JP2018022730A - Lead frame conveying apparatus and method of conveying lead frame - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame conveying apparatus capable of holding and conveying from a supply source of a lead frame to a predetermined position of a molding die or the like as a supply destination even if the lead frame is large-sized, thin, or the like, and bending during transportation is large.SOLUTION: A lead frame conveying apparatus A includes: a positioning pin 35 and a disengagement prevention pin 36 disposed by facing each other with a required spacing for fixing a lead frame 7 by a reaction force of an inward tensile force caused by bending caused by the weight of the lead frame 7 bridged between them; and chuck claws 4, 4a disposed outside the positioning pin 35 and the disengagement prevention pin 36 and capable of holding the lead frame 7 in cooperation therewith.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lead frame transport apparatus and a lead frame transport method.

  2. Description of the Related Art Lead frame transport apparatuses that transport a lead frame that supports and fixes a semiconductor chip or the like are used in various scenes of a semiconductor package manufacturing process. For example, in a taping process, a resin sealing process, a wire bonding process, or an inspection process, the lead frame transport device transports the lead frame to an arrangement position in each process.

  In a resin sealing device that manufactures a resin mold electronic component package by placing a semiconductor chip or the like on a lead frame and sealing with resin, an inloader is used from the lead frame supplier to a fixed position of the molding die. The lead frame is transported. As an apparatus for conveying a lead frame, for example, there is a transfer apparatus disclosed as a component of a mold system described in Patent Document 1.

  As shown in FIG. 2 of Patent Document 1, the transfer device described in Patent Document 1 chucks the lead frame and supplies it to the upper side of the lower mold, or chucks the molded product after resin sealing. This is a structure having a chucking mechanism for unloading from above the lower mold and positioning at a predetermined unloading position.

  This chucking mechanism swings the chuck claw driven by the cylinder in the direction of sandwiching the lead frame from both sides during transport of the lead frame, and further places both sides of the lead frame on the protruding part of the tip of the chuck claw. It comes to hold.

JP-A-6-830

However, the conventional transfer device has the following problems.
That is, there are many types of resin-molded electronic component packages used for a wide variety of products, and the lead frames that serve as the bases have various properties such as size, shape, material, and flexibility.

  In the structure in which both sides of the lead frame are held only by the chuck claws as described above, the inner side of the lead frame is bent in the direction of gravity due to its own weight.

  In this holding structure, if the lead frame has a relatively narrow interval between the held parts and is not easily bent, the lead frame can be transported without any trouble. However, when the lead frame is large or thin, for example, when the lead frame has a large deflection at the time of conveyance, vibration and inertial force are likely to act on the lead frame when the movement starts or stops. As a result, when a change occurs in the bending shape or amount of bending of the lead frame, the lead frame placed on the protruding portion at the tip of the chuck claw is displaced inwardly, and the lead frame falls and forms a molding metal. There is a possibility that the sheet cannot be conveyed to a predetermined position of the mold.

  As another conventional structure, an apparatus shown in FIG. 11 is also employed. This device positions the lead frame 102 by passing the positioning pin 101 on the left side in FIG. 11 through the positioning hole (reference number omitted) of the lead frame 102, and further places the right edge of the lead frame 102 on the chuck claw 103. It is a structure to hold.

  According to this structure, even if the lead frame 102 is bent and the right edge is detached from the chuck claw 103, it can be suspended and supported by the positioning pin 101, and does not fall. However, in any case, if the lead frame 102 is out of the normal position during conveyance, the lead frame 102 cannot be conveyed to a predetermined position of the molding die.

  The present invention has been devised in view of the above points, and even if the lead frame is large or thin, for example, even if the lead frame has a large amount of bending during transportation, the lead frame supplier It is an object of the present invention to provide a lead frame transport device and a lead frame transport method that can hold and transport from a predetermined position such as a molding die as a supply destination.

(1) In order to achieve the above object, the lead frame transport device of the present invention has a pair of members arranged opposite to each other at a required interval, and the leads spanned between the pair of members. By applying an inward pulling force due to the bending caused by the weight of the frame, the lead frame is arranged on the outside of each member of the stopper by stopping the lead frame by the reaction force, and the lead cooperates with the stopper. A holding portion capable of holding the frame.

  In the lead frame transport device, the lead frame is bent in the direction of gravity by its own weight and deformed into a substantially arc shape by bridging the lead frame between a pair of members of the stopper. At this time, the portion of the lead frame that is hung on each member pulls each member inward and slightly downward. When a tensile force is generated in each member, a drag force in a direction opposite to the tensile force, that is, a reaction force is generated in each member. As a result, the lead frame is stopped in a state of being bent in the direction of gravity and supported by the respective members from both sides with its reaction force.

