JP2018024206A - 粘着性構造体 - Google Patents
粘着性構造体 Download PDFInfo
- Publication number
- JP2018024206A JP2018024206A JP2016158633A JP2016158633A JP2018024206A JP 2018024206 A JP2018024206 A JP 2018024206A JP 2016158633 A JP2016158633 A JP 2016158633A JP 2016158633 A JP2016158633 A JP 2016158633A JP 2018024206 A JP2018024206 A JP 2018024206A
- Authority
- JP
- Japan
- Prior art keywords
- carbon nanotube
- adhesive
- layer
- carbon nanotubes
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 217
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 207
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 207
- 239000000853 adhesive Substances 0.000 claims abstract description 144
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 51
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000003960 organic solvent Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims description 152
- 239000000463 material Substances 0.000 claims description 37
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 18
- 229910010272 inorganic material Inorganic materials 0.000 claims description 12
- 230000003100 immobilizing effect Effects 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 150000002484 inorganic compounds Chemical class 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 230000006641 stabilisation Effects 0.000 abstract 2
- 238000011105 stabilization Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 175
- 238000000034 method Methods 0.000 description 30
- 238000009826 distribution Methods 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 24
- 239000002585 base Substances 0.000 description 21
- 239000011247 coating layer Substances 0.000 description 19
- 239000003054 catalyst Substances 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- 239000010408 film Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052799 carbon Inorganic materials 0.000 description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 239000011147 inorganic material Substances 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 150000004703 alkoxides Chemical class 0.000 description 6
- 230000003749 cleanliness Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001747 exhibiting effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000010452 phosphate Substances 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- -1 alumina Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 3
