JP2005216974A - Method for controlling move of moving block in electronic component mounting device, and matrix board used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To correct a positional relation between a measuring camera which is used to measure a transfer error of a moving block, and a component picking part of a component transfer unit which is mounted to replace the measuring camera upon mounting a component, to mount the component picked by the component picking part accurately at a prescribed position on a board. <P>SOLUTION: The moving block 24 is moved to a prescribed position (a distance X2 and a distance Y2), where the moving block 24 is stopped to be located. As a reference gauge G is placed on the top member of a component recognizing camera, distances Xa, Ya between an optical axis O4 and a reference mark Gm are measured using the measuring camera, and distances Xb, Yb between an optical axis O2 and the reference mark Gm are measured using the component recognizing camera. Then the measuring camera is replaced with the component transfer unit 26, and distances Xc, Yc between the optical axis O2 and the center of a suction nozzle O3 are measured using the component recognizing camera 15, as the moving block is kept stationary at the prescribed position. Based on the above measured distances, a positional relation (X1, Y1) between the suction nozzle center O3 and the optical axis O4 is calculated to correct a transfer error of the moving block. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a movement control method of a moving table in an electronic component mounting apparatus for mounting electronic components on a substrate, and a matrix substrate used in the method.

  Produced by making it possible to replace the component transfer device that holds and mounts the electronic component in the electronic component mounting device, and to allow the operator to replace the component transfer device in a short time at the site of the component mounting line. There has been proposed a method for constructing an optimal component mounting line according to the ratio of small electronic components to large electronic components on the board and the type of components.

  In this type of electronic component mounting apparatus, for example, as shown in FIG. 1, a component transfer apparatus 26 having a component mounting head 28 on a movable table 24 supported so as to be movable in two directions X and Y with respect to the base 11. The board recognition camera 25 is provided, and the component recognition camera 15 is fixed to the base 11. Then, the electronic component mounting apparatus 10 detects the position of the board mark Sm provided on the board S that has been carried and positioned by the board conveying apparatus 12 by the board recognition camera 25, and based on the position of the board mark Sm. The position P is corrected, the slide 21 and the moving table 24 are moved in the X direction and the Y direction, and the component P sucked to the tip of the suction nozzle 29 of the component mounting head 28 from the component supply device 13 is set to predetermined coordinates on the substrate S. Implemented in position. Further, while the component P sucked at the tip of the suction nozzle 29 is moved from the component supply device 13 to a predetermined coordinate position on the substrate S, the suction nozzle 29 is temporarily stopped by the component recognition camera 15 and the center of the suction nozzle 29 is stopped. The component misalignment of the component P with respect to the line O3 (hereinafter also referred to as the suction nozzle centerline O3) is detected by the component recognition camera 15, and this also corrects the movement amount of the slide 21 and the moving table 24, so that the component P It is designed to be mounted at a coordinate position on the substrate S.

  However, after the position correction based on the position of the substrate mark Sm and the correction of the movement amount due to the misalignment of the component P, the component is accurately placed at the mounting position on the substrate S even if the slide 21 and the moving table 24 are moved. Could not be positioned.

  This is because the slide 21 and the moving table 24 have feed errors caused by pitching, yawing and perpendicularity deviation, and in order to eliminate this feed error, the error of feed accuracy is measured periodically. It was necessary to correct the position.

  For this reason, conventionally, for example, the technique described in Patent Document 1 has been used to measure the feed error and correct the position. In the technique described in Patent Document 1, a measurement camera is attached in place of the component transfer device at the position where the component transfer device is mounted on the moving table of the electronic component mounting device, and the coordinate reference is held. The coordinates of each work position of the board are detected by the measurement camera and the board recognition camera, and the parts transfer when the parts transfer device is attached to the moving table again based on the coordinates of the work positions detected by these cameras. The coordinates of the work position directly under the mounting device are corrected and obtained, and the movement of the slide and the moving table is controlled.

According to this method, there is an advantage that the component transfer device can be moved without being affected by the feed error of the slide and the moving table.
Japanese Patent Laid-Open No. 9-186589 (paragraph numbers 0015 to 0018 on the third page, FIGS. 2 and 6)

  However, in the method described in Patent Document 1, when the component is mounted after correcting the error of the feeding accuracy based on the coordinates of each work position detected by the measurement camera attached instead of the component transfer device. The measurement camera and the parts transfer device are exchanged again. For this reason, there has been a problem that the center of the suction nozzle of the component transfer device and the optical axis of the measurement camera are displaced, and the component P cannot be mounted accurately.

