JP2018018890A - Electronic device and method of manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which suppresses a substrate from warping, and a method of manufacturing the electronic device.SOLUTION: There is prepared a substrate 10 which has a through hole 12 formed penetrating from a top surface 10a to a reverse surface 10b, and also has electronic components 30 mounted on the top surface 10a and reverse surface 10b. Then the substrate 10 and a metal mold are so fixed that the reverse surface 10b faces an upper cavity and the top surface 10a faces a lower cavity. Then a constituting material of mold resin arranged in the lower cavity is made to flow from the through hole 12 to the upper cavity. The mold resin is thus molded on the top surface 10a and reverse surface 10b. When the substrate 10 is prepared, the substrate 10 is used in which an opening end 12a of the through hole 12 on the side of the top surface 10a is located in the center OA of a top-side sealing region 10c.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device including a substrate in which a through hole is formed, a plurality of electronic components mounted on the front and back surfaces of the substrate, and a mold resin for sealing the electronic component, and a method for manufacturing the electronic device About.

  Conventionally, as described in Patent Literature 1, an electronic device including a substrate, a plurality of electronic components mounted on one surface and the other surface of the substrate, and a resin that seals the electronic components, and manufacture of the electronic device The method is known. A through-hole penetrating from one surface to the other surface is formed in the substrate.

  As a method for manufacturing an electronic device, a frame portion and an upper mold that form a cavity on the other surface side of the substrate, and the substrate are fixed to each other. Then, the resin material is disposed in the cavity formed by the clamp mold and the lower mold, and the cavity is disposed on the one surface side with respect to the substrate by bringing the end of the clamp mold into contact with the one surface.

  Next, the lower mold is moved toward the upper mold. Due to the movement of the lower mold, a part of the resin material moves to the cavity on the other surface side through the through hole. By the above, resin can be shape | molded on both surfaces of a board | substrate by one process.

Japanese Patent Laying-Open No. 2015-76484

  However, in the above method, when the resin material is moved to the cavity on the other surface side, stress acts in a direction from one surface to the other surface from the resin material to the substrate. This stress may cause the substrate to warp. When the substrate is warped, stress acts on the connection portion between the substrate and the electronic component, and the connection reliability is lowered.

  The present invention has been made in view of such problems, and an object thereof is to provide an electronic device that suppresses warping of a substrate and a method for manufacturing the electronic device.

  The present invention employs the following technical means to achieve the above object. In addition, the code | symbol in parenthesis shows the correspondence with the specific means in the following embodiment as one aspect | mode, and does not limit a technical range.

One aspect of the present invention is
A method for manufacturing an electronic device, comprising: a substrate (10); a plurality of electronic components (30) mounted on a front surface (10a) and a back surface (10b) of the substrate; and a mold resin (40) for sealing the electronic components. Because
Preparing a substrate in which through holes (12) penetrating from the front surface to the back surface are formed, and electronic components are mounted on the front surface and the back surface;
A 1st metal mold | die and a board | substrate are mutually contacted so that the cavity (220,222) of a 1st metal mold | die (202) may oppose the back side sealing area | region (10e) in which the mold resin of the back surface is formed. And fix the second mold and the substrate so that the cavity of the second mold (204, 206) faces the front side sealing region (10c) on the surface where the mold resin is formed. Fixed in contact with each other; and
It is configured in the cavities of both the first mold and the second mold by flowing the constituent material (40a) of the mold resin disposed in the cavity of the second mold from the through hole to the cavity of the first mold. Arranging the material and forming the mold resin,
In preparing the substrate, a substrate is used in which the open ends (12a, 12b) on the surface side of the through hole are located at the center (OA) of the front side sealing region.

  When the constituent material of the mold resin is moved to the back surface side, stress acts on the substrate from the constituent material in the direction from the front surface to the back surface. At this time, in the front side sealing region, the stress from the constituent material increases as the distance from the outer peripheral end of the front side sealing region increases. Therefore, in the front side sealing region, the vicinity of the center tends to warp. Further, around the through hole in the substrate, the stress from the constituent material is relieved by the through hole.

  On the other hand, in the above method, in preparing the substrate, a substrate having a through hole opened at the center of the front side sealing region is used. According to this, when flowing the constituent material to the back side, the stress acting near the center can be relaxed by the through hole. Therefore, the substrate can be prevented from warping.

One of the other inventions invented is
A method for manufacturing an electronic device, comprising: a substrate (10); a plurality of electronic components (30) mounted on a front surface (10a) and a back surface (10b) of the substrate; and a mold resin (40) for sealing the electronic components. Because
Preparing a substrate in which a plurality of through holes (12) penetrating from the front surface to the back surface are formed, and electronic components are mounted on the front surface and the back surface;
A 1st metal mold | die and a board | substrate are mutually contacted so that the cavity (220,222) of a 1st metal mold | die (202) may oppose the back side sealing area | region (10e) in which the mold resin of the back surface is formed. And fix the second mold and the substrate so that the cavity of the second mold (204, 206) faces the front side sealing region (10c) on the surface where the mold resin is formed. Fixed in contact with each other; and
It is configured in the cavities of both the first mold and the second mold by flowing the constituent material (40a) of the mold resin disposed in the cavity of the second mold from the through hole to the cavity of the first mold. Arranging the material and forming the mold resin,
In preparing the substrate, a substrate is used in which the open ends (12a, 12b) on the surface side of the plurality of through holes are located on both sides in one direction along the surface with respect to the center (OA) of the front side sealing region.

  When flowing the constituent material to the back side, in the front side sealing region, the stress from the constituent material increases as the distance from the center is shorter, and warpage is likely to occur. Further, in the front side sealing region, the stress from the constituent material is reduced and the warpage is less likely to occur as the distance from the opening end of the through hole is shorter. According to the above, when the through hole opens only in one area in one direction with respect to the center, the through hole does not open in the other area in one direction with respect to the center, and the opening end of the through hole The separation distance from is increased. For this reason, warpage is likely to occur in the region on the other side in one direction with respect to the center.

  On the other hand, in the above method, when preparing a substrate, a substrate in which the open ends of the plurality of through holes are located on both sides in one direction with respect to the center is used. According to this, it can suppress that the separation distance with the opening end of a through-hole becomes long in the area | region of the both sides in one direction with respect to the center. Therefore, the substrate can be prevented from warping when the constituent material is flowed to the back surface side.

One of the other inventions invented is
A substrate (10) having a through hole (12) penetrating from the front surface (10a) to the back surface (10b);
A plurality of electronic components (30) mounted on the front and back surfaces;
A front side sealing portion (42) for sealing the electronic component mounted on the front surface together with the front surface, a back side sealing portion (44) for sealing the electronic component mounted on the rear surface together with the rear surface, and disposed in the through hole. A mold resin (40) having an intermediate part (46) for connecting the front side sealing part and the back side sealing part,
The open ends (12a, 12b) on the surface side of the through hole are formed at the center (OA) of the front side sealing region (10c) on the surface where the mold resin is formed.

  In the above configuration, the through hole is opened in the center where warpage is most likely to occur in the front side sealing region. Therefore, it is possible to suppress the substrate from warping.

One of the other inventions invented is
A substrate (10) on which a plurality of through holes (12) penetrating from the front surface (10a) to the back surface (10b) are formed;
A plurality of electronic components (30) mounted on the front and back surfaces;
A front side sealing portion (42) for sealing the electronic component mounted on the front surface together with the front surface, a back side sealing portion (44) for sealing the electronic component mounted on the rear surface together with the rear surface, and disposed in the through hole. A mold resin (40) having an intermediate part (46) for connecting the front side sealing part and the back side sealing part,
Open ends (12a, 12b) on the surface side of the plurality of through holes are on both sides in one direction along the surface with respect to the center (OA) of the front side sealing region (10c) on which the mold resin is formed. Is formed.

