JP2018041914A - Substrate work device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate work device capable of improving productivity by shortening operation time of work for acquiring a warpage state of the whole substrate.SOLUTION: A substrate P work device 100 comprises: a height position measuring unit 8 which measures a height position of a substrate P at each of a plurality of measuring points P2 in the substrate P on which a component E is mounted; a mark picking-up unit 7 which picks up each of a plurality of marks M having uses different from a mark for height position acquisition put on the substrate P; and a control unit 9 which acquires a warpage state of the whole substrate P on the basis of a height position of the substrate P in each of the plurality of measuring points B2 acquired on the basis of measurement results in the plurality of measuring points B2 by the height position measuring unit 8, and a height position of the substrate P in each position of the plurality of marks M acquired on the basis of picked-up images of the plurality of marks M by the mark picking-up unit 7.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a substrate working apparatus, and more particularly to a substrate working apparatus that acquires a warped state of an entire substrate.

  2. Description of the Related Art Conventionally, a substrate working apparatus that acquires the warpage state of the entire substrate is known (see, for example, Patent Document 1).

  In Patent Document 1, a mounting head, a laser displacement meter that moves together with the mounting head and measures the height position of the substrate at each of the plurality of measurement points, and a plurality of measurement points measured by the laser displacement meter. A component mounting apparatus (board working apparatus) is disclosed that includes a warpage deformation calculation unit that acquires a warpage state of the entire board based on the height position of the board at each position.

Patent No. 5688564

  However, in the component mounting apparatus described in Patent Document 1, since it is necessary to measure many measurement points in order to acquire the warpage state of the entire board, it takes time to measure the measurement points with the laser displacement meter. it is conceivable that. For this reason, it is thought that the problem that productivity falls will arise.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to improve the productivity by shortening the work time for obtaining the warpage state of the entire substrate. The present invention is to provide a substrate working apparatus capable of performing the above.

  According to one aspect of the present invention, there is provided a board working apparatus including a height position measuring unit that measures a height position of a board at each of a plurality of measurement points, and a height position attached to the board on a board on which a component is mounted. At each position of the plurality of measurement points acquired based on the measurement results of the plurality of measurement points by the mark imaging unit that images each of the plurality of marks having uses different from the acquisition application and the height position measurement unit The warpage state of the entire substrate is acquired based on the height position of the substrate and the height position of the substrate at each position of the plurality of marks acquired based on the captured images of the plurality of marks by the mark imaging unit. A control unit.

  In the substrate working apparatus according to one aspect of the present invention, the height position of the substrate at each position of the plurality of measurement points acquired based on the measurement results of the plurality of measurement points by the height position measurement unit, and mark imaging A control unit is provided that acquires the warpage state of the entire substrate based on the height position of the substrate at each position of the plurality of marks acquired based on the captured images of the plurality of marks by the unit. As a result, a plurality of marks having a use different from the height position acquisition application acquired in an imaging operation for an application different from the height position acquisition application such as a substrate position recognition application, for example, by the mark imaging unit Measurement measured by the height position measurement unit without generating a new height position measurement time by acquiring the height position of the substrate at each position of the plurality of marks based on the captured image of The number of points can be reduced. As a result, it is possible to shorten the time required for the measurement operation of the measurement point by the height position measurement unit without causing a new height measurement work time. The work time can be shortened and productivity can be improved.

  In the substrate working apparatus according to the above aspect, preferably, the plurality of marks include a plurality of substrate position recognition marks for recognizing the position of the substrate, and the control unit includes a plurality of substrate position recognition marks by the mark imaging unit. Based on the captured image, the height position of the substrate at each position of the plurality of substrate position recognition marks is obtained. With this configuration, each of the plurality of substrate position recognition marks can be obtained without causing a new height position measurement work time by using the captured image acquired in the imaging operation for recognizing the position of the substrate. The height position of the substrate at the position can be acquired. Also, by using the captured image of the substrate position recognition mark that is always attached to the substrate in order to recognize the position of the substrate, the captured image is different from the case of using the captured image of the mark that is not attached to the substrate. The height position of the substrate based on the above can be obtained with certainty. As a result, the number of measurement points measured by the height position measurement unit can be reliably reduced.

  In this case, it is preferable that the plurality of marks include a plurality of component position recognition marks for recognizing positions where components are mounted on the board, and the control unit is configured to control the board at each position of the plurality of board position recognition marks. In addition to the height position, the height position of the substrate at each position of the plurality of component position recognition marks is acquired based on the captured images of the plurality of component position recognition marks by the mark imaging unit. If comprised in this way, compared with the case where only the height position of the board | substrate in each position of several board | substrate position recognition marks is acquired, the number of the measurement points measured by a height position measurement part will be reduced significantly. be able to. As a result, the time required for the measurement point measurement operation by the height position measurement unit can be further shortened.

  In the substrate working apparatus according to the above aspect, preferably, the height position measurement unit and the mark imaging unit are attached, and further includes a head unit movable relative to the substrate, and the control unit attaches the head unit to the substrate. The mark imaging unit performs a plurality of mark imaging operations, then moves the head unit relative to the substrate, and the height position measuring unit performs a plurality of measurement points. The measurement operation is configured to be performed. If comprised in this way, the imaging operation | movement of the some mark by a mark imaging part and the measurement operation | movement of the several measurement point by a height position measurement part can be performed separately independently. As a result, each control of the imaging operation and the measurement operation by the control unit can be simplified.