  In the electronic component mounting apparatus, after the feeding error is obtained by the measurement camera, the component sucked by the suction nozzle is accurately mounted at the mounting position of the board even if the component transfer device is installed instead of the measurement camera. It is something that can be done.

  The structural feature of the invention described in claim 1 for solving the above-described problems is that a substrate transfer device is provided on a base for carrying in / out and carrying out positioning and holding of the substrate, and in the X direction with respect to the base. The parts collection unit picks up the parts that are supported so as to be movable in two directions of the Y direction, the movement control device that controls the movement of the movements, and the parts that are attached to the parts and supplied by the parts supply device. And a component transfer device mounted on the substrate that is positioned and supported on the substrate transfer device, and a substrate recognition unit in which an optical axis is fixed to the moving table at a predetermined interval from a center line of the component sampling unit. In an electronic component mounting apparatus comprising a camera and a component recognition camera fixed to the base, the measurement camera is replaced with a component transfer device and fixed, and the interval is subdivided into an integer of the predetermined interval Virtual groups orthogonal to each other A matrix substrate with an index mark at the upper intersection is fixed to the base so that each base line is parallel to the X-axis or Y-axis, and the moving table is sequentially indexed and stopped at the index mark on the matrix substrate. Then, at each index stop position, the substrate recognition camera and the measurement camera measure the X and Y errors from the respective optical axes of the corresponding index marks, and the difference between these measured X and Y errors is measured for each index. Stored as a correction value at the exit stop position, the reference mark provided on the base so as to be within the field of view of the component recognition camera is set to the coordinate origin so that the reference mark is within the field of view of the measurement camera. On the other hand, it stops at a predetermined position, and the moving base is positioned at the predetermined position based on the positional relationship between the optical axis of each camera and the reference mark detected by the component recognition camera and the measurement camera. Calculating the positional relationship between the optical axis of the component recognition camera and the optical axis of the measurement camera, attaching a component transfer device instead of the measurement camera, stopping the moving table at the predetermined position, The component recognition camera detects the positional relationship between the optical axis of the component recognition camera and the center line of the component sampling unit of the component transfer device, and the optical axis of the component recognition camera and the optical axis of the measurement camera And the positional relationship between the optical axis of the measurement camera and the center line of the component sampling unit is calculated and stored from the positional relationship between the optical axis of the component recognition camera and the center line of the component sampling unit, and the board When the component is mounted by the component sampling unit on the substrate that is positioned and held by the conveying device, the mounting position of the component is corrected at each index stop position, the optical axis of the component recognition camera, and the component sampling unit. The position of the center line It is to move the moving table is corrected based on the relationship.

  The structural feature of the invention described in claim 2 for solving the above-described problems is that a substrate carrying device is provided on the base for carrying in / out and carrying out positioning and holding of the substrate, and in the X direction with respect to the base. The parts collection unit picks up the parts that are supported so as to be movable in two directions of the Y direction, the movement control device that controls the movement of the movements, and the parts that are attached to the parts and supplied by the parts supply device. And a component transfer device mounted on the substrate that is positioned and supported on the substrate transfer device, and a substrate recognition unit in which an optical axis is fixed to the moving table at a predetermined interval from a center line of the component sampling unit. It is equipped with a camera and a part recognition camera fixed to the base, and the measurement camera is fixed in place of the part transfer device, and an index mark is attached to each intersection point on the virtual base line that is orthogonal to each other at subdivided intervals. The matrix substrate The base line is fixed to the base so as to be parallel to the X-axis or Y-axis, the moving base is sequentially indexed and stopped at each index mark of the matrix substrate, and the substrate recognition camera and measurement are performed at each index stop position. The X and Y errors from the respective optical axes of the corresponding index marks are measured by the cameras, and the feed error of the moving table is calculated based on the X and Y errors of the respective index marks and optical axes measured by these cameras. It is a matrix substrate used in the movement control method of the moving table in the electronic component mounting apparatus to be corrected, wherein the interval between the index marks is set to be an integral number of the predetermined interval.

  According to the invention according to claim 1 configured as described above, the measurement camera used when measuring the feed error of the moving table, and the component sampling unit of the component transfer device attached in place of the measurement camera when mounting the component Since the positional relationship can be calibrated, the components collected by the component collection unit can be accurately mounted at predetermined positions on the board.

  By using the matrix substrate according to the invention according to claim 2 configured as described above, when the movable table is stopped at each index stop position, the measurement camera and the substrate recognition camera simultaneously capture the index mark in the field of view. In addition, each camera captures an index mark, and an error between the captured index mark and the optical axis of each camera can be detected at the same time. Therefore, it is possible to shorten the time for a feed error correction operation.

