JP2018078136A - Polarity discrimination apparatus, mounting apparatus, a nd polarity discrimination method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To discriminate polarity of an electronic component without making tact time longer.SOLUTION: A polarity discrimination device (55) for discriminating polarity of an electronic component (Pa) mounted on a substrate (W) includes: a light-emitting part (46) for emitting light toward a predetermined height position of an electronic component; a light receiving part (47) for receiving light from the light-emitting part across the electronic component; a calculation part (56) for calculating the component width from the light-shielding width with respect to the light-receiving part; and a discrimination part (57) for discriminating the polarity of the electronic component based on the component width of the predetermined height position. The light-emitting part and the light receiving part are loaded on a mounting head for mounting the electronic component on the substrate.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a polarity discriminating device, a mounting device, and a polarity discriminating method for discriminating the polarity of an electronic component mounted on a substrate.

  As an electronic component polarity discriminating device, one that electrically inspects the polarity of an electronic component before the start of production has been proposed (for example, see Patent Document 1). The polarity discriminating device described in Patent Document 1 is provided with a pair of contact terminals, and the polarity of the electronic component is discriminated by pressing the lead of the electronic component against the pair of contact terminals and energizing them. Incorrect mounting of electronic components on the board is prevented. As another polarity discriminating device, one that picks up the electronic component being transported from below with an imaging device and discriminates the polarity of the electronic component from the pattern attached to the outer surface of the electronic component shown in the captured image is proposed. Has been.

JP 2009-115638 A

  However, the polarity discrimination device described in Patent Document 1 cannot perform polarity discrimination unless the electronic component is transported to a predetermined position of the device. Similarly, other polarity discrimination devices transport the electronic component directly above the imaging device. Without polarity, the polarity cannot be determined. For this reason, there has been a problem that the tact time becomes long and the productivity deteriorates.

  SUMMARY OF THE INVENTION The present invention has been made in view of such a point, and an object thereof is to provide a polarity discriminating device, a mounting device, and a polarity discriminating method capable of discriminating the polarity of an electronic component without increasing the tact time. To do.

  A polarity discriminating apparatus according to one aspect of the present invention is a polarity discriminating apparatus that discriminates the polarity of an electronic component mounted on a substrate, and a light emitting unit that emits light toward a predetermined height position of the electronic component; A light receiving unit that receives light from the light emitting unit across the light receiving unit, a calculation unit that calculates a component width from a light shielding width of the electronic component with respect to the light receiving unit, and a polarity of the electronic component based on a component width at a predetermined height position A light-emitting unit and a light-receiving unit are mounted on a mounting head for mounting an electronic component on a substrate.

  A polarity discrimination method according to an aspect of the present invention is a polarity discrimination method for discriminating the polarity of an electronic component mounted on a substrate, and receives light from a light emitting unit directed to a predetermined height position of the electronic component. Receiving the light, and calculating the component width from the light-shielding width of the electronic component with respect to the light receiving unit, and determining the polarity of the electronic component based on the component width at a predetermined height position, The light receiving unit is mounted on a mounting head for mounting an electronic component on a substrate, and the polarity is determined while the electronic component is being conveyed by the mounting head.

  According to these configurations, the light emitting unit and the light receiving unit are mounted on the mounting head, and the light from the light emitting unit is received by the light receiving unit across the electronic component, whereby the component width is calculated and the electronic component is calculated from the component width. The polarity of the part is determined. Since the polarity is determined while transporting the electronic component by the mounting head, the electronic component can be transported to the substrate by the shortest route without making a detour to determine the polarity. Therefore, the polarity of the electronic component can be determined without increasing the tact time.

  The polarity discriminating apparatus includes a driving mechanism that changes a relative position between the electronic component and the light emitting unit and the light receiving unit, and the light emitting / receiving position to the electronic component is varied by the driving mechanism. According to this structure, the light emission position and light reception position with respect to an electronic component can be varied.

  In the above polarity determination device, the electronic component has a plurality of leads, the light emitting unit emits light toward the plurality of leads at a predetermined height position, and the light receiving unit sandwiches the plurality of leads and the light emitting unit The calculation unit calculates the lead width from the light shielding width of the plurality of leads with respect to the light receiving unit, and the determination unit determines the polarity of the electronic component from the difference in the lead widths of the plurality of leads. According to this configuration, it is possible to easily determine the polarity of an electronic component in which the positive electrode and the negative electrode are different depending on the lead width.

  In the above polarity discrimination device, the electronic component has a pair of leads, and one lead is a J lead. According to this configuration, since the lead width of the J lead is wide, the polarity of the electronic component can be easily determined from the lead width.

