JP2018006448A - Expansion device and expansion method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for formation of a sufficient distance between chips, while reducing the risk of occurrence of problems in the post-process.SOLUTION: An expansion device 1 includes expansion means 10 for expanding a sheet 8, holding means 40 for holding a workpiece, alignment means 50 for allowing the workpiece held by the holding means 40 to be positioned in a predetermined orientation for the sheet 8, an attachment roller 30 for attaching the sheet 8 to the workpiece, frame attachment rollers 33a, 33b for attaching the sheet 8 to an annular frame 2, and cut means 34 for cutting the sheet 8 along the annular frame 2. Since the expansion means 10 includes first clamp means 10A and second clamp means 10B for clamping the sheet 8 in a first direction, and third clamp means 10C and fourth clamp means 10D for clamping the sheet 8 in a second direction, a sufficient distance can be formed between the chips, and orientation of the workpiece can be defined uniformly for the annular frame 2, thereby occurrence of alignment failure can be reduced.SELECTED DRAWING: Figure 1

Description

  In the present invention, a sheet is attached and pasted to a workpiece in which a dividing starting point is formed along a plurality of intersecting scheduled lines or divided into individual chips along a plurality of intersecting scheduled lines. The present invention relates to an expansion device and an expansion method for expanding the attached sheet to form a space between adjacent chips.

  A workpiece such as a wafer has devices formed in regions partitioned by grid-like division lines on the surface of the workpiece, and by dividing along the division lines, each device chip having a device is formed. Divided. As a method of dividing a workpiece into individual device chips, a laser beam having a wavelength that is transmissive to the workpiece is irradiated to form a modified layer inside the workpiece, and then the workpiece is processed. A method of applying an external force to the workpiece to divide the workpiece is employed (see, for example, Patent Document 1 below). And as an example of the apparatus which gives external force to a workpiece, the expansion apparatus shown in following patent document 2 is utilized, for example.

  On the other hand, in the above method, after forming a modified layer inside the workpiece by laser beam irradiation, the workpiece is thinned by grinding and polishing, and the workpiece is divided in this thinning step. A method has also been proposed (see, for example, Patent Document 3 below). Since the workpieces divided by the dividing method are in a state where there is no gap between the divided chips and are in close contact with each other, there is a risk that adjacent chips will come into contact with each other and be damaged when handling the workpiece. . Therefore, in order to expand the sheet to which the workpiece is adhered and form a space between adjacent chips, the expansion device as described above is used.

  However, in the expansion device described above, since the sheet is expanded radially, the expansion amount of the sheet is almost equal in any direction. For this reason, for example, when the chip sizes are different in the vertical and horizontal directions, the distance between the chips is different, and even if a sufficient inter-chip distance is formed in one direction (for example, the vertical direction of the chip), the other direction (for example, the horizontal direction of the chip). In the direction), the distance between the chips becomes insufficient, and there is a possibility that adjacent chips come into contact with each other during handling. In view of this problem, the present applicant has proposed an expansion device that holds and pulls the four sides of the sheet (see, for example, Patent Document 4 below).

Japanese Patent No. 3408805 JP 2011-77482 A Japanese Patent No. 3762409 JP 2014-022382 A

  In the expansion device as described above, since the annular frame is adhered to the sheet after the sheet is expanded, if the work piece to be adhered to the sheet or the orientation of the annular frame is dispersed, the workpiece to the annular frame is processed. The direction of the object is not uniformly determined, and there is a problem that, for example, an alignment failure occurs when a subsequent pickup process is performed.

  The present invention has been made in view of the above circumstances, and in the case of expanding a sheet by attaching a sheet to a workpiece, a sufficient distance can be formed between chips and a problem may occur in a subsequent process. It aims at enabling it to reduce.

  In the present invention, a sheet having an adhesive surface is attached to a work piece divided into individual chips along a plurality of division lines, and the attached sheet is expanded to be spaced between adjacent chips. An expansion device for expanding a sheet on which a workpiece is adhered, and a workpiece to be adhered to the sheet above the sheet expanded by the expansion means A holding unit that holds the wearing surface facing the adhesive surface of the sheet, and a workpiece that is held by the holding unit, and has an imaging camera that images the workpiece held by the holding unit Is arranged to face the holding means via the sheet to which the workpiece is stuck, and is held by the holding means. An adhering roller for adhering the sheet to the workpiece, Frame holding means for holding an annular frame having an opening in the center on the upper side of the sheet expanded by the tension means so that the workpiece adhered to the sheet is positioned in the opening; A frame adhering roller for adhering the sheet to the annular frame disposed on the lower side of the sheet to which an object is adhered and held by the frame holding means; and the sheet to which a workpiece is adhered Cutting means that cuts the sheet along the annular frame that is disposed on the lower side of the frame and that is held by the frame holding means, and the expansion means is attached to the sheet in the first direction. A first clamping means and a second clamping means, which are arranged to face each other with a workpiece sandwiched therebetween, and are respectively attached to the sheet in a second direction orthogonal to the first direction. Facing each other across the workpiece And the third clamping means, the fourth clamping means, the first clamping means, and the second clamping means, each of which clamps the sheet, are movable in the first direction in a direction away from each other. Moving means for enabling the third clamping means and the fourth clamping means to move in directions away from each other in the second direction.

  The present invention also provides an adhesive surface on a workpiece in which a division starting point is formed along a plurality of intersecting scheduled lines or a workpiece divided into individual chips along a plurality of intersecting scheduled lines. A method of expanding a bonded sheet and expanding the bonded sheet so as to form a gap between adjacent chips, wherein the sheet wound in a roll shape at one end is sent out and sent out. A sheet feeding step for winding the sheet at the other end, a holding step for holding the workpiece by the holding means, and an image of the workpiece held by the holding means after the holding step is taken with an imaging camera. The workpiece is positioned in a predetermined direction with respect to the sheet fed in the sheet feeding step based on the captured image formed in this manner, and the workpiece is stuck on the adhesive surface of the sheet After performing the workpiece positioning step for facing the surfaces and the workpiece positioning step, the sheet is clamped by the first clamping means and the second clamping means facing each other with the workpiece sandwiched in the first direction. And a sandwiching step of sandwiching the sheet with the third sandwiching means and the fourth sandwiching means facing each other with the workpiece sandwiched in the second direction orthogonal to the first direction, and after performing the sandwiching step, A sticking step of pressing the sheet from the opposite side of the adhesive surface of the sheet and sticking the sheet to a workpiece, and a workpiece stuck to the sheet after performing the sticking step Releasing from the holding means, and after performing the release step, the first holding means and the second holding means with the first holding means and the second holding means holding the sheet Separate from each other After the first direction expansion step for expanding the sheet in the first direction and the release step, the third clamping means and the fourth clamping means hold the sheet. A second direction expansion step for expanding the sheet in the second direction by moving the third clamping means and the fourth clamping means away from each other; the first direction expansion step; and the second direction expansion step. In the state where the sheet is clamped by the first clamping means, the second clamping means, the third clamping means, and the fourth clamping means, the adhesive surface of the sheet is opened in the center. A frame positioning step for positioning a workpiece in the opening and a frame for adhering the sheet to the annular frame positioned facing the adhesive surface in the frame positioning step After performing the adhering step, the frame adhering step, the sheet cutting step for cutting the sheet along the annular frame, and after performing the sheet cutting step, the annular frame is covered with the sheet via the sheet. An unloading step of unloading the frame unit to which the workpiece is attached from the sheet.

  In the above expansion method, the workpiece has a first division planned line extending in the first direction and a second division planned line extending in the second direction orthogonal to the first direction, and the workpieces adjacent to each other. The second interval between the second scheduled division lines adjacent to each other is narrower than the first interval between the first scheduled division lines, and in the workpiece positioning step, the sheet is fed in the sheet feeding step. The workpiece is preferably positioned so that the first direction coincides with the feed-out direction.