  When the lead frame is supported by each member with a sufficient reaction force, the lead frame can be stopped by the frictional force between the lead frame and each member and the state in which the lead frame does not fall off from each member can be maintained. . However, there are various lead frames, and it is not always possible to stop and support them. According to the present invention, even if the reaction force for stopping the lead frame is not sufficient, it is held by the holding portion that cooperates with each member of the stopping portion, so that the lead frame may fall off or partly come off. Can be prevented.

  Thus, even if the lead frame is large or thin, for example, and has a large amount of bending during transportation, the lead frame can be held by the cooperating stopper and holding portion. Can be reliably transported from a supply source to a predetermined position such as a molding die as a supply destination without dropping off.

(2) In the lead frame transport device of the present invention, the stop portion cooperates with the engagement hole on one side of the lead frame, and the positioning pin that determines the position of the lead frame to the required position, and the engagement on the other side of the lead frame It can also be set as the structure which has the fall prevention pin penetrated by a hole.

  In this case, in addition to the action of (1), the lead frame can be set to a normal design position by stopping the lead frame with the positioning pin and the prevention pin that are the stoppers. it can. Thereby, the lead frame held by the stopper and the holding part can be held and transported in a balanced and stable state.

(3) In the lead frame transport device of the present invention, the prevention pin is inserted into the engagement hole on the other side of the lead frame positioned by engaging the engagement hole on one side of the lead frame with the positioning pin. It can also be set as the structure formed so that the edge could be inserted without contact.

  In this case, in addition to the operation (2), the lead frame can be set at a required position by engaging the positioning pin with the engagement hole on one side of the lead frame. At the same time, when the slip-off prevention pin is inserted into the engagement hole on the other side of the lead frame, it is prevented from coming into contact with the hole edge of the engagement hole. It can be reliably inserted into the hole. As a result, the lead frame can be smoothly held by the stop portion and the holding portion.

(4) In the lead frame transport device of the present invention, the leading end of the positioning pin can be brought into contact with the leading end of a guide member provided in the mold of the resin sealing device, which serves as a transport receiving portion of the lead frame. It can also be configured.

  In this case, in addition to the operations (2) and (3), the tip of the positioning pin that engages with the engagement hole and stops the lead frame contacts the guide member provided on the mold. Thus, the positioning pin and the guide member are connected. When the lead frame touches the mold and the bending of the lead frame is eliminated, the lead frame can be lowered and moved from the positioning pin to the guide member. The guide member guides the transferred lead frame and can be set at a predetermined position of the mold, that is, a position for performing resin molding.

(5) The lead frame conveying device of the present invention may be configured to have a clamper that contacts the main surface of the lead frame when the lead frame is transferred to the mold.

  In this case, in addition to the function (4), when the lead frame is disposed at a predetermined position of the mold, the clamper can be brought into contact with the main surface of the lead frame to hold the main surface. In other words, a mold that repeatedly performs a resin molding operation is usually kept at a high temperature when the lead frame is disposed, and thus the lead frame disposed on the mold may be deformed by heat. By pressing the main surface of the lead frame with the clamper, deformation due to heat can be suppressed or prevented, and the resin molding operation can be prevented from being hindered.

(6) In order to achieve the above object, the lead frame transport method according to the present invention provides a self-weight of the lead frame spanned between each member on a pair of members arranged facing each other at a required interval. When the pulling force acts by the bending due to the above, the pair of members stops the lead frame by the reaction force and transports the lead frame.

  According to the lead frame transport method of the present invention, the lead frame is bent in the direction of gravity by its own weight and deformed into a substantially arc shape by bridging the lead frame between the pair of members of the stopper. At this time, the portion of the lead frame that is hung on each member pulls each member inward and slightly obliquely downward. When a tensile force is generated in each member, a drag force in a direction opposite to the tensile force, that is, a reaction force is generated in each member. As a result, the lead frame is stopped in a state of being bent in the direction of gravity and supported by the respective members from both sides with its reaction force.

  When the lead frame is supported by each member with a sufficient reaction force, it is possible to maintain a state in which the lead frame does not drop off from each member due to a frictional force between the lead frame and each member. However, there are various lead frames, and such a support is not always possible. Even if the reaction force supporting the lead frame is not sufficient, the lead frame is held by the holding portion that cooperates with each member of the stop portion, so that the lead frame can be prevented from falling off or partly coming off. .

