JP2018004620A - Measured height correction rule generating device and method, and height measuring device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measured height correction rule generating device and method, and a height measuring device and method.SOLUTION: The measured height correction rule generating method comprises the phases of: acquiring first data including a height from a reference plane 50 at one or more positions on a sample 40A; generating a first mask including a scale factor relating to the height of a first position among the one or more positions, the scale factor being determined based on a relative relation between the height of the first position and a reference height; generating a second mask including a first correction rule relating to the height of the first position, the first correction rule being determined based on a relative relation between the height of the first position and a height of one or more second positions adjacent to the first position; and calculating a ratio of the height of the fist position to the height of a third position which is in an already set relation with the first position and generating a third mask including a second correction rule relating to the height of the first position, the second correction rule being determined based on a relative relation between the calculated ratio and an average ratio.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a measurement height correction rule generation device and method, and a height measurement device and method.

  The chip mounter system is a system that automatically mounts surface-mounted components on a printed circuit wiring board, a component supply unit that supplies the components to be mounted on the printed circuit wiring board, and the actual printed circuit wiring board. It is configured to include a drive unit positioned above.

  Such a chip mounter system measures the mounting height of a component for the purpose of determining whether or not the component is correctly mounted. There was a problem that it was not high.

  The problem to be solved by the present invention is to provide a measurement height correction rule generation apparatus and method for obtaining a more accurate height measurement result by performing a ratio correction on the measurement height.

  The problem to be solved by the present invention is also to generate a measurement height correction rule that further improves accuracy by correcting the measurement height according to the relative relationship with the height of the adjacent position and the symmetrical position. An apparatus and method is provided.

  The problem to be solved by the present invention is also to provide a height measuring apparatus and method that can perform one or more corrections to the measured height and can measure a more accurate height.

  According to an embodiment of the present invention, a method for generating a measurement height correction rule includes obtaining first data including heights from one or more positions on a sample from a reference plane, and any one of the one or more positions. Generating a first mask including a scale factor related to a height of the first position determined based on a relative relationship between a height of the first position as one position and a reference height; A first correction rule for the height of the first position determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position. A step of generating two masks, calculating a ratio between the height of the first position and the height of a third position having a preset relationship with the first position, and calculating the ratio between the calculated ratio and the average ratio The height of the first position determined based on the relative relationship Generating a third mask including the second correction rule that may contain.

  The generating of the second mask may generate a second mask related to second data obtained by applying the first mask to the first data.

  The generating of the third mask may generate a third mask related to third data obtained by applying the second mask to the second data.

  The reference height is a height from the reference surface of the sample, and in the step of generating the first mask, a product of the height of the first position and the scale factor corresponds to the reference height. As such, the method may include determining a scale factor for the first position and generating the first mask including a scale factor for each of the one or more positions.

  The step of generating the second mask includes calculating an average height, which is an average of the heights of the one or more second positions, and a difference between the height of the first position and the average height being a critical difference. If so, generating a first correction rule that replaces the height of the first position with the average height, and generating the second mask that includes a first correction rule for each of the one or more positions And may be included.

  The second position includes the first position, two positions adjacent to the first direction and the opposite direction of the first direction, and the first position, the second direction, and the opposite direction of the second direction. In the step of calculating the average height including two positions adjacent to each other, the average of the heights of the four positions included in the second position can be calculated as the average height. At this time, the first direction and the second direction are perpendicular to each other.

  The step of generating the third mask includes a height of the first position and a position which is symmetrical with the first position with respect to a reference line in the first direction or the second direction on the sample. A step of calculating a ratio with the height of three positions, and if the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference, And calculating the second correction rule for replacing the height of the first position with the correction height when the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference. And generating the third mask including a second correction rule for each of the one or more positions.

  The average ratio is also an average related to a ratio of heights of a plurality of symmetrical pairs that are symmetrical with respect to a reference line in the first direction or the second direction on the sample.

  According to an embodiment of the present invention, a method for measuring height includes obtaining fourth data including a height from a reference plane at one or more positions on a determination target object, and the fourth data includes a first mask, Generating fifth data to which at least one of the second mask and the third mask is applied, and determining a height of the one or more positions from the reference plane based on the fifth data. And may be included. At this time, the height of the first mask is determined based on the relative relationship between the height of the first position, which is one of the one or more positions, and the reference height. The second mask is determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position. A first correction rule relating to a height of the position, wherein the third mask calculates a ratio between the height of the first position and the height of the third position having a preset relationship with the first position; A second correction rule related to the height of the first position, which is determined based on a relative relationship between the calculated ratio and the average ratio, may be included.

  In the generating the fifth data, the fifth data may be generated by sequentially applying the first mask, the second mask, and the third mask to the fourth data.

  The object to be determined is a printed circuit wiring board on which one or more parts are mounted, and the one or more positions are positions on which the one or more parts are mounted.

  A measurement height correction rule generation device according to an embodiment of the present invention generates at least one mask based on first data including a height from a reference plane of one or more positions on a sample and a reference height. A control unit, wherein the control unit obtains the first data and is based on a relative relationship between a height of a first position, which is any one of the one or more positions, and the reference height. Generating a first mask including a scale factor related to the height of the first position to be determined, and comparing a height of the first position with a height of one or more second positions adjacent to the first position; A second mask including a first correction rule related to the height of the first position determined based on the relationship is generated, and a third mask having a predetermined relationship with the height of the first position and the first position is set. The ratio with the height of the position is calculated, and the calculated ratio It is possible to generate a third mask including the second correction rule relating to the height of the first position that is determined based on the relative relationship between the average ratio.