  In the polarity discriminating device, the light emitting unit emits light at a different height position toward the electronic component, the light receiving unit receives light from the light emitting unit across the electronic component, and the calculation unit receives the light receiving unit. The component width is calculated at each height position from the light-shielding width of the electronic component with respect to the portion, and the determination unit determines the polarity of the electronic component from the deviation direction of the center position of the component width at each height position. According to this configuration, it is possible to easily determine the polarities of electronic components having different component shapes on the positive electrode side and the negative electrode side from the deviation of the center position of the component width at each height position.

  In the above polarity discrimination device, the electronic component is divided into a package and a plurality of leads in the height direction, and the light emitting part emits light toward the package at the first height position, and at the second height position. Light is emitted toward a plurality of leads, and the light receiving unit receives light from the light emitting unit across a package, and receives light from the light emitting unit across a plurality of leads, and the calculation unit receives the light. The package width is calculated from the light shielding width of the package with respect to the portion, and the area width from one lead to the other lead is calculated from the light shielding width of the plurality of leads with respect to the light receiving portion. The polarity of the electronic component is determined from the deviation direction of the center position of the lead region width. According to this configuration, it is possible to easily determine the polarities of the electronic components having different component shapes on the positive electrode side and the negative electrode side from the difference between the center positions of the package width and the lead region width.

  A mounting apparatus according to an aspect of the present invention includes a mounting head including the polarity determination device described above, and a moving mechanism that moves the mounting head from a supply position of an electronic component toward a substrate, and is determined by the polarity determination device. The mounting angle is adjusted based on the polarity of the electronic component, and the electronic component is mounted on the substrate by the mounting head. According to this configuration, since the polarity is determined while the electronic component is conveyed by the mounting head, the electronic component can be mounted in an appropriate direction with respect to the substrate without increasing the tact time of the electronic component.

  According to the present invention, the light emitting unit and the light receiving unit are mounted on the mounting head, and the polarity is determined while the electronic component is conveyed by the mounting head. Therefore, the tact time can be shortened and the productivity can be improved.

It is a schematic diagram which shows the whole mounting apparatus of this Embodiment. It is a schematic diagram which shows the mounting head periphery of this Embodiment. It is a schematic diagram which shows the conveyance route of the mounting apparatus of a comparative example. It is a schematic diagram of the polarity discrimination apparatus of this Embodiment. It is explanatory drawing of the 1st polarity discrimination method of this Embodiment. It is explanatory drawing of the 2nd polarity discrimination method of this Embodiment. It is a flowchart of the 1st polarity discrimination method of this Embodiment. It is a flowchart of the 2nd polarity discrimination method of this Embodiment.

  Hereinafter, the mounting apparatus of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the entire mounting apparatus of the present embodiment. In addition, the mounting apparatus of this Embodiment is only an example, and can be changed suitably.

  As shown in FIG. 1, the mounting apparatus 1 is configured to mount a component P (see FIG. 2) supplied by a supply device (feeder) 10 at a predetermined position on a substrate W by a mounting head 40. A substrate transport unit 21 that transports the substrate W in the X-axis direction is disposed substantially at the center of the base 20 of the mounting apparatus 1. The substrate transport unit 21 carries the substrate W before component mounting from one end side in the X-axis direction to the lower side of the mounting head 40 and positions the substrate W after component mounting from the other end side in the X-axis direction to the outside of the apparatus. I am carrying it out. On the base 20, a large number of supply devices 10 are arranged side by side in the X-axis direction on both sides of the substrate transport unit 21.

  A tape reel 11 is detachably mounted on the supply device 10, and a carrier tape in which various components are packaged is wound around the tape reel 11. Each supply device 10 feeds the parts P in order toward the delivery position picked up by the mounting head 40 by the rotation of a sprocket wheel provided in the device. At the delivery position of the mounting head 40, the cover tape on the surface is peeled from the carrier tape, and the component P in the pocket of the carrier tape is exposed to the outside. The component P is not particularly limited to an electronic component or the like as long as it can be mounted on the substrate W.

  A horizontal movement mechanism (movement mechanism) 30 that horizontally moves the mounting head 40 in the X-axis direction and the Y-axis direction is provided on the base 20. The horizontal movement mechanism 30 has a pair of Y-axis drive units 31 extending in the Y-axis direction and an X-axis drive unit 32 extending in the X-axis direction. The pair of Y-axis drive units 31 are supported by support units (not shown) erected at the four corners of the base 20, and the X-axis drive unit 32 is movable in the Y-axis direction by the pair of Y-axis drive units 31. is set up. Further, the mounting head 40 is installed on the X-axis driving unit 32 so as to be movable in the X-axis direction. The mounting head 40 is connected to the supply device 10 and the substrate W by the X-axis driving unit 32 and the Y-axis driving unit 31. Is reciprocated between.