  An expansion device according to the present invention includes an expansion unit that expands a sheet to which a workpiece is bonded, and a surface to be bonded of the workpiece that is bonded to the sheet above the sheet that is expanded by the expansion unit. Holding means for holding the adhesive surface facing the adhesive surface, and an imaging camera for imaging the workpiece held by the holding means, and the workpiece held by the holding means in a predetermined direction with respect to the sheet Alignment means that can be positioned on a frame, frame holding means that holds an annular frame, an adhesion roller that adheres a sheet to a workpiece held by the holding means, and an annular frame held by the frame holding means A frame adhering roller for adhering the sheet to the sheet and a cutting means for cutting the sheet along the annular frame held by the frame holding means, and the expansion means is adhered to the sheet in the first direction. Workpieces disposed opposite to each other with a work piece sandwiched between them, a first holding means and a second holding means for holding the sheet, and a work piece attached to the sheet in a second direction orthogonal to the first direction Since each of the third clamping means and the fourth clamping means for clamping the sheet is provided, the sheet is stuck to the workpiece and the workpiece is stuck in the expansion device. The attached sheet can be expanded, workability is improved as compared with the conventional one, and a sufficient distance can be formed between the chips. In addition, the alignment means can uniformly determine the direction of the workpiece with respect to the annular frame, and can reduce the possibility of alignment failure when, for example, a subsequent pickup process is performed.

  An expansion method according to the present invention includes a sheet feeding step of feeding a sheet wound in a roll shape at one end and winding the fed sheet at the other end, a holding step for holding a workpiece by a holding means, and a holding step Based on the captured image formed by imaging the workpiece held by the means with an imaging camera, the workpiece is positioned in a predetermined direction with respect to the sheet fed in the sheet feeding step, and on the adhesive surface of the sheet The workpiece is positioned between the workpiece positioning step in which the surface to be bonded of the workpiece faces and the first clamping means and the second clamping means facing each other with the workpiece sandwiched in the first direction. A sandwiching step of sandwiching the sheet by the third sandwiching means and the fourth sandwiching means facing each other with the workpiece sandwiched in the second direction orthogonal to the direction, and the reaction of the adhesive surface of the sheet An adhering step of pressing the sheet from the side and adhering the sheet to the workpiece; a releasing step of releasing the workpiece adhering to the sheet from the holding means; and a first clamping means and a second clamping means A first direction expansion step for expanding the sheet in the first direction by moving the first clamping means and the second clamping means away from each other while the sheet is clamped, and a third clamping means and a fourth clamping means. A second directional expansion step for expanding the sheet in the second direction by moving the third nip means and the fourth nip means away from each other in a state where the sheet is clamped; a first nip means; a second nip means; A frame positioning step in which an annular frame having an opening in the center faces the adhesive surface of the sheet and the workpiece is positioned in the opening in a state where the sheet is clamped by the three clamping means and the fourth clamping means; A frame adhering step for adhering a sheet to the annular frame positioned facing the adhesive surface in the positioning step; a sheet cutting step for cutting the sheet along the annular frame; and a work piece via the sheet on the annular frame And carrying out the step of carrying out the frame unit to which the sheet is adhered from the sheet, and before the object is adhered to the sheet, the object held by the holding means is imaged and formed by the imaging camera. Based on the captured image, the workpiece can be positioned in a predetermined direction with respect to the sheet, and the adherend surface of the workpiece can be opposed to the adhesive surface of the sheet, and the orientation of the workpiece with respect to the annular frame is uniform. For example, it is possible to reduce the possibility of alignment failure when performing a subsequent pickup process.

  The workpieces to be expanded by the above expansion method have a first division line extending in the first direction and a second division line extending in the second direction orthogonal to the first direction and are adjacent to each other. In the workpiece positioning step, when the second interval between the second scheduled division lines adjacent to each other is formed narrower than the first interval between the first scheduled division lines, the imaging camera captures an image of the workpiece. Since the orientation of the workpiece can be adjusted and positioned so that the first direction coincides with the feeding direction in which the sheet is fed in the sheet feeding step based on the image, a sufficient distance can be formed between the chips. .

It is a perspective view which shows the structure of an expansion apparatus. It is a disassembled perspective view which shows the structure of an expansion apparatus. It is an expansion perspective view which shows the structure of the 1st hierarchy of an expansion apparatus. It is an expansion perspective view which shows the structure of the 2nd hierarchy of an expansion apparatus. It is an expansion perspective view which shows the structure of the 3rd hierarchy of an expansion apparatus. It is a perspective view which shows the structure of a holding means. It is a perspective view which shows the structure of the tape holding means of a peeling unit. It is a perspective view which shows the structure of the bending roller moving means of a peeling unit. It is a perspective view which shows the structure of the peeling origin part production | generation means of a peeling unit. It is sectional drawing which shows a sheet | seat delivery step. It is sectional drawing which shows a workpiece carrying-in step. It is sectional drawing which shows a holding | maintenance step. It is sectional drawing which shows a workpiece positioning step. It is explanatory drawing of a workpiece positioning step. It is a top view which shows a clamping step. It is sectional drawing which shows a prior 1st direction expansion step. It is sectional drawing which shows a prior second direction expansion step. It is sectional drawing which shows a sticking step. It is sectional drawing which shows a release step. It is sectional drawing which shows the state which made the front-end | tip needle-shaped member approach the to-be-processed object among tape peeling steps. It is sectional drawing which shows the state which abutted the peripheral needle | hook side of the protective tape which stuck the front-end | tip needle-shaped member on the to-be-processed object among tape peeling steps. It is sectional drawing which shows the state which injected the high pressure air from the air nozzle toward the part by which the protective tape was peeled from the to-be-processed object among tape peeling steps. It is sectional drawing which shows the state which clamped the peripheral side of the protective tape with two clamping pieces among tape peeling steps. It is sectional drawing which shows the state which moved the bending roller and contacted the protective tape among tape peeling steps. It is sectional drawing which shows the state which has advanced peeling from a to-be-processed object, moving a bending roller and bending a protective tape among tape peeling steps. It is sectional drawing which shows the state which made the protective tape peel from the to-be-processed object, and was made to hold | maintain the protective tape to the lower surface of a holding plate among the tape peeling steps. It is sectional drawing which shows a 1st direction expansion step. It is sectional drawing which shows a 2nd direction expansion step. It is sectional drawing which shows a frame positioning step. It is sectional drawing which shows a frame sticking step. It is sectional drawing which shows a sheet | seat cutting step. It is sectional drawing which shows a carrying out step.

1 Expansion Device An expansion device 1 shown in FIG. 1 is an example of an expansion device that can expand a sheet 8 attached to a workpiece. The expansion device 1 has a three-layer structure, in which a device base 100a extending in the first direction in one layer portion, a device base 100b extending in the first direction in two layer portions, and a device base 100b extending in the first direction in two layer portions. And a pair of guide bases 103 extending in one direction. An opening 101 for communicating with the apparatus base 100a side is formed in the central portion of the apparatus base 100b. The guide rails 104 extending in the first direction are laid on the pair of guide bases 103, respectively. An annular frame supply unit 4 for accommodating a plurality of annular frames 2 having an opening 3 shown in FIG. 2 at the center is connected to the rear side in the first direction of the apparatus bases 100a and 100b.

  The expansion device 1 shown in FIG. 2 shows a state before the layers are connected and a state before the annular frame supply unit 4 is connected to the device bases 100a and 100b. The annular frame supply unit 4 includes, for example, a box-shaped frame stocker 5 for stacking and stocking the annular frames 2. Inside the frame stocker 5, a plurality (three in the example of FIG. 2) of columnar members 5a that are in contact with the inner peripheral surface of the annular frame 2 are erected at substantially equal intervals. The frame stocker 5 is connected to a cart 6 to which a plurality of casters 7 are attached. For example, the cart 6 can be driven by a caster 7 driven by a worker's human power as a power source.