  The control unit generates a second mask related to second data obtained by applying the first mask to the first data, and generates a third mask related to third data obtained by applying the second mask to the second data. Can be generated.

  The reference height is a height from the reference surface of the sample, and the control unit is configured so that a product of the height of the first position and the scale factor corresponds to the reference height. A scale factor for a first position may be determined and the first mask including a scale factor for each of the one or more positions may be generated.

  The control unit calculates an average height that is an average of the heights of the one or more second positions, and when a difference between the height of the first position and the average height is a critical difference or more, A first correction rule for replacing the height of one position with the average height may be generated, and the second mask including a first correction rule for each of the one or more positions may be generated.

  The second position includes the first position, two positions adjacent to the first direction and the opposite direction of the first direction, and the first position, the second direction, and the opposite direction of the second direction. And the control unit calculates an average height of four positions included in the second position as the average height, and the first direction and the second direction are: They are perpendicular to each other.

  The control unit has a height of the first position and a height of a third position that is symmetrical with the first position with respect to a reference line in the first direction or the second direction on the sample. When the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference, a correction height is calculated based on the average ratio and the height of the third position, and the calculation is performed. If the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference, the second correction rule is generated to replace the height of the first position with the correction height, and the second correction rule for each of the one or more positions is generated. The third mask including a correction rule can be generated.

  The average ratio is also an average related to a ratio of heights of a plurality of symmetrical pairs that are symmetrical with respect to a reference line in the first direction or the second direction on the sample.

  The height measurement apparatus according to an embodiment of the present invention obtains fourth data including a height from a reference plane at one or more positions on a determination target object, and includes a first mask and a second as the fourth data. A controller that generates fifth data to which at least one of the mask and the third mask is applied, and determines a height of the one or more positions from the reference plane based on the fifth data; The first mask is a scale related to the height of the first position determined based on the relative relationship between the height of the first position, which is one of the one or more positions, and a reference height. A height of the first position determined based on a relative relationship between a height of the first position and a height of one or more second positions adjacent to the first position. A first correction rule for the third mask, The ratio between the height of the first position and the height of the third position that has a preset relationship with the first position is calculated, and is determined based on the relative relationship between the calculated ratio and the average ratio. A second correction rule related to the height of the first position may be included.

  The controller may sequentially apply the first mask, the second mask, and the third mask to the fourth data to generate the fifth data.

  ADVANTAGE OF THE INVENTION According to this invention, the measurement height correction rule production | generation apparatus and its method which acquire a more exact height measurement result by performing ratio correction | amendment with respect to measurement height are realizable.

  The present invention also embodies a measurement distance correction rule generation apparatus and method for further improving accuracy by correcting the measurement height based on the relative relationship between the adjacent position and the height of the symmetrical position. be able to.

  The present invention can also implement a height measuring apparatus and method that can perform one or more corrections on the measured height and can measure a more accurate height.

1 is a diagram illustrating a chip mounter system including a measurement height correction rule generation device according to an exemplary embodiment of the present invention. 3 is a diagram schematically illustrating a configuration for measuring the height of a sample in order to generate a correction rule in a chip mounter system according to an exemplary embodiment of the present invention. It is an example of the 1st data which a height measuring device generated. 4 is a diagram schematically illustrating a process of generating a first mask and second data in which the first mask is applied to the first data by the first controller according to an exemplary embodiment of the present invention. 4 is a diagram schematically illustrating a process of generating a second mask and third data in which the second mask is applied to the second data by the first controller according to an exemplary embodiment of the present invention. 4 is a diagram schematically illustrating a process of generating a third mask and fourth data in which the third mask is applied to the third data by the first controller according to an exemplary embodiment of the present invention. It is a flowchart for demonstrating the measurement height correction rule production | generation method performed by the measurement height correction rule production | generation apparatus. 5 is a diagram for explaining a process in which the height measuring device according to an exemplary embodiment of the present invention measures the height of a printed circuit wiring board. 5 is a diagram for explaining a process of correcting a height value measured by a height measuring device using a first mask to a third mask generated by a correction rule generating device. It is a flowchart for demonstrating the height measuring method performed by a height measuring apparatus.

  While the invention is susceptible to various modifications, and having various embodiments, specific embodiments are illustrated in the drawings and will be described in detail by way of the detailed description. The effects, features, and methods of achieving the same of the present invention will be apparent with reference to the embodiments described in detail with reference to the drawings. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various forms.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, when the description is made with reference to the drawings, the same or corresponding components are denoted by the same reference numerals. The redundant explanation related to this is omitted.

  In the following embodiments, terms such as “first” and “second” are not limited, but are used for the purpose of distinguishing one component from another component. In the following embodiments, the singular forms include the plural forms unless the context clearly indicates otherwise. In the following embodiments, terms such as “comprising” or “having” mean that a feature or component described in the specification is present, and one or more other features or configurations It is not to eliminate the possibility of adding an element in advance. In the drawings, the size of components is exaggerated or reduced for convenience of explanation. For example, the size and form of each component illustrated in the drawings are arbitrarily illustrated for convenience of description, and the present invention is not necessarily limited to the illustrated example.

First Embodiment: Measurement Height Correction Rule Generation Device and Method Thereof FIG. 1 is a diagram illustrating a chip mounter system provided with a measurement height correction rule generation device 10 according to an embodiment of the present invention.