  In the above configuration, it is possible to suppress an increase in the separation distance from the opening end of the through hole in the regions on both sides in one direction with respect to the center. Therefore, the substrate can be prevented from warping.

1 is a plan view illustrating a schematic configuration of a substrate in an electronic device according to a first embodiment. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing for demonstrating an arrangement | positioning process. It is sectional drawing for demonstrating an arrangement | positioning process. It is sectional drawing for demonstrating an arrangement | positioning process. It is sectional drawing for demonstrating an arrangement | positioning process. It is sectional drawing for demonstrating a raise process. It is sectional drawing for demonstrating a raise process. It is a figure which shows the measurement result which measured the deformation amount by shaping | molding of mold resin with respect to the board | substrate from which the aperture ratio of a through-hole differs. It is a top view which shows the shape of the board | substrate used for the measurement of FIG. In the electronic device concerning a 2nd embodiment, it is a top view showing a schematic structure of a substrate. It is sectional drawing which follows the XII-XII line | wire of FIG. It is sectional drawing which shows arrangement | positioning of the shape of a metal mold | die, and the structural material of the mold resin after implementation of a raise process. In the electronic device concerning a 3rd embodiment, it is a top view showing a schematic structure of a substrate. In the electronic device concerning a 4th embodiment, it is a top view showing a schematic structure of a substrate. In the electronic device which concerns on 5th Embodiment, it is a top view which shows schematic structure of a board | substrate. In an electronic device concerning a 6th embodiment, it is a top view showing a schematic structure of a substrate. In an electronic device concerning a 7th embodiment, it is a top view showing a schematic structure of a substrate. It is a top view which shows schematic structure of the electronic device which concerns on 8th Embodiment. It is a top view for demonstrating a preparatory process in the manufacturing method of the electronic device which concerns on 9th Embodiment. It is sectional drawing which follows the XXI-XXI line | wire of FIG. 20, Comprising: The arrangement | positioning of the structural material of the mold resin after a raise process implementation is shown. It is sectional drawing which shows the shape of mold resin after a mold release process implementation. It is a top view for demonstrating a preparatory process in the manufacturing method of the electronic device which concerns on 10th Embodiment. It is sectional drawing which follows the XXIV-XXIV line | wire of FIG. 23, Comprising: The arrangement | positioning of the structural material of the mold resin after a raise process implementation is shown. It is sectional drawing which shows the shape of mold resin after a mold release process implementation.

  This will be described with reference to the drawings. In a plurality of embodiments, common or related elements are given the same reference numerals. Further, the thickness direction of the substrate is indicated as the Z direction, the specific direction orthogonal to the Z direction is indicated as the X direction, and the direction orthogonal to the Z direction and the X direction is indicated as the Y direction.

(First embodiment)
First, based on FIG.1 and FIG.2, schematic structure of the electronic device 100 is demonstrated.

  The electronic device 100 includes a substrate 10, an electronic component 30 mounted on the substrate 10, and a mold resin 40 that seals the electronic component 30. Further, the electronic device 100 may include a housing that accommodates the substrate 10, the electronic component 30, and the mold resin 40.

  In the present embodiment, as an example, an example in which the electronic device 100 is applied to an in-vehicle electronic device mounted in an engine room of a vehicle is employed. Furthermore, the electronic device 100 can be applied to an inverter device as an example of an in-vehicle electronic device. However, the electronic device 100 can also be applied to a device different from the in-vehicle electronic device.

  As shown in FIG. 1, the board | substrate 10 has comprised the rectangular parallelepiped shape, for example. FIG. 1 shows the substrate 10 in a state where the electronic component 30 is not mounted and the mold resin 40 is not formed. The planar shape of the substrate 10 along the XY plane has a rectangular shape with long sides along the X direction and short sides along the Y direction. As shown in FIG. 2, the substrate 10 has a front surface 10 a and a back surface 10 b opposite to the front surface 10 a in the Z direction. The front surface 10a and the back surface 10b are planes orthogonal to the Z direction.

  The board 10 is a printed board having a resin base material, lands, and wiring. The resin base material is formed using an insulating resin material. The resin base material is formed using, for example, an epoxy resin. The land is an electrode of the substrate 10 provided for mounting the electronic component 30. The lands are formed on both the front surface 10a and the back surface 10b. In FIG. 1, the land is omitted. The wiring is formed inside the resin base material, on the front surface 10a and the back surface 10b, and connected to the land.

  As the substrate 10, for example, a so-called buildup substrate including a core layer and a buildup layer laminated on the core layer can be employed. Further, as the substrate 10, a so-called any layer substrate in which a core layer is not provided and a plurality of buildup layers are stacked can be employed.

  The surface 10a has a front side sealing region 10c and a front side non-sealing region 10d. The front side sealing region 10c is a region of the surface 10a where the mold resin 40 is formed. That is, the front side sealing region 10c is a region in contact with the mold resin 40 in the surface 10a. The front side non-sealing region 10d is a region of the surface 10a where the mold resin 40 is not formed. That is, the front side non-sealing region 10d is a region that does not contact the mold resin 40 in the surface 10a. In FIG. 1, the boundary between the front side sealing region 10c and the front side non-sealing region 10d is indicated by a two-dot chain line.

  The front-side sealing region 10c has a rectangular shape with long sides along the X direction and short sides along the Y direction. In this embodiment, the center OA of the front side sealing region 10c coincides with the center of the surface 10a. The center OA is a portion having the longest separation distance from the outer peripheral end of the front side sealing region 10c in the front side sealing region 10c. In the present embodiment in which the front side sealing region 10c has a rectangular shape, the intersection of the diagonal lines of the front side sealing region 10c coincides with the center OA. In FIG. 1, the diagonal line of the front side sealing area | region 10c is shown with the broken line.

  The front side non-sealing region 10d has an annular shape surrounding the front side sealing region 10c in the XY plane. The inner peripheral end of the front side non-sealing region 10d coincides with the boundary between the front side sealing region 10c and the front side non-sealing region 10d. The outer peripheral end of the front side non-sealing region 10d coincides with the outer peripheral end of the surface 10a. On the surface 10a, lands are formed only in the front side sealing region 10c, and no lands are formed in the front side non-sealing region 10d.

  The back surface 10b has the back side sealing area | region 10e and the back side non-sealing area | region 10f similarly to the surface 10a. The back side sealing region 10e is a region where the mold resin 40 is formed in the back surface 10b. The back side non-sealing region 10f is a region of the back surface 10b where the mold resin 40 is not formed.

  In a projection view in the Z direction, the boundary between the back-side sealing region 10e and the back-side non-sealing region 10f on the back surface 10b substantially coincides with the boundary between the front-side sealing region 10c and the front-side non-sealing region 10d on the surface 10a. ing. Therefore, the shape of the back side sealing region 10e is a rectangular shape that substantially matches the shape of the front side sealing region 10c. In addition, the shape of the back side non-sealing region 10f has an annular shape that substantially matches the shape of the front side non-sealing region 10d.

  A through hole 12 is formed in the substrate 10 so as to penetrate from the front surface 10a to the back surface 10b. The through hole 12 allows the constituent material 40a of the mold resin 40 to flow from the lower cavity 222 described below to the upper cavity 220 when the mold resin 40 is molded.

  The through hole 12 is formed from the front side sealing region 10c to the back side sealing region 10e. Therefore, the opening end 12a on the surface 10a side of the through hole 12 is formed only in the front side sealing region 10c and is not formed in the front side non-sealing region 10d. The open end 12a is formed at a position that does not overlap with the electronic component 30 mounted on the surface 10a in the projection view in the Z direction. The opening end 12b on the back surface 10b side of the through hole 12 is formed only in the back side sealing region 10e and is not formed in the back side non-sealing region 10f. The open end 12b is formed at a position that does not overlap the electronic component 30 mounted on the back surface 10b in the Z-direction projection view.

  In the present embodiment, the through hole 12 extends in the Z direction. That is, the inner wall surface of the through hole 12 is a surface along the Z direction. In the present embodiment, the planar shape of the through hole 12 along the XY plane is a perfect circle. That is, the planar shape of the opening end 12a along the XY plane and the planar shape of the opening end 12b are perfectly circular.

  A plurality of through holes 12 are formed in the substrate 10. In the present embodiment, nine through holes 12 are formed in the substrate 10. The planar shapes of the through holes 12 along the XY plane are the same as each other.

  One through hole 12 opens at the center OA of the front side sealing region 10c. In other words, the opening end 12a of one through hole 12 is located at the center OA. In other words, the opening end 12a overlaps the center OA in the front side sealing region 10c.

  The through hole 12 that opens to the center OA of the front side sealing region 10c opens to the center OB of the back side sealing region 10e on the back surface 10b. In other words, the opening end 12b of the through hole 12 is located at the center OB of the back side sealing region 10e. In other words, the open end 12b overlaps the center OB in the back side sealing region 10e.

  The eight through holes 12 other than the through hole 12 opening in the center OA of the front side sealing region 10c form four pairs. The paired through holes 12 are formed on both sides in one direction along the surface 10a with respect to the center OA. One direction along the surface 10a is one of the directions orthogonal to the Z direction. According to the above, when the front-side sealing region 10c is divided into two ranges by a virtual straight line passing through the center OA, the opening end 12a of one through hole 12 is positioned in each of the two divided ranges.

  Open ends 12a of the through holes 12 are formed on both sides in the X direction and both sides in the Y direction with respect to the center OA. In FIG. 1, a straight line along the Y direction through the center OA in the front-side sealing region 10c is indicated by a broken line. Moreover, the opening end 12a of the through-hole 12 which makes a pair so that the center OA may be pinched | interposed on each of the diagonal of the front side sealing area | region 10c. That is, in the front side sealing region 10c, the opening end 12a is formed between each of the four apexes and the center OA. According to the above, the center OA is surrounded by the eight open ends 12a.

  The distance between the opening end 12a and the center OA is the same length between the paired through holes 12. The separation distance between the opening end 12a and the center OA is the shortest distance between the opening end 12a and the center OA. According to the above, in the front side sealing region 10c, the opening ends 12a of the paired through holes 12 are formed point-symmetrically. Also on the back surface 10b, the open ends 12b of the paired through holes 12 are formed point-symmetrically with respect to the center OB.

  Moreover, the aperture ratio of the through hole 12 with respect to the front side sealing region 10c is 0.05% or more. The opening ratio of the through hole 12 indicates the ratio of the area of the opening end 12a to the entire area in the front side sealing region 10c.

  As the electronic component 30, for example, a semiconductor element such as a switching element or a microcomputer, or a passive element such as a chip resistor, a chip capacitor, or a crystal resonator can be employed. The electronic component 30 may be an element in a bare chip state. The electronic component 30 is joined to the land via solder. The electronic component 30 is mounted on both the front surface 10a and the back surface 10b. On the surface 10a, the electronic component 30 is mounted only on the front side sealing region 10c, and is not mounted on the front side non-sealing region 10d. Similarly, on the back surface 10b, the electronic component 30 is mounted only on the back side sealing region 10e, and is not mounted on the back side non-sealing region 10f.

  The mold resin 40 seals the electronic component 30 mounted on the front surface 10a together with the front surface 10a, and seals the electronic component 30 mounted on the back surface 10b together with the back surface 10b. Hereinafter, in the mold resin 40, a portion arranged on the surface 10 a side with respect to the substrate 10 is referred to as a front side sealing portion 42. Further, in the mold resin 40, a portion disposed on the back surface 10 b side with respect to the substrate 10 is referred to as a back side sealing portion 44. The mold resin 40 integrally seals lands and solder in addition to the electronic component 30 and the resin base material.

  The front side sealing part 42 covers the electronic component 30 mounted on the surface 10a and also covers the front side sealing region 10c. The front side sealing portion 42 has, as outer surfaces, a bottom surface 42a orthogonal to the Z direction and a side surface 42b that connects the bottom surface 42a and the surface 10a. The side surface 42b has a flat surface 42c along the Z direction and an inclined surface 42d inclined with respect to the Z direction.

  The flat surface 42c is connected to the bottom surface 42a and extends in the Z direction from the bottom surface 42a toward the surface 10a. The plane 42c can also be referred to as a straight portion. The inclined surface 42d connects the flat surface 42c and the back surface 10b. The inclined surface 42d is inclined so as to approach the center OA in the XY plane as the distance from the substrate 10 increases in the Z direction. The inclined surface 42d can also be referred to as a tapered portion.

  The separation distance between the bottom surface 42a and the surface 10a in the Z direction is longer than the height in the Z direction of the electronic component 30 mounted on the surface 10a. That is, the height in the Z direction of the front side sealing portion 42 is set higher than the height in the Z direction of the electronic component 30 mounted on the surface 10a. Thereby, the front side sealing part 42 has covered the whole electronic component 30 mounted in the surface 10a.

  The back side sealing portion 44 covers the electronic component 30 mounted on the back surface 10b and covers the back side sealing region 10e. The back side sealing portion 44 has, as an outer surface, a bottom surface 44a orthogonal to the Z direction and a side surface 44b that connects the bottom surface 44a and the back surface 10b. The side surface 44b is an inclined surface that is inclined with respect to the Z direction. The side surface 44b is inclined so as to approach the center OB in the XY plane as the distance from the substrate 10 increases in the Z direction. The side surface 44b can also be referred to as a tapered portion.

  The separation distance between the bottom surface 44a and the back surface 10b in the Z direction is longer than the height in the Z direction of the electronic component 30 mounted on the back surface 10b. That is, the height in the Z direction of the back side sealing portion 44 is set higher than the height in the Z direction of the electronic component 30 mounted on the back surface 10b. Thereby, the back side sealing part 44 has covered the whole electronic component 30 mounted in the back surface 10b.

  The total of the height of the back side sealing portion 44 and the height of the front side sealing portion 42 in the Z direction is, for example, longer than 1 mm. In the present embodiment, in the Z direction, the separation distance between the bottom surface 44a and the back surface 10b is shorter than the separation distance between the bottom surface 42a and the front surface 10a. That is, the back side sealing portion 44 is lower than the front side sealing portion 42 in the Z direction. The difference between the height of the back side sealing portion 44 and the height of the front side sealing portion 42 in the Z direction is, for example, less than 2 mm.

  The mold resin 40 is also disposed in each through hole 12. Hereinafter, the portion disposed in the through hole 12 in the mold resin 40 is referred to as an intermediate portion 46. Each intermediate portion 46 connects the front side sealing portion 42 and the back side sealing portion 44 in the Z direction. That is, the front side sealing portion 42 and the back side sealing portion 44 are connected to each other by the intermediate portions 46.

  Next, a method for manufacturing the electronic device 100 will be described with reference to FIGS.

  First, the preparatory process for preparing the substrate 10 having the wiring and lands formed on the resin base material is performed. A through hole 12 is formed in the substrate 10 prepared in the preparation process. The through hole 12 is formed by, for example, a drill, a laser, or a router.

  In carrying out the preparation step, the through hole 12 is formed in the substrate 10 so that the opening end 12a is in the above-described position in the front side sealing region 10c. That is, in the preparation step, the substrate 10 is prepared in which the open end 12a of one through hole 12 is located at the center OA in the front side sealing region 10c. In the preparation step, the substrate 10 is prepared in which the opening ends 12a of the paired through holes 12 are located on both sides in one direction with respect to the center OA. Specifically, the substrate 10 is prepared in which the opening ends 12a of the four pairs of through holes 12 are arranged point-symmetrically with respect to the center OA. In the preparation step, the mold resin 40 is not formed in the front side sealing region 10c. Therefore, in the preparation step, a region of the surface 10a where the mold resin 40 is to be formed in the following step is defined as a front side sealing region 10c.

  Further, in performing the preparation process, the substrate 10 in which the center OA is sandwiched between the opening ends 12a of the paired through holes 12 and the center OA is surrounded by the opening ends 12a of the eight through holes 12 is formed. Use. Furthermore, in carrying out the preparation step, the substrate 10 is used in which the distance between the opening end 12a of the through hole 12 and the center OA is the same length between the paired through holes 12. And in implementing a preparatory process, the board | substrate 10 whose opening rate of the through-hole 12 with respect to the front side sealing area | region 10c is 0.05% or more is used.

  Next, a mounting process for mounting the electronic component 30 on the substrate 10 via solder is performed. In the mounting process, the electronic component 30 is solder-mounted on both the front surface 10a and the back surface 10b. Next, a mold resin 40 is formed on the substrate 10. In this embodiment, the mold resin 40 is formed by a compression molding method.

  As shown in FIGS. 3 to 8, the mold 200 used to mold the mold resin 40 includes an upper mold 202, a lower mold 204, and a movable mold 206. The upper mold 202 forms a cavity on the back surface 10 b side with respect to the substrate 10. Hereinafter, the cavity formed by the upper mold 202 is referred to as an upper cavity 220. The upper mold 202 corresponds to the first mold described in the claims.

  The upper mold 202 has a bottomed cylindrical shape with one end opened and the other end closed. That is, the upper mold 202 has a cylindrical portion 208 that extends in one direction and a bottom portion 210 that closes the opening of the cylindrical portion 208. The bottom portion 210 has a flat plate shape whose thickness direction is along the direction in which the cylindrical portion 208 extends. The cylindrical portion 208 has a distal end surface 208 a as one end surface opposite to the bottom portion 210. The distal end surface 208a is a plane whose thickness direction is along the direction in which the cylindrical portion 208 extends.

  The bottom portion 210 forms the bottom surface 220 a of the upper cavity 220. The bottom surface 220 a forms the bottom surface 44 a of the back side sealing portion 44. The cylindrical portion 208 forms the side surface 220 b of the upper cavity 220. The side surface 220 b forms the side surface 44 b of the back side sealing portion 44. The side surface 220b is an inclined surface that is inclined with respect to the direction in which the cylindrical portion 208 extends. More specifically, the side surface 220b is inclined so as to move away from the center of the upper cavity 220 in a plane orthogonal to the direction in which the cylinder portion 208 extends as the distance from the bottom surface 220a increases in the direction in which the cylinder portion 208 extends.

  The lower mold 204 and the movable mold 206 are arranged on the gravity direction side with respect to the upper mold 202, and form a cavity on the surface 10a side with respect to the substrate 10. Hereinafter, a cavity formed by the lower mold 204 and the movable mold 206 is referred to as a lower cavity 222. Moreover, the gravity direction is shown as the bottom, and the opposite direction of the gravity direction is shown as the top. The lower mold 204 and the movable mold 206 correspond to the second mold described in the claims. The lower mold 204 corresponds to the clamp mold described in the claims.

  The lower mold 204 has a cylindrical shape whose inner wall surface forms the side surface 222 b of the lower cavity 222. The side surface 222 b forms the side surface 42 b of the front side sealing portion 42. The lower mold 204 has a front end surface 204a as one end surface in the extending direction. The distal end surface 204a is a plane orthogonal to the direction in which the lower mold 204 extends.

  The movable mold 206 is configured to be movable along the inner wall surface of the lower mold 204 in the space surrounded by the lower mold 204. The movable mold 206 forms the bottom surface 222 a of the lower cavity 222. The bottom surface 222 a forms the bottom surface 42 a of the front side sealing portion 42.

  The side surface 222b has a flat surface 222c along the extending direction of the lower mold 204 and an inclined surface 222d inclined with respect to the extending direction of the lower mold 204. The flat surface 222 c forms the flat surface 42 c of the front side sealing portion 42. The inclined surface 222d forms the inclined surface 42d of the front side sealing portion 42. The inclined surface 222d is connected to the front end surface 204a of the lower mold 204 and forms an opening of the lower mold 204. The inclined surface 222d is inclined so as to approach the center of the lower cavity 222 in a plane orthogonal to the extending direction of the lower mold 204 as it is farther from the tip surface 204a in the extending direction of the lower mold 204.

  In the present embodiment, the mold resin 40 is molded without disposing the release film in the upper cavity 220 and the lower cavity 222. A release film is arrange | positioned between the metal mold | die 200 and the mold resin 40, and suppresses that the metal mold | die 200 and the mold resin 40 mutually adhere | attach.

  In molding the mold resin 40, an arrangement process is performed in which the mold 200 and the substrate 10 are fixedly arranged. In the arranging step, first, the substrate 10 is fixed to the upper mold 202 as shown in FIG. At this time, the upper mold 202 is disposed on the upper side of the substrate 10, and the front end surface 208a is brought into contact with the back surface 10b.

  In the arranging step, the substrate 10 and the upper mold 202 are arranged so that the upper cavity 220 faces the back side sealing region 10e. That is, the back side sealing region 10 e does not contact the tip surface 208 a and faces the upper cavity 220. On the other hand, a region in contact with the front end surface 208a on the back surface 10b is a back side non-sealing region 10f.

  In carrying out the arranging step, the substrate 10 is arranged on the upper mold 202 so that the open ends 12b of the through holes 12 are arranged as described above in the back side sealing region 10e. That is, the substrate 10 is arranged on the upper mold 202 so that the open end 12b of one through hole 12 is positioned at the center OB in the back-side sealing region 10e. Further, the substrate 10 is disposed on the upper mold 202 so that the opening ends 12b of the paired through holes 12 are located on both sides in one direction with respect to the center OB. Specifically, the substrate 10 is arranged on the upper mold 202 so that the opening ends 12b of the four pairs of through holes 12 are arranged point-symmetrically with respect to the center OB.

  After the substrate 10 is fixed to the upper mold 202, the constituent material 40a of the mold resin 40 is put into the lower cavity 222 as shown in FIG. More specifically, the constituent material 40 a of the mold resin 40 that is granular is distributed into the lower cavity 222. Before putting the constituent material 40a into the lower cavity 222, the extending direction of the lower mold 204 is made coincident with the direction of gravity so that the movable mold 206 is movable in the vertical direction. Then, the position of the movable mold 206 is set to the lowest position in the movable range of the movable mold 206, for example.

  In carrying out the arranging step, the mold 200 is heated in order to melt the constituent material 40a of the mold resin 40 put in the cavity. For example, the mold 200 is set to about 175 ° C.

  After the constituent material 40a is put into the lower cavity 222, the lower mold 204 and the movable mold 206 are moved, and the tip surface 204a of the lower mold 204 is pushed against a part of the surface 10a of the substrate 10 as shown in FIG. Fix it by hitting. As a result, the lower mold 204 and the movable mold 206 are disposed below the substrate 10.

  In the arranging step, the substrate 10 and the lower mold 204 are arranged so that the lower cavity 222 faces the front sealing region 10c. That is, the front side sealing region 10 c does not contact the front end surface 204 a and faces the lower cavity 222. On the other hand, the region in contact with the tip surface 204a on the surface 10a is the front side non-sealing region 10d.

  In carrying out the arranging step, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the open ends 12a of the through holes 12 are arranged as described above in the front side sealing region 10c. That is, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the open end 12a of one through hole 12 is positioned at the center OA in the front-side sealing region 10c. Further, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the opening ends 12a of the paired through holes 12 are located on both sides in one direction with respect to the center OA. Specifically, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the open ends 12a of the four pairs of through holes 12 are arranged point-symmetrically with respect to the center OA.

