JP2018016722A - Resin composition for bonding electronic component, method for bonding electronic component and electronic component mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition for bonding an electronic component which has good fillet forming property, obtains high adhesion even in bonding of a small-sized chip, and can be cured in a short time.SOLUTION: A resin composition for bonding an electronic component contains (A) an epoxy resin, (B) dicyandiamide, (C) a curing accelerator, (D) silver powder and (E) a diluent as essential components, where a softening point of (A) the epoxy resin is 30-100°C, (D) the silver powder contains (D-1) flaky silver powder having an average particle size Dof 5.0-9.0 μm of 50-70 mass% and (D-2) flaky silver powder having an average particle size Dof 0.8-3.0 μm of 30-50 mass% in (D) the silver powder, and contains (D) the silver powder of 600-900 pts.mass and (E) the diluent of 100-180 pts.mass with respect to (A) the epoxy resin of 100 pts.mass.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition for adhering electronic parts used when adhering chip parts (hereinafter referred to as electronic parts) such as semiconductor elements such as ICs, LSIs, and LEDs, and capacitors (hereinafter referred to as electronic parts) to metal frames, organic substrates, and the like. In addition, the present invention relates to an electronic component bonding method and an electronic component mounting substrate using the resin composition, and particularly suitable for bonding a small electronic component having a side of 1 mm or less as an electronic component. The present invention relates to an electronic component bonding method and an electronic component mounting substrate.

  Conventionally, an electronic component as described above is mounted on a metal piece called a lead frame and fixed with an adhesive called Au / Si eutectic method or die bonding paste, and then the lead part of the lead frame and the semiconductor element In general, these electrodes are connected to each other by a fine wire (bonding wire) and then housed in a package to obtain a semiconductor product. In recent years, semiconductor elements have been reduced in size in the field of LEDs and the like, and the adhesion area has been reduced, so that peeling of the semiconductor elements may occur.

  In order to prevent peeling of the semiconductor element, a die bond agent for forming a fillet having a specific thixoscope and having an appropriate shape and shape has been proposed (for example, see Patent Document 1). Moreover, the composition which prescribes | regulates the yield stress of a resin composition and tries to achieve the improved self-fillet is proposed (for example, refer patent document 2).

JP 2008-277421 A Special table 2011-514671 gazette

  However, due to further miniaturization of semiconductor elements, the conventionally proposed die-bonding agent has not been able to obtain satisfactory characteristics for a small electronic component having a side of 1 mm or less. Separation of electronic components due to heat history inside. For this reason, there has been a strong demand for the development of a die bond agent that does not peel even small electronic components and has sufficient connection reliability.

  The present invention has been made in view of the above-described circumstances, and provides a resin composition for bonding an electronic component that has good fillet formability and that can provide a high adhesive force even in bonding a small electronic component. Objective.

  Furthermore, the present invention provides an electronic component mounting substrate in which an electronic component bonding method using the electronic component bonding resin composition and the substrate and the electronic component are bonded via the electronic component bonding resin composition. It is also intended to provide.

  As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention have a specific curing system in which a specific silver powder and a diluent are each given a predetermined blending amount, thereby improving the fillet moldability. The inventors have found that a good resin composition can be obtained and have completed the present invention.

That is, the resin composition for adhering electronic components of the present invention essentially comprises (A) an epoxy resin, (B) dicyandiamide, (C) a curing accelerator, (D) silver powder, and (E) a diluent. A resin composition for adhering electronic components, which is an epoxy resin having a softening point of (A) epoxy resin of 30 to 100 ° C., and (D) silver powder is contained in (D) silver powder, ( D-1) having an average particle diameter _{D 50} of the flaky silver powder 50-70% by weight of 5.0~9.0μm (D-2) average particle diameter _{D 50} is 0.8~3.0μm flaky silver powder 30 to 50% by mass, and with respect to 100 parts by mass of the (A) epoxy resin, the silver powder (D) is 600 to 900 parts by mass, and the diluent (E) is 100 to 180 parts by mass. Part content.

  The method for adhering small components of the present invention is characterized in that an electronic component is bonded to a substrate using the resin composition for adhering an electronic component of the present invention.

  The electronic component mounting substrate of the present invention is characterized in that the substrate and the electronic component are bonded via the above-described resin composition for bonding an electronic component.

  According to the resin composition for bonding an electronic component and the bonding method of the electronic component of the present invention, when fixing the electronic component, since the fillet forming property is good, the adhesive strength when cured is good, and the conductivity is improved. Since it can be ensured sufficiently, a cured product having a low volume resistivity can be obtained.

  According to the electronic component mounting substrate of the present invention, since the electronic component is adhered on the substrate with good conductivity and stability, a highly reliable product can be obtained.

  Hereinafter, the resin composition for bonding electronic components, the bonding method for electronic components, and the electronic component mounting substrate of the present invention will be described in detail.

<Electronic component adhesive resin composition>
As described above, the conductive resin composition for bonding electronic parts of the present invention includes (A) an epoxy resin, (B) dicyandiamide, (C) a curing accelerator, (D) silver powder, and (E) dilution. And a resin composition for adhering electronic components. Then, (A) an epoxy resin, a softening point is the 30 to 100 ° C. an epoxy resin, (D) silver powder, in (D) silver powder, the (D-1) the average particle diameter _{D 50} 5.0 to 9.0-μm flaky silver powder 50-70% by mass and (D-2) flaky silver powder 30-50% by mass with an average particle diameter D ₅₀ of 0.8-3.0 μm, and (A) It contains 600-900 mass parts of (D) silver powder and 100-180 mass parts of diluent (E) with respect to 100 mass parts of epoxy resins.

  The (A) epoxy resin used in the present invention is not particularly limited as long as it is an epoxy resin having two or more glycidyl groups in one molecule and having a softening point of 30 to 100 ° C.

  This (A) epoxy resin should just be an epoxy resin which satisfy | fills the said characteristic, and can use various epoxy resins. This (A) epoxy resin may be used alone or in combination of a plurality of types, and when a plurality of types are used in combination, the softening point of the epoxy resin when used in combination may satisfy the above range.

  Examples of the (A) component epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, novolac type epoxy resin, ether or polyether type epoxy resin, ester or polyester epoxy resin, urethane. Epoxy resin, polyfunctional epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin, hydrogenated epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, ethylene oxide modified bisphenol A type epoxy resin, propylene oxide modified bisphenol A type epoxy resin, glycidyl modified polybutadiene resin, glycidyl modified triazine resin, silicone modified epoxy resin, aminophenol type epoxy resin, flexible epoxy resin, methacrylic modified Epoxy resin, acrylic modified epoxy resin, special modified epoxy resin, dicyclopentadiene type epoxy resin, side chain hydroxyl group alkyl modified epoxy resin, long chain alkyl modified epoxy resin, imide modified epoxy resin, carboxyl group terminated butadiene nitrile rubber (CTBN) modified An epoxy resin etc. are mentioned.

  Especially, as an epoxy resin of this (A) component, bisphenol type epoxy resins, such as a bisphenol A type epoxy resin and a bisphenol F type epoxy resin, are preferable from an adhesive viewpoint.

  As described above, the softening point of the epoxy resin of component (A) is 30 to 100 ° C. When the temperature is less than 30 ° C., fillets are not easily formed. When the temperature exceeds 100 ° C., a large amount of diluent to be blended for viscosity adjustment is taken into the cured product, which may lower the adhesive strength.

  Moreover, in this invention, you may mix | blend resin components other than (A) epoxy resin in order to further improve stress relaxation property, adhesiveness, etc. Examples of the resin that can be used in combination include acrylic resin, polyester resin, polybutadiene resin, polyimide resin, silicone resin, polyurethane resin, and xylene resin. These resin components may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  When other resins other than the epoxy resin are used in combination, another resin can be mixed up to 30 parts by mass with respect to 100 parts by mass of the (A) epoxy resin. In addition, when other resins other than the epoxy resin are used in combination, if more than 30 parts by mass of other resins are mixed, there is a concern about insufficient strength or poor fillet formation.

  (B) Dicyandiamide used in the present invention is a compound that functions as a curing agent for (A) an epoxy resin, and is a general-purpose compound that is usually used for adhesives used when bonding electronic components to substrates, etc. If it is.

  The blending amount of (B) dicyandiamide is preferably 3 to 10 parts by mass with respect to 100 parts by mass of (A) epoxy resin. If the blending amount is less than 3 parts by mass, the composition may not be cured sufficiently. If the blending amount exceeds 10 parts by mass, the thickening due to the reaction may be accelerated, and the pot life may be shortened.

  (C) The hardening accelerator used for this invention should just be a conventionally well-known thing as a hardening accelerator of an epoxy resin, and can be used without being restrict | limited in particular. This (C) curing accelerator may be used alone or in combination of two or more.

  Examples of the (C) curing accelerator include imidazole curing accelerators, amine curing accelerators, triphenylphosphine curing accelerators, diazabicyclo curing accelerators, urea curing accelerators, and borate salt curing accelerators. And polyamide curing accelerators. From the viewpoints of curability and adhesiveness, (C) the curing accelerator is preferably an imidazole curing accelerator or an amine curing accelerator, and more preferably an imidazole curing accelerator.

  Specific examples of the imidazole curing accelerator include, for example, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-1H- Imidazole, 4-methyl-2-phenyl-1H-imidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2,4-diamino-6- [2'-methylimidazolyl- (1 ' )]-Ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl -4-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazoli -(1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenyl-imidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 1-benzyl-2-phenylimidazole hydrochloride, 1-benzyl-2-phenylimidazolium trimellitate Etc.

  Specific examples of the amine curing accelerator include aliphatic amines such as ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, alicyclic and heterocyclic amines, modified polyamines, and guanidine. Organic acid hydrazide; diaminomaleonitrile; amine imide; boron trifluoride-piperidine complex; boron trifluoride-monoethylamine complex;

  The compounding quantity of a hardening accelerator has the preferable range of 1-10 mass parts with respect to a total of 100 mass parts of the epoxy resin which is (A) component. If the blending amount is less than 1 part by mass, it takes too much time for curing, and if it exceeds 10 parts by mass, the thickening due to the reaction is accelerated and the pot life may be shortened.

(D) Silver powder used for this invention is used in order to provide electroconductivity to resin hardened | cured material, and uses together 2 types of flaky silver powder from which an average particle diameter differs. The (D) silver powder, specifically, (D-1) and the average particle diameter _{D 50} of flaky 5.0~9.0μm silver powder, (D-2) having an average particle diameter _{D 50} of 0.8 And flaky silver powder having a size of ˜3.0 μm.

(D-1) the average particle diameter D ₅₀ of the flaky silver powder equal to or more than 5.0 .mu.m, the resin composition has a suitable viscosity, not more than 9.0 .mu.m, when with a coating of the resin composition or This is preferable because bleeding of the resin component during curing is suppressed. The flaky silver powder of (D-1) has the above average particle diameter and has a tap density of about 1.5 to 3.0 g / cm ³ , and a commercially available product can be used. If the tap density is 3.0 g / cm ³ or less, the composition has an appropriate viscosity, and if the tap density is 1.5 g / cm ³ or more, the resin when the composition is applied or cured. The bleeding of the component is suppressed, which is preferable.

If (D-2) flaked average particle diameter D ₅₀ of the silver powder is 0.8μm or more, the composition has an appropriate viscosity, long 3.0μm or less, good volume resistivity is obtained .

The average particle diameter D ₅₀ of the silver powder by a laser diffraction particle size distribution analyzer, is 50% cumulative value determined from the obtained particle size distribution on a volume basis.

  These silver powders contain 50 to 70% by mass of the flaky silver powder of the above (D-1) and 30 to 50% by mass of the flaky silver powder of the above (D-2) in the (D) silver powder. It is. As described above, if the ratio of silver powder having different average particle diameters is within this range, even a small electronic component can form a fillet of 1/3 or more of its thickness, and the volume resistance after curing. The rate can be lowered. (D-1) If the flaky silver powder is less than 50% by mass of the total silver powder content, the volume resistivity after curing will increase, and if (D-2) the flaky silver powder is less than 30% by mass, fillet formation proceeds. First, the adhesive strength also decreases.

  Unless the specification of the obtained adhesive composition for electronic components is impaired, the silver powder other than (D-1) and (D-2) may be included in (D) the silver powder. The total amount of (D-1) and (D-2) in the total silver powder is preferably 90% by mass or more, more preferably 95% by mass or more, and particularly preferably 100% by mass.

  Here, the flake shape of the flaky silver powder is a plate-like shape (a piece, see JISZ2500: 2000), which is also called a scale shape. Further, the silver powder other than (D-1) and (D-2) mentioned above is flake-like and deviated from the above average particle diameter, spherical shape, dendritic shape, fibrous shape, irregular shape, granular shape, needle shape, etc. This means silver powder having a shape other than the flake shape.

  Moreover, the compounding quantity of (D) silver powder is 600-900 mass parts with respect to 100 mass parts of epoxy resins, and the range of 700-800 mass parts is preferable. If the blending amount is less than 600 parts by mass, the conductivity may be lowered, and if it exceeds 900 parts by mass, the adhesive strength may be lowered.

  (E) Diluent used for this invention should just be able to adjust the viscosity of the resin composition for electronic component adhesion by diluting, A well-known thing can be used as a diluent of a resin composition. (E) As a diluent, a reactive diluent, a solvent, etc. are mentioned, These may be used individually or in combination of multiple types. Of these diluents, reactive diluents are preferred.

  As reactive diluents, 1,4-butanediol diglycidyl ether, n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, p-sec-butyl Phenyl glycidyl ether, glycidyl methacrylate, t-butylphenyl glycidyl ether, diglycidyl ether, (poly) ethylene glycol glycidyl ether, butanediol glycidyl ether, trimethylolpropane triglycidyl ether, 1,6-hexanediol diglycidyl ether It is done.

  Examples of the solvent include propylene glycol phenyl ether, diethylene glycol n-butyl ether, ethylene glycol n-butyl ether, propylene glycol methyl ether, diethylene glycol monobutyl ether acetate and the like, and propylene glycol phenyl ether is preferable among these solvents.

  The diluent is preferably blended in an amount of 100 to 180 parts by mass with respect to 100 parts by mass of the (A) epoxy resin. By setting it as such a compounding quantity, since the viscosity of the resin composition for electronic component adhesion | attachment obtained can be adjusted to arbitrary values and sufficient viscoelasticity is obtained, appropriate adhesive strength is obtained.

  At this time, the viscosity of the resin composition for adhering electronic components is 4.5 to 7.5 Pa · s measured at 25 ° C. and 50 rotations using a rheometer, and 25 ° C. using an E-type viscometer. It is preferable to satisfy a value measured with a 3 ° cone of 80 to 130 Pa · s. By satisfying these two ranges at the same time, even a small electronic component can form a fillet of 1/3 or more of its thickness.

  If the viscosity obtained by the viscometer is lower than 80 Pa · s, the paste flows at the time of application and the shape cannot be maintained. If it is higher than 130 Pa · s, stringing may occur at the time of application and the shape may not be good. Further, when the viscosity obtained by the rheometer is lower than 4.7 Pa · s, the adhesive flows in a horizontal direction with the chip when mounted, and when it is higher than 7.5 Pa · s, the chip may not be sufficiently wetted and spread. .

  In the resin composition for bonding electronic parts, in addition to the above-mentioned components, an adhesion aid such as a coupling agent, which is generally blended with this type of composition, as long as the effects of the present invention are not impaired, other A curing accelerator such as a solvent and an organic peroxide, an antifoaming agent, a colorant, a flame retardant, a thixotropic agent, and other additives can be blended as necessary.

  Examples of coupling agents include silane coupling agents such as 3-glycidoxypropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, and γ-mercaptopropyltrimethoxysilane, titanate coupling agents, and aluminum couplings. Agents, zirconate coupling agents, and zircoaluminate coupling agents. Among these coupling agents, a silane coupling agent is preferable, and 3-glycidoxypropyltrimethoxysilane is particularly preferable. A coupling agent may be used individually by 1 type, and 2 or more types may be mixed and used for it.

