JP2018073930A - Cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress adhesion of extraneous material.SOLUTION: In a cleaning device 1 including a chuck table 2, a revolving shaft unit 3 including a bearing 5 and a revolving shaft 4 supporting the chuck table 2 rotatably, a leaning fluid supply nozzle 6 for supplying cleaning solvent to a wafer W, a cleaning room chamber 8 forming a cleaning room, and an exhaust unit 9 for evacuating the atmosphere of the cleaning room chamber 8, the cleaning room chamber 8 includes an opening 814, through which the tip of the shaft 4 of the revolving shaft unit 3 supporting the chuck table 2 from the back side projects, in a bottom wall 812, a seal member 86 for preventing the atmosphere from intruding into the cleaning room chamber 8 from the opening 814 is attached to an inside wall 833 standing around the opening 814, and the seal member 86 has an annular body 861 attached to the inside wall 833, and an extension 862 extending from the annular body 861, and the upper end of the extension 862 is in contact with the reverse side of the chuck table 2.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cleaning apparatus.

  2. Description of the Related Art A removal device that cleans and removes cutting waste or protective liquid adhering to the surface of a workpiece after dicing or laser processing is performed by a cutting device or a laser processing device is known (for example, Patent Documents) 1).

JP 2009-253226 A

  For example, an image sensor such as a CMOS (Complementary Metal-Oxide Semiconductor) is a device that hates the adhesion of foreign substances. These image sensors may not function properly if even a small amount of foreign matter adheres to them. However, when the workpiece is cleaned by the cleaning device, stains and foreign matters that did not adhere by dicing or laser processing may adhere to the image sensor. As a result of diligent research by the inventors of the present application, it has been found that grease has entered the cleaning chamber through the rotating shaft bearing of the chuck table of the cleaning device as the atmosphere of the cleaning chamber is exhausted.

  This invention is made | formed in view of the above, Comprising: The objective is to provide the washing | cleaning apparatus which can suppress adhesion of a foreign material.

  In order to solve the above-described problems and achieve the object, a cleaning device of the present invention includes a chuck table that holds a workpiece on a holding surface, and a bearing portion and a shaft portion that rotatably support the chuck table. A rotating shaft unit, a nozzle for supplying a cleaning liquid to a workpiece held on the chuck table, a cleaning chamber for receiving the chuck table and the nozzle and forming a cleaning chamber, and an atmosphere of the cleaning chamber And an exhaust unit that discharges the cleaning chamber, wherein the cleaning chamber has a bottom opening that projects the tip of the shaft portion of the rotary shaft unit that supports the chuck table from the back side. A seal member for preventing an atmosphere from entering the chamber from the opening is attached to a cylindrical wall standing around the opening, and the seal member is an annular shape attached to the cylindrical wall. Has a body portion, an extension portion extending from the annular body portion, the upper end of the extending portion is equal to or in contact with the back side of the chuck table.

  According to the cleaning device of the present invention, it is possible to suppress adhesion of foreign matter.

FIG. 1 is a perspective view illustrating a configuration example of a processing apparatus including a cleaning device according to an embodiment. FIG. 2 is a perspective view of the cleaning device according to the embodiment. FIG. 3 is a cross-sectional view illustrating the cleaning device according to the embodiment. FIG. 4 is a partially enlarged cross-sectional view illustrating the cleaning device according to the embodiment.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

  In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. One end direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction is defined as the Z-axis direction. The X and Y planes including the X axis and the Y axis are parallel to the horizontal plane. The Z-axis direction orthogonal to the X and Y planes is the vertical direction.

  FIG. 1 is a perspective view illustrating a configuration example of a processing apparatus including a cleaning device according to an embodiment. FIG. 2 is a perspective view of the cleaning device according to the embodiment. FIG. 3 is a cross-sectional view illustrating the cleaning device according to the embodiment. FIG. 4 is a partially enlarged cross-sectional view illustrating the cleaning device according to the embodiment.

  As shown in FIG. 1, a processing apparatus 100 including a cleaning apparatus according to the present embodiment cuts a workpiece, for example, a wafer W. The processing apparatus 100 includes a chuck table 110, an X-axis moving unit 120, a cutting unit 130, a Y-axis moving unit 140, a Z-axis moving unit 150, and the cleaning device 1.