  In the present embodiment, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the front-side non-sealing region 10d coincides with the back-side non-sealing region 10f in the projection view in the Z direction. In other words, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the contact location with the lower mold 204 of the front surface 10a coincides with the contact location with the upper mold 202 of the back surface 10b in the projection view in the Z direction. That is, the lower mold 204 and the movable mold 206 are arranged on the substrate 10 so that the front-side sealing region 10c coincides with the back-side sealing region 10e when viewed in the Z direction.

  The constituent material 40a of the mold resin 40 placed in the lower cavity 222 is heated by the mold 200 and melted as shown in FIG. That is, the constituent material 40a, which has been granular, becomes liquid.

  After the placement process, an ascending process for raising the movable mold 206 is performed as shown in FIG. A white arrow in FIG. 7 indicates a moving direction of the movable mold 206. By this movement, a part of the constituent material 40a flows through the through holes 12 to the upper cavity 220. In the ascending step, for example, a pressure of 5 MPa is applied to the movable mold 206, and the movable mold 206 is raised at a speed of 0.2 mm / sec. When the movable mold 206 is moved to a predetermined position, the constituent material 40a of the mold resin 40 is disposed in the upper cavity 220, the lower cavity 222, and the respective through holes 12 as shown in FIG.

  After the ascending step, a pressure holding step is performed to keep the pressure in the cavity constant. In the pressure holding step, a molding pressure is applied to the constituent material 40a by the movable mold 206 while applying heat from the mold 200 to the constituent material 40a. Thereby, the front side sealing part 42 is formed on the front surface 10a and the back side sealing part 44 is formed on the back surface 10b. An intermediate portion 46 is formed in each through hole 12.

  After performing the pressure holding process, a mold release process for separating the mold 200 from the mold resin 40 is performed. In the mold release step, first, the lower mold 204 is moved in the Z direction to release the lower mold 204 from the substrate 10. Then, the movable mold 206 is separated from the front side sealing portion 42 and the upper mold 202 is separated from the back side sealing portion 44. As described above, the electronic device 100 shown in FIGS. 1 and 2 can be manufactured.

  Next, the aperture ratio of the through hole 12 will be described based on FIGS. 9 and 10.

  In the ascending process, the substrate 10 is deformed upward by the stress from the constituent material 40a. FIG. 9 shows measurement results obtained by molding the mold resin 40 on the substrates 10 having different opening ratios of the through holes 12 and measuring the deformation amount of each substrate 10. Further, the measurement is performed by changing the temperature of the mold 200 for each substrate 10 having different opening ratios of the through holes 12. The amount of deformation of the substrate 10 indicates the amount of warpage of the substrate 10.

  As shown in FIG. 10, the substrate 10 used for the measurement has a width in the X direction of 91 mm and a width in the Y direction of 77.5 mm. Unlike the board | substrate 10 shown in FIG.1 and FIG.2, the number of the through-holes 12 formed in the board | substrate 10 used for the measurement is two. In the front-side sealing region 10 c, the center OA is sandwiched between the opening ends 12 a of the two through holes 12 in the X direction.

  The triangular marker in FIG. 9 is a measurement result when the temperature of the mold 200 is set to 135 ° C. The square marker in FIG. 9 is a measurement result when the temperature of the mold 200 is set to 175 ° C. The dashed-dotted line in FIG. 9 is an approximate curve for each measurement result.

  As a matter of course, the higher the opening ratio of the through hole 12, the fewer portions of the substrate 10 that receive stress from the constituent material 40a. Therefore, the higher the aperture ratio of the through hole 12, the smaller the deformation amount of the substrate 10. Further, the higher the temperature of the mold 200, the higher the temperature of the constituent material 40a of the mold resin 40, and the lower the viscosity of the constituent material 40a. According to this, as the temperature of the mold 200 is higher, the fluidity of the constituent material 40a is improved and the stress acting on the substrate 10 from the constituent material 40a is reduced. Therefore, the higher the temperature of the mold 200, the smaller the deformation amount of the substrate 10.

  As shown in FIG. 9, when the opening ratio of the through hole 12 is 0.05% or more, the deformation amount of the substrate 10 is 0.16 mm when the temperature of the mold 200 is both 135 ° C. and 175 ° C. It can be as follows.

  When the warpage of the substrate 10 is increased, stress acts on the connection portion between the substrate 10 and the electronic component 30, the electronic component 30 itself, and the connection portion between the substrate 10 and the mold resin 40. On the other hand, stress is applied to the substrate 10 on which the electronic component 30 such as a crystal (quartz crystal unit) is mounted, and the deformation amount of the substrate 10 when the electronic component 30 is damaged, and the substrate 10 and the mold resin 40 are separated. The amount of deformation of the substrate 10 when measured was measured. In this measurement, in the substrate 10 having the size shown in FIG. 10, the damage of the electronic component 30 and the separation between the substrate 10 and the mold resin 40 can be suppressed by setting the deformation amount of the substrate 10 to 0.16 mm or less. Was confirmed. Therefore, by setting the aperture ratio of the through hole 12 to 0.05% or more, damage to the electronic component 30 and peeling between the substrate 10 and the mold resin 40 can be suppressed.

  Note that the upper limit value of the opening ratio of the through hole 12 is determined in consideration of, for example, the size of the substrate 10 and the mounting area of the electronic component 30 on the front surface 10a and the back surface 10b. That is, the aperture ratio of the through hole 12 is determined so that the substrate 10 does not become large and the mounting area of the electronic component 30 on the front surface 10a and the back surface 10b can be secured.

  Next, effects of the electronic device 100 and the method for manufacturing the electronic device 100 will be described.

  In the ascending step, in the front side sealing region 10c, the vicinity of the center OA having a long separation distance from the outer peripheral end is likely to warp. The stress is relieved from the constituent material 40 a by the through hole 12 around the through hole 12 in the substrate 10.

  On the other hand, in the substrate 10 of the present embodiment, the through hole 12 is opened at the center OA of the front side sealing region 10c. According to this, when flowing the constituent material 40a to the back surface 10b side, the stress acting near the center OA can be relaxed. Accordingly, the substrate 10 can be prevented from warping.

  In the ascending step, in the front-side sealing region 10c, the stress from the constituent material 40a increases as the distance from the center OA is shorter, and the warp tends to warp. In the front-side sealing region 10c, the stress from the constituent material 40a is reduced and the warpage is less likely to occur as the distance from the opening end 12a of the through hole 12 is shorter. According to the above, when the through hole 12 opens only in one region in one direction with respect to the center OA, the through hole 12 does not open in the other region in one direction with respect to the center OA. The separation distance from the 12 open ends 12a becomes longer. For this reason, in the front-side sealing region 10c, warpage is likely to occur in the region on the other side in one direction with respect to the center OA.

  On the other hand, in the substrate 10 of the present embodiment, the open ends 12a of the plurality of through holes 12 are formed on both sides in one direction with respect to the center OA. According to this, it is possible to suppress an increase in the separation distance from the opening end 12a in the regions on both sides in one direction with respect to the center OA. Accordingly, the substrate 10 can be prevented from warping.

  In the substrate 10 of this embodiment, the center OA is sandwiched between the opening ends 12a of the paired through holes 12. According to this, as compared with the configuration in which the opening end 12a of the through hole 12 is not formed at a position sandwiching the center OA, the separation distance from the opening end 12a is larger in the region near the center OA in the front side sealing region 10c. It can suppress becoming longer. Therefore, it is possible to effectively suppress the substrate 10 from warping.

  In the substrate 10 of the present embodiment, the center OA is surrounded by the open ends 12 a of the eight through holes 12. According to this, compared to the configuration in which the opening end 12a of the through hole 12 is not formed at a position surrounding the center OA, the separation distance from the opening end 12a in the region near the center OA in the front side sealing region 10c is smaller. It can suppress becoming longer. Therefore, it is possible to effectively suppress the substrate 10 from warping.