  Hereinafter, a calibration method and apparatus in the electronic component mounting apparatus according to the embodiment will be described with reference to FIGS. A plurality of electronic component mounting apparatuses 10 having a schematic overall structure shown in FIG. 1 to which this embodiment is applied are arranged side by side to constitute a component mounting line. On the base 11 of each electronic component mounting apparatus 10, two board transfer apparatuses 12 and 12 a that transfer the boards S and Sa in the Y direction are provided. Although not shown in the drawings, the electronic component mounting apparatuses 10 are arranged adjacent to each other so that the respective substrate transfer apparatuses 12 and 12a are continuous in the Y direction. 12a is operated in conjunction with each other so that the substrates S and Sa are sequentially fed onto the adjacent substrate transfer devices 12 and 12a, and are positioned and held at predetermined positions.

  On the upper side of each substrate transfer device 12, 12 a, a slide 21 that is elongated in the Y direction is fixed to the lower surface of a table 30 that is movably guided and supported by a fixed rail 20 that extends in the X direction perpendicular to the Y direction. The movement in the X direction is controlled by a servo motor 22 via a ball screw. A movable table 24 is guided and supported on one side surface of the slide 21 so as to be movable in the Y direction, and the movement is controlled by a servo motor 31 via a ball screw. A substrate recognition camera 25 and a detachable component transfer device 26 are attached to the moving table 24.

In the following description, the structure and operation of the slide 21 and the moving table 24 will be described only on the substrate transfer apparatus 12 side. In addition, this invention is applicable not only to the electronic component mounting apparatus 10 provided with the two board | substrate conveyance apparatuses but also to the electronic component mounting apparatus 10 provided with the one board | substrate conveyance apparatus.
The component transfer device 26 attached to the moving table 24 can be replaced with the measurement camera 23 as shown in FIG. The electronic component mounting apparatus 10 is composed of two parts: a component transfer apparatus 26 and a measurement camera 23 that can be exchanged in this way, and a mounting apparatus basic part including all other parts.

  As shown in FIG. 1, the component transfer device 26 is supported by a support base 27 that is detachably attached to the moving table 24, and is supported by the support base 27 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction. A component mounting head 28 whose elevation is controlled by a servo motor 32 via a ball screw, and a cylindrical suction nozzle (component sampling) that protrudes downward from the component mounting head 28 and holds the component P by suction. Part) 29. The center line O3 of the component mounting head 28 and the suction nozzle 29 is parallel to the Z direction, and the suction nozzle 29 is supported so as to be rotatable around the center line O3 with respect to the component mounting head 28 and is driven by a servo motor (not shown). The rotation angle is controlled. The substrate recognition camera 25 is fixed to the moving base 24 and is not replaced except in the case of a failure, and its optical axis O1 is parallel to the Z direction. Further, as shown in FIG. 2, the measurement camera 23 attached to the moving table 24 instead of the component transfer device 26 has the same function as the board recognition camera 25, and its optical axis O4 is parallel to the Z direction. .

  On one end side of the electronic component mounting apparatus 10, a component supply apparatus 13 including a plurality of feeders installed side by side is provided. A component recognition camera 15 having an optical axis O2 parallel to the Z direction is provided on the base 11 between the substrate transfer device 12 and the component supply device 13. As shown in FIG. 3, the component recognition camera 15 is mounted on a base 11 via a support base 16, and has a bowl-shaped upper end member (support member) 17 having an open top and no bottom. It is coaxially attached to the optical axis O2 via the connecting portion 16a. The open upper surface of the upper end member 17 is covered with a transparent cover glass 18, and the side light source 19 made up of a number of LEDs is provided on the inner surface of the upper end member 17, and the component P and the component P recognized by the component recognition camera 15 The lower end of the suction nozzle 29 is illuminated from below.

  The electronic component mounting apparatus 10 is controlled by the control apparatus 200 shown in FIG. The control device 200 mainly includes a computer having a CPU 202, a ROM 204, a RAM 206 and a bus 208 for connecting them, and an input interface 210 connected to the bus 208 includes a board recognition camera 25 and a component recognition camera 15. And the measurement camera 23 is also connected to the input interface 210 when the measurement camera 23 is attached instead of the component transfer device 26. An output interface 216 is also connected to the bus 208, and an X-axis drive servomotor 22, a Y-axis drive servomotor 31, and a Z-axis drive servomotor 32 are connected via drive circuits 218, 220, and 222. In addition, when the substrate recognition camera 25 and the component recognition camera 15 are connected via the control circuit 224, and the measurement camera 23 is attached instead of the component transfer device 26, the measurement camera 23 is also Connected to the control circuit 224. Further, as shown in FIG. 5, the RAM 206 is provided with a measured value storage area 230, a feed error storage area 232, an offset amount storage area 234, and a positional relationship table storage area 236 together with a working area 238. Further, the ROM 204 stores various programs such as a feed error detection routine and a calibration routine.