  As shown in FIG. 2, the mounting head 40 is configured by providing a plurality of nozzles 42 (only one is shown in the present embodiment) on a head main body 41 supported by an X-axis drive unit 32 (see FIG. 1). ing. Each nozzle 42 is supported by the head main body 41 via a nozzle drive unit 43, and is moved up and down in the Z-axis direction and rotated around the Z-axis by the nozzle drive unit 43. Each nozzle 42 is connected to a suction source (not shown) and sucks and holds the component P by a suction force from the suction source. The nozzle 42 is provided with a coil spring, and the component P adsorbed by the nozzle 42 is mounted on the substrate W while the coil spring is contracted.

  The head main body 41 is provided with a height sensor 44 (see FIG. 1) for detecting the height from the substrate W and a recognition unit 45 for recognizing the component shape adsorbed by the nozzle 42. The height sensor 44 detects the height from the substrate W to the nozzle 42 and controls the vertical movement of the nozzle 42. In the recognition unit 45, the light emitting unit 46 and the light receiving unit 47 are horizontally opposed to each other with the component P interposed therebetween, and light from the light emitting unit 46 toward the component P is received by the light receiving unit 47. The component P is rotated by the nozzle 42 between the light emitting unit 46 and the light receiving unit 47, and the component shape, the center of the component, and the like are recognized from the change in the light shielding width by the component P.

  Further, the mounting head 40 includes a substrate imaging unit 48 (see FIG. 1) that images a BOC mark as a reference mark on the substrate W from directly above, and a nozzle that images the mounting operation of the component P by the nozzle 42 from obliquely above. An imaging unit 49 is provided. The board imaging unit 48 sets a coordinate system for the board W based on the picked-up image of the BOC mark, and recognizes a positional deviation of the board W and the like. The nozzle imaging unit 49 images before and after the component P is attracted to the supply device 10 and also images before and after the component P is mounted on the mounting surface of the substrate W. In this way, whether or not the component P is adsorbed by the nozzle 42 and whether or not the component P is mounted on the substrate W are inspected.

  In addition, the mounting device 1 is provided with a control device 50 that performs overall control of each part of the device. The control device 50 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The memory also includes a control program for the mounting apparatus 1, a determination program for executing each step of a polarity determination method for determining the polarity of an electronic component, which will be described later, a determination value used for determining the polarity of the electronic component, and the like. The various parameters are stored.

  In the mounting apparatus 1 configured as described above, the mounting head 40 is moved to the supply apparatus 10 (see FIG. 1), the component P supplied from the supply apparatus 10 is picked up by the nozzle 42, and a desired substrate W is formed. The component P is mounted at the mounting position. By the way, there is an electronic component Pa (see FIG. 4) that requires polarity discrimination in the component P, and the electronic component Pa having such a polarity needs to adjust the mounting angle with respect to the substrate W. The polarity of the electronic component Pa is generally determined by energizing between terminals of the electronic component Pa or imaging the electronic component Pa to check the package mark. Must be placed in.

  For this reason, in a general mounting apparatus 80 as shown in the comparative example of FIG. 3, in order to determine the polarity of the electronic component Pa, the electronic component Pa picked up from the supply device 81 is conveyed to the determination device 82 on the apparatus. There must be. Since the electronic component Pa is transported from the supply device 81 to the mounting position on the substrate W via the determination device 82, the transport route becomes a detour and the tact time becomes long. Here, the polarity of the electronic component Pa is closely related not only to the electrical characteristics between the terminals and the mark of the package, but also to the component shape such as the lead shape (for example, J lead) and the package shape.

  Further, as shown in FIG. 2, a recognition unit 45 capable of recognizing the component shape of the component P is mounted on the mounting head 40. The electronic component P (Pa, Pb, Pc) adsorbed by the nozzle 42 is raised by the nozzle drive unit 43 (drive mechanism) and stopped at a predetermined height position. With respect to the electronic component P stopped at the predetermined height position, the component shape is projected onto the light receiving unit 47 by emitting light from the light emitting unit 46 of the recognition unit 45 toward the component P. Then, the component P is rotated around the suction position by the nozzle 42 to change the light-shielding width of the component P projected on the light receiving unit 47 to obtain the component shape and the center position. As described above, in the recognition unit 45, the component shape and the like are recognized from the light shielding width projected on the light receiving unit 47 for each rotation angle of the component P.