  In the substrate working apparatus according to the above aspect, preferably, the height position measurement unit and the mark imaging unit are attached, and further includes a head unit that is movable relative to the substrate. Based on each position of the mark and each position of the plurality of measurement points on the substrate, a height position acquisition path on the substrate is determined, and the head unit is moved relative to the substrate according to the determined height position acquisition path. Are moved relative to each other so that the measurement operation of a plurality of measurement points and the imaging operation of a plurality of marks are sequentially performed by a height position measurement unit and a mark imaging unit, respectively. If comprised in this way, according to a height position acquisition path | route, by moving a head unit relatively with respect to a board | substrate, the imaging operation of several marks by a mark imaging part and several measuring points by a height position measuring part Compared to the case where the measurement operation is performed separately and independently, the movement path of the head unit can be shortened. As a result, the time required to acquire the height position of the substrate can be shortened, so that productivity can be further improved.

  In this case, preferably, the control unit determines the height position acquisition path so as to be the shortest path based on the positions of the plurality of marks on the substrate and the positions of the plurality of measurement points on the substrate. Is configured to do. With this configuration, the time required to acquire the height position of the substrate can be further shortened, so that productivity can be further improved.

  In the substrate working apparatus according to the aforementioned aspect, the control unit preferably uses the height position measurement unit to determine the height position of the substrate in the vicinity of some of the plurality of marks imaged by the mark imaging unit. Imaging of multiple marks by the mark imaging unit based on the height position of the substrate in the vicinity of some of the marks acquired based on the measurement result of the vicinity of some of the marks by the height position measuring unit The height position of the substrate at each position of the plurality of marks acquired based on the image is corrected. If comprised in this way, based on the height position of the board | substrate based on the measurement result of the vicinity of the mark by the height position measurement part with high measurement accuracy, the height position of the board | substrate based on the captured image of the mark by the mark imaging part Accuracy can be improved. As a result, the warpage state of the entire substrate can be acquired with higher accuracy. In addition, in order to correct the height position of the substrate at each position of the plurality of marks, it is only necessary to measure the height position of the substrate in the vicinity of some of the marks by the height position measuring unit. There is no need to measure the height position of the substrate in the vicinity by the height position measuring unit. As a result, it is possible to correct the height position of the substrate at each position of the plurality of marks while suppressing an increase in the time required for the measurement operation in the vicinity of the mark by the height position measurement unit.

  In the substrate working apparatus according to the above aspect, the control unit preferably acquires the height position of the substrate at each position of the plurality of marks based on a single captured image of each of the plurality of marks. It is configured. If comprised in this way, compared with the case where the height position of the board | substrate in the position of a mark is acquired based on a some captured image, the height position of the board | substrate in the position of a mark can be acquired easily.

  According to the present invention, as described above, it is possible to provide a substrate working apparatus capable of improving the productivity by shortening the work time of the work of acquiring the warpage state of the entire substrate.

It is a figure which shows the whole structure of the substrate working apparatus by 1st and 2nd embodiment of this invention. It is a block diagram which shows the control structure of the substrate working apparatus of 1st and 2nd embodiment. It is a figure for demonstrating acquisition of the curvature state of the whole board | substrate by the board | substrate working apparatus of 1st Embodiment. It is a flowchart for demonstrating the board | substrate work process by the board | substrate working apparatus of 1st Embodiment. It is a figure for demonstrating acquisition of the curvature state of the whole board | substrate by the board | substrate working apparatus of the modification of 1st Embodiment. It is a flowchart for demonstrating the board | substrate work process by the board | substrate working apparatus of the modification of 1st Embodiment. It is a figure for demonstrating acquisition of the curvature state of the whole board | substrate by the board | substrate working apparatus of 2nd Embodiment. It is a figure for demonstrating correction | amendment of the height position based on the captured image of the mark by the board | substrate working apparatus of 2nd Embodiment. It is a flowchart for demonstrating the board | substrate work process by the board | substrate working apparatus of 2nd Embodiment.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the following description, the transport direction of the substrate P is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the vertical direction orthogonal to the horizontal plane is the Z direction.

[First Embodiment]
(Configuration of substrate working device)
With reference to FIGS. 1-3, the structure of the board | substrate working apparatus 100 by 1st Embodiment of this invention is demonstrated.

  As shown in FIG. 1, the substrate working apparatus 100 is a component mounting apparatus that performs board work for mounting a component E (electronic component) such as an IC, a transistor, a capacitor, and a resistor on a substrate P such as a printed circuit board.

  In addition, the substrate working device 100 includes a base 1, a substrate transport unit 2, a head unit 3, a support unit 4, a rail unit 5, a component imaging unit 6, a mark imaging unit 7, and a height position measurement. Unit 8 and a control unit 9 (see FIG. 2).

  The base 1 is a base that serves as a basis for arranging each component in the substrate working apparatus 100. On the base 1, a substrate transport unit 2, a rail unit 5, and a component imaging unit 6 are provided. A control unit 9 is provided in the base 1. In addition, the base 1 is provided with feeder arrangement portions 1a capable of arranging a plurality of tape feeders 10 on both sides (Y1 side and Y2 side) in the Y direction.

  The tape feeder 10 is a device that supplies a component E mounted on the substrate P. The tape feeder 10 holds a reel (not shown) around which a component supply tape holding a plurality of components E is wound. Further, the tape feeder 10 is configured to supply the component E by rotating the held reel and feeding the component supply tape in accordance with the suction operation for taking out the component E by the head unit 3. ing.