  The pair of guide bases 103 includes a holding unit 40 that holds the workpiece, a peeling unit 60 that peels off the protective tape attached to the workpiece, and a frame holding unit 70 that holds the annular frame 2. ing. In the apparatus base 100 b, a feed reel 20 that feeds the sheet 8 wound in a roll shape, a take-up reel 21 that winds the fed sheet 8, and a sheet 8 between the feed reel 20 and the take-up reel 21. And an alignment unit 50 that enables the workpiece held by the holding unit 40 to be positioned in a predetermined direction with respect to the sheet 8. The apparatus base 100 a has a sticking roller 30 that is disposed on the lower side of the sheet 8 that is expanded by the expanding unit 10 and that is held by the holding unit 40. The release means 31 that holds the workpiece via the sheet 8 that is applied, and the annular frame 2 that is disposed on the lower side of the sheet 8 to which the workpiece is attached and is held by the frame holding means 70, Cutting for cutting the sheet 8 along the frame attaching rollers 33a and 33b to be attached and the annular frame 2 disposed on the lower side of the sheet 8 to which the workpiece is attached and held by the frame holding means 70. Means 34 and dividing means 35 for dividing the workpiece into individual chips by applying an external force to the workpiece. Hereinafter, the configuration of each layer of the expansion device 1 will be described in detail with reference to FIGS.

  In the first layer shown in FIG. 3, the adhering roller 30, the release means 31, the frame adhering rollers 33a and 33b, the cutting means 34 and the dividing means 35 are moved in the first direction by the first direction feeding means 37 in the apparatus base 100a. It is arranged to be movable. The first direction feeding means 37 includes a ball screw 370 extending in the first direction, a motor 371 connected to an end of the ball screw 370, a pair of guide rails 372 extending in parallel with the ball screw 370, and a first direction. And a movable base 373 that can move horizontally. A fixed base 310 and a second direction feeding means 38 are disposed on the moving base 373. One surface of the moving base 373 is in sliding contact with the pair of guide rails 372, and a ball screw 370 is screwed to a nut formed on the moving base 373. When the ball screw 370 is rotated by being driven by the motor 371, the moving base 373 is guided by the guide rail 372 and moved in the first direction, and the sticking roller 30, the release means 31, and the frame sticking roller. 33a, 33b, cutting means 34 and dividing means 35 can be moved in the first direction.

  The frame sticking rollers 33a and 33b, the cutting means 34, and the dividing means 35 are further arranged on the moving base 373 so as to be movable in the second direction by the second direction feeding means 38. The second direction feeding means 38 includes a ball screw 380 extending in the second direction, a motor 381 connected to an end of the ball screw 380, a pair of guide rails 382 extending in parallel with the ball screw 380, and a second direction. And a movable base 383 that can move horizontally. A rotary table 36 is disposed on the moving base 383. One surface of the moving base 383 is in sliding contact with the pair of guide rails 382, and a ball screw 380 is screwed to a nut formed at the center of the moving base 383. Then, when the ball screw 380 is rotated by being driven by the motor 381, the moving base 383 is guided by the guide rail 382 and moves in the second direction, and the frame sticking rollers 33a and 33b, the cutting means 34, and the division means The means 35 can be moved in the second direction.

  The sticking roller 30 is disposed on the upper surface of the fixed base 32 fixed on the moving base 373. The sticking roller 30 extends in a second direction orthogonal to the first direction, and is supported by the support portion 300 so as to be rotatable about a shaft portion 301 having an axis in the second direction. Moreover, the sticking roller 30 can be moved up and down by an elevating mechanism constituted by, for example, an air cylinder 302 and a piston 303.

  The release means 31 is disposed in the vicinity of the sticking roller 30 and on the upper surface of the fixed base 32. The release means 31 includes a release table 311 that holds the workpiece by suction. Although not shown, the release table 311 is connected to a suction source, and the workpiece can be sucked and held on the upper surface of the release table 311. For example, each lifting mechanism including an air cylinder 312 and a piston 313 is connected to the lower part of the release table 311, and the release table 311 can be lifted and lowered by each lifting mechanism.

  The frame sticking rollers 33 a and 33 b are pressing rollers that press the sheet 8 against the annular frame 2, and are rotatable about the shaft portion 330. A cutting means 34 is disposed between the frame sticking rollers 33a and 33b. The cutting means 34 is a cutter, for example, and is rotatable around the shaft portion 340. The frame adhering rollers 33a and 33b and the cutting means 34 can be moved up and down by an elevating mechanism including, for example, an air cylinder and a piston. The frame sticking rollers 33a and 33b and the cutting means 34 are disposed on the rotary table 36. When the rotary table 36 rotates, the frame sticking rollers 33a and 33b and the cutting means 34 are, for example, the annular frame 2. Can be circulated along. Note that the number of the frame sticking rollers 33a and 33b and the cutting means 34 is not limited to the configuration shown in the present embodiment.

  The dividing means 35 includes a squeegee 350 that is disposed at the center of the rotary table 36 and extends in a second direction orthogonal to the first direction. The squeegee 350 has a slit 351 connected to a suction source. The squeegee 350 can be moved up and down by an elevating mechanism constituted by, for example, an air cylinder 352 and a piston 353. When the rotary table 36 is rotated by 90 °, for example, the direction of the extending direction of the squeegee 350 is matched with the planned division line of the workpiece facing the first direction and the planned division line of the workpiece facing the second direction, respectively. Can do. In the dividing means 35, the workpiece can be divided into individual chips by sucking the scheduled division line of the workpiece with the squeegee 350 through the slit 351.

  Next, the configuration of the second hierarchy shown in FIG. 4 will be described. A delivery reel 20 is disposed on the rear side in the first direction of the apparatus base 100b, and a take-up reel 21 is disposed on the front side in the first direction of the apparatus base 100b. The sheet 8 is wound around the feed reel 20 in a roll shape. On the lower side of the delivery reel 20, a delivery roller 22 for delivering the sheet 8 from the delivery reel 20 in the first direction is disposed. On the take-up reel 21, the sheet 8 fed from the feed reel 20 is wound in a roll shape. Below the take-up reel 21, take-in rollers 23 and 24 that draw the sheet 8 fed in the first direction by the feed roller 22 and take up the take-up reel 21 are disposed.

  An expansion means 10 is disposed on the upper surface of the apparatus base 100 b between the feed reel 20 and the take-up reel 21. The expansion means 10 are disposed opposite to each other with the workpiece adhered to the sheet 8 in the first direction, and each of the expansion means 10 includes a first clamping means 10A and a second clamping means 10B that sandwich the sheet 8. A third clamping means 10C and a fourth clamping means 10D, which are arranged opposite to each other with the workpiece adhered to the sheet 8 in a second direction orthogonal to the first direction, and each sandwich the sheet 8. It has.

  The first clamping means 10A and the second clamping means 10B include a lower clamping mechanism 11a that presses the lower surface of the sheet 8, an upper clamping mechanism 12a that presses the upper surface of the sheet 8, and a recess formed on the upper surface of the apparatus base 100b. A movable base 13a movably arranged along 102a, and a first direction moving means 14a for moving the first holding means 10A and the second holding means 10B in directions away from each other in the first direction, respectively. I have.

  The third clamping means 10C and the fourth clamping means 10D include a lower clamping mechanism 11b that presses the lower surface of the sheet 8, an upper clamping mechanism 12b that presses the upper surface of the sheet 8, and a recess formed on the upper surface of the apparatus base 100b. A movable base 13b movably disposed along 102b, and second direction moving means 14b for moving the third clamping means 10C and the fourth clamping means 10D in directions away from each other in the second direction, respectively. I have.

  The lower holding mechanism 11 a includes a lower holding part 110 having a rectangular parallelepiped shape extending in the second direction, and an arm part 111 having a substantially L-shaped cross section whose one end is connected to the lower holding part 110. On the upper surface side of the lower clamping unit 110, a plurality of rollers 113 are arranged in a direction parallel to the second direction. The plurality of rollers 113 provided in the lower clamping mechanism 11a are rotatable around a rotation axis parallel to the first direction, and are mounted so that about half of the outer peripheral surface protrudes from the upper surface of the lower clamping unit 110. .