  Therefore, in the mounting apparatus 1 of the present embodiment, paying attention to the fact that the polarity can be determined from the component shape of the electronic component Pa (see FIG. 4), the recognition unit 45 mounted on the mounting head 40 is used for the electronic component Pa. The polarity is discriminated. Thereby, the recognition unit 45 is used as the polarity discriminating device 55 (see FIG. 4), and the polarity of the electronic component Pa is discriminated without preparing a new discriminating device. Further, since the polarity is determined while the electronic component Pa is conveyed by the mounting head 40, the electronic component can be conveyed from the supply device 10 to the substrate W by the shortest route to shorten the tact time and improve the productivity. .

  Hereinafter, with reference to FIG. 4 to FIG. 6, the polarity determination apparatus of the present embodiment will be described. FIG. 4 is a schematic diagram of the polarity discrimination device of the present embodiment. FIG. 5 is an explanatory diagram of the first polarity determination method of the present embodiment. FIG. 6 is an explanatory diagram of the second polarity determination method of the present embodiment. The first polarity discrimination method is a method for discriminating the polarity of the electronic component from the difference in the lead shape, and the second polarity discrimination method is a method for discriminating the polarity of the electronic component from the difference in the overall shape.

  As shown in FIG. 4, the polarity determination device 55 is configured to determine the polarity of the electronic component Pa with respect to the substrate W using a recognition unit 45 that recognizes the component shape during the conveyance of the component. The recognition unit 45 is provided with a light emitting unit 46 that emits light at a predetermined height position of the electronic component Pa and a light receiving unit 47 that receives light from the light emitting unit 46 with the electronic component Pa interposed therebetween. The light emitting unit 46 is configured by arranging light emitting elements in a horizontal row, and the light receiving unit 47 is configured by arranging light receiving elements in a horizontal row. Light beams with high straightness are emitted from the light emitting elements of the light emitting unit 46 toward the electronic component Pa, and light that is not blocked by the electronic component Pa is received by the light receiving elements of the light receiving unit 47.

  When the polarity of the electronic component Pa is determined, unlike the component shape recognition process at the time of calculating the center of the component, the electronic component Pa is not rotated by the nozzle 42, and the light shielding width when the electronic component Pa is viewed from one direction is determined. It is projected on the light receiving unit 47. In this case, the orientation of the electronic component Pa is adjusted between the light emitting unit 46 and the light receiving unit 47 so that one side surface in which the positive electrode side and the negative electrode side of the electronic component Pa are asymmetrical with respect to the light receiving surface of the light receiving unit 47 faces. The Note that the recognition unit 45 may receive the LED light emitted from the light emitting unit 46 with the light receiving unit 47, or may receive the laser light emitted from the light emitting unit 46 with the light receiving unit 47.

  The polarity discriminating device 55 includes a calculating unit 56 that calculates the component width from the light-shielding width of the electronic component Pa with respect to the light receiving unit 47, and a determining unit that determines the polarity of the electronic component Pa based on the component width at a predetermined height position. 57 is provided. The light-shielding width that is not received by the light-receiving element of the light-receiving unit 47 is input to the calculation unit 56, and the component width when the electronic component P is viewed from one side is calculated from the light-shielding width. The discriminator 57 receives the component width of the electronic component Pa from the calculator 56, and discriminates the polarity of the asymmetric electronic component Pa between the positive electrode side and the negative electrode side from the component width. Thus, the positive electrode side and the negative electrode side of the electronic component Pa are discriminated from the component width at the predetermined height position of the electronic component Pa.

  Among electronic parts Pa, those having a difference in the shape of a plurality of leads, such as J lead parts, can be distinguished in polarity by measuring the lead width of each lead. In general, J lead parts are positive on the J lead side and negative on the straight lead side, and the J lead has a larger lead width than the straight lead. Even if all the lead widths are the same, if the overall part shape is different on the left and right, the polarity can be determined by changing the height and measuring the part width several times. If the overall shape of the part is different on the left and right, the center position of the part width is different in the height direction, and therefore the polarity can be determined from the deviation of the center position in the left-right direction.

  As shown in FIG. 5, in the first polarity determination method, the polarity of an electronic component Pb having different lead widths such as a J lead component is determined. A pair of leads 62 and 63 extend from the package 61 to the electronic component Pb, and the lead width is increased by an amount corresponding to the bending of one of the leads 62. The light emitting unit 46 (see FIG. 4) and the light receiving unit 47 (see FIG. 4) are positioned on the pair of leads 62 and 63 at a predetermined height, and light from the light emitting unit 46 is sandwiched between the pair of leads 62 and 63. By receiving light at the light receiving unit 47, the lead widths L1 and L2 are calculated from the light shielding widths of the leads 62 and 63, respectively.