  The chuck table 110 holds the wafer W. The chuck table 110 is supported on the X-axis moving base 121 of the X-axis moving unit 120. The chuck table 110 can be rotated around an axis (θ axis) parallel to the vertical direction by a θ axis rotating means (not shown), in other words, can be rotated in a horizontal plane. In other words, the chuck table 110 can rotate relative to the apparatus main body 200 around the θ axis. The chuck table 110 includes a main body 111 that holds the wafer W.

  The main body 111 is formed in a disc shape. The main body 111 is composed of, for example, a stainless steel frame and a porous ceramic plate that fits into the frame and constitutes a holding surface 111a that holds the wafer W. The holding surface 111 a is formed at the upper end of the main body 111 in the vertical direction. The holding surface 111a is formed in parallel to the horizontal plane and is flat. The holding surface 111a communicates with a vacuum suction source (not shown). The holding surface 111a sucks and holds the wafer W through the sticking tape T attached to the wafer W by the negative pressure of the vacuum suction source.

  The X-axis moving unit 120 feeds the chuck table 110 in the X-axis direction (machining feed direction). The X-axis moving means 120 supports the X-axis moving base 121 so as to be movable in the X-axis direction. The X-axis moving unit 120 includes a drive source configured by, for example, a ball screw, a pulse motor, or the like that extends parallel to the X-axis direction. The X-axis moving unit 120 moves the X-axis moving base 121 relative to the apparatus main body 200 in the X-axis direction. The X-axis moving base 121 is supported by the apparatus main body 200. The X-axis moving base 121 supports the chuck table 110. For this reason, the chuck table 110 is moved relative to the apparatus main body 200 in the X-axis direction by the X-axis moving means 120.

  The cutting means 130 cuts the wafer W held on the chuck table 110. The cutting means 130 includes a cutting blade 131, a spindle 132, and a housing 133. The cutting blade 131 is a cutting grindstone formed in an extremely thin disk shape and in an annular shape. The spindle 132 is detachably mounted with the cutting blade 131. The housing 133 has a drive source such as a motor, and supports the spindle 132 so as to be rotatable around a rotation axis in the Y-axis direction.

  The Y-axis moving unit 140 supports the Y-axis moving base 141 so as to be movable in the Y-axis direction (index feed direction). The Y-axis moving unit 140 includes a drive source configured by, for example, a ball screw, a pulse motor, or the like that extends parallel to the Y-axis direction. The Y-axis moving unit 140 moves the Y-axis moving base 141 relative to the apparatus main body 200 in the Y-axis direction. The Y-axis moving base 141 is supported by a support base 201 that is erected from the upper end of the apparatus main body 200 in the vertical direction. The Y-axis movement base 141 supports the Z-axis movement unit 150.

  The Z-axis moving means 150 supports the Z-axis moving base 151 so as to be movable in the Z-axis direction (cutting feed direction). The Z-axis moving unit 150 includes a drive source configured by, for example, a ball screw, a pulse motor, or the like that extends parallel to the Z-axis direction. The Z-axis moving unit 150 moves the Z-axis moving base 151 relative to the apparatus main body 200 in the Z-axis direction. The Z-axis movement base 151 is supported on the Y-axis movement base 141. The Z-axis moving unit 150 supports the cutting unit 130. Therefore, the cutting means 130 moves relative to the apparatus main body 200 in the Y-axis direction and the Z-axis direction by the Y-axis moving means 140 and the Z-axis moving means 150.

  As shown in FIG. 2, the cleaning device 1 cleans and dries the wafer W that has been subjected to the cutting process. The cleaning device 1 includes a chuck table 2, a rotary shaft unit 3, a cleaning fluid supply nozzle (nozzle) 6, an air supply nozzle 7, a cleaning chamber 8, and an exhaust unit 9.

  As shown in FIGS. 2 to 4, the chuck table 2 holds the wafer W. The chuck table 2 is rotated in a horizontal plane around the rotation shaft 41 of the shaft portion 4 by the rotation shaft unit 3. The chuck table 2 includes a holding unit 21 having a holding surface 21a, a flange 22, a frame clamp 23, and a suction unit 24.