  When the component P is mounted on the substrate S in the electronic component mounting apparatus 10 configured as described above, the position of the substrate mark Sm provided on the substrate S carried and positioned by the substrate transfer device 12 is determined. The position is detected by the board recognition camera 25, the position is corrected based on the position of the board mark Sm, and the slide 21 and the moving base 24 are moved in the X direction and the Y direction. The electronic component P sucked and held at the tip of the suction nozzle 29 is mounted at the commanded coordinate position on the substrate S.

  In this way, the mounting of the component P on the substrate S is performed by the moving table 24 being sent in two directions, the X direction and the Y direction. If there is an error in the feeding of the moving table 24, the component transfer is performed. The suction nozzle 29 of the device 26 is moved to a position shifted from a predetermined mounting position, and the component P cannot be mounted. For this reason, the component mounting apparatus 10 is provided with means for correcting a feed error.

The feed error of the moving table 24 is (I) when indexing to the reference position of the substrate recognition camera 25 when recognizing the position of the substrate mark Sm provided on the substrate S on which the component P is mounted, and (II ) It affects when indexing the suction nozzle 29 to the mounting position.
Therefore, in order to correct the feed error, it is necessary to detect and determine the positioning errors of the optical axis O1 of the substrate recognition camera 25 and the center line O3 of the suction nozzle 29, respectively.

  For the detection of this positioning error, as shown in FIG. 2, a matrix substrate SP with a plurality of index marks Q1 to Qn is used. The index marks Q1 to Qn are attached to intersections of virtual base lines L orthogonal to each other as shown by broken lines in FIG. 2, and in particular in the Y direction, the optical axis O4 of the measurement camera 23 and the optical axis of the substrate recognition camera 25. The interval H is set to an interval that is an integral number of the interval H of O1 (in this embodiment, equal to H / 2). The index marks in the X direction need only be arranged at equal intervals, and the width dimension is not specified, but here the dimension is H / 2 which is the same as the interval between index marks in the Y direction. The matrix substrate SP has a shape larger than the size of the substrate S on which the component P is mounted, and the index marks Q1 to Qn are arranged on the substrate S on which the component P is mounted on the optical axis O4 of the measurement camera 23 and the substrate. The optical axis O1 of the recognition camera 25 is arranged over the entire movable range.

  To detect the positioning error, the matrix substrate SP is fixed on the substrate transport device 12 so as to be parallel to the X axis and Y axis along which the moving table 24 is moved, and the moving table 24 is moved in the X axis direction and the Y axis direction, respectively. This is performed by moving the index marks Q1 to Qn by H / 2 pitches and capturing images with the measurement camera 23 and the substrate recognition camera 25, respectively.

  In the positional relationship table storage area 236 of the RAM 206, a positional relationship table of the coordinate position of the moving table 24 and the index marks Q1 to Qn respectively captured by the measurement camera 23 and the substrate recognition camera 25 is stored. The moving table 24 is determined based on the relation table, and the errors of the index marks Q1 to Qn and the optical axes O1 and O4 captured by the cameras 23 and 25 are stored in the measured value storage area 230 of the RAM 206, respectively. The

