CN107588747B - Measurement height correction rule generation device and method, height measurement device and method - Google Patents
Measurement height correction rule generation device and method, height measurement device and method Download PDFInfo
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- CN107588747B CN107588747B CN201710075742.4A CN201710075742A CN107588747B CN 107588747 B CN107588747 B CN 107588747B CN 201710075742 A CN201710075742 A CN 201710075742A CN 107588747 B CN107588747 B CN 107588747B
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- 238000012937 correction Methods 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000005259 measurement Methods 0.000 title claims description 78
- 238000012545 processing Methods 0.000 description 10
- 239000000470 constituent Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000004590 computer program Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Abstract
The invention relates to a measuring height correction rule generating device and method and a height measuring device and method. The measuring height correction rule generating method according to the present invention comprises the steps of: obtaining first data comprising heights from a reference plane for more than one location on a sample; generating a first mask containing a scaling factor for the height of the first location determined based on the relative relationship between the height of the first location and the reference height; generating a second mask containing a first correction rule for the height of the first position determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position; a ratio between the height of the first position and the height of a third position in a preset relationship with the first position is calculated, and a third mask including a second correction rule for the height of the first position determined based on a relative relationship between the calculated ratio and the average ratio is generated.
Description
Technical Field
The embodiment of the invention relates to a measuring height correction rule generating device and method and a height measuring device and method.
Background
The mounter system is a system that automatically mounts a surface-mount component on a printed circuit board, and is constituted by: a component supply section that supplies components to be mounted on the printed wiring board; a driving section for actually placing a component on the printed wiring board; and the like.
The chip mounter system measures the mounting height of the component in order to achieve the purpose of judging whether the component is correctly mounted or not, and the like.
Disclosure of Invention
Embodiments of the present invention are directed to solving the above-mentioned problems, and provide a measurement height correction rule generating apparatus and method as follows: more accurate height measurements are obtained by performing a ratio correction for the measured height.
Furthermore, the present invention aims to provide a measurement height correction rule generation device and method as follows: correction based on the relative relationship between the measurement height and the heights of the adjacent position and the symmetric position is performed for the measurement height, thereby further improving the accuracy.
Furthermore, the present invention aims to provide a height measuring device and method as follows: more than one correction for the measured height is performed, thereby measuring a more accurate height.
The measurement height correction rule generation method according to an embodiment of the present invention may include the steps of: acquiring first data including the height from a reference plane of one or more positions on a Sample (Sample); generating a first mask including a scale factor for the height of the first position, wherein the scale factor (ScaleFactor) for the height of the first position is determined based on a relative relationship between the height of the first position, which is any one of the one or more positions, and a reference height; generating a second mask containing a first correction rule for the altitude of the first position, wherein the first correction rule for the altitude of the first position is determined based on a relative relationship between the altitude of the first position and the altitudes of one or more second positions adjacent to the first position; calculating a ratio of a height of the first location to a height of a third location in a preset relationship with the first location, and generating a third mask including a second correction rule for the height of the first location, wherein the second correction rule for the height of the first location is determined based on a relative relationship between the calculated ratio and an average ratio.
In the generating of the second mask, a second mask may be generated for second data, the second data being data to which the first mask is applied to the first data.
In the generating of the third mask, a third mask may be generated for third data, the third data being data to which the second mask is applied to the second data.
The reference height may be based on a height of a reference plane of the sample, and the step of generating the first mask includes the steps of: determining a scale factor for the first location in such a way that the product of the height of the first location and the scale factor corresponds to the reference height; and generating the first mask including the scaling factors for each of the one or more locations.
The step of generating the second mask may include the steps of: calculating an average height that is an average of the heights of the one or more second locations; generating a first correction rule that replaces the height of the first location with the average height when the difference between the height of the first location and the average height is greater than or equal to a critical difference; and generating the second mask including the first correction rule for each of the one or more positions.
The second position may include: two positions adjacent to the first position along a first direction and a direction opposite to the first direction; and two positions adjacent to the first position in a second direction and a direction opposite to the second direction, wherein in the step of calculating the average height, an average of heights of four positions included in the second position is calculated as the average height. At this time, the first direction and the second direction are perpendicular to each other.
The step of generating the third mask may include the steps of: calculating a ratio of a height of the first position to a height of a third position located at a position line-symmetrical to the first position, with reference to a reference line in a first direction or a second direction on the sample; calculating a correction height based on the average ratio and a height of the third position when a difference between the calculated ratio and the average ratio is equal to or greater than a critical difference; generating the second correction rule in which the height of the first position is replaced with the corrected height when the difference between the calculated ratio and the average ratio is equal to or larger than a critical difference; generating the third mask including a second correction rule for each of the one or more positions.
The average ratio may be an average of ratios of heights of a plurality of symmetrical pairs symmetrical with respect to a reference line of the first direction or the second direction on the sample.
The height measuring method according to an embodiment of the present invention may include the steps of: acquiring fourth data including a height from the reference surface at which one or more positions on the object to be determined are determined; generating fifth data to which at least one of a first mask, a second mask, and a third mask is applied to the fourth data; and determining a height of the one or more locations from the reference plane based on the fifth data. At this time, the first mask includes a scale factor for the height of the first position, wherein the scale factor for the height of the first position is determined based on a relative relationship between the height of the first position, which is any one of the one or more positions, and a reference height; the second mask includes a first correction rule for the height of the first position, wherein the first correction rule for the height of the first position is determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position; the third mask includes a second correction rule for the height of the first position, wherein the second correction rule for the height of the first position is determined based on a relative relationship between the calculated ratio and an average ratio after calculating a ratio between the height of the first position and the height of a third position in a preset relationship with the first position.