  The holding part 21 is formed in a disk shape. The holding portion 21 is disposed so as to face the wafer W. The outer diameter of the holding portion 21 is larger than the outer diameter of the wafer W and smaller than the outer diameter of the annular frame F. The holding surface 21 a communicates with a vacuum suction source, like the holding surface 111 a of the chuck table 110. The holding surface 21a sucks and holds the wafer W via the sticking tape T by the negative pressure of the vacuum suction source. The outer diameter of the holding surface 21 a is larger than the outer diameter of the wafer W and smaller than the outer diameter of the sticking tape T.

  The flange 22 is joined below the holding portion 21. The flange 22 is integrally formed with a disk-shaped small-diameter portion 221 and a disk-shaped large-diameter portion 222 having an outer diameter larger than that of the small-diameter portion 221. The small diameter part 221 is joined below the holding part 21. The tip of the rotary shaft 41 of the rotary shaft unit 3 is connected to the large diameter portion 222. Thereby, the chuck table 2 rotates as a unit by the rotation of the rotating shaft 41.

  The frame clamp 23 holds the annular frame F. The frame clamps 23 are arranged on the outer periphery of the holding unit 21 with an interval.

  As shown in FIG. 4, the suction unit 24 applies a negative pressure to the holding surface 21a. The suction unit 24 includes a first supply pipe 241, a second supply pipe 242, a connection port 243, a negative pressure supply port 244, and a positive pressure supply port 245.

  The first supply pipe 241 is disposed in the rotation shaft 41 of the shaft portion 4 along a direction parallel to the axial direction. The first supply pipe 241 is formed in a hollow pipe shape communicating with the holding surface 21a and the second supply pipe 242.

  The second supply pipe 242 is disposed in a horizontal plane within the rotation shaft 41 of the shaft portion 4. The second supply pipe 242 is formed in a hollow pipe shape communicating with the first supply pipe 241. The second supply pipe 242 can communicate with the connection port 243.

  The connection port 243 is disposed outside the rotation shaft 41 of the shaft portion 4 and inside the case 52 of the bearing portion 5. The connection port 243 can communicate with the second supply pipe 242. The connection port 243 communicates with the negative pressure supply port 244 and the positive pressure supply port 245.

  Oil in which grease is applied between the connection port 243 and the second supply pipe 242, in other words, in the gap between the outer peripheral surface of the rotating shaft 41 of the shaft portion 4 and the inner peripheral surface of the case 52 of the bearing portion 5. A seal S is installed and sealed. Thereby, between the connection port 243 and the 2nd supply pipe 242, it is controlled that gas leaks out to the space inside the rotating shaft 41 of the shaft part 4 or the case 52 of the bearing part 5. .

  The negative pressure supply port 244 is an opening formed in the case 52 of the bearing unit 5. The negative pressure supply port 244 sucks gas from the holding surface 21a with a vacuum suction source. The negative pressure supply port 244 communicates with the connection port 243 and the positive pressure supply port 245. The negative pressure supply port 244 communicates with the negative pressure supply pipe 53 of the bearing unit 5.

  The positive pressure supply port 245 is an opening formed in the case 52 of the bearing unit 5. The positive pressure supply port 245 is disposed above the negative pressure supply port 244. The positive pressure supply port 245 supplies gas to the holding surface 21a when supplying positive pressure to the holding surface 21a. The wafer W and the adhesive tape T sucked and held by the supplied gas are urged to peel from the holding surface 21a. The positive pressure supply port 245 communicates with the connection port 243 and the negative pressure supply port 244. The positive pressure supply port 245 communicates with the positive pressure supply pipe 54 of the bearing unit 5.

  As shown in FIGS. 3 and 4, the rotary shaft unit 3 supports the chuck table 2 so as to be rotatable from below. The rotating shaft unit 3 includes a shaft portion 4 and a bearing portion 5.

  The shaft portion 4 transmits a rotational force to the chuck table 2. The shaft portion 4 includes a rotation shaft 41, a rotation motor 42, and a support mechanism 43.