  In the present invention, a chip mounter system refers to various systems that automatically mount surface mount components on a printed circuit wiring board. Accordingly, the chip mounter system according to the present invention includes a component supply unit (not shown) that supplies components to be mounted on the printed circuit wiring board, and a drive unit (not shown) that actually positions the components on the printed circuit wiring board. A general configuration such as However, since the present invention relates to the measurement height correction rule generation device 10 provided in the chip mounter system, a detailed description of the above-described general configuration is omitted.

  The chip mounter system according to an embodiment of the present invention may include a measurement height correction rule generation device 10, a height measurement device 20, a video acquisition device 30, a determination target object 40, and a reference surface 50.

  The image acquisition device 30 according to an exemplary embodiment of the present invention may be various means for acquiring an image including distance information related to the determination target object 40. For example, the video acquisition device 30 may be a stereo camera including two video acquisition units as illustrated in FIG. In such a case, the video acquisition device 30 can output distance information to a specific position of the determination target object 40 based on the video acquired by the two video acquisition means. At this time, the two image acquisition means of the image acquisition device 30 are arranged by any one of a parallel type, an orthogonal type, a horizontal type, a crossing type, and a horizontal movement type.

  On the other hand, the image acquisition device 30 is also a distance camera (depth camera) that outputs distances from the camera to all points of the scene being photographed. In such a case, the video acquisition device 30 can output distance information, which is a distance to the object being photographed for each pixel.

  However, the above-described two video acquisition devices 30 are exemplary, and the idea of the present invention is not limited thereto, and the distance information related to a plurality of positions on the determination target object 40 is output. Can be used without limitation.

  The height measuring device 20 according to the embodiment of the present invention can generate the height information of the determination target object 40 based on the distance information acquired by the video acquisition device 30.

  For example, the height measuring device 20 calculates the difference between the distance from the reference plane 50 to the video acquisition device 30 and the distance from the video acquisition device 30 to the determination target object 40, thereby calculating the height of the determination target object 40. Information can be generated.

  Also, the height measuring device 20 may extract only the distance information related to the area that needs to be determined from the distance information acquired by the video acquisition device 30 and provide it to the measured height correction rule generating device 10 described later. it can.

  As described above, the height measurement device 20 can generate the height information of the determination target object 40 based on the distance information acquired by the video acquisition device 30 and provide the height information to the correction rule generation device 10.

  Further, the height measuring device 20 corrects the height information according to one or more correction rules generated by the measurement height correction rule generating device 10 described later, and generates corrected height information related to the determination target object 40. be able to. This will be described in more detail in the second embodiment below.

  In the embodiment of the present invention, the determination target object 40 may be various objects that need to acquire height information. For example, the determination object 40 is also a printed circuit wiring board on which components are mounted. The determination target object 40 is also a sample in which the measurement height correction rule generation device 10 knows the height for generating the correction rule. On the other hand, the reference plane 50 is a plane on which the determination target object 40 is placed and also serves as a reference plane for measuring the height of the determination target object 40.

  FIG. 2 schematically illustrates a configuration for measuring the height of the sample 40A in order to generate a correction rule in the chip mounter system according to an embodiment of the present invention.

  In the present invention, the sample 40A means an object to be determined that already knows the height h1 with respect to the reference plane 50 as described above. For example, the sample 40A has a height of 40 μm and is a uniform sheet-like object. Further, in the sample 40A, the height of the position corresponding to the position where the component is mounted is the same as 80 μm, and the remaining position where the component is not mounted is also a general sheet-like object.

  On the other hand, in the case of FIG. 2, in order for the measurement height correction rule generation device 10 to generate a correction rule, the height measurement device 20 merely measures the height of the sample 40A. It is not intended for itself.

  The measurement height correction rule generation device 10 according to an exemplary embodiment of the present invention may include a first control unit 110 and a first memory 120 for generating a correction rule related to height information of a determination target object.

  The first controller 110 according to an embodiment may include all kinds of devices capable of processing data, such as a processor. Here, the “processor” is, for example, a data processing device built in hardware having a physically structured circuit to perform a function expressed by a code or an instruction included in the program. Means. As described above, as an example of a data processing device built in hardware, a microprocessor, a central processing unit (CPU), a processor core, a multiprocessor, an ASIC (application) -specific integrated circuit), FPGA (field programmable gate array) and other processing apparatuses can be covered, but the scope of the present invention is not limited thereto.

  The first memory 120 according to an embodiment performs a function of temporarily or permanently storing data, instruction languages, programs, program codes, or combinations thereof processed by the first controller 110. In addition, the first memory 120 can temporarily and / or permanently store the height information of the determination target object acquired from the height measuring device 20. In addition, the first memory 120 may temporarily and / or permanently store the generated first to third masks. The first memory 120 may include a magnetic storage medium or a flash storage medium, but the scope of the present invention is not limited thereto.

  On the other hand, in FIG. 1, FIG. 2 and FIG. 8, the measurement height correction rule generation device 10 is illustrated as being provided separately from the height measurement device 20, but this is for convenience of explanation. The measurement height correction rule generation device 10 and the height measurement device 20 are integrated and configured as one height measurement device. Hereinafter, a process in which the measurement height correction rule generation device 10 according to the embodiment of the present invention generates a correction rule using the measurement height of the sample 40A will be described.

  The first controller 110 according to an embodiment of the present invention may obtain first data including the height from the reference plane at one or more positions of the sample from the height measuring device 20.

  FIG. 3 is an example of the first data generated by the height measuring device 20.

  Referring to FIG. 3, the height measuring device 20 can measure the height from the reference plane related to one or more positions of the sample 40A. Here, the reference surface 50 is also a bottom surface. For example, the height measuring device 20 can measure the heights related to the 16 positions of the sample 40A.

  On the other hand, the height measuring device 20 considers the position corresponding to each height, and the first data 111 in the form of a table or a matrix in relation to the measured heights related to a plurality of positions. Can be generated. For example, the height related to a certain position 41 is stored in a position 112 corresponding to the position 41 in the table.

  On the other hand, in the present invention, the “position” is a point that is a height measurement target of the height measuring device 20, and means a certain point in the three-dimensional space. For example, when the sample 40A is placed on the XY plane, a certain position is also a point on the three-dimensional space that can be indicated as (X, Y, Z). At this time, the height of the position is also Z.

  The first controller 110 according to an embodiment of the present invention includes a scale factor related to the height of the first position, which is determined based on a relative relationship between the height of the first position and the reference height. A first mask can be generated. At this time, the first position is also one of the one or more positions of the sample 40A.

  In the present invention, the “reference height” means the height from the reference surface 50 to the upper surface when the thickness of the sample 40A is constant and the height of the upper surface is an ideal sheet-like object. To do. As described above, the sample 40A means an object to be determined that already knows the height h1 (FIG. 2) with reference to the reference plane 50, and therefore the reference height of the sample 40A is compared with the measured height. By doing so, it can be determined how much error the measured height includes. Such a reference height is the same value for all positions when the sample 40A is a sheet-like object having a uniform height, and when the sample 40A is an object having a partially different height, for each position. It is also a different value.

  FIG. 4 schematically illustrates a process in which the first controller 110 according to an exemplary embodiment of the present invention generates the first mask 210 and the second data 220 in which the first mask 210 is applied to the first data 111A. Show.

  Referring to FIG. 4, the first controller 110 may determine the scale factor of the first position so that the product of the height of the first position and the scale factor corresponds to the reference height. Also at this time, the first position is any one of one or more positions on the sample 40A (FIG. 3).

  For example, when the reference height is 1.0 and the height 112A of the first position is 1.5, the first control unit 110 sets the scale factor to 1.5, which is the height 112A of the first position. The scale factor 211 can be determined to be 0.6 so that the product of the value 211 becomes 1.0, which is the reference height. At this time, the unit of height is μm, nm, or the like.

  The first controller 110 may generate a first mask 210 including a scale factor for each of one or more positions. In other words, the first control unit 110 can determine the scale factor related to each position, and can generate the first mask 210 including a plurality of determined scale factors.

  On the other hand, the first controller 110 can obtain the second data 220 including a more accurate height by applying the first mask 210 generated to the first data 111A. For example, the height 112A of the first position included in the first data is 1.5, while the height 221 of the first position included in the second data 220 is 0.9, and the sample 40A It can be confirmed that it is closer to 1.0 which is the reference height (FIG. 3).

  In the present invention, “applying the B mask to the A data” means that the operation rule included in the B mask for each position is applied to the A data. For example, in the case of the first mask described above, each position includes a scale factor, so application of the first mask means that the height of each position is multiplied by the scale factor. The application of the second mask and the application of the third mask, which will be described later, also means that the calculation rule included in each mask for each position is applied to the height value at each position.

  As described above, according to the present invention, a more accurate height measurement result can be obtained by performing the ratio correction with respect to the measurement height. Generally, the height measuring device 20 tends to show the same error at the same position. Therefore, a more accurate height measurement is possible by generating a first mask reflecting such an error tendency and applying it to the measurement data.

  The first controller 110 according to an embodiment of the present invention may determine the first position determined based on the relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position. It is possible to generate a second mask that includes a first correction rule related to height.

  In the present invention, the second position means various positions adjacent to the first position. For example, the second position is adjacent to the first position, two positions adjacent to the first direction and the opposite direction of the first direction, and the first position, opposite to the second direction and the opposite direction of the second direction. Two positions may be included. At this time, the first direction and the second direction are also directions orthogonal to each other.

  On the other hand, in the present invention, “correction rule” means an operation rule related to a certain height value. For example, the correction rule is a rule for replacing the height value at the position with a preset value.

  FIG. 5 schematically illustrates a process in which the first controller 110 according to an embodiment of the present invention generates the second mask 310 and the third data 320 in which the second mask 310 is applied to the second data 220A. Show.

  First, the first controller 110 calculates an average height that is an average of the heights of one or more second positions 222A, 223A, 224A, and 225A. For example, as described above, when the second positions 222A, 223A, 224A, and 225A mean the four positions adjacent to the first position 221A in a cross shape, the first controller 110 determines the height of the four positions. Is calculated as the average height. In the case of the first position 221A in FIG. 5, the average height is also 1.0.

  Thereafter, when the difference between the height of the first position 221A and the average height is greater than or equal to the critical difference, the first controller 110 generates a first correction rule that replaces the height of the first position with the average height. Is possible. For example, as illustrated above, when the average height of the first position 221A is 1.0, the height of the first position 221A is 7.0, and the critical difference is 3.0, This corresponds to the case where the difference between the height of the position 221A and the average height is greater than or equal to the critical difference. In such a case, the first controller 110 can generate the first correction rule 312 that replaces the height of the first position 221A with the average height.

  On the other hand, the first control unit 110 can generate the second mask 310 including the first correction rule for each of one or more positions. In other words, the first control unit 110 can generate the first correction rule related to each position and generate the second mask 310 including the first correction rule generated for each position. .

  Meanwhile, the first controller 110 can obtain the third data 320 including a more accurate height by applying the second mask 310 generated to the second data 220A. For example, the height of the first position 221A included in the second data 220A is 7.0, while the height 322 of the first position included in the third data 320 is 1.0, and the sample 40A It can be confirmed that it is closer to the reference height of 1.0.