  The polarity discriminating device 55 stores a judgment value D1 for discriminating J lead in advance, and the judgment value D1 is compared with each lead width L1, L2, and a lead width larger than the judgment value D1. Is identified as the J lead. An electronic component Pb whose J lead cannot be identified is discarded as a component defect. As the determination value D1, a value obtained experimentally, empirically, or theoretically for each type of part from past data or the like is used. As described above, since the J lead side is generally a positive electrode, the positive electrode side and the negative electrode side of the electronic component Pb are distinguished by identifying the J lead.

  As shown in FIG. 6, in the second polarity determination method, the polarity is determined for components having different overall shapes on the left and right, such as the electronic component Pc. A pair of linear leads 72 and 73 extend from the package 71 to the electronic component Pc, and are divided into a package 71 and a pair of leads 72 and 73 in the height direction of the electronic component Pc. A pair of leads 72 and 73 are provided so as to be shifted to the left with respect to the package 71, and the overall shape of the component differs depending on the position shift of the package 71 and the pair of leads 72 and 73. For this reason, the component width is calculated at each height position while changing the height position with respect to the electronic component Pc.

  In this case, the light emitting unit 46 (see FIG. 4) and the light receiving unit 47 (see FIG. 4) are positioned on the package 71 at the first height position, and the light from the light emitting unit 46 is received by the light receiving unit 47 across the package 71. Receiving light, the package width L3 is calculated from the light shielding width of the package 71. The light emitting unit 46 and the light receiving unit 47 are positioned on the plurality of leads 72 and 73 at the second height position, and the light receiving unit 47 receives light from the light emitting unit 46 with the pair of leads 72 and 73 interposed therebetween. The area width L4 from the lead 72 at one end to the lead 73 at the other end is calculated from the light shielding width of the pair of leads 72, 73. The center position C1 of the package width L3 and the center position C2 of the lead region width L4 are obtained, and the lateral displacement of the center positions C1 and C2 is obtained.

  With reference to the left origin O, the distance from the origin O to the center position C1 of the package width L3 and the distance from the origin O to the center position C2 of the lead region width L4 are obtained. Then, the deviation direction is obtained from the difference between the distance from the origin O to the center position C1 and the distance from the origin O to the center position C2. For example, if the difference in distance from the origin O to each of the center positions C1 and C2 is a positive number, it is determined that the leads 72 and 73 are displaced to the left with respect to the package 71. If the difference between the distances from the origin O to the center positions C1 and C2 is a negative number, it is determined that the leads 72 and 73 are displaced to the right with respect to the package 71. The polarity of the electronic component Pc is determined from the positional deviation in the left-right direction between the package 71 and the leads 72 and 73.

  In the example of FIG. 6, since the pair of leads 72 and 73 are displaced to the left with respect to the package 71, the left side of the electronic component Pc is determined as the positive electrode, and the right side of the electronic component Pc is determined as the negative electrode. Further, the polarity discriminating device 55 stores a judgment value D2 for judging whether the electronic component Pc is good or not, and the center position C1, C2 of the package width L3 and the lead area width L4 is determined from the judgment value D2. If the amount of displacement is small, it is discarded as a defective part. As the determination value D2, a value obtained experimentally, empirically, or theoretically for each type of part from past data or the like is used.

  Thus, since the polarities of the electronic components Pb and Pc are discriminated by the first and second polarity discriminating methods using the recognition unit 45, it is not necessary to newly provide a discriminating equipment in the mounting apparatus 1, and the cost is reduced. Can be reduced. Since the recognition unit 45 is mounted on the mounting head 40 (see FIG. 2), the polarity of the electronic components Pb and Pc is detected by the recognition unit 45 while the mounting head 40 is transporting the electronic components Pb and Pc. Is determined. For this reason, as shown in the comparative example of FIG. 3, the tact time can be shortened without making the transport route detour.

  Next, the flow of the first and second polarity determination methods will be described with reference to FIGS. FIG. 7 is a flowchart of the first polarity determination method of the present embodiment. FIG. 8 is a flowchart of the second polarity determination method of the present embodiment. In addition, here, for convenience of explanation, description will be made using the reference numerals in FIGS. 4 to 6 as appropriate. In the following description, it is assumed that the orientation is such that the positive electrode is on the left side of the component and the negative electrode is on the right side of the component.