  The substrate transport unit 2 carries in the substrate P before mounting from outside the substrate working apparatus 100, transports the substrate P in the transport direction (X direction), and unloads the substrate P after mounting out of the substrate working apparatus 100. It is configured. The board | substrate conveyance part 2 has a pair of conveyor 2a, and is comprised so that the board | substrate P may be conveyed in a conveyance direction by a pair of conveyor 2a. The substrate transport unit 2 transports the loaded substrate P to the substrate working position A, and fixes the substrate P stopped at the substrate working position A by a substrate fixing mechanism (not shown) such as a clamp mechanism. It is configured.

  The head unit 3 is configured to suck the component E supplied from the tape feeder 10 and mount the sucked component E on the substrate P fixed at the substrate working position A. The head unit 3 includes a plurality (five) of heads (mounting heads) 31, a plurality of (five) Z-axis motors 32 (see FIG. 2) respectively provided corresponding to the plurality of heads 31, a plurality of head units 3 A plurality of (five) R-axis motors 33 (see FIG. 2) respectively provided corresponding to the head 31 are included.

  Each of the plurality of heads 31 is connected to a vacuum generator (not shown), and the component E can be adsorbed to a nozzle (not shown) attached to the tip by a negative pressure supplied from the vacuum generator. It is configured. Each of the plurality of Z-axis motors 32 is configured to raise and lower each of the plurality of heads 31 in the vertical direction (Z direction). Accordingly, each of the plurality of heads 31 is between a lowered position when the component E is sucked or mounted (mounted) and a raised position when the component E is transported. It can be moved up and down. Each of the plurality of R-axis motors 33 is configured to rotate each of the plurality of heads 31 around the central axis of a nozzle attached to the head 31. Thereby, each of the plurality of heads 31 is configured to be able to adjust the rotational posture of the component E sucked by the nozzle.

  As shown in FIG. 1, the head unit 3 is configured to be movable in the horizontal direction (X direction and Y direction) above the substrate P. In addition, a mark imaging unit 7 and a height position measuring unit 8 are attached to the head unit 3. The mark imaging unit 7 and the height position measurement unit 8 are configured to move relative to the substrate P in the horizontal direction above the substrate P by moving together with the head unit 3.

  The support unit 4 is configured to support the head unit 3 so as to be movable in the transport direction (X direction). Specifically, the support unit 4 includes a ball screw shaft 41 extending in the transport direction and an X-axis motor 42 that rotates the ball screw shaft 41. The head unit 3 is provided with a ball nut 34 that engages with the ball screw shaft 41 of the support portion 4. The head unit 3 is configured to be movable in the transport direction along the support portion 4 together with the ball nut 34 engaged with the ball screw shaft 41 when the ball screw shaft 41 is rotated by the X-axis motor 42.

  The pair of rail portions 5 are configured to support the support portion 4 so as to be movable in the Y direction. Specifically, the rail portion 5 rotates a pair of guide rails 51 that support both end portions in the X direction of the support portion 4 so as to be movable in the Y direction, a ball screw shaft 52 that extends in the Y direction, and the ball screw shaft 52. Y axis motor 53 is included. The support portion 4 is provided with a ball nut 43 that engages with the ball screw shaft 52 of the rail portion 5. The support portion 4 is configured to be movable in the Y direction along the pair of rail portions 5 together with the ball nut 43 engaged with the ball screw shaft 52 when the ball screw shaft 52 is rotated by the Y-axis motor 53. .

  With such a configuration, the head unit 3 is configured to be movable in the horizontal direction (X direction and Y direction) on the base 1. As a result, the head unit 3 moves above the tape feeder 10 to suck the component E supplied from the tape feeder 10 and moves above the substrate P fixed at the substrate working position A to suck. It is possible to mount the manufactured component E on the substrate P.

  The component imaging unit 6 is a component recognition camera that images the component E adsorbed by the head 31 prior to the mounting operation of the component E on the substrate P. The component imaging unit 6 is fixed on the upper surface of the base 1 and is configured to image the component E attracted by the head 31 from below the component E (Z2 direction). Based on the captured image of the component E by the component imaging unit 6, the control unit 9 is configured to acquire (recognize) the suction state (rotational posture and suction position with respect to the head 31) of the component E.

  The mark imaging unit 7 is a mark recognition camera that images a plurality (six) of marks M (see FIG. 3) attached to the upper surface of the substrate P prior to the mounting operation of the component E on the substrate P. The mark imaging unit 7 is configured to move together with the head unit 3 above the mark M to be imaged, and to image the mark M to be imaged from above (Z1 direction). The plurality of marks M have uses different from the height position acquisition use described later, and include a plurality (two) of substrate position recognition marks M1 and a plurality (four) of component position recognition marks M2. It is out.

  The substrate position recognition mark M1 is a mark for recognizing the position of the substrate P. The substrate position recognition mark M1 is imaged by the mark imaging unit 7 in a state where the substrate P is fixed by the substrate fixing mechanism. Then, based on the captured image of the substrate position recognition mark M1 by the mark imaging unit 7, the control unit 9 acquires (recognizes) the accurate position and orientation (rotation angle) of the substrate P fixed by the substrate fixing mechanism. It is configured.

  The component position recognition mark M2 is a mark for recognizing the position where the component E requiring high mounting accuracy is mounted on the substrate P, and is located near the position where the component E requiring high mounting accuracy is mounted on the substrate P. Is provided. The component position recognition mark M2 is imaged by the mark imaging unit 7 in a state where the substrate P is fixed by the substrate fixing mechanism. Then, based on the captured image of the component position recognition mark M2 by the mark imaging unit 7, the control unit 9 mounts the component E requiring high mounting accuracy and the rotation angle on the substrate P fixed by the substrate fixing mechanism. Is configured to accurately acquire (recognize).