- 239000013067 intermediate product Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- CIJMTDMRJVFJTP-UHFFFAOYSA-N calcium;aluminum Chemical compound [Al].[Ca+2] CIJMTDMRJVFJTP-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/008—Gripping heads and other end effectors with sticking, gluing or adhesive means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Crystallography & Structural Chemistry (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Carbon And Carbon Compounds (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Adhesive Tapes (AREA)
- Materials For Medical Uses (AREA)
Abstract
Description
1つの実施形態においては、上記粘着性構造体は、上記基材と上記中間層との間に、固定化剤層をさらに備える。
1つの実施形態においては、上記固定化剤層の厚みが、1μm以上である。
1つの実施形態においては、上記固定化剤層が、無機物を含む接着剤から構成される。
1つの実施形態においては、上記無機物を含む接着剤が、有機溶剤系セラミックス接着剤である。
1つの実施形態においては、上記無機物が、Al、Si、Ti、Kからなる群より選ばれる少なくとも1種の元素を含む無機化合物である。
図1は、本発明の1つの実施形態による粘着性構造体の概略断面図である。粘着性構造体100は、基材10と、中間層20と、カーボンナノチューブ集合体層30とをこの順に備える。カーボンナノチューブ集合体層30は、複数のカーボンナノチューブ31により構成される。基材10とカーボンナノチューブ31とは、固定化剤により接合されている。中間層20は、カーボンナノチューブ31と固定化剤とを含む層である。
上記基材を構成する材料としては、任意の適切な材料が採用され得る。1つの実施形態においては、搬送基材を構成する材料として、アルミナ、ジルコニアなどの金属酸化物;炭化ケイ素などの炭化物;窒化ケイ素、窒化ガリウム等のセラミックス材料;ステンレス鋼等の耐熱性材料;銅、アルミなどの熱伝導性材料または電気伝導性材料が用いられる。好ましくは、アルミナが用いられる。
上記のとおり、中間層は、カーボンナノチューブと固定化剤とを含む。中間層は、上記基材上に形成した固定化剤層の前駆層に、カーボンナノチューブの少なくとも一部を含有させることにより形成され得る。固定化剤層の前駆層とは、固定化剤硬化前の層(接着剤または粘着剤の塗布層)および固定化剤硬化後の層を含む概念である。固定化剤層の前駆層全体にカーボンナノチューブの少なくとも一部を含有させれば、固定化剤層を有さない粘着性構造体が得られる。また、固定化剤層の前駆層の厚み方向の一部にカーボンナノチューブの少なくとも一部を含有させれば、固定化剤層を有する粘着性構造体が得られる。なお、中間層に含有されなかったカーボンナノチューブがカーボンナノチューブ集合体層を構成する。
カーボンナノチューブ集合体層は、複数のカーボンナノチューブから構成される。
上記粘着性構造体は、任意の適切な方法により製造され得る。1つの実施形態においては、基板上に固定化剤層を構成する接着剤または粘着剤を塗布し、該塗布により形成された塗布層上にカーボンナノチューブ集合体を配置した後、該塗布層を硬化させることにより接着剤層を形成して、粘着性構造体を得ることができる。また、基材上に粘着剤から構成される固定化剤層を形成し、該固定化剤層にカーボンナノチューブ集合体の一部を埋め込むことにより、粘着性構造体を製造してもよい。カーボンナノチューブ集合体を塗布層上に配置する方法としては、例えば、上記D項で説明した方法により得られたカーボンナノチューブ集合体付平板から、カーボンナノチューブ集合体を上記塗布層に転写する方法が挙げられる。
粘着性構造体の断面をSEMにより観察し、各層の厚みを測定した。
(2)耐久性試験
直線方向に往復するステージ上にシリコン製半導体ウエハを固定し、該シリコン製半導体ウエハ上に粘着性構造体を載置した。このとき、粘着性構造体のカーボンナノチューブ集合体面が、半導体ウエハに接するようにした。
次いで、上記ステージを加速度1Gで100往復させ、その後の、粘着性構造体の破損状態(カーボンナノチューブ集合体の脱離状態)を目視にて確認した。
シリコン製の平板(バルカー・エフティ社製、厚み700μm)上に、スパッタ装置(芝浦メカトロニクス社製、商品名「CFS−4ES」)により、Al2O3薄膜(到達真空度:8.0×10−4Pa、スパッタガス:Ar、ガス圧:0.50Pa、成長レート:0.12nm/sec、厚み:20nm)を形成した。このAl2O3薄膜上に、さらにスパッタ装置(芝浦メカトロニクス社製、商品名「CFS−4ES」)にてFe薄膜を触媒層(スパッタガス:Ar、ガス圧:0.75Pa、成長レート:0.012nm/sec、厚み:1.0nm)として形成した。
その後、この平板を30mmφの石英管内に載置し、水分率700ppmに保ったヘリウム/水素(105/80sccm)混合ガスを石英管内に30分間流して、管内を置換した。その後、電気管状炉を用いて管内を765℃まで昇温させ、765℃にて安定させた。765℃にて温度を保持したまま、ヘリウム/水素/エチレン(105/80/15sccm、水分率700ppm)混合ガスを管内に充填させ、60分間放置して、平板上にカーボンナノチューブ集合体を形成させた。
基材(アルミナ製、サイズ:10mm×30mm)上に、スキージを用いて、有機溶剤系セラミックス接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ、溶剤:メタノール)を9.5mm角のサイズで塗布した。
製造例1で得られたカーボンナノチューブ集合体を上記平板から採取し、接着剤塗布層上に配置した。このとき、カーボンナノチューブ集合体の平板に接していた側が、接着剤塗布層に接するように配置した。