  In the substrate 10 of the present embodiment, the distance between the opening end 12a of the through hole 12 and the center OA is the same length between the pair of through holes 12. According to this, the separation distance between one of the paired through holes 12 and the opening end 12a does not become longer than the separation distance between the other of the paired through holes 12 and the center OA. . That is, it is possible to suppress an increase in the separation distance from the opening end 12a in the region between both of the paired through holes 12 and the center OA. Therefore, it is possible to effectively suppress the substrate 10 from warping.

  By the way, in the ascending process, the constituent material 40 a flowing from the lower cavity 222 to the upper cavity 220 needs to pass through the through hole 12, and therefore, the upper cavity 220 is less likely to be filled with the constituent material 40 a compared to the lower cavity 222.

  In contrast, in the present embodiment, when the mold resin 40 is molded, the height of the back side sealing portion 44 is made lower than that of the front side sealing portion 42 in the Z direction. According to this, as compared with the configuration in which the height of the back side sealing portion 44 is equal to or greater than the front side sealing portion 42, the constituent material 40a flowing into the upper cavity 220 can be reduced. Therefore, it is easy to fill the entire upper cavity 220 with the constituent material 40a, and it is possible to suppress the generation of voids in the upper cavity 220.

  In the present embodiment, the side surface 220b is inclined so as to be away from the center of the upper cavity 220 in the XY plane as it is farther from the bottom surface 220a in the Z direction. According to this, in the ascending step, the constituent material 40a in the upper cavity 220 tends to flow toward the center of the upper cavity 220 in the XY plane when it hits the side surface 220b. That is, since the side surface 220 b is inclined, the flow of the constituent material 40 a is generated in the upper cavity 220, and the constituent material 40 a is easily filled in the entire upper cavity 220. Therefore, generation of voids in the upper cavity 220 can be suppressed.

  In the present embodiment, when performing the arranging step, the contact location with the lower mold 204 on the front surface 10a and the contact location with the upper mold 202 on the back surface 10b are made to coincide with each other in the projection view in the Z direction. Therefore, a part of the substrate 10 is sandwiched and fixed by the mold 200 on both sides in the Z direction. According to this, since a downward stress is applied from the upper mold 202 to the substrate 10, a gap is hardly generated between the lower mold 204 and the substrate 10. Therefore, the constituent material 40 a in the lower cavity 222 can be prevented from leaking from the gap between the lower mold 204 and the substrate 10. Similarly, when an upward stress is applied from the lower mold 204 to the substrate 10, a gap is hardly generated between the upper mold 202 and the substrate 10, and leakage of the constituent material 40 a from the upper cavity 220 can be suppressed.

  In the mold release step, the lower mold 204 is moved away from the substrate 10 so that a frictional force in the direction opposite to the moving direction of the lower mold 204 acts on the lower mold 204 from the front side sealing portion 42. On the other hand, in the lower mold 204 of this embodiment, the flat surface 222c that is a part of the side surface 222b is along the moving direction of the lower mold 204. According to this, as compared with the configuration in which the entire side surface 222b is inclined with respect to the moving direction of the lower mold 204, the frictional force acting on the lower mold 204 from the front side sealing portion 42 in the mold release process can be reduced. it can. Therefore, the lower mold 204 can be easily separated from the front side sealing portion 42 when performing the mold release process. In addition, when moving the lower mold | type 204 in a mold release process, it can suppress that the front side sealing part 42 and the board | substrate 10 peel by forming the inclined surface 222d.

(Second Embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 11, two through holes 12 are formed in the substrate 10. The open ends 12b of the two through holes 12 are arranged on both sides in the X direction with respect to the center OB in the back side sealing region 10e. The open ends 12b of the two through holes 12 are arranged so as to sandwich the center OB in the X direction. The planar shape of the opening end 12b of each through hole 12 along the XY plane is an elliptical shape extending in the Y direction. Note that the through hole 12 is not formed in the center OB.

  As shown in FIG. 12, a recess 48 is formed in the back side sealing portion 44. The recess 48 is recessed in the Z direction from the bottom surface 44a toward the back surface 10b. In the back side sealing portion 44, the portion where the recess 48 is formed has a lower height in the Z direction than the other portions. The dent 48 has a bottom surface 48a that forms a plane orthogonal to the Z direction, and a side surface 48b that connects the bottom surface 48a and the bottom surface 44a.

  In FIG. 11, a range that overlaps the bottom surface 48a in the projection view in the Z direction is indicated by a broken line. The bottom surface 48a is formed at a position overlapping the center OB in the projection view in the Z direction. In the projection view in the Z direction, the bottom surface 48a is sandwiched between the opening ends 12b of the two through holes arranged in the X direction. That is, in the projection view in the Z direction, the recess 48 is sandwiched between the open ends 12b of the two through holes 12 arranged in the X direction. The side surface 48b is an inclined surface that is inclined so as to move away from the center OB in the XY plane as the distance from the back surface 10b increases in the Z direction. In addition, in FIG. 11, it has shown about the bottom face 48a made into square shape. However, the present invention is not limited to this. For example, the bottom surface 48a may be circular.

  As shown in FIG. 13, the upper mold 202 has a protruding portion 212 that protrudes from the bottom portion 210 toward the upper cavity 220. The protruding portion 212 forms a recess 48 in the back side sealing portion 44. Since the protrusion 212 is formed on the upper mold 202, a part of the bottom surface 220a is recessed.

  In this embodiment, the protrusion part 212 opposes the back surface 10b by implementing an arrangement | positioning process. In the arranging step, the upper mold 202 is arranged on the substrate 10 so that the recess 48 is positioned between the two opening ends 12b in the projection view in the Z direction. After the placement step, the distance between the protruding portion 212 and the back surface 10b in the Z direction is shorter than the distance between the bottom portion 210 and the back surface 10b.

  When the ascending process is performed, the constituent material 40a that has passed through each through hole 12 joins in the upper cavity 220 in a region between the open ends 12b in the Z-direction projection view. Therefore, in the upper cavity 220, the region between the open ends 12b in the projection view in the Z direction can also be referred to as a resin joining portion. When the movable mold 206 is raised to a predetermined position, the entire cavity is filled with the constituent material 40a as shown in FIG.

  By the way, in the resin merging portion, voids may occur when the constituent materials 40a having different flow directions merge. On the other hand, in this embodiment, when performing an arrangement | positioning process, the upper mold | type 202 is arrange | positioned at the board | substrate 10 so that the protrusion part 212 may protrude toward a resin merge part. For this reason, the height in the Z direction is lower in the resin joining portion than in other locations in the upper cavity 220. According to this, in the ascending step, the constituent material 40a increases in flow rate and flow rate at the resin joining portion as compared with other portions in the upper cavity 220. Therefore, it can suppress that a void arises in a resin confluence | merging part.

(Third embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 14, three through holes 12 are formed in the substrate 10. In the back side sealing region 10e, the center OB is sandwiched between the opening ends 12b of the two through holes 12 in the X direction. The open end 12b of the remaining one through hole 12 is formed on one side in the Y direction with respect to the center OB in the back side sealing region 10e.

  In FIG. 14, a range that overlaps with one electronic component 30 mounted on the back surface 10 b in a projected view in the Z direction is indicated by a broken line. The electronic component 30 is surrounded by the open ends 12b of the three through holes 12 in a projected view in the Z direction. In other words, the three open ends 12b are formed so as to surround one electronic component 30 mounted on the back surface 10b in the projection view in the Z direction.

  In carrying out the preparation step, the substrate 10 is prepared in which the portion of the back surface 10b where the electronic component 30 is mounted is surrounded by the open ends 12b of the plurality of through holes 12 in the projection view in the Z direction. In the preparation process, the electronic component 30 is not mounted on the substrate 10. In the preparation step, the portion of the back surface 10b where the electronic component 30 is mounted is a portion where the electronic component 30 is to be mounted.