  As described above, the present invention can obtain a more accurate height measurement result by correcting the measurement height based on the relative relationship with the height of the adjacent position.

  The first controller 110 according to the embodiment of the present invention calculates a ratio between the height of the first position and the height of the third position that is in a preset relationship with the first position, and the calculated ratio and the average ratio A third mask including a second correction rule related to the height of the first position determined based on the relative relationship between the first mask and the second mask can be generated.

  FIG. 6 schematically illustrates a process in which the first controller 110 according to an exemplary embodiment of the present invention generates the third mask 410 and the fourth data 420 in which the third mask 410 is applied to the third data 320A. Show.

  First, the first control unit 110 can calculate the ratio between the height of the first position 321A and the height of the third position 322A, which is a position having a preset relationship with the first position 321A. At this time, the third position 322A is also a position on the sample that is symmetrical with the first position 321A with respect to the reference line 350 in the first direction or the second direction. For example, in the case of FIG. 6, the ratio between the height of the first position 321A and the height of the third position 322A is also 3 (3.0 / 1.0 = 3).

  Thereafter, when the difference between the calculated ratio and the average ratio is greater than or equal to the critical difference, the first controller 110 can calculate the correction height based on the average ratio and the height of the third position.

  At this time, the average ratio is also an average related to the ratio of the heights of a plurality of symmetrical pairs that are symmetrical with respect to the reference line 350 in the first direction or the second direction on the sample. For example, in the case of FIG. 6, there are a total of 8 symmetrical pairs with respect to the reference line 350, and the average of their ratio is 1.25 ((1 × 7 + 3) / 8). In other words, in the case of FIG. 6, the average ratio is also 1.25. At this time, assuming that the critical difference is 1, the ratio between the height of the first position 321A and the height of the third position 322A is 3, and the average ratio is 1.25. This is more than the difference. In such a case, the first control unit 110 calculates an average ratio, that is, 1.25, which is a product of 1.25 and 1.0 which is the height of the third position 322A, as the correction height. (1.25 × 1.0).

  On the other hand, if the difference between the calculated ratio, that is, the ratio between the height of the first position 321A and the height of the third position 322A, and the average ratio is greater than or equal to the critical difference, The second correction rule for replacing the height of the position with the calculated correction height can be generated. That is, in the case of FIG. 6, the first control unit 110 can generate a second correction rule that replaces 3.0 as the height of the first position 321A with 1.25 as the correction height.

  Finally, the first controller 110 may generate a third mask 410 including a second correction rule for each of one or more positions. In other words, the first control unit 110 can generate the second correction rule related to each position and generate the third mask 410 including the second correction rule generated for each position.

  Furthermore, the first controller 110 can obtain the fourth data 420 including a more accurate height by applying the third mask 410 generated to the third data 320A. For example, the height of the first position 321A included in the third data 320A is 3.0, while the height 421 of the first position included in the fourth data 420 is 1.25, and the sample 40A It can be confirmed that it is closer to the reference height of 1.0.

  As described above, the present invention can obtain a more accurate height measurement result by correcting the measurement height based on the relative relationship with the height of the symmetric position.

  On the other hand, the above description is for generating a correction rule. When the correction rule is generated by the above-described process, the measurement height correction rule generating device 10 is not limited to the sample 40A. It is obvious that it is possible to measure the height of such various objects.

  FIG. 7 is a flowchart for explaining a measurement height correction rule generation method performed by the measurement height correction rule generation device 10. In the following, detailed description of contents overlapping with those described in FIGS. 1 to 6 is omitted.

  The first controller 110 according to the embodiment of the present invention may obtain first data including the height from the reference plane at one or more positions on the sample from the height measuring device 20 (S710).

  In the present invention, the “position” is a point that is a height measurement target of the height measuring device 20, and means a certain point in the three-dimensional space. For example, when the sample 40A is placed on the XY plane, a certain position is also a point on the three-dimensional space that can be indicated by (X, Y, Z). At this time, the height of the position is also Z.

  The first controller 110 according to an embodiment of the present invention may include a first mask including a scale factor related to the height of the first position determined based on the relative relationship between the height of the first position and the reference height. It can be generated (S720). At this time, the first position is any one of one or more positions on the sample 40A. On the other hand, in the present invention, the “reference height” means the height of the sample 40A from the reference surface 50. As described above, the sample 40A means an object to be determined who already knows the height with respect to the reference plane 50. Therefore, the sample 40A is measured by comparing the reference height of the sample 40A with the measured height. It can be determined how much error the measured height includes.

  The first controller 110 can determine the scale factor of the first position so that the product of the height of the first position and the scale factor corresponds to the reference height. For example, when the reference height is 1 and the height of the first position is 1.5, the first control unit 110 calculates that the product of 1.5, which is the height of the first position, and the scale factor. The scale factor can be determined to be 0.6 so that the reference height is 1. In addition, the first controller 110 can generate a first mask including a scale factor for each of one or more positions.

  On the other hand, the first control unit 110 can obtain second data including a more accurate height by applying the first mask generated to the first data. As described above, according to the present invention, a more accurate height measurement result can be obtained by performing the ratio correction with respect to the measurement height. Generally, the height measuring device 20 tends to show the same error with respect to the same position. Therefore, a more accurate height measurement is possible by generating a first mask reflecting such a tendency of errors and applying it to the measurement data.