その後、カーボンナノチューブ集合体の接着剤塗布層とは反対側に、清浄なウエハを介して10gの重りをおき、カーボンナノチューブ集合体と接着剤塗布層とを密着させた。
次いで、上記のようにして得られた積層体を、常温下に1時間、さらに、100℃の環境下に1時間置いて、接着剤を硬化させた。
上記のようにして、基材/固定化剤層(厚み:194μm)/中間層/カーボンナノチューブ集合体層(厚み:440μm)から構成される粘着性構造体を得た。中間層の厚みは、30.2μmであった。
得られた粘着性構造体を上記評価(1)に供した。結果を表1に示す。
有機溶剤系セラミックス接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ、溶剤:メタノール)100重量部に対してエタノール20重量部を添加した後に、接着剤を塗布したこと以外は、実施例1と同様にして、粘着性構造体を得た。固定化剤層の厚みは152μmであり、カーボンナノチューブ集合体層の厚みは526μmであった。中間層の厚みは、81.4μmであった。
得られた粘着性構造体を上記評価(1)に供した。結果を表1に示す。
基材(アルミナ製、サイズ:10mm×30mm)上に、スキージを用いて、有機溶剤系セラミックス接着剤(アイン社製、商品名「RG−57−2−3」;バインダ:オルガノポリシロキサン、無機物:シリカ、チタニア、チタン酸カリウム、溶剤:エチレングリコールジブチルエーテル)を9.5mm角のサイズで塗布した。
製造例1で得られたカーボンナノチューブ集合体を上記平板から採取し、接着剤塗布層上に配置した。このとき、カーボンナノチューブ集合体の平板に接していた側が、接着剤塗布層に接するように配置した。
その後、カーボンナノチューブ集合体の接着剤塗布層とは反対側に、清浄なウエハを介して10gの重りをおき、カーボンナノチューブ集合体と接着剤塗布層とを密着させた。
次いで、上記のようにして得られた積層体を、80℃の環境下に30分、さらに、150℃の環境下に1時間、さらに、400℃の環境下に2時間置いて、接着剤を硬化・焼成させた。
上記のようにして、基材/固定化剤層(厚み:31μm)/中間層/カーボンナノチューブ集合体層(厚み:1119μm)から構成される粘着性構造体を得た。中間層の厚みは、1.8μmであった。
得られた粘着性構造体を上記評価(1)に供した。結果を表1に示す。
基材(アルミナ製、サイズ:10mm×30mm)上に、ポリイミド系粘着剤層を有する両面粘着テープを貼り合せた。
製造例1で得られたカーボンナノチューブ集合体を上記平板から採取し、粘着剤層上に配置した。このとき、カーボンナノチューブ集合体の平板に接していた側が、両面粘着テープの粘着剤層に接するように配置した。
その後、カーボンナノチューブ集合体の両面テープとは反対側に、清浄なウエハを介して300gの重りをおき、カーボンナノチューブ集合体と粘着剤層とを密着させた。
上記のようにして、基材/固定化剤層(厚み:135μm)/中間層/カーボンナノチューブ集合体層(厚み:599μm)から構成される粘着性構造体を得た。中間層の厚みは、0.8μmであった。
得られた粘着性構造体を上記評価(1)に供した。結果を表1に示す。
接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ、溶剤:メタノール)に代えて、接着剤(イーエムジャパン社製、商品名「G7716」、硬化物:無機ケイ酸、フィラー:炭素、溶剤:水)を用いたこと以外は、実施例1と同様にして、粘着性構造体を得た。固定化剤層の厚みは24μmであり、カーボンナノチューブ集合体層の厚みは908μmであった。中間層の厚みは、0.08μmであった。
得られた粘着性構造体を上記評価(1)に供した。結果を表1に示す。
接着剤(スリーボンド社製、商品名「TB3732」、バインダ:金属アルコキシド、フィラー:アルミナ、溶剤:メタノール)に代えて、接着剤(イーエムジャパン社製、商品名「G7716」、硬化物:無機ケイ酸、フィラー:炭素、溶剤:水)を用い、カーボンナノチューブ集合体と接着剤塗布層とを密着させるための重りを用いなかったこと以外は、実施例1と同様にして、粘着性構造体を得た。固定化剤層の厚みは30μmであり、カーボンナノチューブ集合体層の厚みは616μmであった。中間層の厚みは、0.05μmであった。
20 固定化剤層
30 カーボンナノチューブ集合体層
31 カーボンナノチューブ
40 中間層
100、200 粘着性構造体(搬送固定治具)
Claims (6)
- 基材と、中間層と、カーボンナノチューブ集合体層とを備え、
該カーボンナノチューブ集合体が複数のカーボンナノチューブ集合体により構成され、
該中間層が、該カーボンナノチューブと、固定化剤とを含む層であり、
該中間層の厚みが、100nm以上である、
粘着性構造体。 - 前記基材と前記中間層との間に、固定化剤層をさらに備える、請求項1に記載の粘着性構造体。
- 前記固定化剤層の厚みが、1μm以上である、請求項2に記載の粘着性構造体。
- 前記固定化剤層が、無機物を含む接着剤から構成される、請求項2または3に記載の粘着性構造体。
- 前記無機物を含む接着剤が、有機溶剤系セラミックス接着剤である、請求項4に記載の粘着性構造体。
- 前記無機物が、Al、Si、Ti、Kからなる群より選ばれる少なくとも1種の元素を含む無機化合物である、請求項5に記載の粘着性構造体。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016158633A JP6879692B2 (ja) | 2016-08-12 | 2016-08-12 | 粘着性構造体 |
CN201780049406.0A CN109641421A (zh) | 2016-08-12 | 2017-08-02 | 粘合性结构体 |
PCT/JP2017/028046 WO2018030235A1 (ja) | 2016-08-12 | 2017-08-02 | 粘着性構造体 |