  Thus, even if the lead frame is large or thin, for example, and has a large amount of bending during transportation, the lead frame can be held by the cooperating stopper and holding portion. Can be reliably transported from a supply source to a predetermined position such as a molding die as a supply destination without dropping off.

(7) In order to achieve the above object, the lead frame transport method of the present invention includes a step of setting a position of the lead frame with respect to a stop portion for stopping the lead frame between a pair of members to a predetermined position, and the stop portion. And a step of holding the lead frame by a holding portion that is arranged outside the respective members of the stopper and holds the lead frame in cooperation with the stopper, and the stopper and the holder When the pulling force is applied by bending due to the weight of the held lead frame, the lead frame is stopped by the reaction force, and the lead frame is conveyed to the mold of the resin sealing device. And a step of arranging at a predetermined position of the mold.

  According to this lead frame transport method, it has the same action as the above (6), and is provided on the outside of each of the stopper and each member of the stopper, and holds the lead frame in cooperation with the stopper. By the portion, the lead frame can be held from the outside without interfering with the lead frame held inside each member. As a result, the holding unit can hold the lead frame in a state in which it does not easily interfere with the lead frame, so that it is possible to cause each of the above actions to work naturally.

(8) The lead frame transport method of the present invention includes a positioning pin for engaging the lead frame with an engagement hole on one side of the lead frame, which constitutes a stopper, and determining the position of the lead frame to a required position; You may make it stop with the fall prevention pin passed through the engagement hole of the other side of a flame | frame.

  In this case, in addition to the action of (7) above, the lead frame is stopped by the positioning pin and the stopper pin which are the stoppers, so that the position of the lead frame with respect to the stopper is automatically set to the normal design position. Can be set. Thereby, the lead frame held by the stopper and the holding part can be conveyed in a balanced and stable state.

(9) In the lead frame transport method according to the present invention, when the lead frame is arranged in the mold, the tip of the positioning pin holding the lead frame is brought into contact with the tip of the guide member provided in the mold, The frame may be arranged on the guide member from the positioning pin.

  In this case, in addition to the action of (8) above, the tip of the positioning pin that stops the lead frame, for example, by engaging with the engaging hole, is brought into contact with the guide member provided in the mold. The positioning pin and the guide member are connected. When the lead frame touches the mold and the bending of the lead frame is eliminated, the lead frame descends and moves from the positioning pin to the guide member. The guide member can be disposed at a predetermined position of the mold, that is, a position for performing resin molding, by guiding the lead frame that has moved.

(10) In the lead frame transport method of the present invention, the clamper may be brought into contact with the main surface of the lead frame when the lead frame is transferred to the mold.

  In this case, in addition to the actions (7), (8) and (9) above, when the lead frame is disposed at a predetermined position of the mold, the clamper is brought into contact with the main surface of the lead frame, You can hold the main surface. In other words, a mold that repeatedly performs a resin molding operation is usually kept at a high temperature when the lead frame is disposed, and thus the lead frame disposed on the mold may be deformed by heat. By pressing the main surface of the lead frame with the clamper, deformation due to heat can be suppressed or prevented, and the resin molding operation can be prevented from being hindered.

  In the present invention, even if the lead frame is large or thin, for example, and has a large amount of bending at the time of conveyance, a predetermined die such as a molding die that is a supply destination from a supply source of the lead frame is used. A lead frame transport apparatus and a lead frame transport method that can be held and transported to a position can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional explanatory view showing an embodiment of a lead frame transport device according to the present invention and holding a lead frame. It is a plane view explanatory drawing which shows the outline of the frame of the lead frame conveying apparatus which concerns on this invention, and its incidental apparatus. FIG. 6 is an explanatory cross-sectional view illustrating a state in which the lead frame transport device is positioned above a lead frame aligned with an alignment table that is a lead frame supply source. FIG. 5 is a cross-sectional explanatory view showing a state in which the lead frame transport device is lowered and meshed with the alignment table. FIG. 10 is a cross-sectional explanatory view showing a state in which the chuck claws are closed in a state where the lead frame conveying device and the alignment table are engaged with each other. It is a cross-sectional explanatory view showing a state in which the lead frame transport device holding the lead frame is raised from the alignment table. FIG. 6 is an explanatory cross-sectional view showing a state in which a lead frame carrying device holding a lead frame is moved upward of a lower mold as a supply destination. FIG. 6 is a cross-sectional explanatory view showing a state in which the lead frame transport device is lowered and meshed with the lower mold, and the guide pins of the lower mold push up the positioning pins of the lead frame transport device. FIG. 10 is a cross-sectional explanatory view showing a state where the clamper is lowered and the lead frame is set at a predetermined position of the lower mold after the chuck claw is opened in a state where the lead frame transport device and the lower mold are engaged with each other. FIG. 9 is an explanatory cross-sectional view showing a state in which the lead frame transport device is lifted from the lower mold after the lead frame is set in the lower mold. It is sectional explanatory drawing which shows the structure of the conventional lead frame holding | maintenance apparatus.