  The error detection operation will be described in detail with reference to FIGS. Assume that the index marks Q1, Q2, Q3, and Q4 are arranged on the matrix substrate every H / 2 as shown in FIG. As shown in FIG. 7, the RAM 206 stores a positional relationship table of index marks respectively captured by the measurement camera 23 and the board recognition camera 25. The moving table 24 is stopped at every H / 2 pitch based on the positional relationship table of FIG. 7 as shown in FIGS. 6 (1) and 6 (2), and the measurement camera 23 and the substrate recognition camera at each indexing position. Thus, the index marks in the field of view are respectively imaged. That is, when the movable table 24 is positioned at K1 as shown in FIG. 6A, the index mark Q3 enters the field of view of the substrate recognition camera 25 from FIG. Since it can be seen that the mark Q1 enters, the positional relationship between the index mark Q3 and the optical axis O1 in the field of view of the substrate recognition camera 25 and the positional relationship between the index mark Q1 and the optical axis O4 in the field of view of the measurement camera 23. Are detected, and the errors (Δ1X3, Δ1Y3) between the optical axis O1 and the index mark Q3 and the errors (Δ2X1, Δ2Y1) between the optical axis O4 and the index mark Q1 are stored in the measured value storage area 230 of the RAM 206. Next, the moving table 24 is moved in the Y direction by H / 2 pitch and positioned at K2. When the movable table 24 is positioned at K2 as shown in FIG. 6B, the index mark Q4 is in the field of view of the substrate recognition camera 25, and the index mark Q2 is in the field of view of the measuring camera 23. Therefore, the positional relationship between the index mark Q4 in the field of view of the substrate recognition camera 25 and the optical axis O1 and the positional relationship between the index mark Q2 in the field of view of the measurement camera 23 and the optical axis O4 are detected. The errors (Δ1X4, Δ1Y4) between the axis O1 and the index mark Q4 and the errors (Δ2X2, Δ2Y2) between the optical axis O4 and the index mark Q2 are stored in the measured value storage area 230 of the RAM 206. As described above, the moving table 24 is indexed according to the positional relationship table of FIG. 7, and the errors between the optical axis O1 of the substrate recognition camera 25 and the optical axis O4 of the measurement camera 23 for the index marks Q1 to Qn on the matrix substrate SP. Are detected and stored in the measured value storage area 230 of the RAM 206, respectively.

  Among these values stored in the measured value storage area 230 of the RAM 206, errors (Δ1X1, Δ1Y1) to (Δ1Xn, Δ1Yn) between the optical axis O1 of the substrate recognition camera 25 and the index marks Q1 to Qn are components. It is used when the substrate recognition camera 25 is indexed to the reference position when recognizing the position of the substrate mark Sm provided on the substrate S on which P is mounted, and the optical axis O4 of the measurement camera 23 and the index marks Q1 to Q1. Errors (Δ2X1, Δ2Y1) to (Δ2Xn, Δ2Yn) with respect to Qn are used when the suction nozzle 29 is indexed to the mounting position.

  Further, as described above, the electronic component mounting apparatus 10 according to this embodiment includes the mounting device basic portion and the component transfer device 26 and the measurement camera 23 that are replaceably attached to the moving table 24. In order to accurately mount the component P at a predetermined coordinate position on the substrate S with respect to the substrate mark Sm, the suction after the optical axis O4 of the measurement camera 23 and the measurement camera 23 are replaced with the component transfer device 26. It is necessary to accurately calibrate the positional relationship between the nozzle 29 and the center line O3 (distance X1 in the X direction and distance Y1 in the Y direction in FIG. 8).

  Next, the operation for performing such calibration will be described mainly with reference to FIGS. Prior to the start of this operation, as shown in FIG. 9, a reference gauge G provided with various reference marks Gm such as a circle and a cross on a colorless and transparent glass plate is provided on the cover glass 18 of the upper end member 17. The reference mark Gm is placed so as to be within the field of view of the component recognition camera 15. The moving table 24 is stopped after being positioned at a predetermined position so that the reference mark Gm is within the field of view of the measurement camera 23. The positional relationship of the optical axis O4 of the measurement camera 23 with respect to the coordinate origin of the electronic component mounting apparatus 10 at that time (distance X2 and distance Y2 in FIG. 8) is from the coordinate origin of the slide 21 and the movable table 24 of the electronic component mounting apparatus 10. Is detected by a position detection device such as induct thin and recorded in the working area 238 of the RAM 206 of the control device 200.

  In this way, when the moving base 24 is positioned at a predetermined position so that the optical axis O4 of the measurement camera 23 moves from the coordinate origin to the distance X2 and the distance Y2 in FIG. 8, the measurement camera 23 is positioned at the position of the image of the reference mark Gm. Based on the above, the positional relationship (distance Xa and distance Ya) between the optical axis O4 of the measurement camera 23 and the reference mark Gm is measured. The component recognition camera 15 measures the positional relationship (distance Xb and distance Yb) between the component camera optical axis O2 and the reference mark Gm based on the position of the image of the reference mark Gm.