  The height position measuring unit 8 measures the height position of the substrate P at each of a plurality of preset measurement points B (see FIG. 3) prior to mounting the component E on the substrate P. Displacement meter. The height position measurement unit 8 irradiates the measurement point B to be measured with laser light, and receives the laser light reflected from the measurement point B to be measured, whereby the substrate at the position of the measurement point B to be measured. It is configured to measure the height position of P. Further, the height position measuring unit 8 is configured to move together with the head unit 3 above the measurement point B to be measured, and measure the measurement point B to be measured from above (Z1 direction). In the present specification, the “height position” is a height position with respect to a reference height position in the substrate working apparatus 100.

  As shown in FIG. 2, the control unit 9 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like, and is a control circuit that controls the operation of the substrate working apparatus 100. . The controller 9 adsorbs the component E supplied from the tape feeder 10 by controlling the substrate transport unit 2, the X-axis motor 42, the Y-axis motor 53, the Z-axis motor 32, the R-axis motor 33, and the like according to the production program. And the component E is mounted on the board P.

(Acquisition of warpage of entire board)
Prior to the mounting operation of the component E on the board P, the control unit 9 is configured to acquire the warpage state of the entire board P.

  Here, in 1st Embodiment, as shown in FIG. 3, the control part 9 is acquired based on the measurement result of the several measurement point B (B2 mentioned later) by the height position measurement part 8, and is obtained. Acquired based on the height position of the substrate P at each position of the measurement point B (B2) and the captured images of the plurality of marks M (the substrate position recognition mark M1 and the component position recognition mark M2) by the mark imaging unit 7. The warp state of the entire substrate P is acquired based on the height position of the substrate P at each position of the plurality of marks M.

<Acquisition of board height position based on captured image of mark>
The control unit 9 is configured to move the mark imaging unit 7 sequentially above each of the plurality of marks M by moving the head unit 3 so that each of the plurality of marks M is sequentially imaged.

  At this time, the control unit 9 is configured to cause the mark imaging unit 7 to capture each of the plurality of marks M only once and to acquire a single captured image of each of the plurality of marks M. Further, the control unit 9 is configured to acquire the height position of the substrate P at each position of the plurality of marks M based on the single captured image of each of the plurality of marks M acquired. .

  The control unit 9 is configured to acquire the height position of the substrate P based on the blur of the mark M in the captured image of the mark M. For example, the control unit 9 acquires the focus index (an index indicating the degree of blur) of the mark M based on the captured image of the mark M, and associates the acquired focus index with the height position of the substrate P. The height position of the substrate P can be obtained by comparing the reference focus index stored in advance. Alternatively, the control unit 9 performs pattern matching between the captured image of the mark M and the reference blur image of the mark M that is stored in advance in association with the height position of the substrate P, thereby setting the height position of the substrate P. It is possible to obtain. It should be noted that the blur of the mark M in the captured image of the mark M is a slight blur that allows the mark M to be recognized.

  In the first embodiment, the control unit 9 not only acquires (recognizes) the position of the substrate P based on the captured images of the plurality of substrate position recognition marks M1 by the mark imaging unit 7, but also the plurality of substrate positions. The height position of the substrate P at each position of the recognition mark M1 is obtained.

  Further, the control unit 9 not only acquires (recognizes) the position where the component E is mounted on the substrate P based on the captured images of the plurality of component position recognition marks M2 by the mark imaging unit 7, but also the plurality of component positions. The height position of the substrate P at each position of the recognition mark M2 is obtained.

  Note that the imaging operation of the plurality of marks M by the mark imaging unit 7 is an operation performed for an application different from the height position acquisition application such as an application for recognizing the position of the substrate P. Therefore, even if the height position of the substrate P at each position of the plurality of marks M is acquired based on the captured images of the plurality of marks M by the mark imaging unit 7, no new height measurement work time is generated.

<Acquisition of substrate height position based on measurement results at measurement points>

  The control unit 9 is configured to sequentially move the height position measurement unit 8 above each of the plurality of measurement points B by moving the head unit 3 and sequentially measure each of the plurality of measurement points B. Has been.

  At this time, the control unit 9 causes the height position measurement unit 8 to select a measurement point B1 included in the imaging field of view V when the mark imaging unit 7 captures the mark M among the plurality of preset measurement points B. It is configured not to be measured. In other words, the control unit 9 selects only the measurement point B2 that is not included in the imaging field of view V at the time of imaging of the mark M by the mark imaging unit 7 among the plurality of measurement points B set in advance. 8 for measurement.

  Further, the control unit 9 determines the height of the substrate at each position of the plurality of measurement points B2 based on the measurement results of the plurality of measurement points B2 that are not included in the imaging field of view V when the mark M is captured by the mark imaging unit 7. It is configured to obtain the position.

  In the first embodiment, the control unit 9 moves the head unit 3 relative to the substrate P and causes the mark imaging unit 7 to perform the imaging operation of the plurality of marks M, and then the head unit 3. Is moved relative to the substrate P, and the height position measuring unit 8 performs the measurement operation of the plurality of measurement points B.

(Board work processing)
Next, with reference to FIG. 4, the board | substrate work process by the board | substrate working apparatus 100 of 1st Embodiment is demonstrated based on a flowchart. Each process of the flowchart is performed by the control unit 9.

  As shown in FIG. 4, first, in step S <b> 1, the substrate transport unit 2 loads the substrate P from outside the substrate working apparatus 100, transports it to the substrate working position A, and fixes it at the substrate working position A.