  The first controller 110 according to an embodiment of the present invention may determine the first position determined based on the relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position. A second mask including the first correction rule related to the height can be generated (S730). Specifically, the first control unit 110 can calculate an average height that is an average of the heights of one or more second positions. For example, as described above, the second position means four positions adjacent to the first position in a cross shape. In such a case, the first control unit 110 averages the average of the heights of the four positions. It can be calculated as height.

  Thereafter, when the difference between the height of the first position and the average height is greater than or equal to the critical difference, the first controller 110 may generate a first correction rule that replaces the height of the first position with the average height. it can. Meanwhile, the first control unit 110 can generate a second mask including the first correction rule for each of one or more positions. In other words, the first control unit 110 can generate the first correction rule related to each position and generate the second mask 310 including the first correction rule generated for each position.

  On the other hand, the first controller 110 can obtain third data including a more accurate height by applying the second mask generated to the second data. As described above, the present invention can obtain a more accurate height measurement result by correcting the measurement height based on the relative relationship with the height of the adjacent position.

  The first controller 110 according to the embodiment of the present invention calculates a ratio between the height of the first position and the height of the third position that is in a preset relationship with the first position, and the calculated ratio and the average ratio A third mask including a second correction rule related to the height of the first position determined based on the relative relationship between the first mask and the first mask can be generated (S740).

  First, the first control unit 110 can calculate the ratio between the height of the first position and the height of the third position. At this time, the third position is also a position on the sample 40A that is symmetrical with the first position with respect to the reference line in the first direction or the second direction.

  Thereafter, when the difference between the calculated ratio and the average ratio is greater than or equal to the critical difference, the first controller 110 can calculate the correction height based on the average ratio and the height of the third position. At this time, the average ratio is also an average related to the ratio of the heights of a plurality of symmetrical pairs that are symmetrical with respect to the reference line in the first direction or the second direction on the sample 40A.

  Furthermore, the first control unit 110 replaces the second correction rule by replacing the height of the first position with the calculated correction height when the difference between the calculated ratio and the average ratio is greater than or equal to the critical difference. Can be generated.

  Finally, the first controller 110 may generate a third mask that includes a second correction rule for each of one or more positions. In other words, the first control unit 110 can generate a second correction rule related to each position and generate a third mask including the second correction rule generated for each position.

  On the other hand, the first control unit 110 can obtain the fourth data including a more accurate height by applying the third mask generated to the third data. As described above, the present invention can obtain a more accurate height measurement result by correcting the measurement height based on the relative relationship with the height of the symmetric position.

Second Embodiment: Height Measurement Apparatus and Method In the first embodiment described above, the measurement height correction rule generation apparatus 10 generates a correction rule by measuring the height of a sample whose height is known. Explained how to do.

  In the present embodiment, a method in which the height measurement device 20 generates height information corrected based on the correction rule generated by the correction rule generation device 10 will be described.

  FIG. 8 is a view for explaining a process in which the height measuring device 20 according to an embodiment of the present invention measures the height of the printed circuit wiring board 40B.

  The height measuring device 20 according to an exemplary embodiment of the present invention includes a second controller 250 for generating height information of the printed circuit wiring board 40B and corrected height information of the printed circuit wiring board 40B, and a second control unit 250. Two memories 260 may be included.

  The second controller 250 according to an exemplary embodiment may include all kinds of devices capable of processing data, such as a processor. Here, the “processor” is, for example, a data processing device built in hardware having a physically structured circuit to perform a function expressed by a code or an instruction included in the program. Means. As described above, as an example of a data processing device built in hardware, a microprocessor, a central processing unit (CPU), a processor core, a multiprocessor, an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), and the like However, the scope of the present invention is not limited to them.

  The second memory 260 according to an embodiment performs a function of temporarily or permanently storing data processed by the second controller 250, instruction languages, programs, program codes, or combinations thereof. Further, the second memory 260 can temporarily and / or permanently store the height information of the printed circuit wiring board 40B. Further, the second memory 260 can temporarily and / or permanently store the first mask to the third mask generated by the measurement height correction rule generation device 10. The second memory 260 may include a magnetic recording medium or a flash recording medium, but the scope of the present invention is not limited thereto.

  The second controller 250 according to the embodiment of the present invention can acquire the fourth data including the height h2 from the reference plane 50 of one or more components 42 on the printed circuit wiring board 40B.

  In addition, the second controller 250 according to the embodiment of the present invention uses at least one of the first mask, the second mask, and the third mask generated by the measurement height correction rule generation device 10 to the acquired fourth data. The fifth data to which the mask is applied can be generated. For example, the second controller 250 can generate the fifth data by sequentially applying the first mask, the second mask, and the third mask to the fourth data.

  The second control unit 250 can determine the height h2 of the one or more parts 42 from the reference plane 50 based on the generated fifth data.

  According to the prior art, the chip mounter system includes only the height measuring device 20, and even when there is an error in the height of the part 42 measured by the height measuring device 20, it cannot be corrected. There was a point. As a result, the chip mounter system cannot faithfully achieve the purpose of determining whether or not the component is correctly mounted.

  The present invention applies the first mask to the third mask generated by the measurement height correction rule generation device 10 to the height measurement value related to the sample 40A (FIG. 2), and the height measurement device 20 measures the height. By correcting the height value, a more accurate height measurement result can be obtained.

  FIG. 9 shows the first mask (MASK 1), the second mask (MASK 2), and the third mask (MASK 3) generated by the measured height correction rule generating device 10 based on the height values measured by the height measuring device 20. It is drawing for demonstrating the process corrected using ().