  This adhesive composition for electronic parts comprises (A) an epoxy resin, (B) dicyandiamide, (C) a curing accelerator, (D) silver powder, (E) a diluent, and components mixed as necessary. It can be easily prepared by kneading with a purse, kneader, three rolls, etc. and then defoaming. In this kneading, the mixing with a planetary stirrer is preferable. The planetary agitation device performs uniform agitation of the material by revolving the container containing the material at a high speed and simultaneously rotating on the revolution orbit. Specifically, Awatori Nertaro ARE-310 (trade name) manufactured by Shinky Corporation is used. By this kneading method, the dispersibility of the silver powder in the resin composition is increased, whereby the conductivity can be improved.

  The resin composition for bonding electronic parts of the present invention is excellent in fillet-forming properties, and high adhesiveness with a substrate can be obtained even in a small electronic part. That is, the resin composition for adhering electronic parts of the present invention is less likely to cause peeling of the electronic parts and can ensure high reliability.

  The resin composition of the present invention can be widely used as an adhesive for bonding an electronic component onto a substrate, and is particularly useful when applied to an adhesive for a small electronic component.

<Electronic component mounting board>
The electronic component mounting substrate of the present invention is an electronic component mounting substrate composed of a substrate and an electronic component fixed on the substrate, and the fixing of the substrate and the electronic component is performed as described above. It is characterized in that it is carried out using a resin composition for bonding parts.

  As the substrate and the electronic component used here, conventionally known ones can be used without any particular limitation. Examples of the electronic component include semiconductor components such as IC, LSI, and LED, and chip components such as a capacitor. Particularly, it is preferable that the electronic component is a small electronic component having one side of 1 mm or less.

  That is, the resin composition for adhering an electronic component of the present invention can be stably bonded even when the above-described small electronic component is bonded to a substrate. For example, even if a small electronic component has a thickness of about 0.3 mm, a fillet can be formed in about one third of the electronic component, thereby firmly bonding to the substrate.

  In order to obtain this electronic component mounting substrate, the resin composition for bonding an electronic component of the present invention is applied on the substrate, the electronic component is mounted thereon, and then cured and fixed. At this time, the resin composition for bonding an electronic component may be applied to the electronic component side, disposed on the substrate, and then cured and fixed.

  EXAMPLES Next, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited at all by these Examples.

(Examples 1-6 and Comparative Examples 1-8)
Each component was mixed according to the composition shown in Tables 1 and 2, and kneaded with three rolls to prepare a resin composition for bonding electronic parts. The obtained resin composition was applied onto a silver-plated copper frame, a 1 mm × 1 mm semiconductor chip was mounted thereon, heat-cured, and an electronic component mounting substrate in which a small semiconductor chip was bonded and fixed was manufactured. .

Details of each component used are as described below.
[Epoxy resin]
Epoxy resin 1: YD-134 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name; epoxy equivalent 230: semi-solid bisphenol A type epoxy resin)
Epoxy resin 2: YD-014 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name; epoxy equivalent 900: solid bisphenol A type epoxy resin)
Epoxy resin 3: YD-115G (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name; epoxy equivalent 180: liquid bisphenol A type epoxy resin)

[Curing agent]
Dicyandiamide: Nippon Carbide Industries Co., Ltd. Phenol resin: TD-2093 (manufactured by DIC Corporation, trade name; hydroxyl group equivalent 104 g / eq: novolac type phenol resin)
[Accelerator]
2P4MHZ-PW (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name; 2-phenyl-4-methyl-5-hydroxymethylimidazole)

[Silver powder]
Flaky silver powder 1: TC-101 (trade name; D ₅₀ 6.6 μm, TD: 1.9 g / cm ³ , SSA 1.0 cm ² / g, manufactured by Tokuri Chemical Laboratory Co., Ltd.)
Flaky silver powder 2: TC-910 (trade name; D ₅₀ 2.0 μm, TD: 4.8 g / cm ³ , SSA 1.1 cm ² / g, manufactured by Tokuri Chemical Laboratory Co., Ltd.)
Spherical silver powder 1: AgF-2.5S (trade name; D ₅₀ 2.5 μm, TD: 5.0 g / cm ³ , SSA 0.4 cm ² / g, manufactured by Tokuri Chemical Laboratory Co., Ltd.)