The embodiment of the present invention will be described in more detail with reference to FIGS.
1 and 3 to 10 show the lead frame transport device A, but for the sake of convenience of illustration, the resin accommodating portion 14 in the center and the holding portion on the right side in each figure are shown. The holding part is omitted. Further, in FIGS. 1, 3 to 10, illustration of guide shafts 15 a and 16 a described later is also omitted.

  The lead frame transport device A constitutes, for example, a resin sealing device (not shown) for manufacturing a resin mold electronic component package, and is also referred to as an inloader. The lead frame transport device A holds the lead frame before molding cut out one by one from the magazine placed in the material supply unit of the resin sealing device and placed on the alignment table 5, and performs resin sealing in the next process. It is conveyed to the lower mold 6.

  The lead frame transport device A has a transition drive unit (not shown), and can shift between the material supply unit and the mold 6 as described above. The lead frame conveying device A has a rectangular frame 1 that is slightly long in the vertical direction in FIG. The frame 1 is formed by being framed by frame members 10 and 11 on the short side and frame members 12 and 13 on the long side.

  The frame body 1 is provided in the middle of the short direction (left and right direction in FIG. 2) with a resin housing portion 14 for housing a resin tablet (not shown) in parallel with the longitudinal direction so as to span the frame members 10 and 11. It has been. As a result, spaces (reference numerals omitted) are formed on the left and right sides of the resin accommodating portion 14 for accommodating the device for holding the lead frame.

  In addition, the frame body 1 includes guide shafts 15 and 16, and guides that are bridged between the two members near the both ends of the frame members 12 and 13 and the resin housing portion 14 in the longitudinal direction. Shafts 15a and 16a are provided. The guide shafts 15 and 16 and the guide shafts 15a and 16a are provided in parallel with the frame members 10 and 11 in the short direction.

  In FIG. 2, drive arms 49 and 49a, which will be described later, are fitted between the left guide shafts 15 and 16 so as to be parallel to each other. The drive arms 49 and 49a are movable along the guide shafts 15 and 16 via a drive cylinder (not shown).

  In addition, drive arms 49 and 49a are bridged and fitted between the right guide shafts 15a and 16a in FIG. 2 so as to be parallel to each other. The drive arms 49 and 49a are movable along the guide shafts 15a and 16a via a drive cylinder (not shown).

A set block 130 is provided on the outside in the middle of the frame member 13 in the longitudinal direction of the frame 1. A fitting portion 131 (see FIG. 1) protruding downward is provided at the outer end portion of the set block 130. When holding the lead frame, the set block 130 engages the fitting portion 131 with the fitting receiving portion 50 of the alignment table 5 (see FIGS. 3 to 6) of the material supply portion, and a stop portion described later. Positioning with respect to the alignment table 5 is performed.

  Please refer to FIG. In FIG. 1, as described above, the resin accommodating portion 14 at the center of the frame and the holding portion (reference numeral omitted) on the right side in each drawing are shown, and the left holding portion is omitted. In addition to FIG. 1, the guide shaft 16 a is not shown in FIGS. 3 to 10. The left holding part has the same configuration as the right holding part described below.

  Two or more pairs of pin holding blocks 3 and 3a are provided on the opposite sides of the resin accommodating portion 14 in the short side direction of the frame body 1 and the frame member 13 at a required interval in the depth direction in FIG. Provided (only one set is shown in FIG. 1). The pin holding blocks 3, 3a are bilaterally symmetric and have substantially the same shape.

  The pin holding block 3 has a prismatic lower block 30 fixed to the resin accommodating portion 14, and the pin holding block 3 a has a prismatic lower block 30 a fixed to the frame member 13. In the center of the lower blocks 30 and 30a, guide holes 31 and 31a are provided in the vertical direction.

  Moreover, the upper blocks 32 and 32a are connected on the lower blocks 30 and 30a. The upper blocks 32 and 32a are provided with spring housing holes 33 and 33a having slightly larger diameters connected to the guide holes 31 and 31a, respectively. The spring accommodating holes 33 and 33a are provided with through holes 34 and 34a, respectively, that allow the springs to pass upward.