US16/324,655 US20190218426A1 (en) | 2016-08-12 | 2017-08-02 | Adhesive structure |
EP17839308.8A EP3498468A4 (en) | 2016-08-12 | 2017-08-02 | ADHESIVE STRUCTURE |
KR1020197004010A KR102449288B1 (ko) | 2016-08-12 | 2017-08-02 | 점착성 구조체 |
TW106126665A TWI773681B (zh) | 2016-08-12 | 2017-08-08 | 黏著性構造體 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016158633A JP6879692B2 (ja) | 2016-08-12 | 2016-08-12 | 粘着性構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018024206A true JP2018024206A (ja) | 2018-02-15 |
JP6879692B2 JP6879692B2 (ja) | 2021-06-02 |
Family
ID=61162470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016158633A Active JP6879692B2 (ja) | 2016-08-12 | 2016-08-12 | 粘着性構造体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190218426A1 (ja) |
EP (1) | EP3498468A4 (ja) |
JP (1) | JP6879692B2 (ja) |
KR (1) | KR102449288B1 (ja) |
CN (1) | CN109641421A (ja) |
TW (1) | TWI773681B (ja) |
WO (1) | WO2018030235A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020027337A1 (ja) * | 2018-08-02 | 2020-02-06 | 三菱ケミカル株式会社 | 接合体、それを有する分離膜モジュール及びアルコールの製造方法 |
JP2020023432A (ja) * | 2018-08-02 | 2020-02-13 | 三菱ケミカル株式会社 | 接合体及びそれを有する分離膜モジュール |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108942994A (zh) * | 2018-07-09 | 2018-12-07 | 上海交通大学 | 柔性仿生抓手 |
JP7315913B2 (ja) * | 2019-03-01 | 2023-07-27 | 東芝テック株式会社 | 吸着装置及び分析装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008201594A (ja) * | 2007-02-16 | 2008-09-04 | Matsushita Electric Ind Co Ltd | 微細繊維の構造体およびその製造方法 |
JP2011132074A (ja) * | 2009-12-25 | 2011-07-07 | Nitto Denko Corp | カーボンナノチューブ複合構造体および粘着部材 |
JP2012532435A (ja) * | 2009-07-06 | 2012-12-13 | ゼプター コーポレイション | カーボンナノチューブ複合材料構造及びその製造方法 |
JP2016046520A (ja) * | 2014-08-21 | 2016-04-04 | 日東電工株式会社 | 半導体搬送部材および半導体載置部材 |
JP2017175126A (ja) * | 2016-03-18 | 2017-09-28 | 日東電工株式会社 | 搬送固定治具 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001351961A (ja) | 2000-06-07 | 2001-12-21 | Taiheiyo Cement Corp | Siウェハ搬送治具及びその製造方法 |
JP2005129406A (ja) * | 2003-10-24 | 2005-05-19 | Hitachi Zosen Corp | カーボンナノチューブの転写方法 |
JP4509981B2 (ja) * | 2006-08-11 | 2010-07-21 | 日東電工株式会社 | クリーニング部材、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法 |
JP5905718B2 (ja) | 2011-12-28 | 2016-04-20 | 東新産業株式会社 | 搬送治具、搬送方法、および搬送治具材料 |
JP2016046521A (ja) * | 2014-08-21 | 2016-04-04 | 日東電工株式会社 | 半導体搬送部材および半導体載置部材 |
-
2016
- 2016-08-12 JP JP2016158633A patent/JP6879692B2/ja active Active
-
2017
- 2017-08-02 CN CN201780049406.0A patent/CN109641421A/zh active Pending
- 2017-08-02 WO PCT/JP2017/028046 patent/WO2018030235A1/ja unknown
- 2017-08-02 US US16/324,655 patent/US20190218426A1/en not_active Abandoned