[Silane coupling agent]
KBM-403 (trade name; 3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.)
[Reactive diluent]
PEG (Sakamoto Pharmaceutical Co., Ltd., trade name: phenylglycidyl ether)

  The characteristics (viscosity, fillet formability) of the above resin composition for semiconductor adhesion and the cured product characteristics (adhesion strength, volume resistivity) of the resin composition for semiconductor adhesion are evaluated as follows, and the results are shown. These are also shown in Tables 1 and 2.

<Characteristics of resin composition>
(viscosity)
-Viscosity by E type viscometer Using an E type viscometer (3 ° cone) manufactured by Toki Sangyo Co., Ltd., the viscosity was measured under the conditions of 25 ° C. and 0.5 min ⁻¹ .
-Viscosity by rheometer Assuming mounting of a semiconductor chip using a rheometer ARES-G2 (trade name) manufactured by TA Instruments, a high shear rate of Shear rate 50 [1 / s] at 25 ° C The viscosity was measured.

(Fillet formation)
The height of the fillet when a 1 mm square (thickness 300 μm) semiconductor chip was mounted was measured. The obtained height was evaluated according to the following criteria with 1/3 of the thickness as a boundary.
○: 100 μm or more, ×: less than 100 μm

<Hardened product characteristics>
(Adhesive strength)
The obtained resin composition is applied onto a silver-plated copper frame, a 1 mm × 1 mm semiconductor element is mounted thereon, and is cured by heating at 160 ° C. for 30 minutes. A die shear strength measuring instrument manufactured by Nordson Advanced Technology, Inc. Was used to determine the adhesive strength at 25 ° C.

(Volume resistivity)
The obtained resin composition was applied and cured on a glass plate so that the thickness after curing was 0.03 mm, and then the volume resistivity at 25 ° C. was measured with a digital multimeter.

(Comprehensive evaluation)
Viscosity of resin by E-type viscometer 80 to 130 Pa · s, viscosity by rheometer 7.5 Pa · s or less, fillet formation ○, curing time 30 minutes or less, adhesive strength 30 N or more, volume resistivity 6 × 10 ⁻⁴ or less, Those that satisfy all of the above were accepted, and those that did not satisfy even one were rejected.

  From Tables 1 and 2, the resin composition which is an example of the present invention has better fillet-forming properties than the resin composition of the comparative example, and the adhesive strength of the cured product obtained by curing and The volume resistivity was also good. That is, it has been found that the resin composition of the present invention is a resin composition that can stably adhere even to a small electronic component and can ensure a good electrical conductivity.

Claims (7)

An electronic component adhesion resin composition comprising (A) an epoxy resin, (B) dicyandiamide, (C) a curing accelerator, (D) silver powder, and (E) a diluent,
The (A) epoxy resin is an epoxy resin having a softening point of 30 to 100 ° C.,
Wherein (D) silver powder, wherein (D) in the silver powder, (D-1) having an average particle diameter _{D 50} of the flaky silver powder 50-70% by weight of 5.0~9.0μm (D-2) average particle diameter _{D 50} is configured to include a flaky silver powder 30-50 wt% is 0.8～3.0Myuemu, a, and,
Resin for bonding electronic parts, characterized in that it contains 600 to 900 parts by mass of the (D) silver powder and 100 to 180 parts by mass of the diluent (E) with respect to 100 parts by mass of the (A) epoxy resin. Composition.   Regarding the viscosity of the resin composition for adhering electronic components, the viscosity measured at 25 ° C. and 50 rpm with a rheometer is 4.5 to 7.5 Pa · s and 25 with an E-type viscometer. The resin composition for electronic component adhesion according to claim 1, wherein the viscosity measured with a cone at 3 ° C. is 80 to 130 Pa · s.   The resin composition for bonding electronic components according to claim 1, wherein the (A) epoxy resin is a bisphenol-type epoxy resin.   An electronic component bonding method comprising bonding an electronic component to a substrate using the resin composition for bonding an electronic component according to any one of claims 1 to 3.   The electronic component bonding method according to claim 4, wherein the electronic component is a small electronic component having a side of 1 mm or less.   The board | substrate and electronic component are adhere | attached through the resin composition for electronic component adhesion | attachment of any one of Claims 1-3, The electronic component mounting board | substrate characterized by the above-mentioned.   The electronic component mounting substrate according to claim 6, wherein the electronic component is a small electronic component having a side of 1 mm or less.