  A positioning pin 35 is fitted in the guide hole 31, the spring accommodating hole 33, and the through hole 34 of the pin holding block 3 so as to be slidable in the vertical direction. The position of the axis of the positioning pin 35 is set so as to overlap with the axis of the guide pin 60 of the lower mold 6 when the transport device moves above the lower mold 6. (See FIGS. 7 and 8). In addition, a drop prevention pin 36 is fitted in the guide hole 31a, the spring accommodating hole 33a, and the through hole 34a of the pin holding block 3a so as to be slidable in the vertical direction.

  The positioning pin 35 has a shaft 350 that is slidably received in the guide hole 31. A lower end portion of the shaft 350 is narrowed, and a tip 351 having the same diameter and a required length is provided at the tip thereof, and a pin 351 that constitutes a stop portion is provided together with a pin 361 described later. Note that the tip of the pin 351 is formed to be slightly sharpened and further the tip surface to be flat (see the enlarged left side of FIG. 1). The pin 351 is formed to have substantially the same diameter as a positioning hole 70 (see an enlarged view on the left side in FIG. 1) that is an engagement hole of the lead frame 7 described later.

  Similarly, the lower end portion of the shaft 360 of the drop prevention pin 36 is also narrowed, and a pin 361 constituting a stop portion having the same diameter and the required length is provided at the tip. The pin 361 is slightly smaller in diameter than the pin 351. As a result, when the positioning hole 70 of the lead frame 7 is engaged with the positioning pin 35 and the position of the lead frame 7 with respect to the positioning pin 35 is determined, before the lead frame transport device A is lifted from the alignment table 5 (lead) In a state where the frame does not bend due to its own weight, when the pin 361 of the prevention pin 36 passes through the engagement hole 71 of the lead frame 7, it does not come into contact with the hole edge of the engagement hole 71 (FIG. 4). (See the enlarged view on the right side).

  1, FIG. 3 to FIG. 10, the stop portion represents a pair of a positioning pin 35 and a removal prevention pin 36 that are arranged to face each other at a required interval. However, the present invention is not limited to this. Absent. As in the present embodiment, when the lead frame 7 has a rectangular shape that is long in one direction and the longitudinal direction is the depth direction in each drawing, a plurality of pairs (plural sets) are arranged in the depth direction. The lead frame 7 may be stopped.

  In this case, even in the depth direction in each figure (horizontal and perpendicular to each figure), the lead frame is stopped by the positioning pins and the removal prevention pins, and it is conceivable that the bending also occurs in the depth direction. However, if deflection occurs in one direction of the lead frame due to the difference between the vertical and horizontal spans between the pins, the rigidity in the horizontal and perpendicular directions becomes extremely high. Will not bend. Therefore, the lead frame is held substantially in the direction shown in the drawings (assuming that the lead frame is first bent in this direction).

  For example, if the lead frame is square and is held by four pins, and the vertical and horizontal spans between the pins are the same, when the lead frame is held, the center portion is bent deeply. Can be considered. In this case, it can be assumed that the pins at the diagonal positions have the same effect as the pins at the opposing positions in each figure, and the lead frame is stopped.

  A spring hook shaft 352 having a smaller diameter than the shaft 350 and capable of being inserted into the through hole 34 is coaxially provided on the upper portion of the shaft 350 of the positioning pin 35. A spring receiver 353 having a diameter larger than that of the shaft 350 and smaller than that of the spring accommodating hole 33 is provided at the boundary between the shaft 350 and the spring hooking shaft 352, and between the spring receiver 353 and the top of the spring accommodating hole 33, A compression coil spring 354 is hung.

  According to this structure, when an upward force is applied to the positioning pin 35, the positioning pin 35 rises through the through-hole 34 through the spring-loaded shaft 352 while resisting the biasing force of the compression coil spring 354. Can do. Similarly to the positioning pin 35, the drop prevention pin 36 is provided with a spring hook shaft 362 and a spring receiver 363, and a compression coil spring 364 is hung between the spring receiver 363 and the top of the spring accommodating hole 33a. ing. Note that this structure of the drop prevention pin 36 is mainly intended to prevent breakage due to a buffering action.

  Further, chuck claws 4, 4a as holding portions are provided at four positions on the outer surfaces of the drive arms 49, 49a (surfaces opposite to the surfaces facing each other) at predetermined intervals. It has been. Note that the number of chuck claws 4, 4a provided in each drive arm 49, 49a is not limited to this, and can be set as appropriate. The chuck claw 4 on the drive arm 49 side is arranged outside the pin 351 of the positioning pin 35 (left side in FIG. 1), and the chuck claw 4a on the drive arm 49a side is outside the pin 361 of the removal prevention pin 36 ( It is arranged on the right side in FIG. The chuck claws 4, 4a provided on the drive arms 49, 49a can be moved back and forth in the inner and outer directions and in opposite directions by a drive cylinder (not shown).