  In step S2, the mark image pickup unit 7 together with the head unit 3 is sequentially moved above each of the plurality of marks M (the substrate position recognition mark M1 and the component position recognition mark M2). Each of M is sequentially imaged. In step S2, the accurate position of the substrate P is acquired based on the captured images of the plurality of substrate position recognition marks M1 by the mark imaging unit 7, and the substrate at each position of the plurality of substrate position recognition marks M1. The height position of P is acquired. Further, in step S2, an accurate position for mounting the component E on the substrate P is acquired based on the captured images of the plurality of component position recognition marks M2 by the mark imaging unit 7, and the plurality of component position recognition marks M2 are obtained. The height position of the substrate P at each position is acquired.

  In step S3, it is determined whether or not the next measurement point B to be measured is included in the imaging field of view V when the mark imaging unit 7 captures the mark M. When it is determined that the measurement point B to be measured next is included in the imaging visual field V when the mark M is imaged by the mark imaging unit 7 (when it is the measurement point B1), the measurement of the measurement point B is measured. Omit and repeat step S3.

  In step S3, when it is determined that the measurement point B to be measured next is not included in the imaging field of view V at the time of imaging the mark M by the mark imaging unit 7 (when it is the measurement point B2), Proceed to step S4.

  In step S4, the height position measuring unit 8 is moved together with the head unit 3 above the measurement point B2 to be measured, and the height position measuring unit 8 measures the measurement point B2. In step S4, the height position of the substrate P at the position of the measured measurement point B2 is acquired based on the measurement result of the measurement point B2 by the height position measurement unit 8.

  In step S5, it is determined whether or not there is an unmeasured measurement point B except for the measurement point B1 that is not measured among the plurality of preset measurement points B. If it is determined that there is an unmeasured measurement point B, the process proceeds to step S3. If it is determined that there is no unmeasured measurement point B, the process proceeds to step S6. By repeating the processes of steps S3 to S5, the height position measuring unit 8 measures a plurality of measurement points B2, and based on the measurement results of the plurality of measurement points B2, each of the plurality of measurement points B2 is measured. The height position of the substrate at the position is acquired.

  In step S6, the height position of the substrate P at each position of the plurality of measurement points B2 acquired in step S4 and the height of the substrate P at each position of the plurality of marks M acquired in step S2. Based on the position, the warpage state of the entire substrate P is acquired.

  In step S7, the mounting operation of the component E on the board P by the head unit 3 is performed. In step S7, the component of the head unit 3 with respect to the substrate P in the state where the descending height position of the head 31 of the head unit 3 is corrected based on the warpage state of the entire substrate P acquired in step S6. E mounting work is performed.

  Then, when the mounting operation of the component E on the substrate P is completed, the fixing of the substrate P by the substrate transport unit 2 at the substrate operation position A is released. In step S <b> 8, the substrate transport unit 2 transports the substrate P from the substrate work position A and carries it out of the substrate work apparatus 100. Then, the substrate work process is completed.

(Effect of 1st Embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the height position of the substrate P at each position of the plurality of measurement points B2 obtained based on the measurement results of the plurality of measurement points B2 by the height position measurement unit 8 Control for acquiring the warpage state of the entire substrate P based on the height position of the substrate P at each position of the plurality of marks M acquired based on the captured images of the plurality of marks M by the mark imaging unit 7. A portion 9 is provided. Thereby, the mark imaging unit 7 has a plurality of uses different from the height position acquisition application acquired in the imaging operation for an application different from the height position acquisition application such as the position recognition use of the substrate P, for example. On the basis of the captured image of the mark M, the height position of the substrate P at each position of the plurality of marks M is acquired (measurement point B1) without causing a new height measurement operation time. The number of measurement points B2 measured by the height position measurement unit 8 can be reduced. As a result, the time required for the measurement operation of the measurement point B2 by the height position measurement unit 8 can be shortened without causing a new height position measurement work time. It is possible to improve the productivity by shortening the work time of the work to acquire the.

  In the first embodiment, as described above, the height position of the substrate P at each position of the plurality of substrate position recognition marks M1 based on the captured images of the plurality of substrate position recognition marks M1 by the mark imaging unit 7. The control unit 9 is configured to acquire Accordingly, the position of each of the plurality of substrate position recognition marks M1 can be obtained without causing a new height position measurement work time by using the captured image acquired in the imaging operation for recognizing the position of the substrate P. The height position of the substrate P can be acquired. In addition, when using the captured image of the substrate position recognition mark M1 that is always attached to the substrate P in order to recognize the position of the substrate P, the captured image of the mark M that is not attached to the substrate P is used. Unlike the above, the height position of the substrate P based on the captured image can be reliably acquired. As a result, the number of measurement points B2 measured by the height position measurement unit 8 can be reliably reduced.

  In the first embodiment, as described above, in addition to the height position of the substrate P at each position of the plurality of substrate position recognition marks M1, the captured images of the plurality of component position recognition marks M2 by the mark imaging unit 7 are used. Based on the above, the control unit 9 is configured to acquire the height position of the substrate P at each position of the plurality of component position recognition marks M2. As a result, the number of measurement points B2 measured by the height position measurement unit 8 is greatly reduced as compared with the case where only the height position of the substrate P at each position of the plurality of substrate position recognition marks M1 is acquired. be able to. As a result, the time required for the measurement operation of the measurement point B2 by the height position measurement unit 8 can be further shortened.