  The rotary shaft 41 is connected to the drive shaft of the rotary motor 42 and transmits the rotational force of the rotary motor 42 to the chuck table 2. One end of the rotation shaft 41 in the axial direction is connected to the rotation motor 42. The other end (tip) of the rotation shaft 41 in the axial direction is connected to the chuck table 2. The rotating shaft 41 rotates around the axis.

  The rotary motor 42 is a drive source for the rotary shaft unit 3. The rotation motor 42 rotates the rotation shaft 41 around the axis.

  The support mechanism 43 supports the rotary motor 42 so as to be movable in the vertical direction. The support mechanism 43 includes a plurality of, for example, three support legs 431, and a plurality of, for example, three air cylinders 432 connected to the rotation motor 42 by connecting the support legs 431. By operating the air cylinder 432, the rotary motor 42 and the chuck table 2 are positioned at the workpiece loading / unloading position which is the upper position and the work position which is the lower position.

  The bearing unit 5 connects the shaft unit 4 and the cleaning chamber 8. The bearing unit 5 includes a bearing 51, a case 52, a negative pressure supply pipe 53, a positive pressure supply pipe 54, and an open pipe 55.

  The bearing 51 is a ball bearing. The bearing 51 rotatably supports the central portion of the rotating shaft 41 of the shaft portion 4. The outer ring of the bearing 51 is fixed inside the case 52.

  The case 52 is formed in a cylindrical shape that can accommodate the bearing 51 inside. The case 52 is fixed below the cleaning chamber 8. More specifically, the case 52 is disposed in a space inside the inner wall 813 of the cleaning chamber 8.

  The negative pressure supply pipe 53 is disposed so as to penetrate the case 52 in the thickness direction. The negative pressure supply pipe 53 is formed in a hollow pipe shape communicating with the negative pressure supply port 244 of the suction unit 24. The negative pressure supply pipe 53 is connected to a vacuum suction source.

  The positive pressure supply pipe 54 is disposed so as to penetrate the case 52 in the thickness direction. The positive pressure supply pipe 54 is disposed above the negative pressure supply pipe 53. The positive pressure supply pipe 54 is formed in a hollow pipe shape communicating with the positive pressure supply port 245 of the suction unit 24.

  The open tube 55 is disposed through the case 52 in the thickness direction. The open pipe 55 is disposed above the positive pressure supply pipe 54. The open pipe 55 is formed in a hollow pipe shape that communicates with the space inside the case 52 and the space outside the cleaning chamber 8. One end of the open pipe 55 communicates with the space inside the case 52, and the other end is opened to the atmosphere outside the apparatus.

  As shown in FIGS. 2 and 3, the cleaning fluid supply nozzle 6 cleans the wafer W by spraying cleaning water such as pure water toward the wafer W at the time of cleaning. The cleaning fluid supply nozzle 6 injects clean air or the like toward the wafer W during drying to dry the wafer W. The cleaning fluid supply nozzle 6 includes a nozzle arm 61 and a cleaning fluid ejection part 62.

  The nozzle arm 61 is provided so as to be swingable within a horizontal plane. The nozzle arm 61 is connected to a cleaning fluid supply source (not shown). The nozzle arm 61 is formed in a hollow pipe shape that communicates with the cleaning fluid ejection portion 62. The cleaning fluid ejection part 62 is disposed at the tip of the nozzle arm 61. The cleaning fluid ejection unit 62 ejects a cleaning fluid composed of pure water and air in the vertical direction toward the wafer W that has been subjected to the cutting process and is held on the holding surface 21 a of the chuck table 2.

  As shown in FIG. 2, the air supply nozzle 7 ejects air to the cleaned wafer W. The air supply nozzle 7 has a nozzle arm 71 and an air ejection part 72. The nozzle arm 71 is swingably provided in a horizontal plane. The nozzle arm 71 is connected to an air supply source (not shown). The nozzle arm 71 is formed in a hollow pipe shape that communicates with the air ejection part 72. The air ejection part 72 is disposed at the tip of the nozzle arm 71. The air ejection part 72 ejects air toward the cleaned wafer W held on the holding surface 21 a of the chuck table 2.

  As shown in FIGS. 2 and 3, the cleaning chamber 8 forms a cleaning chamber that houses the chuck table 2 and the cleaning fluid supply nozzle 6. The cleaning chamber 8 includes a cleaning chamber body 81, support legs 82, a cover member 83, a drain hose 84, a labyrinth seal portion 85, a seal member 86, and a lid 87.