  Referring to FIG. 9, it is assumed that a total of 16 components 43 are attached to the printed circuit wiring board 40B, and the height measuring device 20 measures the height of the 16 components 43 from the reference plane 50. . Further, it is assumed that the measurement height correction rule generation device 10 generates the first mask 210, the second mask 310, and the third mask 410 by the method described in the first embodiment.

  Under such an assumption, the height measuring apparatus 20 can generate the final data 600 by sequentially applying the first mask 210, the second mask 310, and the third mask 410 to the measurement data 500. Since the generated final data 600 is data that reflects compensation processing for errors due to the characteristics of the chip mounter system, the final data 600 can have higher accuracy than the measurement data 500.

  FIG. 10 is a flowchart for explaining a height measuring method performed by the height measuring apparatus 20. In the following, detailed description of the contents overlapping with those described in FIGS. 8 and 9 is omitted.

  The height measuring device 20 according to the embodiment of the present invention can acquire fourth data including the height from the reference plane at one or more positions on the determination target object (S910).

  In addition, the height measuring device 20 according to the embodiment of the present invention uses at least one of the first mask, the second mask, and the third mask generated by the measured height correction rule generating device 10 to the acquired fourth data. The fifth data to which the mask is applied can be generated (S920). For example, as shown in the drawing, the height measuring device 20 can generate fifth data by sequentially applying a first mask, a second mask, and a third mask to the fourth data.

  The height measuring device 20 can determine the height from the reference plane at one or more positions based on the generated fifth data (S930).

  According to the prior art, the chip mounter system includes only the height measuring device 20 and cannot correct even if there is an error in the height of the component measured by the height measuring device 20. was there. As a result, the chip mounter system cannot faithfully fulfill the purpose of determining whether or not the component is correctly mounted.

  The present invention applies the first mask to the third mask generated by the measurement height correction rule generation device 10 to the height measurement value related to the sample 40A (FIG. 2), and the height measurement device 20 measures the height. By correcting the height value, a more accurate height measurement result can be obtained.

  The embodiment according to the present invention described above is embodied in the form of a computer program executed on a computer via various components, and such a computer program is recorded on a computer-readable medium. . At this time, the medium includes a magnetic medium such as a hard disk, a floppy disk, and a magnetic tape; an optical recording medium such as a compact disc read only memory (CD-ROM) and a digital versatile disc (DVD); a floptical disk (floptical). specially designed to store and execute program instruction languages such as magneto-optical media (such as disk); and read only memory (ROM), random access memory (RAM), and flash memory A configured hardware device may be included. Further, the medium may include an intangible medium embodied in a form that can be transmitted on a network, for example, a medium that is embodied in a software form or an application form and can be transmitted and distributed via the network. But there is.

  On the other hand, the computer program is also designed and constructed specifically for the present invention, and is also known and usable by those skilled in the computer software field. Examples of the computer program include not only machine language code used by a compiler but also high-level language code executed by a computer using an interpreter.

  The particular implementation described in the present invention is an embodiment and is not intended to limit the scope of the invention in any way. For the sake of brevity, the description of the conventional electronic configuration, control system, software, and other functional aspects of the system is omitted. In addition, the line connection or connection member between the components illustrated in the drawings exemplifies functional connection and / or physical or circuit connection. It is shown as various functional connections, physical connections or circuit connections that are possible or added. In addition, unless there is a specific reference such as “essential” or “importantly”, it may not necessarily be a necessary component for the application of the present invention.

  Therefore, the idea of the present invention is not limited to the above-described embodiments, and is not limited to the scope of the claims, but is equivalent to the scope of the claims or all equivalently modified from the scope of the claims. This range belongs to the category of the idea of the present invention.

  The measurement height correction rule generation device and method thereof, and the height measurement device and method thereof according to the present invention can be effectively applied to, for example, a technical field related to a printed circuit.

DESCRIPTION OF SYMBOLS 10 Measurement height correction rule production | generation apparatus 20 Height measurement apparatus 30 Image | video acquisition apparatus 40 Object to be judged 40A Sample 40B Printed circuit wiring board 50 Reference plane 110 1st control part 120 1st memory 250 2nd control part 260 2nd memory

Claims (20)