  Next, as shown in FIG. 10, the measurement camera 23 is replaced with the component transfer device 26, and the light of the measurement camera 23 with respect to the coordinate origin of the slide 21 and the moving table 24 recorded in the working area 236 of the RAM 206 of the control device 23. The moving base 24 is moved to a predetermined position that satisfies the positional relationship of the axis O4 (distance X2 and distance Y2 in FIG. 8). In the stop state at this predetermined position, the suction nozzle 29 is lowered to a position where the tip of the suction nozzle 29 approaches the reference gauge G and falls within the depth of focus of the component recognition camera 15 (see the two-dot chain line 29a in FIG. 10). In this way, the moving table is moved to a predetermined position that is the positional relationship of the optical axis O4 of the measuring camera 23 with respect to the coordinate origin of the slide 21 and the moving table 24 recorded in the working area 238 of the RAM 206 (distance X2 and distance Y2 in FIG. 8). When 24 is located, the component recognition camera 15 determines the positional relationship (distance Xc and distance Yc) between the optical axis O2 of the component recognition camera 15 and the suction nozzle center line O3 based on the position of the image of the tip of the suction nozzle 29. ).

  When the moving base 24 is located at a predetermined position so that the optical axis O4 of the measurement camera 23 moves from the coordinate origin by the distance X2 and the distance Y2 in FIG. 8, the optical axis O4 of the measurement camera 23 and the optical axis of the component recognition camera 15 As is clear from FIG. 8, the calibration values of the positional relationship with O2 (distance X3 in the X direction and distance Y3 in the Y direction) are as follows:

X3 = Xa + Xb (1a)
Y3 = Ya + Yb (1b)
Given by.

  Then, when the moving base 24 is positioned at a predetermined position so that the optical axis O4 of the measuring camera 23 moves from the coordinate origin by the distance X2 and the distance Y2 in FIG. 8, the optical axis O4 of the measuring camera 23 and the measuring camera 23 are moved to the parts. As is apparent from FIG. 8, the calibration value of the positional relationship (distance X1 in the X direction and distance Y1 in the Y direction) with the center line O3 of the suction nozzle 29 after replacement with the mounting device 26 is given by the above equation. Based on the positional relationship (distance Xc and distance Yc) between X3 and Y3 and the component camera optical axis O2 and the suction nozzle center line O3 measured as described above,

X1 = Xc−X3 (2a)
Y1 = Yc−Y3 (2b)
Given by.

As a result, the deviation between the optical axis O4 of the measurement camera 23 and the center O3 of the suction nozzle 29 of the component transfer device 26 can be obtained, and finally obtained using the substrate recognition camera 25 and the measurement camera 23. The component P sucked by the suction nozzle 29 based on the feed error of the moving table 24 can be accurately mounted at a predetermined position on the substrate S.
The positive and negative signs such as the distances Xa, Xb,... In the above equations are different depending on the positional relationship between the center line O3 and the optical axes O2, O4.

  Hereinafter, the detection of the feed error of the moving table 24 will be specifically described. First, the matrix substrate SP is fixed on the substrate transfer device 12 so as to be parallel to the X axis and the Y axis along which the moving table 24 is moved. Next, based on the command of the control device 200, the moving table 24 is stored based on the relationship between the moving table 24 stored in advance in the ROM 204 and the index marks Q1 to Qn that can be imaged by the measurement camera 23 and the substrate recognition camera 25. Are indexed sequentially. Each time the index mark is indexed, the image is captured by the measurement camera 23 and the substrate recognition camera 25, and the index axis Q1 to Qn on the matrix substrate SP is measured by the optical axis O1 of the substrate recognition camera 25 and the measurement camera 23. Each error from the optical axis O4 is stored in the measured value storage area 230 of the RAM 206.

  Next, the moving table 24 is moved to the predetermined positions (distance X2 and distance Y2) shown in FIG. 8 to stop positioning, and the reference gauge G is placed on the upper end member 17 of the component recognition camera 15, The distances Xa and Ya are measured by the measurement camera 23, and the distances Xb and Yb are measured by the component recognition camera 15. Next, the distance Xc and Yc are measured by the component recognition camera 15 in a state where the measurement camera 23 is replaced with the component transfer device 26 and the movable table 24 is stopped at a predetermined position. The control device 200 calculates the calibration values of the distances X3 and Y3 using the equations (1a) and (1b), calculates the calibration values of the distances X1 and Y1 using the equations (2a) and (2b), and stores them in the offset amount storage area 234. Remember.

  The distance stored in the offset amount storage area 234 with respect to the errors (Δ2X1, Δ2Y1) to (Δ2Xn, Δ2Yn) between the optical axis O4 of the measurement camera 23 and the index marks Q1 to Qn stored in the measurement storage area 230 Correction is performed with the calibration values of X1 and Y1, and the final feed errors (ΔX1, ΔY1) to (ΔXn, ΔYn) for positioning the suction nozzle 29 during mounting are stored in the feed error storage area 232 of the RAM 206.