- 2017-08-02 EP EP17839308.8A patent/EP3498468A4/en not_active Withdrawn
- 2017-08-02 KR KR1020197004010A patent/KR102449288B1/ko active IP Right Grant
- 2017-08-08 TW TW106126665A patent/TWI773681B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008201594A (ja) * | 2007-02-16 | 2008-09-04 | Matsushita Electric Ind Co Ltd | 微細繊維の構造体およびその製造方法 |
JP2012532435A (ja) * | 2009-07-06 | 2012-12-13 | ゼプター コーポレイション | カーボンナノチューブ複合材料構造及びその製造方法 |
JP2011132074A (ja) * | 2009-12-25 | 2011-07-07 | Nitto Denko Corp | カーボンナノチューブ複合構造体および粘着部材 |
JP2016046520A (ja) * | 2014-08-21 | 2016-04-04 | 日東電工株式会社 | 半導体搬送部材および半導体載置部材 |
JP2017175126A (ja) * | 2016-03-18 | 2017-09-28 | 日東電工株式会社 | 搬送固定治具 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020027337A1 (ja) * | 2018-08-02 | 2020-02-06 | 三菱ケミカル株式会社 | 接合体、それを有する分離膜モジュール及びアルコールの製造方法 |
JP2020023432A (ja) * | 2018-08-02 | 2020-02-13 | 三菱ケミカル株式会社 | 接合体及びそれを有する分離膜モジュール |
JP7359590B2 (ja) | 2018-08-02 | 2023-10-11 | 三菱ケミカル株式会社 | 接合体及びそれを有する分離膜モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP6879692B2 (ja) | 2021-06-02 |
KR20190039946A (ko) | 2019-04-16 |
US20190218426A1 (en) | 2019-07-18 |
CN109641421A (zh) | 2019-04-16 |
TW201823152A (zh) | 2018-07-01 |
TWI773681B (zh) | 2022-08-11 |
KR102449288B1 (ko) | 2022-09-29 |
WO2018030235A1 (ja) | 2018-02-15 |
EP3498468A1 (en) | 2019-06-19 |
EP3498468A4 (en) | 2020-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018030235A1 (ja) | 粘着性構造体 | |
US11420832B2 (en) | Transport fixing jig | |
WO2017026336A1 (ja) | 搬送装置 | |
WO2016027803A1 (ja) | 半導体搬送部材および半導体載置部材 | |
WO2017086254A1 (ja) | 部品把持具 | |
WO2018173456A1 (ja) | 搬送固定治具 | |
KR102477740B1 (ko) | 카본 나노 튜브 집합체 | |
WO2016027600A1 (ja) | 半導体搬送部材および半導体載置部材 | |
WO2017159661A1 (ja) | 搬送固定治具 | |
WO2016027804A1 (ja) | 半導体搬送部材および半導体載置部材 | |
TWI760320B (zh) | 載置構件 | |
KR102424471B1 (ko) | 카본 나노 튜브 집합체 | |
JP6549995B2 (ja) | 載置部材 | |
WO2016027601A1 (ja) | 半導体搬送部材および半導体載置部材 | |
TWI743077B (zh) | 載置構件 | |
WO2018030182A1 (ja) | カーボンナノチューブ集合体 | |
WO2018066233A1 (ja) | カーボンナノチューブ集合体 | |
KR20220124055A (ko) | 시트 형상을 유지할 수 있는 복수의 카본 집합체 | |
JP2017126695A (ja) | 載置部材の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190702 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200825 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201021 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210128 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210427 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210430 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6879692 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |