JP6266888B2 - Dummy frame, convex member, dummy frame manufacturing method, resin fluidity evaluation method, resin molding method, and mold manufacturing method - Google Patents

Description

  The present invention relates to a dummy chip, a dummy substrate, a dummy frame and a method for manufacturing a dummy frame used for evaluating a sealing resin of a semiconductor mounting substrate on which a semiconductor chip is mounted, and a sealing resin resin using the dummy frame. The present invention relates to a fluidity evaluation method and a resin molding method.

  When resin molding is performed on a semiconductor mounting substrate, it is necessary to evaluate and adjust various conditions such as a mold to be used and a resin material and pressure.

  In Patent Document 1, by using a dummy frame in which a convex portion simulating a semiconductor chip is mounted on a planar metal plate simulating a semiconductor mounting substrate, a semiconductor is used without using an actual semiconductor mounting substrate. The chip sealing resin is being evaluated.

JP 2012-114305 A

  In Patent Document 1, a dummy frame on which a convex portion imitating a semiconductor chip is formed by cutting out from a metal plate or processing the metal plate by etching. Therefore, processing takes time and the cost increases.

  In recent years, flip-chip connection is increasingly used as a connection method between a semiconductor and a package substrate. In flip chip connection, under-chip filling of a flip chip package by mold underfill is important. However, in patent document 1, since the convex part imitating the semiconductor chip is integrally formed with the metal plate, it is impossible to grasp the under-chip filling property.

  In view of such problems, the present invention provides a highly accurate method of manufacturing a dummy chip, a dummy substrate, a dummy frame and a dummy frame that can be manufactured by a simple and inexpensive method, and the resin fluidity of the sealing resin under the chip. An object of the present invention is to provide a resin fluidity evaluation method and a resin molding method that can be evaluated in the following manner.

A dummy frame as one aspect of the present invention is a dummy frame used for evaluating a sealing resin when resin molding is performed on a semiconductor chip when mounted on a semiconductor mounting substrate. And at least one of the dummy chip and the dummy substrate has at least one dummy substrate, and a dummy chip manufactured separately that simulates the semiconductor chip disposed on the dummy substrate. Two first convex portions are formed , at least one concave portion is formed in the dummy chip, and an adhesive for adhering to the dummy substrate is applied to the concave portion, The dummy chip is removable from the dummy substrate so that the first convex portion is maintained without being destroyed after the resin molding, and the dummy substrate Between the dummy chip and the dummy substrate and the fluidity of the sealing resin when the resin molding is performed in a state where the first convex portion is interposed between the dummy substrate and the dummy substrate. It is used for evaluating the filling property of the resin.

According to another aspect of the present invention, there is provided a resin fluidity evaluation method comprising: evaluating a resin fluidity of a resin mold using a dummy frame having a dummy chip and a dummy substrate on which the dummy chip is disposed. And at least one of the dummy chip and the dummy substrate has at least one first protrusion, and the dummy chip has at least one recess, and the recess Is coated with an adhesive for adhering to the dummy substrate, and the dummy chip can be removed from the dummy substrate after the resin molding so that the first convex portion is maintained without being destroyed. And a sealing tree when resin molding is performed in a state in which the first convex portion is sandwiched between the dummy substrate and the dummy substrate so as to be removable. Of used to evaluate the filling of resin between the fluidity and the dummy chip and the dummy substrate, wherein the.

  According to the present invention, a dummy chip, a dummy substrate, a dummy frame and a dummy frame that can be manufactured by a simple and inexpensive method, and a resin flow that can accurately evaluate the resin fluidity of a sealing resin under the chip. A property evaluation method and a resin molding method can be provided.

2 is a schematic diagram of a dummy chip in Example 1. FIG. 2 is a schematic diagram of a dummy frame in Embodiment 1. FIG. In Example 1, it is a schematic sectional drawing of the metal mold | die in the state before installing a dummy frame. In Example 1, it is a schematic sectional drawing of the metal mold | die in the state which installed the dummy frame using the lower mold | type liner. In Example 1, it is a schematic sectional drawing of the metal mold | die in the state which installed the dummy frame without using the lower mold | type liner. In Example 1, it is a schematic sectional drawing of the metal mold | die in the state which clamped the dummy frame. 3 is a schematic configuration diagram of an upper mold in Example 1. FIG. 3 is a schematic configuration diagram of a lower mold in Example 1. FIG. In Example 1, it is a schematic block diagram of the resin mold method using the upper metal mold | die of FIG. 7, and the lower metal mold | die of FIG. 3 is a schematic configuration diagram of an upper mold in Example 1. FIG. 3 is a schematic configuration diagram of a lower mold in Example 1. FIG. 2 is a flowchart of a resin molding method in Example 1. 6 is a schematic plan view of a dummy chip group in Example 2. FIG. 6 is a schematic diagram of a dummy frame in Embodiment 2. FIG. 6 is a schematic plan view of a dummy frame in Embodiment 3. FIG. FIG. 10 is a schematic diagram of a dummy frame in Embodiment 4. 10 is a schematic diagram of a dummy chip which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy chip which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy frame which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy frame which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy frame which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy chip which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy chip which is an example of Example 4. FIG. 10 is a schematic diagram of a dummy frame in Embodiment 5. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a schematic configuration diagram of a dummy chip 100 in the present embodiment. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view. The dummy chip 100 has a semiconductor chip mounted on a semiconductor mounting substrate during resin molding (here, not only the semiconductor chip but also a mounting component including a lens, a mechanical component, and a sensor component added to a semiconductor such as MEMS). In some cases, the semiconductor chip is also manufactured. That is, the size, thickness, material, etc. of the dummy chip vary depending on the semiconductor chip actually used. Examples of the material of the dummy chip include metals, silicon chips, transparent heat-resistant glass, and heat-resistant resins, but are not limited thereto, and any material having heat resistance may be used.

  Next, the dummy frame will be described with reference to FIG. FIG. 2 is a schematic diagram of a dummy frame in the present embodiment. The dummy frame is used for evaluating the fluidity of the sealing resin when resin molding is performed.

  FIG. 2A is a plan view of a dummy substrate 500 simulating a semiconductor mounting substrate. As an example of the dummy substrate 500, pilot holes 501 are formed at four corners. Similar to the dummy chip 100, the size, thickness, material and the like of the dummy substrate 500 may be changed according to the semiconductor mounting substrate actually used. For example, the cost can be suppressed by configuring the dummy substrate 500 from an inexpensive material such as a copper plate. The dummy substrate 500 may be made of a material having heat resistance like the dummy chip.

  As shown in FIG. 2B, on the dummy substrate 500, a plurality of dummy chips 100 are arranged in a lattice pattern. In this embodiment, three vertical and 11 horizontal dummy chips 100 are arranged on the dummy substrate 500, but the present embodiment is not limited to this. The dummy chip 100 may be arranged according to the number of semiconductor chips mounted on the semiconductor mounting substrate to be imitated and the size and arrangement of the semiconductor chips. In some cases, the dummy chip 100 may be disposed on an actual substrate (such as a lead frame or a multilayer substrate). In this case, it is not used as a product, so here it is a dummy frame.

  In FIG. 2B, the same dummy chip 100 is arranged on the dummy substrate 500. However, as shown in FIG. 2D, the dummy chips 110A, 110B, and 110C having different areas are replaced with the dummy substrate. 500 may be arranged.

  As shown in FIG. 2C, in this embodiment, the dummy chip 100 is merely placed on the dummy substrate 500 and is not bonded. Even in this state, in the case of a mold in which a dummy chip and a dummy frame are clamped by an upper and lower mold as will be described later, the dummy chip 100 is fixed on the dummy substrate 500 by the mold. Therefore, resin molding can be performed appropriately. The dummy chip 100 and the dummy substrate 500 may be bonded with an adhesive such as an epoxy resin or a double-sided tape.

  Next, with reference to FIG. 3 to FIG. 12, a mold used at the time of resin molding of the dummy frame (and semiconductor mounting substrate) of this embodiment will be described. FIG. 3 is a schematic cross-sectional view of the mold in a state before the dummy frame is installed. FIG. 4 is a schematic cross-sectional view of a mold in a state where a dummy frame is installed using a lower mold liner. FIG. 5 is a schematic cross-sectional view of a mold in a state where a dummy frame is installed without using a lower mold liner. FIG. 6 is a schematic sectional view of the mold in a state where the dummy frame is clamped.

  As shown in FIGS. 5 to 8, in this embodiment, the mold includes an upper mold 50 and a lower mold 60. The upper mold 50 has a center block 51 and a cavity block 52. The center block 51 is formed with a part of a cull 54 and a runner 55. A part of the runner 55, a gate 56, and a cavity 53 are formed in the cavity block 52. The cavity 53 is resin-molded by transfer molding, and determines the shape of the resin that seals the dummy substrate 500 of the dummy frame.

  The lower mold 60 includes a chase block 62 and a lower center block 61 disposed on the chase block 62. In one embodiment, the lower mold 60 includes a lower mold liner 63 disposed on the chase block 62 and a lower cavity block 64 disposed on the lower mold liner 63 as shown in FIG. Prepare. The dummy substrate 500 </ b> B on which the dummy chip 100 is disposed is disposed on the lower cavity block 64. In another embodiment, the lower mold 60 includes a lower cavity block 64 disposed directly on the chase block 62 as shown in FIG. The dummy substrate 500 </ b> C is disposed on the lower cavity block 64. In the embodiment shown in FIG. 5, the resin molding of the dummy frame is performed without using the lower mold liner 63. The lower mold liner 63 has a thickness of 3 mm in this embodiment, but is not limited to this. As described above, the mold of this embodiment is mainly composed of the upper mold 50 and the lower mold 60. At the time of resin molding, as shown in FIG. 7, the dummy frame (dummy substrates 500 </ b> B and 500 </ b> C) is clamped (pinched) between the upper mold 50 and the lower mold 60, and the cavity 53 is filled with resin.

  At the time of resin molding, as shown in FIGS. 3 to 6, a resin tablet 70 in which a thermosetting resin or the like is formed into a tablet (column) shape is put into a pot 66 of a preheated lower mold 60 and melted. . Then, the resin is filled between the upper mold 50 and the lower mold 60 by moving the plunger 68 upward to pump the molten resin. The plunger 68 is configured to be slidable up and down along the pot 66 by a transfer mechanism (not shown). In addition, it can replace with the resin tablet 70 and can supply a liquid thermosetting resin with a dispenser (not shown), and can also put powder resin, sheet resin, temporary molding resin, and granule resin into a pot. . When the resin is pumped by the plunger 68, the molten resin is supplied to the cavity 53 through the cull 54, the runner 55, and the gate 56, and the inside of the cavity 53 is filled with the resin.

  Next, with reference to FIGS. 7 to 9, a plan view and a cross-sectional view of a mold used in this embodiment will be described. In this embodiment, when any problem such as the tendency of voids to collect in the cavity occurs or when the possibility of occurrence is predicted, before processing and manufacturing an upper mold having a recess as an overflow cavity A dummy frame is dug into the overflow cavity. Then, after experimentally testing and confirming that the result is good, an overflow cavity recess is formed in the upper mold.

  FIG. 7 is a schematic configuration diagram of the upper mold 50a in this embodiment, FIG. 7 (a) is a plan view of the upper mold 50a, and FIG. 7 (b) is a BB cut surface of FIG. 7 (a). FIG. The upper mold 50a has a cavity recessed portion, and the right half of the upper mold 50a has three overflow cavities 57 and 58 other than the gate inflow side including the short side on the long side, and the left half has The case where the overflow cavity 57 is processed only on the long side is shown. FIG. 8 is a schematic configuration diagram of the lower mold 60 in which a dummy frame is mounted. FIG. 8 (a) is a plan view of the lower mold 60, and FIG. 8 (b) is a diagram of FIG. 8 (a). Sectional drawing in a BB cut surface is shown. 9 is a schematic configuration diagram of a resin molding method using the upper mold of FIG. 7 and the lower mold of FIG. 8. FIG. 9A shows the lower mold 60 (see FIG. 8) and the upper mold. FIG. 9B shows a state in which the semiconductor mounting substrate is clamped by using the upper mold 50a (see FIG. 7) and the lower mold 60. FIG. In the upper mold 50a shown in FIG. 9B, the cavity recess (overflow cavity 57) is processed only on the long side.

  As shown in FIG. 7, the upper mold 50a includes a cavity block 52a in which an overflow cavity 57 is formed, and a cavity block 52b in which overflow cavities 57 and 58 are formed. In this manner, the cavity block 52b of the upper mold 50a is formed with the overflow cavity 58 at the end portion (both opposite end portions) different from the overflow cavity 57.

  As shown in FIG. 8, the dummy frame (dummy substrate 500 </ b> A) is mounted on the lower cavity block 64 of the lower mold 60. The dummy substrate 500A has a recess 502 as an overflow cavity. When the dummy frame is clamped using the upper mold 50 and the lower mold 60, a recess 502 as an overflow cavity is formed between the dummy frame and the upper mold 50. In addition, the overlap for the resin of the cavity 53 of the upper metal mold | die 50 to flow into the recessed part 502 of a dummy frame is required. Further, it is desirable that the concave portion 502 is a concave portion opened upward by about 10 degrees so as to be peeled off after the resin is cured. It should be noted that if processing such as forming the overflow cavities 57 and 58 in the upper mold 50a (mold) is performed, the shape of the mold cannot be restored. For this reason, a recess 502 as an overflow cavity is formed (prototype) on a dummy substrate 500A like a dummy frame, and a resin mold is evaluated. When the evaluation result is preferable, the mold is processed.

  As shown in FIG. 9A, in this embodiment, before the upper mold provided with the overflow cavity 57 is processed and manufactured, a dummy frame (dummy substrate 500A) in which a recess 502 as an overflow cavity is dug is formed. To manufacture. At this time, the recess 502 has a region overlapping the cavity 53 of the upper mold 50, and the resin in the cavity 53 is configured to flow into the recess 502. Then, after experimentally testing and confirming that the result is good, the semiconductor chip 10 is mounted using the upper die 50a having the overflow cavity 57 as shown in FIG. 9B. Resin molding is performed on the semiconductor mounting substrate 12 thus formed. Thereby, a low-cost and efficient resin molding method can be provided.

  Next, with reference to FIG.10 and FIG.11, the metal mold | die of the other form used by a present Example is demonstrated. FIG. 10 is a schematic configuration diagram of the upper mold 50b in the present embodiment, FIG. 10 (a) is a plan view of the upper mold 50b, and FIG. 10 (b) is a BB cut surface of FIG. 10 (a). FIG. FIG. 11 is a schematic configuration diagram of the lower mold 60, and FIG. 11A is a plan view of the lower mold 60. 11B is a cross-sectional view taken along the line BB in FIG. 11A, and shows a state in which the dummy frame is clamped using the upper mold 50b and the lower mold 60 in FIG. 10B. .

  As shown in FIG. 10, the left half of the upper mold 50b includes a cavity block 52c in which a branching runner 55a and a gate 56a are formed. The right half of the upper mold 50b includes a cavity block 52d in which a total gate 56b common to the plurality of runners 55 is formed. In this embodiment, as shown by a two-dot chain line in FIG. 11A, when a resin flow problem occurs when resin is sealed with each runner and gate in each cavity, an experiment is performed. Thus, the gate is branched or a recess as a total gate groove is formed in the dummy frame. As shown in FIG. 11, a dummy frame (dummy substrate 500D) is mounted on one of the lower cavity blocks 64 of the lower mold 60 (the lower cavity block on the left side in FIG. 11). A dummy frame (dummy substrate 500E) is mounted on the other side of the lower cavity block 64 (the lower cavity block on the right side in FIG. 11).

  The dummy frame has a recess 503 as a branching runner groove. As shown in FIG. 11B, when the dummy frame is clamped using a mold, the concave portion 503 of the dummy frame is arranged to face the runner 55a (gate 56a) of the upper mold 50b. . The dummy frame has a recess 504 as a total gate groove. As shown in FIG. 11B, when the dummy frame is clamped using a mold, the concave portion 504 of the dummy frame is disposed so as to face the total gate 56b of the upper mold 50b. With such a configuration, the fluidity of the resin can be improved during resin molding.

  Note that if the upper die 50b (die) is processed such as forming the branch runner 55a or the total gate 56b, the shape of the die cannot be restored. For this reason, concave portions 503 and 504 are respectively formed (prototypes) on dummy substrates 500D and 500E to evaluate the fluidity, filling properties, molding conditions, etc. of the resin mold, and when the evaluation result is favorable, the mold is processed. Configure as follows.

  The dummy frame of the present embodiment only needs to have a recess formed in the inflow portion of the sealing resin in the metal plate, not only for experiments for determining the runner, gate, and overflow cavity, but also the depth of the air vent, It can also be used to determine the number and position. Further, in order to determine the resin amount of the cavity, it is also possible to process the part which becomes the cavity part experimentally by changing the size of the concave part or the convex part depending on the case. Further, even in the case of the lower package, the dummy frame can be similarly processed. In the case of the upper and lower packages, a through hole can be formed in the cavity portion of the dummy frame. Further, the present embodiment is not limited to a map-like product, and can be applied to a product having a matrix arrangement. Thus, in this embodiment, it is possible to perform an experiment using a dummy cavity at any location where resin flows. In this embodiment, transfer molding is performed. However, the present invention is not limited to this, and compression molding may be performed.

  Next, with reference to FIG. 12, the resin molding method of the semiconductor mounting board using the dummy frame in a present Example is demonstrated. FIG. 12 is a flowchart of a resin molding method (molding method) in the present embodiment.

  First, in step S101, a dummy frame having a desired shape is manufactured using a dummy chip and a dummy substrate that are processed and manufactured in advance. Subsequently, in step S102, a predetermined mold (upper mold and lower mold) is used to clamp the dummy frame produced in step S101 to perform resin molding, and the result is evaluated. If this evaluation result is favorable (good), the process proceeds to step S104. If the evaluation result is not desirable (bad), the process proceeds to step S103.

  Further, when the dummy substrate 500 is made of a transparent material, a sealing resin in the resin mold is used by using a mold structure having a transparent portion as disclosed in Japanese Patent Laid-Open No. 2002-76041 as an example. Evaluation of resin fluidity can be performed. The transparent material is assumed to be glass, transparent resin, or the like, and preferably has a heat resistance of 180 degrees or more.