  As shown in FIG. 7, in the first polarity determination method, when the electronic component Pb is attracted by the nozzle 42 (step S01), the electronic component Pb is stopped at a predetermined height position by the nozzle drive unit 43 (drive mechanism). At this predetermined height position, the light from the light emitting unit 46 is received by the light receiving unit 47 through the leads 62 and 63, and the light blocking width is detected (step S02). Next, the calculation unit 56 calculates the number of leads and the lead widths L1 and L2 from the light shielding width of the leads 62 and 63 (step S03). In the present embodiment, since the number of leads is two, J lead determination is performed for the two left and right leads 62 and 63 below. The number of leads is implemented to detect a component error.

  In the J lead determination, the determination unit 57 compares the lead width L1 of the left lead 62 with the J lead determination value D1 (step S04). When the lead width L1 of the left lead 62 is greater than or equal to the determination value D1 (Yes in step S04), it is determined that the left lead 62 is the J lead, that is, the positive electrode. Thus, assuming that the correct mounting angle is such that the electronic component Pb is positive on the left side and negative on the right side, the electronic component Pb is mounted on the substrate W by the nozzle 42 without reversing the mounting angle of the electronic component Pb with respect to the substrate W. It is mounted at the mounting position (step S05).

  On the other hand, if the lead width L1 is smaller than the determination value D1 (No in step S04), the lead width L2 of the right lead 63 and the J lead determination value D1 are compared (step S06). When the lead width L2 of the right lead 63 is equal to or larger than the determination value D1 (Yes in step S06), it is determined that the right lead 63 is a J lead, that is, a positive electrode. Accordingly, the mounting angle of the electronic component Pb with respect to the substrate W is reversed (step S07), and the electronic component Pb is appropriately mounted at the mounting position of the substrate W by assuming that the mounting angle is the reverse mounting angle of the electronic component Pb. (Step S05).

  If the lead width L2 is smaller than the determination value D1 (No in step S06), the electronic component Pb is discarded because the J lead cannot be determined (step S08). As described above, in the first polarity discrimination method, the positive electrode is discriminated based on whether the J lead is the left lead 62 or the right lead 63, and the mounting angle of the electronic component Pb with respect to the substrate W is adjusted. . In addition, although the example which discriminate | determines the polarity of J lead component by the 1st polarity discriminating method was demonstrated, when discriminating the polarity of the electronic component from which a some lead shape (lead width) differs, the 1st polarity discriminating method May be used.

  As shown in FIG. 8, in the second polarity discrimination method, when the electronic component Pc is adsorbed by the nozzle 42 (step S11), the light from the light emitting unit 46 is packaged at the first height position of the electronic component Pc. The light receiving unit 47 receives light through 71 and detects the light shielding width (step S12). Next, the calculation unit 56 calculates the package width L3 from the light shielding width of the package 71 (step S13). Next, at the second height position of the electronic component Pc, the light from the light emitting unit 46 is received by the light receiving unit 47 through the pair of leads 72 and 73, and the light blocking width is detected (step S14). Next, the area width L4 from the lead 72 at one end to the lead 73 at the other end is calculated from the light shielding width of the pair of leads 72 and 73 by the calculating unit 56 (step S15).

  Next, the difference between the center position C1 of the package width L3 and the center position C2 of the lead area width L4 is calculated by the determination unit 57 (step S16), and the difference between the center positions C1 and C2 is compared with the component pass / fail judgment value D2. (Step S17). When the difference (absolute value) between the center positions C1 and C2 is smaller than the determination value D2 (No in step S17), the electronic component Pc is discarded because the polarity cannot be determined (step S18). On the other hand, if the difference (absolute value) between the center positions C1 and C2 is greater than or equal to the determination value D2 (Yes in step S17), it is determined whether or not the difference between the center positions C1 and C2 is a positive number (step S19). ).

  When the difference between the center positions C1 and C2 is a positive number (Yes in step S19), it is determined that the left side where the leads 72 and 73 are displaced from the package 71 is the positive electrode. Assuming the correct mounting angle so that the electronic component Pc is positive on the left side and negative electrode on the right side, the electronic component Pc is moved to the mounting position of the substrate W by the nozzle 42 without reversing the mounting angle of the electronic component Pc with respect to the substrate W. It is mounted (step S20). When the difference between the center positions C1 and C2 is a negative number (No in step S19), it is determined that the right side where the leads 72 and 73 are displaced from the package 71 is the positive electrode. The mounting angle of the electronic component Pc with respect to the substrate W is reversed (step S21), and the electronic component Pc is mounted at the mounting position of the substrate W by the nozzle 42 (step S20).

  Thus, in the second polarity discrimination method, the positive electrode is discriminated based on the positional deviation direction of the leads 72 and 73 with respect to the package 71, and the mounting angle of the electronic component Pc with respect to the substrate W is adjusted. In addition, although the example which discriminate | determines the polarity of components by the 2nd polarity discrimination method was demonstrated, you may make it discriminate | determine the polarity of J lead components by the 2nd polarity discrimination method. In addition, by combining the first polarity determination method and the second polarity determination method, the electronic component that is determined to be unable to determine the J lead by the first polarity determination method is transferred to the second polarity determination method. You may make it discriminate | determine.

  As described above, in the polarity discriminating apparatus 55 of the present embodiment, the light emitting unit 46 and the light receiving unit 47 are mounted on the mounting head 40, and light from the light emitting unit 46 is received by the light receiving unit 47 across the electronic component Pa. By receiving light, the component width is calculated, and the polarity of the electronic component Pa is determined from the component width. Since the polarity is determined while transporting the electronic component Pa by the mounting head 40, the electronic component Pa can be transported to the substrate W by the shortest route without making a detour to determine the polarity. Therefore, the polarity of the electronic component Pa can be determined without increasing the tact time.

  In the present embodiment, the light emitting unit and the light receiving unit are arranged to face each other in the horizontal direction, but the present invention is not limited to this configuration. As long as the light from the light emitting part toward the predetermined height of the electronic component can be received by the light receiving part, the light receiving part may be arranged in any manner.

  In the present embodiment, a nozzle driving unit is provided as a driving mechanism (first driving mechanism) that changes the relative positions of the electronic component and the light receiving unit and the light emitting unit of the recognition unit. Instead, a drive mechanism (second drive mechanism) including a linear guide (guide member) that supports the recognition unit so as to move up and down with respect to the mounting head body, and an actuator (motor, cylinder) that moves the recognition unit up and down. It is also conceivable to use

  It is also conceivable to easily change the relative positions of the electronic component and the light receiving unit and the light emitting unit of the recognition unit in cooperation with the first drive mechanism and the second drive mechanism. That is, the first drive mechanism moves up and stops at a predetermined position after the electronic component is attracted. Thereafter, the second drive mechanism is moved up and down to change the relative position between the light emitting unit and the light receiving unit. As described above, these drive mechanisms change the relative positions of the electronic component, the light emitting unit, and the light receiving unit, and vary the light emission / light reception position to the electronic component.

  Moreover, in this Embodiment, although it was set as the structure which acquires the light-shielding width of an electronic component using the light emission part and light-receiving part of a recognition unit, it is not limited to this structure. The mounting head may be provided with a light emitting unit and a light receiving unit separately from the recognition unit.

  In the present embodiment, the first polarity determination method is configured to determine the polarity of the electronic component by specifying the J lead. However, the present invention is not limited to this configuration. In the first polarity determination method, the polarity of the electronic component may be determined from the difference in the lead widths of the plurality of leads. For example, the lead width of the plurality of leads is compared, and the lead having the largest lead width is determined as the positive electrode. May be.

  In the present embodiment, the second polarity determination method is configured to calculate the component width based on the height positions of the package and leads of the electronic component, but is not limited to this configuration. In the second polarity determination method, the polarity of the electronic component may be determined from the shift direction of the center position of the component width at a plurality of height positions. That is, the light emitting unit emits light at different height positions toward the electronic component, and the light receiving unit receives light from the light emitting unit at each height position, and calculates the component width at each height position. Further, the polarity of the electronic component may be determined from the shift direction of the center position of the component width at each height position, and the method for specifying the shift direction of the center position is not particularly limited.

  Moreover, although embodiment and modification of this invention were demonstrated, what combined the said embodiment and modification as the other embodiment of this invention entirely or partially may be sufficient.

  The embodiments of the present invention are not limited to the above-described embodiments and modifications, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

  Further, the determination program of the present embodiment may be stored in a storage medium. The recording medium is not particularly limited, but may be a non-transitory recording medium such as an optical disk, a magneto-optical disk, or a flash memory.

  In the present embodiment, the configuration in which the present invention is applied to a mounting apparatus has been described. However, the present invention can be applied to other apparatuses that can determine the polarity of an electronic component without increasing the tact time. .