  In the first embodiment, as described above, the height position measurement unit 8 and the mark imaging unit 7 are attached, and the head unit 3 that is movable relative to the substrate P is provided. Then, after moving the head unit 3 relative to the substrate P and causing the mark imaging unit 7 to perform the imaging operation of the plurality of marks M, the head unit 3 is moved relative to the substrate P. Thus, the control unit 9 is configured so that the height position measurement unit 8 performs the measurement operation of the plurality of measurement points B2. Thereby, the imaging operation of the plurality of marks M by the mark imaging unit 7 and the measuring operation of the plurality of measurement points B2 by the height position measuring unit 8 can be performed separately and independently. As a result, it is possible to simplify the control of the imaging operation and the measurement operation by the control unit 9.

  In the first embodiment, as described above, control is performed so as to obtain the height position of the substrate P at each position of the plurality of marks M based on the single captured image of each of the plurality of marks M. Part 9 is configured. Thereby, compared with the case where the height position of the board | substrate P in the position of the mark M is acquired based on a some captured image, the height position of the board | substrate P in the position of the mark M can be acquired easily.

(Modification of the first embodiment)
Next, a modification of the first embodiment will be described with reference to FIGS. 1, 2, 5, and 6.

  A substrate working apparatus 100a (see FIG. 1) according to a modification of the first embodiment is different from the substrate working apparatus 100 of the first embodiment in that a control unit 9a is provided as shown in FIG.

  In the modification of the first embodiment, as shown in FIG. 5, the control unit 9 a measures the plurality of measurement points B <b> 2 by the height position measurement unit 8 and the plurality of marks M (substrate position recognition by the mark imaging unit 7). Prior to the imaging operation of the mark M1 and the component position recognition mark M2), the height position acquisition path R on the board P is determined. Specifically, the control unit 9a determines the shortest path on the substrate P based on the positions of the plurality of marks M on the substrate P and the positions of the plurality of measurement points B2 on the substrate P. The height position acquisition route R is determined. Further, the control unit 9a moves the head unit 3 relative to the substrate P in accordance with the determined height position acquisition path R, and performs the measurement operation of the plurality of measurement points B2 and the imaging operation of the plurality of marks M. Are sequentially performed by the height position measuring unit 8 and the mark imaging unit 7, respectively.

  Next, with reference to FIG. 6, the board | substrate work process by the board | substrate working apparatus 100a of the modification of 1st Embodiment is demonstrated based on a flowchart. Each process of the flowchart is performed by the control unit 9a. In addition, the same code | symbol is attached | subjected and shown in the figure in the process similar to the said 1st Embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 6, after the processing of step S <b> 1 is performed, in step S <b> 11, the position of each of the plurality of marks M (substrate position recognition mark M <b> 1 and component position recognition mark M <b> 2) on the substrate P and the substrate P are displayed. Based on the position of each of the plurality of measurement points B2, the height position acquisition path R on the substrate P is determined so as to be the shortest path.

  In step S12, according to the height position acquisition path R determined in step S11, the height position measuring unit 8 and the mark together with the head unit 3 above the measurement point B2 to be measured and above the mark M to be imaged. The imaging unit 7 is moved sequentially. In step S <b> 12, when the mark imaging unit 7 is moved above the mark M, the mark M is imaged by the mark imaging unit 7. In step S12, when the height position measurement unit 8 is moved above the measurement point B2, the height position measurement unit 8 measures the measurement point B2. In step S12, the height position of the substrate P at each position of the plurality of marks M is acquired based on the captured images of the plurality of marks M by the mark imaging unit 7, and the height position measuring unit 8 Based on the measurement results of the plurality of measurement points B2, the height position of the substrate P at each position of the plurality of measurement points B2 is acquired. Thereafter, similarly to the first embodiment, the processes of steps S6 to S8 are performed, and the substrate work process is completed.

(Effects of Modification of First Embodiment)
In the modification of the first embodiment, as described above, the height position measurement unit 8 and the mark imaging unit 7 are attached, and the head unit 3 that is movable relative to the substrate P is provided. Then, the control unit 9a is configured to determine the height position acquisition path R on the substrate P based on the respective positions of the plurality of marks M on the substrate P and the respective positions of the plurality of measurement points B2 on the substrate P. Configure. Then, according to the determined height position acquisition path R, the head unit 3 is moved relative to the substrate P, and the measurement operation of the plurality of measurement points B2 and the imaging operation of the plurality of marks M are respectively performed at a high level. The control unit 9 is configured so that the position measurement unit 8 and the mark imaging unit 7 sequentially perform the operations. As a result, the head unit 3 is moved relative to the substrate P along the height position acquisition path R, whereby a plurality of marks M are imaged by the mark imaging unit 7 and a plurality of height position measuring units 8 are used. The movement path of the head unit 3 can be shortened as compared with the case where the measurement operation at the measurement point B2 is performed separately and independently. As a result, the time required to acquire the height position of the substrate P can be shortened, so that productivity can be further improved.

  In the modification of the first embodiment, as described above, the shortest path is based on the positions of the plurality of marks M on the substrate P and the positions of the plurality of measurement points B2 on the substrate P. Thus, the control unit 9a is configured to determine the height position acquisition route R. As a result, the time required to acquire the height position of the substrate P can be further shortened, and the productivity can be further improved.

  In addition, the other structure and effect of the modification of 1st Embodiment are the same as that of the said 1st Embodiment.

[Second Embodiment]
Next, a second embodiment will be described with reference to FIGS. 1, 2, and 7 to 9. In the second embodiment, unlike the first embodiment, an example in which the height position of the substrate acquired based on the captured image of the mark is corrected will be described. In addition, about the structure same as the said 1st Embodiment, the same code | symbol is attached | subjected and shown in the figure, and the description is abbreviate | omitted.