  If the evaluation result in step S102 is not preferable, parameter assignment is performed in step S103. That is, various conditions for resin molding are changed. Here, the various conditions include, for example, a resin material, a pressure and temperature at the time of resin molding, a size of the dummy chip 100, a gate shape of a mold, and the like, but are not limited thereto.

  When the parameter assignment in step S103 is completed, the process returns to step S101, and a dummy frame is created so as to satisfy the various conditions set in step S103 (under the changed conditions). Further, in step S102, resin molding is performed again using a predetermined mold (modified mold), and the result is evaluated. These steps are repeated until the evaluation result becomes favorable, that is, until it is determined as “good”.

  If it is determined in step S102 that the evaluation result is preferable, the process proceeds to step S104, and a regular semiconductor mounting board, that is, a semiconductor mounting board on which an actual semiconductor chip is mounted is prepared. The semiconductor mounting substrate prepared here corresponds to the shape of the dummy frame used when the evaluation result is determined to be preferable in step S102. Subsequently, in step S105, the semiconductor mounting substrate is clamped by the mold used in step S102 to perform resin molding. In step S105, an actual resin mold is performed under various conditions of a resin mold such as a mold and a resin when it is finally determined to be preferable in step S102.

  If the resin mold in step S105 is not preferable (defective), the process proceeds to step S106, and conditions such as the shape of the mold are corrected. After the condition correction, the process returns to step S104 to prepare an actual semiconductor mounting board. In step S105, resin molding is performed using the corrected mold. These processes are repeated until it is determined in step S105 that a resin mold is preferable. If it is determined that the resin mold is preferable (good) in step S105, the condition at this time is determined as the final resin mold condition, and the mold is completed (step S107). Thereafter, resin molding of the semiconductor mounting substrate is performed under the determined various conditions.

  Thus, according to the resin molding method of the present embodiment, resin molding is performed using a dummy frame to determine preferable conditions during resin molding, and then the resin for the semiconductor mounting substrate on which the actual semiconductor chip is mounted. Perform molding and final conditions are determined. For this reason, the optimal resin mold conditions can be determined to some extent without using an actual semiconductor mounting substrate. Eventually, an actual semiconductor mounting substrate is required, but it is possible to reduce the steps required to determine optimum conditions using the semiconductor mounting substrate.

  According to the present embodiment, by manufacturing a dummy frame having a desired shape by using a dummy chip and a dummy substrate that are processed and manufactured in advance, the manufacturing of the dummy frame is simplified and the cost can be reduced.

  FIG. 13 is a schematic plan view of the dummy chip group 120 in this embodiment.

  The dummy chip group 120 includes a plurality of dummy chip portions (first dummy chip and second dummy chip) 121 corresponding to dummy chips, and a connecting member (connecting member) for connecting the dummy chip portions. I have. The number and size of the dummy chip portions 121 may be determined according to the form of semiconductor chips actually used and the versatility.

  The dummy frame will be described with reference to FIG. FIG. 14 is a schematic diagram of a dummy frame in the present embodiment.

  As shown in FIG. 14A, dummy chip groups 120A, 120B, and 120C in which dummy chip portions having different areas are formed are arranged on the dummy substrate 500. As shown in FIG. 14B, the dummy substrate 500 is formed with recesses or through holes corresponding to each dummy chip group, and the dummy chip groups 120A, 120B, 120C are fitted into the respective recesses or through holes. Is fixed. Note that each dummy chip group may be placed on the dummy substrate 500 without forming a recess in the dummy substrate 500, or each dummy chip group may be fixed to the dummy substrate 500 with an adhesive or a double-sided tape.

  When the semiconductor chip is of a chip exposed type, as shown in FIG. 14C, each dummy chip group is arranged on the dummy substrate 500 with the state of FIG. 14B reversed. At this time, the connecting member is not limited to a member that covers the entire dummy chip group. In other words, any dummy chip may be used as long as it can connect the dummy chips.

  According to the present embodiment, by manufacturing a dummy frame having a desired shape by using a dummy chip group and a dummy substrate which are processed and manufactured in advance, the dummy frame can be easily manufactured and the cost can be reduced. .

  Further, according to the present embodiment, since the dummy chip group includes a plurality of dummy chip portions, it becomes easier to manage the dummy chips than storing them individually, and the dummy chips are easily arranged on the dummy substrate. be able to.

  FIG. 15 is a schematic plan view of a dummy frame in the present embodiment.

  In this embodiment, a dummy frame of a semiconductor mounting board on which a reflector is mounted is assumed. A plurality of dummy chips 130 and members 131 are arranged on the dummy substrate 500. The dummy chip 130 simulates an LED, and the member 131 is a member simulating a reflector, and is made of resin.

  Therefore, by performing the same resin molding method as in Example 1 using the dummy frame of this example, it is possible to evaluate the sealing resin for the semiconductor chip with high accuracy. In particular, it is effective for determining the lens molding conditions using a transparent resin as a secondary mold.