  By the way, the flow of the constituent material 40a flowing into the upper cavity 220 is likely to be hindered by the electronic component 30 mounted on the back surface 10b. According to this, the entire upper cavity 220 may not be filled with the constituent material 40a, and a void may be generated in the upper cavity 220.

  On the other hand, in the substrate 10 of the present embodiment, the open ends 12b of the plurality of through holes 12 surround the electronic component 30 mounted on the back surface 10b in the projection view in the Z direction. According to this, the constituent material 40a that has flowed into the upper cavity 220 through each through hole 12 flows toward the electronic component 30 so as to surround the electronic component 30 mounted on the back surface 10b. Therefore, it can suppress that the constituent material 40a does not flow to the specific location in the upper side cavity 220. FIG. That is, it is easy to fill the entire upper cavity 220 with the constituent material 40a, and it is possible to suppress the generation of voids in the upper cavity 220.

(Fourth embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 15, three through holes 12 are formed in the substrate 10. The three through holes 12 are formed so that the open ends 12a are arranged in the X direction in the front-side sealing region 10c. Open ends 12a of two through holes 12 of the three through holes 12 are formed on both sides in the X direction with respect to the center OA in the front side sealing region 10c. The opening end 12a of the remaining one through hole 12 is formed so as to overlap the center OA. Note that the planar shape of the through hole 12 along the XY plane is an elliptical shape extending in the Y direction.

(Fifth embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 16, one through hole 12 is formed in the substrate 10. The opening end 12a of one through hole 12 is formed so as to overlap the center OA. The planar shape of the opening end 12a along the XY plane is a perfect circle.

(Sixth embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 17, three through holes 12 are formed in the substrate 10. The three through holes 12 are formed such that the open end 12a surrounds the center OA. The planar shape of the open end 12a of each through hole 12 along the XY plane is a perfect circle.

(Seventh embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 18, two through holes 12 are formed in the substrate 10. The open ends 12a of the two through holes 12 are disposed on both sides in the X direction with respect to the center OA in the front-side sealing region 10c. However, the center OA is not located in a region sandwiched by the opening ends 12b of the two through holes 12 in the front side sealing region 10c. In FIG. 18, a region sandwiched between the open ends 12 b of the two through holes 12 is indicated by a broken line. The planar shape of each through hole 12 along the XY plane is an elliptical shape extending in the Y direction. Note that the through hole 12 is not formed in the center OA.

(Eighth embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 19, two through holes 12 are formed in the substrate 10. The open ends 12a of the two through holes 12 are disposed on both sides in the X direction with respect to the center OA in the front-side sealing region 10c. In the present embodiment, the distance between the opening end 12 a and the center OA is different between the two through holes 12. That is, the separation distance L1 between one opening end 12a and the center OA is longer than the separation distance L2 between the other opening end 12a and the center OA.

(Ninth embodiment)
In the present embodiment, the description of the first embodiment is referred to for parts common to the electronic device 100 shown in the first embodiment.

  As shown in FIG. 20, in the preparation step, a multiple substrate 300 in which a plurality of substrates 10 are connected is prepared. The multiple substrate 300 has a flat plate shape whose thickness direction is along the Z direction. In the multiple substrate 300 of this embodiment, four substrates 10 are connected to each other. The substrates 10 are connected in the X direction and the Y direction. In FIG. 20, the boundary between the substrates 10 is indicated by a broken line. Each substrate 10 has the same rectangular shape. The planar shape of the multiple substrate 300 along the XY plane has a rectangular shape with long sides along the X direction and short sides along the Y direction.

  In the multiple substrate 300, independent front side sealing regions 10 c are formed for each substrate 10. In other words, the front side sealing regions 10c of each substrate 10 are not connected to each other and are separated by the front side non-sealing region 10d. That is, the mold resins 40 formed on each substrate 10 are not connected to each other.

  Each substrate 10 is formed with two through holes 12 whose open ends 12a are located in the front side sealing region 10c. In each substrate 10, two through holes 12 are formed so that the two open ends 12 a sandwich the center OA in the X direction. In the mounting process, the electronic components 30 are mounted on both surfaces of the multiple substrate 300.

  As shown in FIG. 21, the mold 200 used in this embodiment has a shape that forms an independent cavity for each substrate 10. That is, the cavities formed for each substrate 10 are not connected. Therefore, even if it is a case where a raise process is implemented, the constituent material 40a of the mold resin 40 does not move between cavities.

  After performing the mold release step, a mold resin 40 is formed for each substrate 10 as shown in FIG. That is, a plurality of mold resins 40 are formed on the multiple substrate 300. At this time, the mold resins 40 formed on the substrates 10 are not connected to each other. In the multiple substrate 300, the mold resin 40 is not formed on the front surface 10 a and the back surface 10 b of the connecting portion between the substrates 10.

  After the mold release step, a cutting step for cutting the connecting portion between the substrates 10 in the multiple substrate 300 is performed. In the cutting step, the multiple substrate 300 is cut using, for example, a drill, a laser, or a router. The multiple substrate 300 is divided into four substrates 10 by performing the cutting process. Thereby, the four electronic devices 100 can be manufactured.

  In the present embodiment, the mold resin 40 can be formed on each of the plurality of substrates 10 in one step. According to this, as compared with the method of molding the mold resin 40 on one substrate 10 without using the multiple substrate 300, the time for manufacturing the plurality of electronic devices 100 can be shortened.

(10th Embodiment)
In the present embodiment, the description of the ninth embodiment is referred to for parts common to the electronic device 100 shown in the ninth embodiment.

  As shown in FIG. 23, in the multiple substrate 300, the through hole 12 is formed in the connecting portion between the substrates 10. More specifically, the through hole 12 is formed in the connecting portion between the substrates 10 connected in the X direction.

  In the mold 200 used in this embodiment, as shown in FIG. 24, cavities formed with respect to the substrates 10 connected in the X direction are connected on the front surface 10a side and the back surface 10b side. Therefore, when the ascending process is performed, the constituent material 40a of the mold resin 40 moves between cavities.

  After performing the mold release process, as shown in FIG. 25, the mold resins 40 of the substrates 10 connected in the X direction are connected to each other. In the multiple substrate 300, a mold resin 40 is formed on the front surface 10a and the back surface 10b of the connecting portion between the substrates 10. In the cutting step, the mold resin 40 formed on the connecting portion is cut together with the connecting portion between the substrates 10.

(Other embodiments)
The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the above-described embodiment, an example in which the planar shape of the substrate 10 along the XY plane is rectangular has been described, but the present invention is not limited to this. An example in which the planar shape of the substrate 10 along the XY plane is a square shape or a circular shape can also be adopted.

  In the said embodiment, although the opening rate of the through-hole 12 with respect to the front side sealing area | region 10c showed 0.05% or more, it was not limited to this. An example in which the opening ratio of the through hole 12 is less than 0.05% may be employed.

  In the said embodiment, although the inner wall surface of the through-hole 12 showed the example which follows a Z direction, it does not limit to this. An example in which the inner wall surface of the through hole 12 is an inclined surface inclined by a predetermined angle with respect to the Z direction may be employed. That is, the extending direction of the through hole 12 may be inclined by a predetermined angle with respect to the Z direction.

  In the said embodiment, although the example which shape | molds the mold resin 40 without using a mold release film was shown, it is not limited to this. An example in which the release film is disposed in the cavity of the mold 200 so that the release film is disposed between the mold resin 40 and the mold 200 may be employed.

  In the above-described embodiment, an example in which the front side sealing region 10c coincides with the back side sealing region 10e in the projection view in the Z direction is shown, but the present invention is not limited to this. An example in which the front-side sealing region 10c does not coincide with the back-side sealing region 10e in the projection view in the Z direction may be employed. For example, a configuration in which the opening end 12a is located at the center OA on the front surface 10a but the opening end 12b is not located at the center OB on the back surface 10b can be adopted.

  DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 10a ... Front surface, 10b ... Back surface, 10c ... Front side sealing area | region, 10d ... Front side non-sealing area | region, 10e ... Back side sealing area | region, 10f ... Back side non-sealing area | region, 12 ... Through-hole, 12a ... Opening End, 12b ... Open end, 30 ... Electronic component, 40 ... Mold resin, 40a ... Constituent material, 42 ... Front side sealing part, 42a ... Bottom surface, 42b ... Side surface, 42c ... Flat surface, 42d ... Inclined surface, 44 ... Back side seal Stopping portion, 44a ... bottom surface, 44b ... side surface, 46 ... intermediate portion, 48 ... dent, 100 ... electronic device, 200 ... mold, 202 ... upper die, 204 ... lower die, 204a ... tip surface, 206 ... movable type, 208 ... Cylinder, 208a ... Tip, 210 ... Bottom, 220 ... Upper cavity, 220a ... Bottom, 220b ... Side, 222 ... Lower cavity, 222a ... Bottom, 222b ... Side, 222c ... Plane, 222d ... Inclined surface

Claims (15)

An electronic device comprising: a substrate (10); a plurality of electronic components (30) mounted on a front surface (10a) and a back surface (10b) of the substrate; and a mold resin (40) for sealing the electronic components. A manufacturing method comprising:
Preparing a substrate in which a through hole (12) penetrating from the front surface to the back surface is formed, and the electronic component is mounted on the front surface and the back surface;
The first mold and the substrate so that the cavities (220, 222) of the first mold (202) face the back side sealing region (10e) on the back surface where the mold resin is formed. Are fixed in contact with each other, and the cavity of the second mold (204, 206) is opposed to the front side sealing region (10c) of the surface where the mold resin is formed. Fixing the second mold and the substrate in contact with each other; and
By flowing the constituent material (40a) of the mold resin disposed in the cavity of the second mold from the through hole to the cavity of the first mold, the first mold and the second mold Disposing the constituent material in both cavities of a mold and molding the mold resin,
In preparing the substrate, an electronic device manufacturing method using the substrate in which the opening end (12a, 12b) on the surface side of the through hole is located at the center (OA) of the front side sealing region. An electronic device comprising: a substrate (10); a plurality of electronic components (30) mounted on a front surface (10a) and a back surface (10b) of the substrate; and a mold resin (40) for sealing the electronic components. A manufacturing method comprising:
A plurality of through holes (12) penetrating from the front surface to the back surface are formed, and the substrate on which the electronic component is mounted on the front surface and the back surface is prepared,
The first mold and the substrate so that the cavities (220, 222) of the first mold (202) face the back side sealing region (10e) on the back surface where the mold resin is formed. Are fixed in contact with each other, and the cavity of the second mold (204, 206) is opposed to the front side sealing region (10c) of the surface where the mold resin is formed. Fixing the second mold and the substrate in contact with each other; and
By flowing the constituent material (40a) of the mold resin disposed in the cavity of the second mold from the through hole to the cavity of the first mold, the first mold and the second mold Disposing the constituent material in both cavities of a mold and molding the mold resin,
In preparing the substrate, the opening ends (12a, 12b) on the surface side of the plurality of through holes are located on both sides in one direction along the surface with respect to the center (OA) of the front side sealing region. An electronic device manufacturing method using the substrate.   3. The method of manufacturing an electronic device according to claim 2, wherein, in preparing the substrate, the substrate is used in which the center is sandwiched between the opening ends on the surface side of the plurality of through holes.   In preparing the substrate, the substrate is used in which three or more through holes are formed and the center is surrounded by the open end on the surface side of the three or more through holes. The manufacturing method of the electronic device of Claim 2 or Claim 3.   In preparing the substrate, the substrate in which the distance between the opening end on the surface side of the through hole and the center is the same length in the plurality of through holes is used. 5. The method of manufacturing an electronic device according to claim 4.   6. The method of manufacturing an electronic device according to claim 1, wherein, when the substrate is prepared, the substrate having an opening ratio of the through hole with respect to the front-side sealing region of 0.05% or more is used.   When molding the mold resin, the height of the mold resin on the front surface side in the thickness direction of the substrate is set higher than that of the mold resin on the back surface side. A method for manufacturing an electronic device. In preparing the substrate, using the substrate in which a plurality of the through holes are formed,
In fixing the substrate and the first mold, in the projection view in the thickness direction of the substrate, the first mold in which the protruding portion (212) protruding from the bottom surface (220a) of the cavity is formed. The electronic device according to claim 1, wherein the substrate and the first mold are arranged so that the protruding portion is surrounded by the opening ends on the back surface side of the plurality of through holes. Manufacturing method.   In preparing the substrate, the back surface is used by the opening end on the back surface side of the plurality of through holes in the projection view in the thickness direction of the substrate, using the substrate in which the plurality of through holes are formed. The method for manufacturing an electronic device according to claim 1, wherein the substrate in which the electronic component mounted on the substrate is surrounded is used.   In fixing the substrate and the first mold, the side surface (220b) of the cavity of the first mold is in a plane orthogonal to the thickness direction as the distance from the substrate increases in the thickness direction of the substrate. The method for manufacturing an electronic device according to claim 1, wherein the first mold that is inclined so as to approach the center of the cavity is used.   In fixing the substrate, the first mold, and the second mold, in the projection view in the thickness direction of the substrate, the contact location with the first mold on the front surface, and the back surface The method for manufacturing an electronic device according to any one of claims 1 to 10, wherein the contact points with the second mold are made to coincide with each other.   In fixing the substrate and the second mold, the second mold in which at least a part of the side surface (222b) of the cavity of the second mold is a plane along the thickness direction of the substrate. The manufacturing method of the electronic device of any one of Claims 1-11 used. In fixing the substrate and the second mold, a cylindrical clamp mold whose inner wall surface forms the side surface (222b) of the cavity, and a bottom surface (222a) of the cavity, the space surrounded by the clamp mold is And using the second mold having a movable mold movable along an inner wall surface, the constituent material is disposed in the cavity formed by the clamp mold and the second mold, and the clamp mold Press one end (204a) that forms the opening of
When molding the mold resin, the movable mold is moved to the surface side to cause the constituent material in the cavity of the second mold to flow from the through hole to the cavity of the first mold. Item 13. The method for manufacturing an electronic device according to any one of Items 1 to 12. A substrate (10) having a through hole (12) penetrating from the front surface (10a) to the back surface (10b);
A plurality of electronic components (30) mounted on the front surface and the back surface;
A front side sealing portion (42) for sealing the electronic component mounted on the surface together with the surface, and a back side sealing portion (44) for sealing the electronic component mounted on the back surface together with the back surface; A mold resin (40) having an intermediate part (46) disposed in the through hole and connecting the front side sealing part and the back side sealing part,
The open end (12a, 12b) on the surface side of the through hole is an electronic device formed at the center (OA) of the front side sealing region (10c) where the mold resin is formed on the surface. A substrate (10) on which a plurality of through holes (12) penetrating from the front surface (10a) to the back surface (10b) are formed;
A plurality of electronic components (30) mounted on the front surface and the back surface;
A front side sealing portion (42) for sealing the electronic component mounted on the surface together with the surface, and a back side sealing portion (44) for sealing the electronic component mounted on the back surface together with the back surface; A mold resin (40) having an intermediate part (46) disposed in the through hole and connecting the front side sealing part and the back side sealing part,
Open ends (12a, 12b) on the surface side of the plurality of through holes are on the surface with respect to the center (OA) of the front side sealing region (10c) on which the mold resin is formed. An electronic device formed on both sides in one direction.

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