(Configuration of substrate working device)
The substrate working apparatus 200 (see FIG. 1) according to the second embodiment of the present invention is different from the substrate working apparatus 100 of the first embodiment in that a control unit 109 is provided as shown in FIG.

  In the second embodiment, the control unit 109, as shown in FIG. 7, has one mark M (a substrate position recognition mark on the X2 direction side in FIG. 7) of the plurality of marks M imaged by the mark imaging unit 7. M1 (hereinafter referred to as “correction mark M3”), the height position of the substrate P is measured by the height position measuring unit 8.

  The control unit 109 is configured to acquire the height position of the substrate P at the position of the correction mark M3 based on the measurement result of the correction mark M3 by the height position measurement unit 8. In addition, the control unit 109 acquires a plurality of marks M acquired based on the captured images of the plurality of marks M by the mark imaging unit 7 based on the height position of the substrate P at the acquired position of the correction mark M3. The height position of the substrate P at each (all) position is corrected.

  Specifically, as shown in FIG. 8, the control unit 109 at the position of the correction mark M3 acquired based on the captured image of the correction mark M3 (substrate position recognition mark M1) by the mark imaging unit 7. A difference ΔH between the height position H1 of the substrate P and the height position H2 of the substrate P at the position of the correction mark M3 is acquired based on the measurement result of the correction mark M3 by the height position measurement unit 8. Is configured to do. Further, the control unit 109 adds the acquired difference ΔH to the height position of the substrate P at each position of the plurality of marks M acquired based on the captured images of the plurality of marks M by the mark imaging unit 7. By doing so, the height position of the substrate P at each position of the plurality of marks M is corrected.

  Next, with reference to FIG. 9, the board | substrate work process by the board | substrate working apparatus 200 of 2nd Embodiment is demonstrated based on a flowchart. Each process of the flowchart is performed by the control unit 109. In addition, the same code | symbol is attached | subjected and shown in the figure in the process similar to the said 1st Embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 9, after the processing of steps S <b> 1 to S <b> 5 is performed, in step S <b> 21, one mark M among a plurality of marks M imaged by the mark imaging unit 7 by the height position measurement unit 8. The height position of the substrate P at the position of the (correction mark M3) is measured. In step S21, the height position of the substrate P at the position of the correction mark M3 is acquired based on the measurement result of the correction mark M3 by the height position measuring unit 8.

  In step S22, a plurality of images acquired based on the captured images of the plurality of marks M by the mark imaging unit 7 based on the height position of the substrate P at the position of the correction mark M3 acquired in step S21. The height position of the substrate P at each position of the mark M is corrected. Thereafter, similarly to the first embodiment, the processes of steps S6 to S8 are performed, and the substrate work process is completed.

  In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.

(Effect of 2nd Embodiment)
In the second embodiment, the following effects can be obtained.

  In the second embodiment, as described above, the height position of the substrate P at the position of a part (one) mark M (correction mark M3) of the plurality of marks M imaged by the mark imaging unit 7. Is configured to be measured by the height position measuring unit 8. And based on the height position of the board | substrate P of the position of the part (one) mark M acquired based on the measurement result of the position of the part (one) mark M by the height position measurement part 8. The control unit 109 is configured to correct the height position of the substrate P at each position of the plurality of marks M acquired based on the captured images of the plurality of marks M by the mark imaging unit 7. Thus, the height of the substrate P based on the image captured by the mark imaging unit 7 based on the height position of the substrate P based on the measurement result of the position of the mark M by the height position measuring unit 8 with high measurement accuracy. Position accuracy can be improved. As a result, the warpage state of the entire substrate P can be acquired with higher accuracy. Further, in order to correct the height position of the substrate P at each position of the plurality of marks M, the height position measuring unit 8 measures the height position of the substrate P at the position of a part (one) of the marks M. There is no need to measure the height position of the substrate P at the positions of all the marks M by the height position measuring unit 8. As a result, the height position of the substrate P at each position of the plurality of marks M can be corrected while suppressing an increase in the time required for the operation of measuring the position of the mark M by the height position measuring unit 8. .

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Modification]
In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims, and further includes meanings equivalent to the scope of claims and all modifications (variants) within the scope.

  For example, in the first and second embodiments, examples in which the present invention is applied to a substrate working apparatus as a component mounting apparatus for mounting components (so-called package components) such as an IC, a transistor, a capacitor, and a resistor are shown. However, the present invention is not limited to this. The present invention may be applied to a substrate working apparatus as a component mounting apparatus that takes out and mounts a bare chip from a diced wafer. In addition, the present invention may be applied to a substrate working apparatus as a bonding material application device that applies a bonding material such as solder to a substrate in order to bond components to the substrate.

  Moreover, although the example which uses a laser displacement meter as the height position measurement part of this invention was shown in the said 1st and 2nd embodiment, this invention is not limited to this. In this invention, you may use other than a laser displacement meter as a height position measurement part of this invention.

  In the first and second embodiments, the example in which both the board position recognition mark and the component position recognition mark are used as the marks of the present invention has been described. However, the present invention is not limited to this. In the present invention, only one of the substrate position recognition mark and the component position recognition mark may be used as the mark of the present invention. In the present invention, a mark other than the board position recognition mark and the component position recognition mark may be used as the mark of the present invention. For example, as a mark of the present invention, a pass / fail judgment mark for judging pass / fail of each of a plurality of individual substrates attached to a multi-sided substrate including a plurality of individual substrates may be used.