  According to the present embodiment, by manufacturing a dummy frame having a desired shape by using a dummy chip and a dummy substrate that are processed and manufactured in advance, the manufacturing of the dummy frame is simplified and the cost can be reduced.

  Next, with reference to FIGS. 16 to 18, a dummy chip and a dummy frame according to the fourth embodiment of the present invention will be described.

  FIG. 16 is a schematic diagram of a dummy frame in the present embodiment. FIG. 16A shows a dummy substrate 500A, and FIG. 16B shows a dummy chip 140A on which a convex portion (first convex portion) 141 is formed. FIG. 16C shows a state where the dummy chip 140 </ b> A is arranged on the dummy substrate 500.

  FIG. 17 is a schematic diagram of a dummy chip as an example of the present embodiment. FIG. 17A shows a dummy chip 140B on which a convex portion 142 is formed. FIG. 17B shows a dummy chip 140 </ b> C in which the convex portion 143 is formed.

  FIG. 18 is a schematic diagram of a dummy chip as an example of the present embodiment. Each dummy chip is formed with a protrusion shape 145 so as to surround the convex portion, the concave portion 144 and the concave portion 144.

  As shown in FIG. 16B, the dummy chip 140A imitates a semiconductor chip in which a solder ball shape, a bump shape, a power pole shape by plating or the like is formed on one surface, and a plurality of convex portions 141 are formed on one surface. Is formed. Ideally, convex portions having thicknesses, heights, and intervals close to the shape matched to the actual semiconductor connection are good, but as shown in FIGS. 17A and 17B, the number of convex portions is at least one. There may be at least two, and an area for applying the adhesive may be provided on the convex portion. Moreover, the convex part does not need to be prismatic shape, and may be cylindrical shape as FIG.18 (b) shows. In this embodiment, the processing is performed by etching so that the convex portions of each dummy chip are formed, but it may be machined by polishing, cutting or the like, or may be press processing such as coining. Further, an actual solder ball may be connected, or a utility pole shape may be formed by bumps or plating.

  As shown in FIG. 16C, by placing the dummy chip 140A on the dummy substrate 500, a state simulating flip chip mounting is obtained.

  In FIG. 16 (c), the dummy chip 140A is not bonded to the dummy substrate 500. However, by using each dummy chip shown in FIGS. 18 (a) to 18 (c), a concave portion of each dummy chip is used. An adhesive may be applied to 144 and bonded to the dummy substrate. Each dummy substrate is formed with a projection shape 145 so as to surround the concave portion 144, thereby preventing the adhesive from flowing into the convex portion. Note that the bonding method of the dummy chip and the dummy substrate is not limited to the above method, and for example, the bonding may be performed by providing a concave portion for bonding on the convex portion.

  When the resin molding is performed in the state shown in FIG. 16C, since the dummy substrate 500 and the dummy chip 140A are separately manufactured, the dummy chip 140A can be removed from the dummy substrate 500 after the resin molding. Therefore, the filling property under the dummy chip 140A can be evaluated after the resin molding.

  Further, when the dummy substrate 500 is made of a transparent material, by using the structure disclosed in Japanese Patent Laid-Open No. 2002-76041 as an example, the sealing resin under the dummy chip 140A can be used even during resin molding. Resin fluidity evaluation can be performed. The transparent material is assumed to be glass, transparent resin, or the like, and preferably has a heat resistance of 180 degrees or more.

  Further, by configuring the dummy substrate 500 with a transparent material, the fluidity of the resin mold below the dummy chip 140A can be evaluated during the resin mold by using the configuration described in the first embodiment.

  FIG. 19 is a schematic diagram of a dummy frame which is an example of the present embodiment. FIG. 19A shows a state in which the dummy chips 140 are stacked and arranged on the dummy substrate 500. FIG. 19B shows a state in which a dummy chip 140 and a member 300 simulating an electronic component are arranged on the dummy substrate 500. The member 300 may be provided by directly processing the dummy substrate 500. Even if resin molding is performed in this case, since each dummy chip can be removed, the filling property under the chip can be evaluated.

  FIG. 20 is a schematic diagram of a dummy frame which is an example of the present embodiment. 20A shows a dummy substrate 500, FIG. 20B shows a convex member 200 in which a plurality of convex portions (second convex portions) 201 are formed on one surface (first surface), and FIG. 20C. Indicates a dummy chip 150 formed of a flat plate member. FIG. 20D shows a state where the convex member 200 and the dummy chip 150 are arranged on the dummy substrate 500. Similar to the convex portion 141 of the fourth embodiment, the convex portion 201 is formed with a solder ball shape, a bump shape, a plating shape, etc. according to an actual semiconductor connection, but the number of convex portions is at least One or more may be sufficient and the area which applies an adhesive agent to a convex part may be provided.