  The upper clamping mechanism 12 a includes an upper clamping unit 120 extending in parallel with the lower clamping unit 110, and an arm unit 121 having a substantially L-shaped cross section whose one end is connected to the upper clamping unit 120. A plurality of rollers (not shown) are arranged in a direction parallel to the second direction. The plurality of rollers provided in the upper clamping mechanism 12a can be rotated around a rotation axis parallel to the first direction, and about half of the outer peripheral surface protrudes from the lower surface of the upper clamping unit 120 and is mounted.

  The lower clamping mechanism 11b includes a rectangular parallelepiped lower clamping part 110 extending in the first direction, and an arm part 112 having an end connected to the lower clamping part 110 and extending in the second direction. On the upper surface side of the lower clamping unit 110, a plurality of rollers 113 are arranged in a direction parallel to the first direction. The plurality of rollers 113 provided in the lower clamping mechanism 11b are rotatable around a rotation axis parallel to the second direction, and are mounted so that about half of the outer peripheral surface protrudes from the upper surface of the lower clamping unit 110. .

  The upper clamping mechanism 12 b includes an upper clamping unit 120 extending in parallel with the lower clamping unit 110 and an arm unit 122 having one end connected to the upper clamping unit 120 and extending in parallel with the arm unit 112. A plurality of rollers (not shown) are arranged on the lower surface side of the upper clamping unit 120 in alignment with a direction parallel to the first direction. The plurality of rollers provided in the upper clamping mechanism 12b can rotate around a rotation axis parallel to the second direction, and are mounted so that about half of the outer peripheral surface protrudes from the lower surface of the upper clamping unit 120.

  The first direction moving means 14a includes a ball screw 140 extending in the first direction, a bearing portion 141 that rotatably supports one end of each ball screw 140, and a motor 142 connected to the other end of each ball screw 140. The device base 100b is disposed respectively. The second direction moving means 14b includes a ball screw 140 extending in the second direction, a bearing portion 141 that rotatably supports one end of each ball screw 140, and a motor 142 connected to the other end of each ball screw 140. Are disposed on the apparatus base 100b.

  The movable base 13a includes a support portion 130 that supports the lower holding portion 110 and the upper holding portion 120, a slide portion 131 that is connected to the lower portion of the support portion 130 and is movable in the first direction, and one of the support portions 130. A guide rail 132 formed on the surface side and a guide groove 133 formed so as to penetrate from one surface side of the support portion 130 to the other surface side are provided. A ball screw 140 is screwed into a nut formed inside the slide portion 131, and the slide portion 131 can be reciprocated in the first direction by driving the ball screw 140 by the motor 142.

  The movable base 13b includes a support portion 134 having a substantially L-shaped cross section that supports the lower holding portion 110 and the upper holding portion 120. A slide portion 135 that is movable in the second direction is provided below the support portion 134. Are connected. A ball screw 140 is screwed into a nut formed inside the slide part 135, and the slide part 135 can be reciprocated in the second direction by driving the ball screw 140 by the motor 142.

  The movable base 13a and the movable base 13b are provided with a lower lifting means 15 for raising and lowering the lower clamping mechanism 11a and the lower clamping mechanism 11b, and an upper lifting means 16 for raising and lowering the upper clamping mechanism 12a and the upper clamping mechanism 12b. Is disposed along the guide groove 133. The lower lifting / lowering means 15 includes a ball screw 150 extending in the vertical direction, a bearing portion 151 connected to one end of the ball screw 150, and a motor 152 connected to the other end of the ball screw 150. The ball screw 150 is screwed into a nut formed on the base end portion 111a of the arm portion 111 and the base end portion 112a of the arm portion 112, and the ball screw 150 is driven by the motor 152, whereby the lower clamping mechanism 11a and The lower clamping mechanism 11b can be raised and lowered in the vertical direction.

  The upper lifting / lowering means 16 has the same configuration as the lower lifting / lowering means 15, and includes a ball screw 160 extending in the vertical direction, a bearing portion 161 connected to one end of the ball screw 160, and a motor connected to the other end of the ball screw 160. 162. The ball screw 160 is screwed into nuts formed on the base end portion 121a of the arm portion 121 and the base end portion 122a of the arm portion 122, and the ball screw 160 is driven by the motor 162, whereby The clamping mechanism 12b can be raised / lowered in the vertical direction.

  In the expansion means 10 configured in this way, the sheet 8 fed from the feed reel 20 passes between the lower clamping mechanisms 11a and 11b and the upper clamping mechanisms 12a and 12b and is wound on the take-up reel 21. In this state, the upper and lower surfaces of the sheet 8 are clamped by the lower clamping mechanisms 11a and 11b and the upper clamping mechanisms 12a and 12b, and the first clamping means 10A, the second clamping means 10B, the third clamping means 10C, and the fourth clamping mechanism. The sheet 8 can be expanded by the means 10D moving in directions away from each other in the first direction and the second direction.

  An alignment unit 50 is disposed on the front side in the first direction of the apparatus base 100b. The alignment unit 50 includes an imaging camera 51 that captures an image of the workpiece held by the holding unit 40 illustrated in FIG. 2 from below. The imaging camera 51 is configured by, for example, an IR camera. The alignment unit 50 includes a CPU, a memory, and the like. For example, when a target pattern is formed on each chip of the workpiece, the alignment unit 50 captures an image of the target pattern captured by the imaging camera 51 and the target pattern registered in the memory of the alignment unit 50 in advance. By performing pattern matching with the captured image, the workpiece held by the holding means 40 can be positioned in a predetermined direction with respect to the sheet 8.

  Next, the configuration of the third hierarchy shown in FIG. 5 will be described. The frame holding means 70 is disposed on the rear side in the first direction of the pair of guide bases 103. The frame holding means 70 includes a circular plate-like frame holding portion 71 that holds the annular frame 2 shown in FIG. The frame holding unit 71 is connected to an elevating unit 700 that moves the entire unit up and down. The elevating unit 700 is an elevating mechanism having, for example, an air cylinder and a piston, or a motor and a guide rail, and is connected to a traveling unit 701 having a substantially L-shaped cross section. An opening 702 is formed in the traveling unit 701, and the elevating unit 700 moves up and down in the opening 702 to raise and lower the frame holding unit 71. The traveling unit 701 can travel in the first direction along the pair of guide rails 104. Then, the frame holding means 70 can move upward of the annular frame supply unit 4 shown in FIG. 2 and enter the inside of the frame stocker 5 to carry out and carry in the annular frame 2.

  The holding means 40 is disposed on the front side in the first direction of the pair of guide bases 103. As shown in FIG. 6, the holding means 40 supports a holding table 41 having a holding surface 41a for holding a workpiece, a rotating table 42 for rotating the holding table 41, and the holding table 41 and the rotating table 42 from below. A rotating shaft 44 that is pivoted through the base 43 and reverses the holding surface 41a of the holding table 41, and a portal-shaped support portion 45 that is rotatably supported at the end of the rotating shaft 44. . The support unit 45 is supported by the moving unit 400. The moving unit 400 is an elevating mechanism having, for example, an air cylinder and a piston, or a motor and a guide rail, and includes a traveling unit 401 having a substantially L-shaped cross section. An opening 402 is formed in the traveling unit 401, and the moving unit 400 can raise and lower the holding table 41 in the opening 402. On the inner wall 401a of the traveling unit 401, a pair of guide rails 403 and a movable plate 404 having a moving unit 400 connected to one surface are disposed. One surface of the movable plate 404 is in sliding contact with the pair of guide rails 403. Then, when the movable plate 404 moves in the second direction along the guide rail 403, the moving unit 400 can be moved in the second direction.

