receiver of the chamber lid. However, for example, a configuration in which the weight is received by air from the compressor can be used.

DESCRIPTION OF SYMBOLS 10 Resin supply apparatus 30 Chamber 31 Chamber lid 32 Chamber main body 32a Opening edge 33 Seal ring 37 Load receiving

Claims (11)

A resin supply device that supplies liquid resin to a supply in a vacuum chamber.
A chamber lid and a chamber body constituting the chamber;
A seal ring that is provided at an opening edge of the chamber body and seals between the chamber lid and the chamber body;
A load receiver provided on the chamber body along the seal ring and receiving a load between the chamber lid and the chamber body;
A resin supply device comprising: In the resin supply apparatus of Claim 1,
In the state where the chamber is opened, the seal ring is higher than the load receiver at a height from the chamber body toward the chamber lid. In the resin supply apparatus of Claim 1 or 2,
The resin supply apparatus further comprising: a lid driving unit that moves the chamber lid with respect to the chamber body in a state where the chamber is closed. In the resin supply apparatus as described in any one of Claims 1-3,
The weight receiving is configured to include a plurality of ball rollers. In the resin supply apparatus as described in any one of Claims 1-4,
A resin supply apparatus, further comprising a weigh scale provided in the chamber and on which the material to be supplied is set. In the resin supply apparatus as described in any one of Claims 1-5,
A set table provided in the chamber and on which the material to be supplied is set;
A table drive unit for rotating the set table;
A resin supply device further comprising: The resin supply apparatus according to claim 6, wherein
A resin supply apparatus, further comprising a weigh scale provided outside the chamber and set with the supply object via a pin penetrating the chamber main body. The resin supply device according to any one of claims 1 to 7,
A mold having a cavity and thermosetting the resin in the cavity;
A resin molding apparatus comprising: A resin supply method for supplying a liquid resin to an article having a narrow portion,
(A) setting the supply object in a chamber;
(B) after the step (a), reducing the pressure in the chamber;
(C) after the step (b), supplying the resin so as to be applied to the narrow portion;
(D) after the step (c), pressurizing the chamber;
A resin supply method comprising: The resin supply method according to claim 9, wherein
In the step (b), the chamber is evacuated,
In the step (d), the chamber is opened to the atmosphere. In the resin supply method according to claim 9 or 10,
A resin supply method characterized in that a carrier to which a chip component is flip-chip connected is used as the supply object, and the narrow portion is between the carrier and the chip component.