  The cleaning chamber main body 81 has a cylindrical outer wall 811, an annular bottom wall (bottom) 812, a cylindrical inner wall 813, an opening 814, and a drain port 815. A space surrounded by the outer side wall 811, the bottom wall 812, and the inner side wall 813 is a cleaning chamber. The outer side wall 811 protrudes upward from the outer peripheral edge of the bottom wall 812. The inner wall 813 protrudes upward from the inner periphery of the bottom wall 812, in other words, from the periphery of the opening 814. The length of the inner wall 813 in the axial direction is shorter than the length of the outer wall 811 in the axial direction. The opening 814 is formed at the center of the bottom wall 812, and the tip of the rotating shaft 41 of the rotating shaft unit 3 protrudes. The drainage port 815 is formed through the bottom wall 812 in the thickness direction. A drain hose 84 is connected to the drainage port 815.

  A space inside the inner wall 813 communicates with a space outside the cleaning chamber 8 through the opening 814. An open tube 55 communicates with the space inside the inner wall 813.

  The support legs 82 are a plurality of, for example, three legs that support the cleaning chamber body 81. The support legs 82 are arranged around the support mechanism 43.

  The cover member 83 is attached to the rotation shaft 41 of the rotation shaft unit 3. The cover member 83 has an annular bottom wall 831, a cylindrical outer wall 832, and a cylindrical inner wall (tubular wall) 833. The outer diameter of the bottom wall 831 is larger than the inner diameter of the bottom wall 812. The outer side wall 832 protrudes downward from the outer peripheral edge of the bottom wall 831. The inner wall 833 protrudes upward from the inner periphery of the bottom wall 831. The outer wall 832 of the cover member 83 configured in this way is positioned with a gap on the outer side of the inner wall 813 constituting the cleaning chamber body 81.

  The drain hose 84 discharges the cleaning liquid accumulated in the lower portion of the cleaning chamber body 81 to the outside of the cleaning chamber 8. The drain hose 84 is connected to the drainage port 815.

  The labyrinth seal portion 85 restricts the cleaning liquid in the cleaning chamber of the cleaning chamber 8 from entering the space inside the inner wall 833. The labyrinth seal portion 85 is disposed between the chuck table 2 and the cover member 83. More specifically, the labyrinth seal portion 85 is disposed between the flange 22 of the chuck table 2 and the inner wall 833 of the cover member 83. The labyrinth seal portion 85 has an inner cylinder portion 851 and an outer cylinder portion 852.

  The inner cylinder portion 851 has an annular bottom wall 8511 and a cylindrical side wall 8512. The bottom wall 8511 is fixed to the upper surface of the bottom wall 831. The inner diameter of the bottom wall 8511 is slightly larger than the outer diameter of the flange 22. The side wall 8512 protrudes upward from the inner peripheral edge of the bottom wall 8511.

  The outer cylinder portion 852 has an annular bottom wall 8521 and a cylindrical side wall 8522. The bottom wall 8521 is fixed between the holding portion 21 of the chuck table 2 and the small diameter portion 221 and the large diameter portion 222 of the flange 22. The outer diameter of the bottom wall 8521 is slightly larger than the outer diameter of the side wall 8512. The side wall 8522 protrudes downward from the outer peripheral edge of the bottom wall 8521. The side wall 8522 is positioned outside the side wall 8512 with a slight gap.

  As shown in FIGS. 2 to 4, the seal member 86 restricts the cleaning liquid in the cleaning chamber of the cleaning chamber 8 from entering the space inside the inner wall 833. The seal member 86 is disposed between the chuck table 2 and the cover member 83. More specifically, the seal member 86 is disposed between the flange 22 of the chuck table 2 and the inner wall 833 of the cover member 83. The seal member 86 is attached to the entire circumference of the inner wall 833 of the cover member 83. The seal member 86 is composed of a V ring. The seal member 86 has an annular main body portion 861 and an extending portion 862.