  As shown in FIG. 20 (d), the dummy substrate 500 has a recess or a through hole 505. The convex member 200 is fitted into the concave portion or the through-hole 505, and is optionally bonded. The size of fitting the convex member 200 into the dummy substrate 500 is not necessarily matched with the size of the dummy chip 150, and may be fitted in a size larger or smaller than the dummy chip 150.

  The dummy chip 150 is disposed on the surface of the convex member 200 on which the plurality of convex portions 201 are formed. When resin molding is performed in this state, since the dummy chip 150 is made of a transparent material for the resin fluidity test, the resin between the convex member 200 and the dummy chip 150 is not required to be removed. Fillability can be evaluated in real time. Further, by using the configuration disclosed in Japanese Patent Application Laid-Open No. 2002-76041 as an example, the resin fluidity between the convex member 200 and the dummy chip 150 can be evaluated even during resin molding.

  Furthermore, both the dummy frame 500 and the dummy chip 150 may be made of transparent glass or transparent resin, and a pole-shaped heat-resistant material such as a solder ball shape, a bump shape, or plating may be sandwiched as it is, and may be bonded in some cases. By doing so, since both the dummy frame and the dummy chip are transparent, the resin fluidity of the member between the dummy frame and the dummy chip can be more clearly evaluated in real time.

  Note that even if the convex member 200 and the dummy chip 150 are bonded, the surface of the convex member 200 on which the plurality of convex portions are formed is a surface as shown in FIGS. 18 (a) to 18 (c). Good.

  FIG. 21 is a schematic diagram of a dummy frame as an example of the present embodiment. FIG. 21A shows a dummy substrate 500 on which a plurality of convex portions 506 and convex portions 507 simulating an electronic component are formed. FIG. 21B shows a dummy chip 150 made of a transparent material, and FIG. 21C shows a state where the dummy chip 150 is arranged on the dummy substrate 500. Even if resin molding is performed in this case, since the dummy chip 150 is made of a transparent material, it is possible to evaluate the filling properties of the plurality of convex portions 506 without having to remove the dummy chip 150. Moreover, the fluidity | liquidity of the resin mold of the some convex part 506 can be evaluated during a resin mold.

  22 and 23 are schematic views of a dummy chip as an example of this embodiment.

  As shown in FIG. 22A, an integrated dummy chip is configured in a state where a member 160 having a plurality of convex portions and a column portion 161 are connected by a connecting member 162. FIG. 22B is a cross-sectional view of the dummy chip in FIG. As shown in FIG. 22C, the column 161 is provided so that the member 160 does not come into contact with other dummy chips when these dummy chips are stacked. Further, the connecting member need not cover the entire dummy chip. That is, any member can be used as long as the members can be connected to each other. The column part 161 imitates the upper and lower connection electrodes in the case of an actual semiconductor.

  FIG. 23A shows a dummy chip 170A on which a pillar portion 171 is formed, and FIG. 23B shows a dummy chip 170B. FIG. 23C shows a state in which the dummy chip 170A and the dummy chip 170B are stacked at the pillar portion 171. FIG. A space between the dummy chip 170A and the dummy chip 170B is provided by a column portion 171.

  Even if resin molding is performed in the state of FIG. 22C and FIG. 23C, each dummy chip can be removed, so that the filling property under each dummy chip can be evaluated.

  According to the present embodiment, by manufacturing a dummy frame having a desired shape by using a dummy chip and a dummy substrate that are processed and manufactured in advance, the manufacturing of the dummy frame is simplified and the cost can be reduced.

  Further, according to the present embodiment, when the dummy chip and the dummy substrate can be removed, the filling property of the sealing resin under the dummy chip can be evaluated after the resin molding.

  Further, according to the present embodiment, the flow state of the sealing resin under the dummy chip can be evaluated during the resin molding by configuring at least one of the dummy chip and the dummy substrate with a transparent material.

  Next, with reference to FIG. 24, the dummy frame in Example 5 of this invention is demonstrated. FIG. 24 is a schematic diagram of a dummy frame in the present embodiment.

  As shown in FIG. 24A, the dummy substrate 500 of this embodiment has a semiconductor wafer shape. Therefore, the dummy substrate 500 has a notch 508 formed in a part of a circle. In addition, a plurality of dummy chips 180A arranged in a lattice pattern imitating a plurality of semiconductor chips are formed on a dummy substrate 500 having a semiconductor wafer shape of 8 inches or 12 inches, for example. In the present embodiment, the dummy frame is not limited to the shape of the semiconductor wafer, and may have another shape such as a square shape, as long as the material is heat resistant. Further, as shown in FIG. 24D, the dummy chip 180B having a plurality of convex portions formed on one surface may be placed on the dummy substrate 500 in a state where the dummy chip 180B is placed on the member 181.