  Thereafter, when the component transfer device 26 mounts the component P, the substrate recognition camera 25 detects the position of the substrate mark Sm provided on the substrate S that has been loaded and positioned by the substrate transfer device 12. At this time, the substrate recognition camera based on the positional relationship table stored in the RAM 206 and the errors (Δ1X1, Δ1Y1) to (Δ1Xn, Δ1Yn) between the optical axis O1 of the substrate recognition camera 25 and the index marks Q1 to Qn. The positioning error of 25 is corrected as follows. The coordinates of the moving table 24 nearest to the command position coordinates of the substrate mark Sm are retrieved from the positional relationship table, and the index marks Q1 to Q recognized by the substrate recognition camera 25 when the moving table 24 is positioned at this coordinate. Qn is detected. The command position coordinates are corrected based on the errors (Δ1X1, Δ1Y1) to (Δ1Xn, Δ1Yn) between the detected optical axes O1 of the index marks Q1 to Qn and the index marks Q1 to Qn. By moving the moving table 24 to the corrected command position coordinates, the optical axis O1 of the substrate recognition camera 25 is positioned at a position where there is no feeding error. Note that the feed error of the board recognition camera 25 may be determined by other methods such as proportional distribution from the feed errors of the index marks Q1 to Qn surrounding the command position coordinates.

  The substrate mark Sm is picked up by the substrate recognition camera 25 moved to a position where there is no feed error, and a deviation between the optical axis O1 of the substrate recognition camera 25 and the substrate mark is detected to determine the positioning error of the substrate S. And stored in the workking area 238 of the RAM 206.

  Based on the final feed error for positioning the suction nozzle 29 during mounting and the positioning error of the substrate S determined by the operation as described above, the feed command value (mounting position coordinates) according to the mounting position of the substrate S For example, the suction nozzle 29 can be moved to the mounting position with high accuracy.

  For example, the feed error is stored in association with each normal position of the index marks Q1 to Qn (specified by the movement instruction data in the X-axis direction and the Y-axis direction), with the normal position as the center, It is assumed that a feed error calculated for the normal position occurs in a square area having one side of a half distance between adjacent index marks. When the component P is mounted, the mounting position is corrected for the positioning error of the board S, and the mounting position where the positioning error of the board S is corrected is determined to belong to the region centered on the normal position. Based on the feed error obtained for the position, the feed amount of the movable table 24 is corrected. The correction value of the feed amount may be determined by other methods such as a proportional distribution based on feed errors at the normal positions of the index marks Q1 to Qn surrounding the target mounting position.

  In the above embodiment, the interval between the index marks Q1 to Qn attached to the matrix substrate SP is set to half the distance H between the optical axis O4 of the measurement camera 23 and the optical axis O1 of the substrate recognition camera 25 (H / However, the present invention is not limited to this as long as the index mark can be arranged so that it can coincide with the optical axis O4 of the measurement camera 23 and the optical axis O1 of the substrate recognition camera 25 at the same time. For example, when the optical axis O4 of the measurement camera 23 and the optical axis O1 of the substrate recognition camera 25 are arranged at the same distance as the distance H, or between the optical axis O4 of the measurement camera 23 and the optical axis O1 of the substrate recognition camera 25 The distance H may be set to an interval (H / 3, H / 4, etc.) that is an integral number of the distance H between them. As described above, the optical axis O4 of the measurement camera 23 and the optical axis O1 of the substrate recognition camera 25 are arranged at the same interval as the distance H between the optical axis O4 of the measurement camera 23 and the optical axis O1 of the substrate recognition camera 25. If the index marks Q1 to Qn are arranged at an interval (H / 3, H / 4, etc.) that is an integral fraction of the distance H between O1, the optical axis O4 of the measurement camera 23 and the light of the substrate recognition camera 25 Since it can coincide with the axis O1 at the same time, the detection of the positional deviation due to the feed error between the optical axis O4 of the measurement camera 23 and the index marks Q1 to Qn of the optical axis O1 of the substrate recognition camera 25 is separately performed. Since it is not necessary to perform this, it is possible to shorten the time for the feeding error correction operation.