  The chuck claws 4, 4 a have receiving portions 40, 40 a that are provided in a symmetrical manner so that the lower end portion has a “U” shape and the open side faces inward. The chuck claws 4 and 4a are provided at positions shifted in the depth direction in the respective drawings so that the chuck claws 4 and 4a do not come into contact with the pins 351 and 361 when moved inward. Note that the chuck claws 4, 4 a appearing in FIG. 1 are on the back side of the pins 351, 361.

  Further, the chuck claws 4 and 4a may have a structure in which the receiving portions 40 and 40a come into contact with the pins 351 and 361 when moved inward. In this case, if the chuck claws 4 and 4a are moved outward, a gap of a required width can be provided between the pins 351 and 361 and the tips of the receiving portions 40 and 40a, and the lead frame can be passed through. become.

  Further, a frame clamper 2 is provided below the pin holding blocks 3 and 3a so as to move in the vertical direction separately from the chuck claws 4 and 4a. The frame clamper 2 has clamp portions 20 protruding downward at both ends. The frame clamper 2 is fitted to a guide shaft (not shown) attached to the frame body 1 so as to be movable up and down.

  In the state where no external force is applied, the frame clamper 2 is moved to the lowest position (position where the tips of the clamp portions 20 are almost the same height as the tips of the pins 351 and 361 as shown in FIG. 3). falling. Further, the frame clamper 2 can be raised to a height located slightly above the receiving portions 40, 40a of the chuck claws 4, 4a when the tip of the clamp portion 20 moves inward (for convenience, (Refer to the left and right enlarged view of FIG. 1). Each clamp portion 20 can hold the tip end in contact with the main surface of the lead frame 7 when the lead frame 7 is transferred to the lower mold 6.

(Function)
The operation of the lead frame transport apparatus A and the lead frame transport method using the lead frame transport apparatus A will be described mainly with reference to FIGS.
Hereinafter, a lower mold that cuts out and holds lead frames before molding in a magazine placed in a material supply unit of a resin sealing device that manufactures resin molded electronic component packages one by one and performs resin sealing in the next process An example of transporting to 6 will be described.

  The lead frame transport device A can be any of the above resin sealing devices as long as the lead frame or similar lead frame-like material having similar characteristics such as flexibility is transported to the next process. It can be diverted as an accessory device of other devices than the above, or can be diverted to other fields.

(A-1)
The lead frame conveying device A is positioned above the lead frame 7 aligned with the alignment table 5 that is a supply source of the lead frame 7 before molding. At this time, the chuck claws 4, 4a are moved outward by the drive arms 49, 49a, respectively, and are in an open state (see FIG. 3).

(A-2)
The lead frame transport device A is lowered and meshed with the alignment table 5 (see FIG. 4). Specifically, the tip of each clamp portion 20 of the frame clamper 2 that has initially fallen to the lowest position contacts the lead frame 7, and the fitting portion 131 of the set block 130 fits into the fitting receiving portion 50 of the alignment table 5. The position of the lead frame transfer device A is determined.

  When the lead frame transport device A is further lowered, the pin 351 of the positioning pin 35 passes through the positioning hole 70 of the lead frame 7, and at the same time, the pin 361 of the removal preventing pin 36 passes through the engagement hole 71 (see FIG. 4). . At this time, the pin 351 whose tip portion of the positioning pin 35 is slightly sharp has the same diameter portion as the diameter of the positioning hole 70, but can be smoothly inserted. Further, the frame clamper 2 slightly rises relative to the chuck claws 4 and 4a because each clamp portion 20 is pushed from below.

  Since the position of the lead frame 7 with respect to the positioning pin 35 is substantially determined by inserting the pin 351 into the positioning hole 70, the pin 361 can be inserted without contacting the hole edge of the engagement hole 71. Therefore, the pin 361 can be reliably inserted into the engagement hole 71 without being caught by the pin 361. Accordingly, the lead frame 7 can be smoothly held by the cooperation of the pins 351 and 361 and the chuck claws 4 and 4a described below.

(A-3)
With the lead frame transport device A and the alignment table 5 engaged with each other as shown in (A-2) above, the drive arms 49 and 49a are moved in directions toward each other to close the chuck claws 4 and 4a (see FIG. 5). As a result, the receiving portions 40 and 40a of the chuck claws 4 and 4a move so that the respective inward end portions thereof do not contact the pin 351 of the positioning pin 35 and the pin 361 of the removal preventing pin 36.