  Even if resin molding is performed in these states, the filling property and the resin fluidity can be evaluated.

  According to the present embodiment, by using a dummy frame having a semiconductor wafer shape, a resin mold of a semiconductor mounting substrate such as EWLP can be evaluated easily and with high accuracy. The dummy chip 180 is not limited to a semiconductor chip shape, and may be a shape in which MEMS is mounted.

  According to each of the above-described embodiments, the dummy frame having a desired shape is manufactured using the dummy chip and the dummy substrate that are processed and manufactured in advance, so that the dummy frame can be easily manufactured and the cost can be reduced. .

  Moreover, according to each said Example, the resin fluidity evaluation method and the resin mold method which can evaluate the resin fluidity of sealing resin with high precision can be provided.

  The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the matters described as the above-described embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

100 dummy chip

Claims (10)

A dummy frame used for evaluating a sealing resin when resin molding is performed on a semiconductor chip when mounted on a semiconductor mounting substrate,
A dummy substrate imitating a semiconductor mounting substrate;
A dummy chip that can be arranged on the dummy substrate and is manufactured separately to imitate the semiconductor chip,
At least one first protrusion is formed on at least one of the dummy chip and the dummy substrate,
The dummy chip has at least one recess formed therein,
The concave portion is coated with an adhesive for bonding to the dummy substrate,
The dummy chip is removable from the dummy substrate so that the first convex portion is maintained without being destroyed after the resin molding, and the first convex portion is sandwiched between the dummy chip and the dummy substrate. Used to evaluate the fluidity of the sealing resin when resin molding is performed and the resin filling property between the dummy chip and the dummy substrate in a state where the resin substrate is detachably disposed on the dummy substrate. ,
A dummy frame characterized by that. A connection member for connecting the first dummy chip and the second dummy chip included in the dummy chip; and
The dummy frame according to claim 1, wherein the dummy chip forms a dummy chip group through the connection member.   The dummy frame according to claim 1, wherein the dummy substrate is made of a transparent material. The dummy chip is a rectangle,
The recesses are formed at the four corners of the dummy chip,
The dummy frame according to claim 1 , wherein the dummy chip is formed with a protruding shape so as to surround the recess. The dummy substrate is formed with a recess or a through hole,
Said recess is a dummy frame according to claim 1, any one of 4, wherein the dummy chip is fitted. The dummy chip, the dummy frame according to claim 1, any one of 5, characterized by being composed of a transparent material. A dummy frame used for evaluating a sealing resin when resin molding is performed on a semiconductor chip when mounted on a semiconductor mounting substrate,
A dummy substrate imitating a semiconductor mounting substrate;
A dummy chip that can be arranged on the dummy substrate and imitates the semiconductor chip,
The dummy substrate is formed with a recess or a through hole,
It has a convex part member fitted in the concave part or the through hole,
The convex member has at least one convex portion on the first surface,
The dummy chip is a flat plate member, and is disposed on the convex portion of the first surface of the convex member. Used to evaluate the sealing resin when resin molding is performed on a semiconductor chip when mounted on a semiconductor mounting substrate, a dummy substrate imitating a semiconductor mounting substrate, and can be disposed on the dummy substrate, A convex member that can be incorporated into a dummy frame having a dummy chip imitating a semiconductor chip,
The dummy substrate is formed with a recess or a through hole,
The convex member is configured to be fitted into the concave portion or the through hole, has at least one convex portion on the first surface, and the dummy chip is disposed on the convex portion of the first surface. It is comprised so that it may be, The convex part member characterized by the above-mentioned. A step of evaluating resin fluidity of the resin mold using a dummy frame having a dummy chip and a dummy substrate on which the dummy chip is disposed;
At least one first protrusion is formed on at least one of the dummy chip and the dummy substrate,
The dummy chip has at least one recess formed therein,
The concave portion is coated with an adhesive for bonding to the dummy substrate,
The dummy chip is removable from the dummy substrate so that the first convex portion is maintained without being destroyed after the resin molding, and the first convex portion is sandwiched between the dummy chip and the dummy substrate. Used to evaluate the fluidity of the sealing resin when resin molding is performed and the resin filling property between the dummy chip and the dummy substrate in a state where the resin substrate is detachably disposed on the dummy substrate. ,
The resin fluidity | liquidity evaluation method characterized by the above-mentioned. A mold manufacturing method comprising a step of processing a mold for clamping a semiconductor mounting substrate on which an actual semiconductor chip is mounted based on the evaluation result of the resin fluidity evaluation method according to claim 9. Method.