  In the first and second embodiments, the substrate height position measuring unit and the mark imaging unit are attached to the head unit and moved together with the head unit. However, the present invention is not limited to this. . In the present invention, the substrate height position measurement unit and the mark imaging unit may be configured to be independently movable relative to the substrate.

  In the first and second embodiments, the control unit determines the height position acquisition path so as to be the shortest path, but the present invention is not limited to this. In the present invention, if the movement path of the head unit is shortened as compared with the case where the mark imaging unit performs a plurality of mark imaging operations and the height position measurement unit separately performs a plurality of measurement point measurement operations. The height position acquisition route may not be determined so as to be the shortest route.

  In the first and second embodiments, an example is shown in which the control unit acquires the height position of the substrate at each position of the plurality of marks based on a single captured image of each of the plurality of marks. However, the present invention is not limited to this. In the present invention, the control unit may acquire the height position of the substrate at each position of the plurality of marks based on the plurality of captured images of each of the plurality of marks.

  In the second embodiment, an example is shown in which the height position of the substrate at the position of one of the plurality of marks imaged by the mark imaging unit is measured by the height position measuring unit. The invention is not limited to this. In the present invention, if not all of the plurality of marks imaged by the mark imaging unit, the height position of the substrate at the position of two or more of the plurality of marks imaged by the mark imaging unit is set to the height. You may make it measure by a position measurement part. Further, if it is in the vicinity of the mark position, the height position measurement unit may measure the height position of the substrate around the mark position instead of the mark position.

  In the second embodiment, the control unit acquires a plurality of marks acquired based on the captured images of the plurality of marks by the mark imaging unit based on the height position of the substrate at the position of one correction mark. Although the example which correct | amends the height position of the board | substrate in all the positions of this was shown, this invention is not limited to this. In the present invention, the control unit acquires a part of the plurality of marks acquired based on the captured images of the plurality of marks by the mark imaging unit based on the height position of the substrate at the position of the one or more correction marks. You may correct | amend the height position of the board | substrate in this position.

  In the above embodiment, for convenience of explanation, the processing operation of the control unit has been described using a flow-driven flowchart that performs processing in order along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

3 Head unit 7 Mark imaging unit 8 Height position measuring unit 9, 9a, 109 Control unit 100, 100a, 200 Substrate working device B, B1, B2 Measuring point E Component M mark M1 Substrate position recognition mark M2 Component position recognition mark P substrate

Claims (8)

In a board on which a component is mounted, a height position measurement unit that measures the height position of the board at each of a plurality of measurement points;
A mark imaging unit that images each of a plurality of marks having an application different from the height position acquisition application attached to the substrate;
The height position of the substrate at each position of the plurality of measurement points, obtained based on the measurement results of the plurality of measurement points by the height position measurement unit, and the plurality of marks by the mark imaging unit. A substrate working apparatus comprising: a control unit that acquires a warpage state of the entire substrate based on a height position of the substrate at each position of the plurality of marks acquired based on a captured image. The plurality of marks include a plurality of substrate position recognition marks for recognizing the position of the substrate,
The control unit is configured to acquire a height position of the substrate at each position of the plurality of substrate position recognition marks based on captured images of the plurality of substrate position recognition marks by the mark imaging unit. The substrate working apparatus according to claim 1. The plurality of marks include a plurality of component position recognition marks for recognizing positions where the components are mounted on the substrate,
In addition to the height position of the substrate at each position of the plurality of substrate position recognition marks, the control unit is configured to perform the plurality of components based on images captured by the mark image capturing unit. The board | substrate working apparatus of Claim 2 comprised so that the height position of the said board | substrate in each position of a position recognition mark may be acquired. The height position measurement unit and the mark imaging unit are attached, and further includes a head unit movable relative to the substrate,
The control unit moves the head unit relative to the substrate and causes the mark imaging unit to perform an imaging operation of the marks, and then moves the head unit relative to the substrate. The substrate working apparatus according to claim 1, wherein the substrate work apparatus is configured to cause the height position measurement unit to perform measurement operations of the plurality of measurement points. The height position measurement unit and the mark imaging unit are attached, and further includes a head unit movable relative to the substrate,
The control unit determines and determines a height position acquisition path on the substrate based on the position of each of the plurality of marks on the substrate and the position of each of the plurality of measurement points on the substrate. According to the height position acquisition path, the head unit is moved relative to the substrate, and the measurement operation of the plurality of measurement points and the imaging operation of the plurality of marks are respectively performed at the height position measurement. The board | substrate working apparatus of any one of Claims 1-3 comprised so that it may be made to perform sequentially by a part and the said mark imaging part.   The control unit determines the height position acquisition path to be the shortest path based on the position of each of the plurality of marks on the substrate and the position of each of the plurality of measurement points on the substrate. The board | substrate working apparatus of Claim 5 comprised so that it may do.   The control unit causes the height position measurement unit to measure the height position of the substrate in the vicinity of some of the plurality of marks imaged by the mark imaging unit, and the height position. Based on the height position of the substrate in the vicinity of the partial mark acquired based on the measurement result in the vicinity of the partial mark by the measurement unit, the captured image of the plurality of marks by the mark imaging unit The board | substrate working apparatus of any one of Claims 1-6 comprised so that the height position of the said board | substrate in each position of these several marks acquired based on may be correct | amended.   The said control part is comprised so that the height position of the said board | substrate in each position of these marks may be acquired based on the single captured image of each of these marks. 8. The substrate working apparatus according to any one of 7 above.

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