  As shown in FIG. 5, the peeling unit 60 is disposed between the holding unit 40 and the frame holding unit 70. The peeling unit 60 is a tape peeling unit for peeling off the protective tape attached to the workpiece. The peeling unit 60 includes a tape holding means 60A shown in FIG. 7 for sandwiching the protective tape, a folding roller moving means 60B shown in FIG. 8 for bending the protective tape peeled off from the workpiece, and a protection peeled off from the workpiece. It is constituted by a peeling start point generating means 60C shown in FIG. 9 for generating a tape peeling start point, and the three means are accommodated in a frame 600, for example. The lower side of the frame 600 is open. An elevating part 601 is connected to the frame body 600. The elevating unit 601 is an elevating mechanism having, for example, an air cylinder and a piston, or a motor and a guide rail, and is connected to a traveling unit 602 having a substantially L-shaped cross section. An opening 603 is formed in the traveling unit 602, and the lifting / lowering unit 601 can lift and lower the entire frame 600 through the opening 603.

  As shown in FIGS. 7A to 7C, the tape holding means 60A includes a first air cylinder 61a and a holding base 62 supported by a shaft 610a that is driven by the first air cylinder 61a and extends in the vertical direction. A second air cylinder 61b erected on the upper surface of the holding base 62, and a shaft 610b that penetrates from the second air cylinder 61b to the lower surface side of the holding base 62 and is driven by the second air cylinder 61b. A holding plate 63 to be supported, a third air cylinder 61c which is disposed on the holding base 62 and has a clamping piece 611 at its end and which can move forward and backward in the horizontal direction, and advances and retracts in the horizontal direction. It is comprised by the clamping piece 612 arrange | positioned in the position facing the clamping piece 611 on the lower surface side.

  The inside of the holding plate 63 is hollow, and a large number of micro holes (not shown) are provided on the entire bottom surface. The inside of the holding plate 63 is connected to the inside of the holding plate 63 via the shaft 610b connecting the second air cylinder 61b and the holding plate 63. Can be sucked, and a negative pressure can be generated on the lower surface of the holding plate 63 through the minute holes.

  The holding base 62 is configured to be movable up and down together with a shaft 610a that is driven to move forward and backward by the first air cylinder 61a. Further, as shown by an arrow in FIG. 7B, the holding base 62 is horizontally oriented around the shaft 610a. It can be rotated.

  As shown in FIG. 8, the folding roller moving means 60B is configured by a support frame 64 having a gate shape, and the support frame 64 includes column portions 640 and 640a arranged in parallel at intervals, a column portion 640, A support portion 641 connected to the lower end of 640a, and a folding roller 65 that moves along a guide hole 642 of the support portion 641 by a drive mechanism (not shown) built in the support portion 641 are provided. The bending roller 65 is rotatable about the axial center in the longitudinal direction, and its length is at least longer than the diameter of the protective tape attached to the workpiece.

  As shown in FIG. 9, the peeling start point generating means 60C includes a fourth air cylinder 61d, a shaft 610d extending from the fourth air cylinder 61d and capable of moving forward and backward and finely adjusting the position in the height direction, and an arm member 66. A tip member 67 provided at the tip of the arm member 66, a tip needle-like member 68 attached to the tip member 67, and an air nozzle 69. The tip member 67 is configured to be movable up and down, and the tip portion of the tip needle-like member 68 can be positioned at the height of the protective tape attached to the workpiece by adjusting the height position thereof. Has been. The air nozzle 69 is configured to be supplied with high-pressure air via the fourth air cylinder 61d and the shaft 610d, and to eject high-pressure air as necessary.

As described above, the expansion device 1 according to the present invention is adhered to the sheet 8 above the sheet 8 expanded by the expansion unit 10 and the expansion unit 10 that expands the sheet 8 on which the workpiece is adhered. A holding unit 40 that holds the workpiece to be adhered in a state of facing the adhesive surface 8 a of the sheet 8, and an imaging camera 51 that captures an image of the workpiece held by the holding unit 40. Alignment means 50 that makes it possible to position the work piece held at 40 in a predetermined direction with respect to the sheet 8, frame holding means 70 that holds the annular frame 2, and work piece that is held by the holding means 40 An attachment roller 30 for attaching the sheet 8 to the object, a frame attachment roller 33a, 33b for attaching the sheet 8 to the annular frame 2 held by the frame holding means 70, and a frame holding means 70. Cutting means 34 for cutting the sheet 8 along the frame 2, and the expansion means 10 are arranged opposite to each other with the work piece attached to the sheet 8 in the first direction. The first clamping means 10A and the second clamping means 10B for clamping the sheet 8 are disposed opposite to each other with the workpiece adhered to the sheet 8 in the second direction orthogonal to the first direction, respectively. Is provided with the third clamping means 10C and the fourth clamping means 10D for clamping the sheet 8, so that the sheet 8 is adhered to the workpiece and the sheet 8 to which the workpiece is adhered is expanded in the expansion device 1. As a result, the workability is improved as compared with the prior art, and a sufficient distance can be formed between the chips.
Further, since the orientation of the workpiece to be adhered to the sheet 8 can be adjusted by the alignment means 50, the orientation of the workpiece with respect to the annular frame 2 can be determined uniformly. It is possible to reduce the possibility of alignment failure when the pickup process is performed.

2 Expansion Method Next, the expansion device 1 is used to attach the sheet 8 to the workpiece divided into individual chips, and expand the sheet 8 to form a space between adjacent chips. A method will be described. A workpiece to which the present invention is applied is a workpiece in which a division starting point (for example, a modified layer) is formed along a planned division line, or a workpiece divided into individual chips along a planned division line. It is a thing.

(1) Sheet Feeding Step As shown in FIG. 10, the sheet 8 wound in a roll shape from the feed reel 20 on one end side is fed in the first direction by the feed roller 22, and the fed sheet 8 is pulled in the drawing roller 23. , 24 and take-up by the take-up reel 21. At this time, the upper surface of the fed sheet 8 exposed upward is an adhesive surface 8a having adhesiveness. The sheet 8 used in the present embodiment is not particularly limited. For example, an expanded sheet in which an adhesive layer is laminated on a base material layer such as polyolefin or polyvinyl chloride is used.

(2) Workpiece carrying-in step As shown in FIG. 11, the wafer W is carried into the holding means 40. The wafer W is an example of a workpiece, and a device is formed in each region partitioned by a plurality of division lines that intersect the surface Wa. A protective tape T for protecting the device is attached to the surface Wa of the wafer W. The back surface opposite to the front surface Wa is a surface to be bonded Wb that is bonded to the sheet 8 in the bonding step described later. In the wafer W shown in the present embodiment, for example, a modified layer is formed inside the wafer W along a division planned line by irradiation of a laser beam, and is thinned by, for example, a grinding apparatus and divided into individual chips starting from the modified layer. Has been.

  For example, the wafer W is carried into the holding means 40 by the robot hand 80. The robot hand 80 moves to the upper side of the holding means 40 while holding the adherend surface Wb of the wafer W. At this time, it is preferable that the holding means 40 stands by with the holding surface 41a of the holding table 41 facing upward. As a result, since the robot hand 80 can directly carry the wafer W into the holding table 41 without inverting the front and back of the wafer W after grinding / cleaning is completed, the risk of damage to the wafer W in a state of being separated into individual chips. Can be reduced. An operator may carry the wafer W directly into the holding table 41.

(3) Holding Step As shown in FIG. 12, the wafer W is held by the holding means 40. Specifically, a suction force of a suction source (not shown) is applied to the holding surface 41a of the holding table 41, and the surface Wa side of the wafer W is sucked and held via the protective tape T. Subsequently, with the holding surface 41a of the holding table 41 holding the surface Wa side of the wafer W, the rotating shaft 44 shown in FIG. 6 rotates to reverse the holding surface 41a of the holding table 41, and the wafer W is attached. The surface Wb faces downward.

(4) Workpiece positioning step After performing the holding step, as shown in FIG. 13, the wafer W held by the holding means 40 is imaged by the imaging camera 51, and the orientation of the wafer W is determined based on the captured image. By adjusting, the wafer W is positioned in a predetermined direction with respect to the sheet 8 fed in the sheet feeding step, and the adherend surface Wb of the wafer W faces the adhesive surface 8a of the sheet 8.

  As shown in FIG. 14, each chip C of the wafer W is formed with a target pattern TP that serves as a reference for alignment when positioned on the sheet 8. In addition, the wafer W has a first scheduled division line S1 extending in the first direction and a second scheduled division line S2 extending in the second direction orthogonal to the first direction. When the chip C formed in the region partitioned by the planned division line S2 is a long chip, the number of planned division lines is different in the first direction and the second direction, and therefore the amount of expansion of the wafer W is different. In the illustrated example, the number of second scheduled division lines S2 extending in the second direction is larger than the first planned division line S1 extending in the first direction, and the wafer W is to be expanded radially evenly. Then, the second interval h2 between the second scheduled division lines S2 adjacent to each other is formed narrower than the first interval h1 between the first scheduled division lines S1 adjacent to each other.

  Here, when the imaging camera 51 shown in FIG. 13 images the surface Wb of the wafer W to form the captured image 500, the captured image of the target pattern TP registered in the alignment unit 50 in advance is used. Perform pattern matching. Based on the result of the pattern matching, the orientation of the wafer W with respect to the sheet 8 is adjusted. That is, after the travel unit 401 shown in FIG. 5 travels to a desired position, the angle is adjusted by the rotation of the rotary table 42, and the division schedule line (the first division schedule) with the wider distance between the chips C is adjusted. The extending direction of the line S1) is made to coincide with the feeding direction (first direction) of the sheet 8. Then, the holding table 41 is lowered by the moving unit 400 so that the adherend surface Wb of the wafer W faces the adhesive surface 8a of the sheet 8 at a position about several mm above the sheet 8. In the present embodiment, the case where the target pattern TP is detected and the orientation of the wafer W is adjusted has been described. However, the present invention is not limited to this case. For example, when a notch is formed on the outer periphery of the wafer W, The orientation of the wafer W may be adjusted by detecting the notch with the imaging camera 51. When detecting the notch, a camera other than the IR camera may be used.

(5) Nipping Step After performing the workpiece positioning step, as shown in FIG. 15, the sheet 8 is held between the first clamping means 10 </ b> A and the second clamping means B facing each other across the wafer W in the first direction. While sandwiching, the sheet 8 is sandwiched between the third sandwiching means 10C and the fourth sandwiching means 10D facing each other across the wafer W in the second direction orthogonal to the first direction. First, the two first direction moving means 14a are operated, and the slide portions 131 shown in FIG. 4 are horizontally moved in the first direction so that the first holding means 10A and the second holding means 10B approach each other. Further, the two second direction moving means 14b are operated to horizontally move the slide portions 135 in the second direction so that the third holding means 10C and the fourth holding means 10D approach each other. In this way, the first clamping means 10A, the second clamping means 10B, the third clamping means 10C, and the fourth clamping means 10D are brought close to each other.

  At this time, the sheet 8 extending in the first direction is connected to the lower clamping portions 110 shown in FIG. 4 in the first clamping means 10A, the second clamping means 10B, the third clamping means 10C, and the fourth clamping means 10D. It is positioned between each upper clamping part 120. Next, each lower lifting / lowering means 15 is operated to raise each lower clamping part 110 and each upper lifting / lowering means 16 is operated to lower each upper clamping part 120. The roller 113 of the lower clamping unit 110 presses the lower surface of the sheet 8, and the roller 123 of the upper clamping unit 120 presses the upper surface of the sheet 8, thereby clamping the upper and lower surfaces of the sheet 8.

(6) Advance first direction expansion step If the sheet 8 is bent in the first direction before performing the adhering step after performing the clamping step, as shown in FIG. Then, the sheet 8 is expanded to eliminate the bending of the sheet 8. Specifically, the first clamping means 10A and the second clamping means 10B are moved away from each other while the first clamping means 10A and the second clamping means 10B clamp the upper and lower surfaces of the sheet 8. That is, the two first direction moving means 14a shown in FIG. 13 are operated, and the slide parts 131 shown in FIG. 4 are moved to the recesses 102a so that the first holding means 10A and the second holding means 10B are separated from each other. , The sheet 8 held by the roller 113 of each lower holding part 110 and the roller 123 of each upper holding part 120 is pulled outward, respectively. As a result, the sheet 8 is stretched in the first direction and the bending is eliminated.

(7) Advance Second Direction Expansion Step Next, when the sheet 8 is bent in the second direction, the sheet 8 is expanded in the second direction to eliminate the bending of the sheet 8 as shown in FIG. To do. With the third clamping means 10C and the fourth clamping means 10D holding the upper and lower surfaces of the sheet 8, the third clamping means 10C and the fourth clamping means 10D are moved away from each other. That is, the two second-direction moving means 14b shown in FIG. 15 are operated, and each slide part 135 shown in FIG. 4 is moved to the recess 102b so that the third holding means 10C and the fourth holding means 10D are separated from each other. Then, the sheet 8 is horizontally moved in the second direction, and the sheet 8 held by the roller 113 of each lower holding unit 110 and the roller 123 of each upper holding unit 120 is pulled outward. As a result, the sheet 8 is stretched in the second direction and the bending is eliminated.

  In the present embodiment, the preliminary second direction expansion step is performed after the preliminary first direction expansion step is performed. However, the present invention is not limited to this, and the preliminary first direction expansion step and the preliminary second direction expansion step are performed simultaneously. The sheet 8 may be expanded in the first direction after the sheet 8 is expanded in the second direction. The expansion amount in the first direction and the expansion amount in the second direction of the seat 8 may be the same or different. However, the expansion amount in the first direction and the expansion amount in the second direction of the sheet 8 may be appropriately set according to the degree of bending of the sheet 8.

(8) Adhesion step After performing the clamping step (after performing the preliminary first direction expansion step and preliminary second direction expansion step), as shown in FIG. 18, the opposite side of the adhesive surface 8a of the sheet 8 Then, the sheet 8 is pressed to adhere the sheet 8 to the wafer W. Specifically, when the piston 303 is raised in the air cylinder 302, the sticking roller 30 is brought into contact with the lower surface of the sheet 8. Subsequently, while rotating the sticking roller 30, the lower surface of the sheet 8 is pressed upward, and the first base feeding means 37 shown in FIG. 3 is used to move the moving base 373 in the first direction so that the sticking roller 30 is rotated. Move. The adhesive surface 8a of the sheet 8 is adhered to the entire surface of the adherend surface Wb by pressing the sheet 8 toward the adherend surface Wb of the wafer W in accordance with the pressing of the sticking roller 30 that rolls. Thereafter, the piston 303 is lowered in the air cylinder 302, and the sticking roller 30 is retracted from the sheet 8. At this time, the upper and lower surfaces of the sheet 8 are clamped by the first clamping means 10A, the second clamping means 10B, and the third clamping means 10C and the fourth clamping means 10D shown in FIG. Maintained until the step is complete.

(9) Release Step After performing the sticking step, the wafer W stuck to the sheet 8 is released from the holding means 40 as shown in FIG. Specifically, the moving base 37 is moved in the first direction by the first direction feeding means 37 shown in FIG. 3, and the release table 311 is moved in the first direction. Subsequently, the piston 313 is raised in the air cylinder 312 to raise the release table 311, and the release table 311 is positioned at a position facing the holding means 40. That is, the release table 311 comes into contact with the adherend surface Wb side of the wafer W held by the holding table 41 via the sheet 8. Thereafter, the holding table 41 releases the suction of the wafer W, and the release table 311 sucks and holds the wafer W. In this way, by taking over the suction and holding of the wafer W from the holding table 41 to the release table 311, damage to the wafer W can be reduced.

(10) Tape peeling step Next, the protective tape T is peeled from the surface Wa of the wafer W using the peeling unit 60. First, as shown in FIG. 20, the tape holding means 60 </ b> A and the peeling start point generation means 60 </ b> C are moved above the release table 311. At this time, a slight outer peripheral portion of the outer peripheral end portion of the protective tape T attached to the wafer W is positioned immediately below the distal end of the distal needle member 68 in the separation starting point generating means 60C. Thereafter, the fourth air cylinder 61d shown in FIG. 9 is operated to lower the tip of the tip needle-like member 68 to a position close to the outer peripheral end of the protective tape T.

  The tip height of the tip needle-shaped member 68 is finely adjusted according to the surface height of the protection tape T so that the tip of the tip needle-shaped member 68 is close to the outer peripheral portion of the protection tape T, and the tip is close Then, by moving the tape holding means 60A and the peeling start point generating means 60C slightly to the left in the drawing, the tip of the tip needle-like member 68 projects into the outer peripheral portion of the protective tape T as shown in FIG. Hit it. As shown in the figure, the tip of the tip needle-like member 68 may be abutted from the outer side of the protective tape T in the circumferential direction, but the tip of the tip needle-like member 68 is struck from above the outer peripheral portion of the protection tape T. It is also possible to apply it.

  After the tip of the tip needle-like member 68 hits the outer peripheral portion of the protective tape T, the fourth air cylinder 61d is operated to slightly raise the tip needle-like member 68, thereby The part is peeled well.

  After a part of the protective tape T has been peeled off, as shown in FIG. 22, the tip member 67 is raised and high-pressure air is jetted from the air nozzle 69, thereby protecting the protective tape T from the tip of the tip needle-like member 68. The outer peripheral portion of the protective tape T is separated from the outer peripheral portion of the protective tape T, and a peeling region including a part of the protective tape T that has been peeled first is enlarged, and a peeling start point TS suitable for being sandwiched by the tape holding means 60A is generated. Note that the height of the holding base 52 in the peeling start point generating step is such that the peeling start point TS is provided on the holding base 62 when the peeling start point TS is peeled off by high-pressure air from the air nozzle 69. , 612 to be adjusted. In addition, when the high pressure air is jetted by the air nozzle 69 to expand the separation region, the above-described distal needle member 68 may be further abutted. In this way, the peeling start point TS is suitably generated.

  When the outer peripheral portion of the protective tape T is lifted by the high-pressure air jetted from the air nozzle 69, the holding piece 612 is moved to the holding piece 611 side by the operation of the third air cylinder 50c as shown in FIG. The outer peripheral portion of the protective tape T is held between the holding piece 611 and the holding piece 612. Then, by operating the first air cylinder 61a, the entire tape holding means 60A is moved upward to such an extent that the bending roller 65 can be entered below the clamping pieces 611 and 612.

  The tape holding means 60A is moved upward, and the bending roller 65 is moved to the tape holding means 60A side as shown in FIG. Since the folding roller 65 advances the peeling while abutting on the adhesive surface side of the protective tape T with respect to the wafer W, the folding roller 65 can rotate about the axis in the longitudinal direction and the adhesive surface of the protective tape T that comes into contact does not adhere. The surface is coated with a fluororesin.

  In this embodiment, as shown in FIG. 25, the protective tape T on the wafer W is bent 180 degrees in the peeling direction (left side in the figure), but the bending angle is not necessarily 180 degrees. Absent. However, the wafer W is ground to be formed into a very thin plate shape, and if the bending angle is small, the wafer W may be cracked or damaged when the protective tape T is peeled off. It is preferable to bend at an angle close to that.

  As shown in FIG. 26, when the bending roller 65 moves to the other end on the left side of the bottom surface of the holding plate 63 in the drawing, the protective tape T is completely peeled from the surface Wa of the wafer W. The protective tape T peeled off from the surface Wa of the wafer W is sucked and held by the holding plate 63. Then, by operating the third air cylinder 61c, the clamping piece 612 is separated from the clamping piece 611 to release the outer peripheral portion of the protective tape T, and is discarded, for example, in a disposal container. In this way, the tape peeling step is completed.

(11) First Direction Expansion Step Next, as shown in FIG. 27, the sheet 8 is further expanded in the first direction to form intervals between the individual chips C. Specifically, the first holding means 10A and the second holding means 10B move the first holding means 10A and the second holding means 10B so as to be separated from each other in the first direction while the sheet 8 is held therebetween. That is, the two first direction moving means 14a shown in FIG. 4 are operated, and the slide parts 131 are moved in the first direction in the recess 102a so that the first holding means 10A and the second holding means 10B are separated from each other. The sheet 8 held by the roller 113 of each lower holding unit 110 and the roller 123 of each upper holding unit 120 is pulled outward. As the sheet 8 further expands, the distance between the adjacent chips C increases, and a sufficient distance can be formed between the chips C. Thereby, it is possible to prevent the adjacent chips C from coming into contact with each other when the wafer W is transported. The sheet 8 is easier to extend in the winding direction (first direction) than the second direction, and in this step, the division direction line S2 having a chip interval narrower than the division line S1 is the direction in which the division direction is easy to extend. Therefore, the chip interval in the division planned line S2 can be formed with a sufficient width.

(12) Second Direction Expansion Step Subsequently, as shown in FIG. 28, the sheet 8 is further expanded in the second direction to form intervals between the individual chips C. Specifically, the third clamping means 10C and the fourth clamping means 10D are moved away from each other in the second direction while the third clamping means 10C and the fourth clamping means 10D hold the sheet 8. That is, the two second-direction moving means 14b shown in FIG. 4 are operated, and each slide part 135 is moved in the second direction in the recess 102b so that the third clamping means 10C and the fourth clamping means 10D are separated from each other. The sheet 8 held by the roller 113 of each lower holding unit 110 and the roller 123 of each upper holding unit 120 is pulled outward. As the sheet 8 further expands, the interval between adjacent chips C increases, and a sufficient interval can be formed between the chips C. Thereby, like the 1st direction expansion step, it can prevent that the chip | tip C adjacent adjacent at the time of conveyance of the wafer W contacts. In this embodiment, the second direction expansion step is performed after the first direction expansion step is performed. However, the present invention is not limited to this, and the first direction expansion step and the second direction expansion step are performed simultaneously. Alternatively, the expansion in the first direction may be performed after the expansion in the second direction.

(13) Undivided region dividing step Here, of the wafers W expanded by the first direction extending step and the second direction extending step, undivided regions (starting from the modified layer as a starting point) that are not divided into individual chips C. If there is an area that has not been divided, the dividing means 35 shown in FIG. 3 applies an external force to the wafer W to divide it into individual chips C. For example, when there is an undivided area on the wafer W in the first direction, the rotating table 36 is rotated so that the extending direction of the squeegee 350 is adjusted to the first direction and the moving base is moved by the second direction feeding means 38. The squeegee 350 is positioned at a position corresponding to the undivided area by moving 383 in the second direction. Subsequently, the squeegee 350 is raised and brought into contact with the wafer W via the sheet 8 and the wafer W is sucked through the slits 351, thereby dividing the undivided region into individual chips C. The undivided region dividing step is performed before at least the frame attaching step.

(14) Frame positioning step After performing the first direction expansion step and the second direction expansion step, the annular frame 2 is made to face the seat 8 by the frame holding means 70 as shown in FIG. First, the frame holding means 70 sucks and holds the annular frame 2 accommodated in the frame stocker 5 shown in FIG. 2 by the frame holding portion 71, and moves to the upper side of the seat 8. Next, in the state where the sheet 8 is clamped by the first clamping means 10A, the second clamping means 10B, and the third clamping means 10C and the fourth clamping means 10D shown in FIG. And the wafer W is positioned inside the opening 3 of the annular frame 2.