  At this time, the receiving portions 40 and 40a scoop up the left and right end edges of the lead frame 7 fixed by the pins 351 and 361 by slopes (reference numerals omitted) provided at the top corners of the upper surface. Since it moves inward so as to be able to move, it smoothly enters the lower side of both side edge portions of the lead frame 7 and the lower side of the tip of each plump portion 20 located at the height of the lead frame 7. be able to.

  As described above, the chuck claws 4 and 4a are received by the receiving portions 40 and 40a from the side that does not interfere with the lead frame 7 held inside the pins 351 and 361, that is, from the outside that does not interfere (both ends of the lead frame). The lead frame can be moved to a position where it can be held.

  Accordingly, the receiving portions 40, 40 a support the lead frame 7, which is fixed by inserting the positioning holes 70 and the engagement holes 71 into the pins 351, 361 from below, and from the pins 351, 361. It can be prevented from falling out (reference: enlarged view on the left and right sides in FIG. 1).

(A-4)
The lead frame transport device A is lifted from the alignment table 5 together with the lead frame 7. In this way, the lead frame 7 is bridged between the pin 351 of the positioning pin 35 and the pin 361 of the drop prevention pin 36. The lead frame 7 is bent in the direction of gravity by its own weight and deformed into a substantially arc shape (see FIG. 6). The frame clamper 2 is supported from below by convex portions (not shown) of the chuck claws 4 and 4a and does not fall downward.

  At this time, the hole edge portions of the holes 70 and 71 on the pins 351 and 361 of the lead frame 7 pull the pins 351 and 361 inward and slightly obliquely downward. When a tensile force is generated in each pin 351, 361, a drag force in the direction opposite to the tensile force, that is, a reaction force is generated in each pin 351, 361. Thereby, the lead frame 7 is stopped in a state where it is bent in the direction of gravity and supported by the pins 351 and 361 from both sides with its reaction force. Further, since the position of the lead frame 7 with respect to the positioning pin 35 can be set to a normal design position, the lead frame 7 can be held in a balanced and stable state.

  Furthermore, the lead frame 7 is supported from below by the receiving portions 40 and 40a of the chuck claws 4 and 4a as described above, and the reaction force that supports the lead frame 7 by the pins 351 and 361 is sufficient. Even if not, since it is held by the receiving portions 40 and 40a that cooperate with the pins 351 and 361 of the stopper, it is possible to prevent the lead frame 7 from falling off or partly coming off (FIG. 6, (See left and right enlarged view in FIG. 1).

  In this way, for example, even if the lead frame 7 is large or thin and has a large amount of bending during conveyance, the positioning pins 35 and the pins 351 and 361 of the slip-off prevention pin 36 that cooperate with each other. Since it can be held by the receiving portions 40, 40a of the chuck claws 4, 4a, the lead frame transport device A drops the lead frame 7 from the supply source to a predetermined position of the lower mold 6 that is the supply destination. And can be reliably conveyed.

(A-5)
As described above (A-4), the lead frame transport apparatus A holding the lead frame 7 moves above the lower mold 6 as the supply destination and stops at a required position (see FIG. 7). In this stop position, the axis of the positioning pin 35 provided in the lead frame conveying apparatus A overlaps with the axis of the guide pin 60 of the lower mold 6 on the same straight line.

(A-6)
The lead frame transfer device A is lowered and meshes with the lower mold 6. Thereby, the front end surface of the pin 351 of the positioning pin 35 and the front end portion of the guide pin 60 come into contact with each other, and the pin 351 of the positioning pin 35 and the guide pin 60 are apparently connected. When the lead frame transport device A is further lowered, the lead frame 7 has the lower surface side of the center portion touching the lower mold 6, the flexure is reduced, and the hook on the guide pin 60 is loosened. And descend along 60. Further, the positioning pin 35 is pushed up against the urging force of the compression coil spring 354 by the guide pin 60. As a result, the guide pin 60 enters the positioning hole 70 of the lead frame 7 from below, and the lead frame 7 moves to the guide pin 60 side (see FIG. 8).

(A-7)
The chuck claws 4 and 4a are opened in a state where the lead frame transport device A and the lower mold 6 are engaged as in (A-6) above. The lead frame 7 that is no longer supported by the receiving portions 40 and 40a and the frame clamper 2 that is no longer supported by the chuck claws 4 and 4a are lowered, and the clamp portion 20 abuts against the edge of the lead frame 7 to push down the lead frame 7 The frame 7 is set at a predetermined position of the lower mold 6 (see FIG. 9). Further, the clamp portion 20 at this time has an effect of reliably setting the lead frame 7 as described above and an effect of suppressing or preventing deformation of the lead frame 7 due to residual heat of the lower mold 6.