  The annular main body 861 is attached to the inner wall 833 of the cover member 83. The annular main body portion 861 is in close contact with the outer peripheral surface of the bottom wall 831 and the outer peripheral surface of the inner wall 833 of the cover member 83. The extending portion 862 extends upward from the upper surface of the annular main body portion 861. The extension portion 862 is inclined from the inner side to the outer side in the radial direction as it goes from the lower side to the upper side in the upper and lower direction in a side view. The upper end of the extending part 862 is in contact with the bottom surface of the large diameter part 222 of the flange 22.

  The lid 87 covers the upper part of the cleaning chamber body 81. More specifically, the lid 87 closes the opening above the outer wall 811.

  The exhaust unit 9 exhausts the atmosphere inside the cleaning chamber of the cleaning chamber 8, that is, the internal atmosphere. The exhaust unit 9 exhausts from the upper part of the cleaning chamber 8. The exhaust unit 9 includes an exhaust port 91 provided in the outer wall 811 of the cleaning chamber 8 and an exhaust pipe 92 connected to the exhaust port 91 and the suction pump 93. The exhaust unit 9 sucks the internal atmosphere of the cleaning chamber of the cleaning chamber 8 through the exhaust pipe 92 and the exhaust port 91 by the suction pump 93, and the wafer W contained in the internal atmosphere by an exhaust processing unit (not shown). Impurities such as adhered substances and substances contained in the cleaning solution are removed and exhausted to the outside.

  Next, the cleaning method and operation of the wafer W using the cleaning device 1 according to this embodiment will be described.

  The wafer W subjected to the cutting process is transported from the chuck table 110 to the cleaning device 1 by a transport unit (not shown). The conveyed wafer W is sucked and held by the holding surface 21a of the chuck table 2 on which negative pressure acts. The annular frame F is clamped and fixed by a frame clamp 23. Then, cleaning water is sprayed from the cleaning fluid supply nozzle 6 toward the wafer W, and the wafer W is cleaned.

  When cleaning the wafer W, the cleaning liquid sprayed onto the wafer W rises as a spray containing foreign matters such as dirt. The spray is exhausted outside the cleaning chamber 8 via the exhaust port 91 and the exhaust pipe 92 by operating the exhaust unit 9.

  A seal member 86 is mounted between the chuck table 2 and the cover member 83 in the cleaning chamber of the cleaning chamber 8. Thereby, when the exhaust unit 9 is operated, the seal member 86 is mounted on the inner wall 833 of the cover member 83 even if the internal atmosphere of the cleaning chamber of the cleaning chamber 8 flows toward the exhaust port 91. The atmosphere in the space inside the inner wall 833 of the cover member 83 is blocked from the internal atmosphere of the cleaning chamber of the cleaning chamber 8. In other words, the external atmosphere of the cleaning chamber of the cleaning chamber 8 containing the grease of the oil seal S is restricted from flowing into the cleaning chamber of the cleaning chamber 8 via the bearing 51 of the bearing portion 5. As described above, the cleaning chamber of the cleaning chamber 8 is restricted from flowing in the external atmosphere of the cleaning chamber of the cleaning chamber 8.

  When the oil seal S between the outer peripheral surface of the rotating shaft 41 of the shaft portion 4 and the inner peripheral surface of the case 52 of the bearing portion 5 is deteriorated, the space inside the case 52 of the bearing portion 5 is activated when the suction unit 24 is operated. The atmosphere becomes negative pressure. As a result, the atmosphere outside the cleaning chamber of the cleaning chamber 8 flows into the case 52 of the bearing portion 5 through the open pipe 55. In this manner, the atmosphere in the space inside the case 52 of the bearing portion 5 is suppressed from becoming excessively negative pressure.

  As described above, according to the present embodiment, the cleaning chamber of the cleaning chamber 8 is the cleaning chamber of the cleaning chamber 8 because the seal member 86 is mounted between the chuck table 2 and the cover member 83. It is possible to regulate the inflow of the external atmosphere. More specifically, in the present embodiment, the labyrinth seal portion 85 prevents the atmosphere in the space inside the side wall 8512 of the inner cylinder portion 851 from flowing toward the exhaust port 91 when the exhaust unit 9 is operated. it can. Furthermore, in this embodiment, the seal member 86 can block the atmosphere in the space inside the inner wall 833 of the cover member 83 from the atmosphere in the cleaning chamber of the cleaning chamber 8. Thereby, in this embodiment, the external atmosphere of the cleaning chamber of the cleaning chamber 8 including the grease of the bearing unit 5 and the oil seal S is transferred to the cleaning chamber of the cleaning chamber 8 via the bearing 51 of the bearing unit 5. Inflow can be regulated. Thus, this embodiment can suppress that a foreign material adheres to the wafer W.