Obtaining first data including height from a reference plane at one or more positions on the sample;
A first mask including a scale factor related to the height of the first position, which is determined based on the relative relationship between the height of the first position, which is one of the one or more positions, and a reference height. Generating
A first correction rule relating to a height of the first position determined based on a relative relationship between a height of the first position and a height of one or more second positions adjacent to the first position; Generating two masks;
The ratio between the height of the first position and the height of the third position that has a preset relationship with the first position is calculated, and is determined based on the relative relationship between the calculated ratio and the average ratio. Generating a third mask including a second correction rule related to the height of the first position. Generating the second mask comprises:
The method for generating a measurement height correction rule according to claim 1, wherein a second mask related to second data obtained by applying the first mask to the first data is generated. Generating the third mask comprises:
The method for generating a measurement height correction rule according to claim 2, wherein a third mask related to third data obtained by applying the second mask to the second data is generated. The reference height is
The height from the reference plane of the sample,
Generating the first mask comprises:
Determining a scale factor of the first position such that a product of the height of the first position and the scale factor corresponds to the reference height;
The method for generating a measurement height correction rule according to claim 1, further comprising: generating the first mask including a scale factor of each of the one or more positions. Generating the second mask comprises:
Calculating an average height that is an average of the heights of the one or more second positions;
Generating a first correction rule for replacing the height of the first position with the average height if the difference between the height of the first position and the average height is greater than or equal to a critical difference;
The method for generating a measurement height correction rule according to claim 1, further comprising: generating the second mask including a first correction rule for each of the one or more positions. The second position is
The first position and two positions adjacent to each other in the first direction and the opposite direction of the first direction;
Including the first position, the second direction, and two positions adjacent to each other in the opposite direction of the second direction,
The step of calculating the average height includes
An average of the heights of the four positions included in the second position is calculated as the average height,
The method of claim 5, wherein the first direction and the second direction are perpendicular to each other. Generating the third mask comprises:
A ratio between the height of the first position and the height of the third position, which is a line symmetrical with the first position, is calculated with reference to the reference line in the first direction or the second direction on the sample. Stages,
If the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference, calculating a correction height based on the average ratio and the height of the third position;
Generating a second correction rule that replaces the height of the first position with the correction height if the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference;
The method for generating a measurement height correction rule according to claim 1, further comprising: generating the third mask including a second correction rule for each of the one or more positions. The average ratio is
The measurement height correction according to claim 7, wherein the measurement height correction is an average related to a ratio of heights of a plurality of symmetrical pairs that are symmetrical with respect to a reference line in the first direction or the second direction on the sample. Rule generation method. Obtaining fourth data including a height from a reference plane at one or more positions on the object to be judged;
Generating fifth data by applying at least one of a first mask, a second mask, and a third mask to the fourth data;
Determining a height of the one or more positions from the reference plane based on the fifth data,
The first mask is
A scale factor related to the height of the first position determined based on the relative relationship between the height of the first position, which is one of the one or more positions, and a reference height;
The second mask is
A first correction rule relating to the height of the first position determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position;
The third mask is
The ratio between the height of the first position and the height of the third position that has a preset relationship with the first position is calculated, and is determined based on the relative relationship between the calculated ratio and the average ratio. A height measuring method including a second correction rule related to the height of the first position. The step of generating the fifth data includes:
The height measurement method according to claim 9, wherein the fifth data is generated by sequentially applying the first mask, the second mask, and the third mask to the fourth data. The object to be judged is
A printed circuit wiring board on which one or more components are mounted,
The height measurement method according to claim 9, wherein the one or more positions are positions where the one or more parts are mounted. A controller that generates at least one mask based on the first data including the height from the reference plane at one or more positions on the sample and the reference height;
The controller is
Obtaining the first data;
A first factor including a scale factor related to the height of the first position determined based on a relative relationship between the height of the first position, which is one of the one or more positions, and the reference height; Generate a mask,
A first correction rule relating to a height of the first position determined based on a relative relationship between a height of the first position and a height of one or more second positions adjacent to the first position; Two masks,
The ratio between the height of the first position and the height of the third position that has a preset relationship with the first position is calculated, and is determined based on the relative relationship between the calculated ratio and the average ratio. A measurement height correction rule generation device that generates a third mask including a second correction rule related to the height of the first position. The controller is
Generating a second mask related to second data obtained by applying the first mask to the first data;
13. The measurement height correction rule generation device according to claim 12, wherein a third mask related to third data obtained by applying the second mask to the second data is generated. The reference height is
The height from the reference plane of the sample,
The controller is
Determining the scale factor of the first position such that the product of the height of the first position and the scale factor corresponds to the reference height;
The measurement height correction rule generation device according to claim 12, wherein the first mask including a scale factor of each of the one or more positions is generated. The controller is
Calculating an average height that is an average of the heights of the one or more second positions;
If the difference between the height of the first position and the average height is greater than or equal to a critical difference, generate a first correction rule that replaces the height of the first position with the average height;
13. The measurement height correction rule generation device according to claim 12, wherein the second mask including a first correction rule for each of the one or more positions is generated. The second position is
The first position and two positions adjacent to each other in the first direction and the opposite direction of the first direction;
Including the first position, the second direction, and two positions adjacent to each other in the opposite direction of the second direction,
The controller is
An average of the heights of the four positions included in the second position is calculated as the average height,
The measurement height correction rule generation device according to claim 15, wherein the first direction and the second direction are perpendicular to each other. The controller is
A ratio between the height of the first position and the height of the third position, which is a line symmetrical with the first position, is calculated with reference to the reference line in the first direction or the second direction on the sample. ,
When the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference, a correction height is calculated based on the average ratio and the height of the third position;
If the difference between the calculated ratio and the average ratio is greater than or equal to a critical difference, generate the second correction rule to replace the height of the first position with the correction height;
13. The measurement height correction rule generation device according to claim 12, wherein the third mask including a second correction rule for each of the one or more positions is generated. The average ratio is
18. The measurement height correction according to claim 17, wherein the measurement height correction is an average related to a ratio of heights of a plurality of symmetrical pairs that are symmetrical with respect to a reference line in the first direction or the second direction on the sample. Rule generator. Acquire fourth data including the height from the reference plane at one or more positions on the object to be judged,
Generating fifth data by applying at least one of a first mask, a second mask, and a third mask to the fourth data;
A control unit that determines a height of the one or more positions from the reference plane based on the fifth data;
The first mask is
A scale factor related to the height of the first position determined based on the relative relationship between the height of the first position, which is one of the one or more positions, and a reference height;
The second mask is
A first correction rule relating to the height of the first position determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position;
The third mask is
The ratio between the height of the first position and the height of the third position that has a preset relationship with the first position is calculated, and is determined based on the relative relationship between the calculated ratio and the average ratio. A height measuring device including a second correction rule relating to the height of the first position. The controller is
The height measurement apparatus according to claim 19, wherein the fifth data is generated by sequentially applying the first mask, the second mask, and the third mask to the fourth data.