(15) Frame adhering step When the frame positioning step is performed, the sheet 8 is adhered to the annular frame 2 positioned facing the adhesive surface 8a of the sheet 8 as shown in FIG. Specifically, the frame adhering rollers 33 a and 33 b are raised by the lifting mechanism, and the frame adhering rollers 33 a and 33 b are brought into contact with the lower surface of the sheet 8. Subsequently, the rotary table 36 shown in FIG. 3 is rotated at least once so that the frame attachment rollers 33a and 33b roll along the annular frame 2 while pressing the lower surface of the sheet 8 upward, thereby 2, the adhesive surface 8 a of the sheet 8 is adhered. After the sheet 8 is attached to the annular frame 2, the frame attaching rollers 33 a and 33 b are lowered and retracted from the sheet 8.

(16) Sheet Cutting Step After performing the frame sticking step, the sheet 8 is cut along the annular frame 2 as shown in FIG. Specifically, the cutting means 34 is raised and cut into the sheet 8 by the lifting mechanism, and the cutting table 34 is made circular along the annular frame 2 by rotating the rotary table 36 shown in FIG. 3 at least once. The sheet 8 is cut by moving it.

(17) Carrying-out step After performing the sheet cutting step, as shown in FIG. 32, the frame unit 9 in which the wafer W is bonded to the annular frame 2 via the sheet 8 is formed. Then, the frame holding means 70 moves up while holding the frame unit 9, thereby unloading the frame unit 9 from the position P where the sheet 8 is cut and transferring the frame unit 9 to the next process (for example, a mounting process). .

As described above, in the expansion method according to the present invention, the wafer W held by the holding unit 40 is imaged and formed by the imaging camera 51 in order to proceed to the holding step and the workpiece positioning step after performing the sheet feeding step. Based on the captured image 500, the wafer W can be positioned in a predetermined direction with respect to the sheet 8, and the adherend surface Wb of the wafer W can be made to face the adhesive surface 8 a of the sheet 8. Can be determined uniformly, and for example, it is possible to reduce the possibility that alignment failure occurs when a subsequent pickup process is performed.
Further, in the expansion method according to the present invention, the first division planned line S1 in which the wafer W to be expanded extends in the first direction and the second division planned line S2 in the second direction orthogonal to the first direction. And when the chip C formed in the region partitioned by the first scheduled division line S1 and the second divided planned line S2 is a long chip, pattern matching is performed by the alignment means 50 in the workpiece positioning step. Thus, the extending direction of the division planned line (first division planned line S1) in the direction in which the distance between the chips C is wide can be made to coincide with the feeding direction (first direction) of the sheet 8, and the distance between the chips C is sufficient. Distance can be formed.

1: expansion device 2: ring frame 3: opening 4: annular frame supply unit 5: frame stocker 6: cart 7: caster 8: seat 8a: adhesive surface 9: frame unit 10: expansion means 10A: first clamping means 10B: Second clamping means 10C: Third clamping means 10D: Fourth clamping means 11a, 11b: Lower clamping mechanism 12a, 12b: Upper clamping mechanism 13a, 13b: Movable base 14a: First direction moving means 14b: Second direction Moving means 15: Lower elevating means 16: Upper elevating means 20: Delivery reel 21: Take-up reel 22: Delivery rollers 23, 24: Pull-in roller 30: Adhesion roller 31: Release means 32: Fixed bases 33a, 33b: Frame sticking roller 34: cutting means 35: dividing means 36: rotating table 37: first direction feeding means 3 : Second direction feeding means 40: holding means 41: holding table 42: rotating table 43: base 44: rotating shaft 45: support portion 50: alignment means 51: imaging camera 500: captured image 60: peeling unit 70: frame holding means 71: Frame holding unit 80: Robot hand

Claims (3)

A sheet having an adhesive surface is pasted on a workpiece in which division starting points are formed along a plurality of intersecting scheduled lines or on a workpiece divided into individual chips along a plurality of intersecting scheduled lines. An expansion device that expands the attached and pasted sheet to form an interval between adjacent chips,
Expansion means for expanding the sheet to which the work piece is attached;
Holding means for holding the adherend surface of the work piece adhered to the sheet above the sheet expanded by the expansion means in a state of facing the adhesive surface of the sheet;
An alignment unit having an imaging camera for imaging the workpiece held by the holding unit, and enabling the workpiece held by the holding unit to be positioned in a predetermined direction with respect to the sheet;
A sticking roller that is disposed to face the holding means via the sheet to which the work piece is stuck, and sticks the sheet to the work piece held by the holding means;
Frame holding means for holding an annular frame having an opening in the center on the upper side of the sheet expanded by the expanding means so that the workpiece adhered to the sheet is positioned in the opening;
A frame adhering roller for adhering the sheet to the annular frame disposed on the lower side of the sheet to which the workpiece is adhered and held by the frame holding means;
Cutting means for cutting the sheet along the annular frame disposed on the lower side of the sheet to which the workpiece is adhered and held by the frame holding means;
The expansion means are disposed opposite to each other with a workpiece to be adhered to the sheet in the first direction, and each of the expansion means includes a first clamping means and a second clamping means for clamping the sheet, A third clamping means and a fourth clamping means, which are arranged opposite to each other with a work piece adhered to the sheet in a second direction orthogonal to the one direction, and each sandwich the sheet; The first clamping means and the second clamping means can be moved away from each other in the first direction, and the third clamping means and the fourth clamping means are moved away from each other in the second direction. An expansion device comprising: A sheet having an adhesive surface is pasted on a workpiece in which division starting points are formed along a plurality of intersecting scheduled lines or on a workpiece divided into individual chips along a plurality of intersecting scheduled lines. An expansion method for expanding the sheet attached and pasted to form an interval between adjacent chips,
A sheet feeding step of feeding the sheet wound in a roll shape at one end and winding the fed sheet at the other end;
A holding step for holding the workpiece by holding means;
After carrying out the holding step, the workpiece is fed out in the sheet feeding step based on the captured image formed by imaging the workpiece held by the holding means with an imaging camera. A workpiece positioning step for positioning the workpiece in a predetermined direction and causing the surface to be adhered to face the adhesive surface of the sheet;
After performing the workpiece positioning step, the sheet is sandwiched between the first clamping means and the second clamping means facing each other with the workpiece sandwiched in the first direction, and the second orthogonal to the first direction. A sandwiching step of sandwiching the sheet with a third sandwiching means and a fourth sandwiching means facing each other across the workpiece in the direction;
After performing the sandwiching step, an adhesion step of pressing the sheet from the opposite side of the adhesive surface of the sheet and adhering the sheet to a workpiece;
A release step of releasing the workpiece adhered to the sheet from the holding means after performing the adhesion step;
After performing the release step, the first clamping means and the second clamping means are moved away from each other in a state where the first clamping means and the second clamping means clamp the sheet. Extending in the first direction in a first direction,
After performing the release step, the third clamping means and the fourth clamping means are moved away from each other in a state where the third clamping means and the fourth clamping means clamp the sheet, and the sheet is moved. Extending in the second direction, a second direction expansion step;
After the first direction expansion step and the second direction expansion step, the sheet is clamped by the first clamping means, the second clamping means, the third clamping means, and the fourth clamping means Then, a frame positioning step of causing an annular frame having an opening in the center to face the adhesive surface of the sheet and positioning a workpiece in the opening;
A frame adhering step of adhering the sheet to the annular frame positioned facing the adhesive surface in the frame positioning step;
A sheet cutting step of cutting the sheet along the annular frame after performing the frame attaching step;
An expansion method comprising: carrying out the frame unit in which the workpiece is bonded to the annular frame via the sheet after carrying out the sheet cutting step; The workpiece has a first scheduled division line extending in the first direction and a second divided division line extending in the second direction orthogonal to the first direction, and between the adjacent first division planned lines adjacent to each other. A second interval between the second scheduled division lines adjacent to each other with respect to the first interval is formed narrowly,
The expansion method according to claim 2, wherein, in the workpiece positioning step, the workpiece is positioned so that the first direction coincides with a feeding direction in which the sheet is fed in the sheet feeding step.

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