(A-8)
In this way, after the lead frame 7 is set at a predetermined position of the lower mold 6 by the lead frame conveying apparatus A, the lower mold 6 is lowered and separated from the lead frame conveying apparatus A (see FIG. 10). Then, the lead frame transport device A moves in the direction of the alignment table 5 that is a supply source, and repeats the above movement. On the lower mold 6, a resin sealing operation for the lead frame 7 is performed as a next process, and a resin molded electronic component package (not shown) is manufactured.

  The terms and expressions used in the present specification and claims are for illustrative purposes only, and are not intended to be limiting in any way. The features described in the present specification and claims and their terms There is no intention of excluding some equivalent terms and expressions. It goes without saying that various modifications are possible within the scope of the technical idea of the present invention.

A Lead frame transport device 1 Frame body 10, 11 Short frame member 12, 13 Long frame member 130 Set block 131 Fitting portion 14 Resin housing portion 15, 16 Guide shaft 15a, 16a Guide shaft 2 Frame clamper 20 Clamp part 3, 3a Pin holding block 30, 30a Lower block 31, 31a Guide hole 32, 32a Upper block 33, 33a Spring receiving hole 34, 34a Exit hole 35 Positioning pin 350 Shaft 351 Pin 352 Spring hook shaft 353 Spring receiver 354 Compression Coil spring 36 Pin prevention pin 360 Shaft 361 Pin 362 Spring hook shaft 363 Spring receiver 364 Compression coil spring 4, 4a Chuck claw 40, 40a Receiving portion 49, 49a Drive arm 5 Alignment table 50 Fitting receiving portion 6 Lower Mold 60 guide member 7 lead frame 70 positioning hole 71 engaging hole

Claims (10)

It has a pair of members arranged opposite to each other at a required interval, and the reaction force is applied by applying an inward pulling force due to the bending caused by the weight of the lead frame spanned between the pair of members. With a stop to stop the lead frame,
A lead frame transport device comprising: a holding portion that is disposed outside each member of the stop portion and can hold the lead frame in cooperation with the stop portion. The stop portion includes a positioning pin that determines the position of the lead frame in a required position in cooperation with the engagement hole on one side of the lead frame, and a slip prevention pin that passes through the engagement hole on the other side of the lead frame. The lead frame carrying device according to claim 1. The anti-disengagement pin is formed so as to be able to be inserted in a non-contact manner into an engagement hole on the other side of the lead frame positioned by engaging the engagement hole on one side of the lead frame and the positioning pin. The lead frame carrying device according to claim 2. The lead frame transport device according to claim 2 or 3, wherein a tip of the positioning pin can contact a tip of a guide member provided on a mold of a resin sealing device, which serves as a transport receiving portion of the lead frame. . The lead frame transport device according to claim 4, further comprising a clamper that contacts the main surface of the lead frame when the lead frame is delivered to the mold. A tensile force is applied to a pair of members arranged opposite to each other at a required interval due to the deflection of the lead frame spanned between the members, and the pair of members lead to the reaction force. A method for transporting a lead frame, comprising the step of transporting the frame after stopping. A step of setting the position of the lead frame with respect to a stopper for stopping the lead frame between a pair of members to a predetermined position;
A step of holding the lead frame by the holding portion and a holding portion which is arranged outside the respective members of the stopping portion and holds the lead frame in cooperation with the stopping portion;
The step of raising the stopper and the holding part, and stopping the lead frame with the reaction force by applying a tensile force to the stopper part by bending due to the weight of the held lead frame,
And a step of conveying the lead frame to a mold of the resin sealing device and arranging the lead frame at a predetermined position of the mold. The lead frame is passed through an engaging hole on one side of the lead frame that engages with an engaging hole on one side of the lead frame that constitutes the stopper, and a positioning pin that determines the position of the lead frame to a required position. The lead frame transport method according to claim 7, wherein the lead frame is stopped by a removal prevention pin. When placing the lead frame on the mold, the tip of the positioning pin that holds the lead frame is brought into contact with the tip of a guide member provided on the mold, and the lead frame is moved from the positioning pin to the guide member. The lead frame transport method according to claim 8. The lead frame transport method according to claim 7, wherein the clamper is brought into contact with the main surface of the lead frame when the lead frame is delivered to the mold.

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