  Furthermore, in the said embodiment, it is a polarity discrimination apparatus which discriminate | determines the polarity of the electronic component mounted with respect to a board | substrate, and the light emission part which light-emits toward the predetermined height position of an electronic component, and a light emission part on both sides of an electronic component A light receiving unit that receives light from the light receiving unit, a calculation unit that calculates a component width from a light shielding width of the electronic component with respect to the light receiving unit, and a determination unit that determines the polarity of the electronic component based on the component width at a predetermined height position. The light emitting unit and the light receiving unit are mounted on a mounting head for mounting an electronic component on a substrate. According to this configuration, the light emitting unit and the light receiving unit are mounted on the mounting head, and the light from the light emitting unit is received by the light receiving unit across the electronic component, whereby the component width is calculated and the electronic component is calculated from the component width. Is determined. Since the polarity is determined while transporting the electronic component by the mounting head, the electronic component can be transported to the substrate by the shortest route without making a detour to determine the polarity. Therefore, the polarity of the electronic component can be determined without increasing the tact time.

  As described above, the present invention has an effect that the polarity of the electronic component can be determined without increasing the tact time, and in particular, the polarity determination for determining the polarity of the J lead component mounted on the board. It is useful for devices, mounting devices, and polarity discrimination methods.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 10 Supply apparatus (feeder)
30 Horizontal movement mechanism (movement mechanism)
40 Mounting head 41 Head body 43 Nozzle drive unit (drive mechanism)
45 recognition unit 46 light emitting unit 47 light receiving unit 55 polarity discriminating device 56 calculating unit 57 discriminating unit 61, 71 package 62, 63, 72, 73 lead Pa, Pb, Pc electronic component W substrate

Claims (8)

A polarity discriminating device for discriminating the polarity of an electronic component mounted on a substrate,
A light emitting unit that emits light toward a predetermined height position of the electronic component;
A light receiving unit that receives light from the light emitting unit across an electronic component;
A calculation unit for calculating a component width from a light shielding width of the electronic component with respect to the light receiving unit;
A discriminator for discriminating the polarity of the electronic component based on the component width at the predetermined height position;
The polarity discriminating apparatus, wherein the light emitting unit and the light receiving unit are mounted on a mounting head for mounting an electronic component on a substrate. A drive mechanism for changing a relative position between the electronic component, the light emitting unit, and the light receiving unit;
The polarity discriminating apparatus according to claim 1, wherein the light emitting / receiving position to the electronic component is varied by the driving mechanism. The electronic component has multiple leads,
The light emitting unit emits light toward a plurality of leads at a predetermined height position,
The light receiving unit receives light from the light emitting unit across a plurality of leads,
The calculation unit calculates a lead width from a light shielding width of a plurality of leads with respect to the light receiving unit,
3. The polarity discriminating apparatus according to claim 1, wherein the discriminating unit discriminates the polarity of the electronic component from the difference in the lead widths of the plurality of leads.   The polarity discriminating apparatus according to claim 3, wherein the electronic component has a pair of leads, and one lead is a J lead. The light emitting part emits light by changing the height position toward the electronic component,
The light receiving unit receives light from the light emitting unit across an electronic component;
The calculation unit calculates the component width at each height position from the light shielding width of the electronic component with respect to the light receiving unit,
The polarity discriminating apparatus according to claim 1 or 2, wherein the discriminating unit discriminates the polarity of the electronic component from the deviation direction of the center position of the component width at each height position. The electronic component is divided into a package and multiple leads in the height direction,
The light emitting unit emits light toward the package at the first height position, and emits light toward the plurality of leads at the second height position,
The light receiving unit receives light from the light emitting unit across a package, and receives light from the light emitting unit across a plurality of leads,
The calculation unit calculates the package width from the light-shielding width of the package with respect to the light-receiving unit, and calculates the region width from the light-shielding width of the plurality of leads to the light-receiving unit from one lead to the other lead,
6. The polarity discriminating apparatus according to claim 5, wherein the discriminating unit discriminates the polarity of the electronic component from a deviation direction between the center position of the package width and the center position of the lead region width. A mounting head comprising the polarity discrimination device according to any one of claims 1 to 6,
A moving mechanism for moving the mounting head from the electronic component supply position toward the substrate,
A mounting apparatus that mounts an electronic component on a substrate by the mounting head by adjusting a mounting angle based on the polarity of the electronic component determined by the polarity determination device. A polarity determination method for determining the polarity of an electronic component mounted on a substrate,
Receiving light from the light emitting unit toward the predetermined height position of the electronic component by the light receiving unit;
Calculating a component width from a light-shielding width of the electronic component with respect to the light receiving unit;
Determining the polarity of the electronic component based on the component width at the predetermined height position,
A polarity discriminating method, wherein the light emitting unit and the light receiving unit are mounted on a mounting head for mounting an electronic component on a substrate, and the polarity is discriminated during conveyance of the electronic component by the mounting head.

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