  In the present embodiment, when the oil seal S between the outer peripheral surface of the rotating shaft 41 of the shaft portion 4 and the inner peripheral surface of the case 52 of the bearing portion 5 is deteriorated due to lack of grease or the like, The atmosphere in the space inside the case 52 becomes negative pressure. Thereby, according to this embodiment, the external atmosphere of the cleaning chamber of the cleaning chamber 8 can flow into the case 52 of the bearing portion 5 through the open pipe 55. Thus, this embodiment can suppress that the atmosphere of the space inside the case 52 of the bearing part 5 becomes a negative pressure too much.

  On the other hand, when the open pipe 55 is not disposed, if the oil seal S deteriorates, the atmosphere in the space inside the inner wall 833 becomes negative pressure via the bearing 51 of the bearing portion 5. The seal member 86 is deformed so that the extending portion 862 stands by a suction force due to the negative pressure of the atmosphere inside the inner wall 833. By extending the extending portion 862, the extending portion 862 is in close contact with the back side of the chuck table 2, and the seal member 86 is attracted to the chuck table 2. Thereby, there exists a possibility that rotation of the chuck table 2 may be inhibited. Further, the holding surface 21a of the chuck table 2 may not be flat. Further, the extension portion 862 is worn by the rotation of the chuck table 2, and the seal member 86 may have a short life and may need to be replaced in a short period.

  However, according to this embodiment, it is suppressed that the atmosphere of the space inside the case 52 of the bearing part 5 becomes a negative pressure too much, and the seal member 86 is not deformed. For this reason, this embodiment can suppress that rotation of the chuck table 2 is inhibited. In the present embodiment, the state where the chuck table 2 is held flat can be maintained. Moreover, according to this embodiment, it can suppress that the extension part 862 wears by rotation of the chuck table 2. FIG. Thereby, in this embodiment, it is possible to extend the life of the seal member 86 and lengthen the replacement cycle of the seal member 86.

  According to the present embodiment, when cleaning the wafer W, the cleaning liquid sprayed onto the wafer W rises as a spray containing foreign matters such as dirt. In the present embodiment, the exhaust unit 9 can exhaust the soared spray to the outside of the cleaning chamber 8 via the exhaust port 91 and the exhaust pipe 92.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 2 Chuck table 3 Rotating shaft unit 4 Shaft part 5 Bearing part 6 Cleaning fluid supply nozzle (nozzle)
7 Air supply nozzle 8 Cleaning chamber chamber 81 Cleaning chamber body 812 Bottom wall (bottom)
814 Opening 83 Cover member 833 Inner side wall (tubular wall)
86 Seal member 861 Annular body 862 Extension 9 Exhaust unit 100 Processing device 110 Chuck table 111a Holding surface 120 X-axis moving means 130 Cutting means 140 Y-axis moving means 150 Z-axis moving means W Wafer (workpiece)

Claims (1)

A chuck table that holds a workpiece on a holding surface, a rotary shaft unit that includes a bearing portion and a shaft portion that rotatably supports the chuck table, and a cleaning liquid is supplied to the workpiece held on the chuck table. A cleaning apparatus comprising a nozzle, a cleaning chamber chamber that houses the chuck table and the nozzle and forms a cleaning chamber, and an exhaust unit that discharges the atmosphere of the cleaning chamber chamber,
The cleaning chamber chamber
The bottom portion has an opening from which the tip of the shaft portion of the rotary shaft unit that supports the chuck table from the back side protrudes,
A sealing member for preventing an atmosphere from entering the cleaning chamber chamber from the opening is attached to a cylindrical wall standing around the opening,
The seal member has an annular main body portion attached to the cylindrical wall and an extending portion extending from the annular main body portion, and an upper end of the extending portion is in contact with the back side of the chuck table. A cleaning apparatus characterized by that.

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