The perspective view which shows the principal part of the electronic component mounting apparatus which concerns on embodiment. The figure explaining the method for detecting the feed error of a moving stand. The sectional side view which shows the support structure of the upper end member which supports a reference gauge, and a component recognition camera. The control block diagram of the electronic component mounting apparatus which concerns on embodiment. The conceptual diagram which shows the structure of RAM. The figure explaining the method for detecting the feed error of a moving stand. The figure which shows the positional relationship table memorize | stored in RAM. The figure explaining the method of calibrating the positional relationship of a suction nozzle center and a measurement camera optical axis. The figure explaining the method to detect the positional relationship of the measurement camera optical axis and the component recognition camera optical axis. The figure explaining the method to detect the positional relationship of the suction nozzle center and the camera optical axis for component recognition.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Base, 12 ... Board | substrate conveyance apparatus, 13 ... Component supply apparatus, 15 ... Component recognition camera, 17 ... Upper end member (supporting member), 23 ... Measurement camera, 24 ... Moving stand, 25 ... Board recognition camera, 26 ... Component transfer device, 29 ... Suction nozzle (component sampling unit), G, ... Reference gauge, Gm ... Reference mark, S ... Substrate, P ... Component, O1 ... Substrate camera optical axis, O2 ... Component camera optical axis, O3 ... Suction nozzle center line, O4 ... Optical camera optical axis

Claims (2)

A substrate transfer device provided on the base for carrying in / out and positioning and holding the substrate, a movable base supported so as to be movable in two directions of X and Y with respect to the base, and movement of the movable base A movement control device that controls the component, and a component transfer that is mounted on the substrate that is mounted on the substrate transporting device by picking up a component that is attached to the moving table and supplied by the component supply device by a component collecting unit Electronic component mounting comprising: an apparatus; a substrate recognition camera whose optical axis is fixed to the moving table at a predetermined interval from a center line of the component sampling unit; and a component recognition camera fixed to the base In the device
The measurement camera is replaced with a component transfer device and fixed, and a matrix substrate with index marks at each intersection point on a virtual base line orthogonal to each other at an interval that is subdivided by an integral number of the predetermined interval is used for each base line. Is fixed to the base so as to be parallel to the X-axis or Y-axis, and the moving table is sequentially indexed and stopped at each index mark of the matrix substrate, and the substrate recognition camera and measurement camera at each index stop position Measure the X and Y errors from the respective optical axes of the corresponding index marks respectively in, and store the X and Y errors measured by these cameras as correction values at the respective index stop positions.
The moving table is stopped at a predetermined position with respect to the coordinate origin so that a reference mark provided on the base so as to fall within the field of view of the component recognition camera falls within the field of view of the measurement camera, and the part recognition The optical axis of the component recognition camera and the measurement camera when the moving base is located at the predetermined position based on the positional relationship between the optical axis of each camera and the reference mark detected by the camera for measurement and the measurement camera Calculate the positional relationship with the optical axis of
A component transfer device is installed instead of the measurement camera, the moving table is stopped at the predetermined position, and the optical axis of the component recognition camera and the center of the component sampling unit of the component transfer device are detected by the component recognition camera. Detect the positional relationship with the line,
From the positional relationship between the optical axis of the component recognition camera and the optical axis of the measurement camera and the positional relationship between the optical axis of the component recognition camera and the center line of the component sampling unit, the optical axis of the measurement camera and the component sampling unit Calculate and store the positional relationship with the center line of
When the component is mounted on the substrate that is positioned and held by the substrate transporting device, the mounting position of the component is set to a correction value at each index stop position, and the optical axis and component of the component recognition camera. A moving control method for a moving table, wherein the moving table is moved after correction based on a positional relationship with a center line of a sampling unit. A substrate transfer device provided on the base for carrying in / out and positioning and holding the substrate, a movable base supported so as to be movable in two directions of X and Y with respect to the base, and movement of the movable base A movement control device that controls the component, and a component transfer that is mounted on the substrate that is mounted on the substrate transporting device by picking up a component that is attached to the moving table and supplied by the component supply device by a component collecting unit An apparatus, a substrate recognition camera whose optical axis is fixed to the moving table at a predetermined interval from the center line of the component sampling unit, and a component recognition camera fixed to the base, and the measurement camera as a component A matrix substrate fixed in place of the transfer device and indexed at each intersection point on a virtual base line that is orthogonal to each other at subdivided intervals is arranged so that the base line is parallel to the X axis or the Y axis. Fixed to the base The moving table is sequentially indexed and stopped at each index mark on the Rix substrate, and the X and Y errors from each optical axis of the corresponding index mark are measured by the substrate recognition camera and the measurement camera at each index stop position. The matrix substrate used in the movement control method of the moving table of the electronic component mounting apparatus which corrects the feed error of the moving table based on the index marks measured by these cameras and the X and Y errors of the optical axis The matrix substrate is characterized in that the interval between the index marks is made an integral number of the predetermined interval.

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