In the step of generating the fifth data, the first mask, the second mask, and the third mask may be sequentially applied to the fourth data to generate the fifth data.
The determination target object may be a printed circuit board on which one or more components are mounted, and the one or more positions may be positions where the one or more components are mounted.
The measurement height correction rule generation device according to an embodiment of the present invention may include: a control unit that generates at least one mask based on first data including a height of one or more positions on a sample from a reference surface and a reference height, and that acquires the first data and generates a first mask including a scale factor for the height of the first position, the scale factor for the height of the first position being determined based on a relative relationship between the height of the first position, which is any one of the one or more positions, and the reference height; a second mask including a first correction rule for the altitude of the first position may be generated, wherein the first correction rule for the altitude of the first position is determined based on a relative relationship between the altitude of the first position and the altitudes of one or more second positions adjacent to the first position; and may generate a third mask including a second correction rule for the height of the first position, wherein the second correction rule for the height of the first position is determined based on a relative relationship between the calculated ratio and an average ratio after calculating a ratio between the height of the first position and a height of a third position in a preset relationship with the first position.
The control section may generate a second mask for second data and generate a third mask for third data, the second data being data to which the first mask is applied to the first data; the third data is data to which the second mask is applied to the second data.
The reference height may be a height based on a reference plane of the sample, and the control portion may determine a scale factor of the first position such that a product of the height of the first position and the scale factor corresponds to the reference height, and generate the first mask including the scale factors of the one or more positions.
The control unit may calculate an average height that is an average of the heights of the one or more second positions, may generate a first correction rule in which the height of the first position is replaced with the average height when a difference between the height of the first position and the average height is a critical difference or more, and may generate the second mask including first correction rules for the respective one or more positions.
The second position may include: two positions adjacent to the first position along a first direction and a direction opposite to the first direction; and two positions adjacent to the first position along a second direction and a direction opposite to the second direction, and the control portion may calculate an average of heights of four positions included in the second position as the average height, and the first direction and the second direction may be perpendicular to each other.
The control unit may calculate a ratio of a height of the first position to a height of a third position located at a position line-symmetrical to the first position with reference to a reference line in a first direction or a second direction on the sample, calculate a corrected height based on the average ratio and a height of the third position when a difference between the calculated ratio and the average ratio is a critical difference or more, generate the second correction rule in which the height of the first position is replaced with the corrected height when the difference between the calculated ratio and the average ratio is the critical difference or more, and generate the third mask including second correction rules for the one or more positions.
The average ratio may be an average of ratios of heights of a plurality of symmetrical pairs symmetrical with respect to a reference line of the first direction or the second direction on the sample.
The height measuring apparatus according to an embodiment of the present invention may include: a control unit configured to acquire fourth data including a height from a reference surface at one or more positions on a determination target object, generate fifth data in which at least one of a first mask, a second mask, and a third mask is applied to the fourth data, and determine the height from the reference surface at the one or more positions based on the fifth data, wherein the first mask may include a scale factor for the height of the first position, the scale factor for the height of the first position being determined based on a relative relationship between the height of the first position as any one of the one or more positions and the reference height; the second mask may include a first correction rule for the height of the first position, wherein the first correction rule for the height of the first position is determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position; the third mask may include a second correction rule for the height of the first position, wherein the second correction rule for the height of the first position is determined based on a relative relationship between the calculated ratio and an average ratio after calculating a ratio between the height of the first position and the height of a third position in a preset relationship with the first position.
The control unit may apply the first mask, the second mask, and the third mask to the fourth data in this order to generate the fifth data.
Embodiments of the present invention are directed to solving the above-described problems, and can realize a measurement height correction rule generation device and method as follows: more accurate height measurements are obtained by performing a ratio correction for the measured height.
In addition, the present invention can realize a measurement height correction rule generation device and method as follows: a correction based on the relative relationship between the measured height and the heights of the adjacent position and the symmetrical position is performed for the measured height, thereby further improving the accuracy.
In addition, the present invention can realize a height measuring apparatus and method as follows: more than one correction for the measured height is performed, so that a more accurate height can be measured.
Drawings
Fig. 1 is a diagram showing a mounter system equipped with a measurement height correction rule generation device according to an embodiment of the present invention.
Fig. 2 schematically shows a configuration in which the height of a sample is measured in order to generate a correction rule in the mounter system according to an embodiment of the present invention.
FIG. 3 is an example of first data generated by the height measuring device.
Fig. 4 schematically illustrates a process in which the first control section generates the first mask and the second data employing the first mask to the first data according to an embodiment of the present invention.
Fig. 5 schematically illustrates a process in which the first control section generates the second mask and the third data that employs the second mask for the second data according to an embodiment of the present invention.
Fig. 6 schematically illustrates a process in which the first control section generates the third mask and the fourth data employing the third mask to the third data according to an embodiment of the present invention.
Fig. 7 is a flowchart for explaining a measurement height correction rule generation method performed by the measurement height correction rule generation means.
Fig. 8 is a diagram for explaining a process in which the height measurement device measures the height of the printed wiring board according to an embodiment of the present invention.
Fig. 9 is a diagram for explaining a process of correcting the height value measured by the height measuring device using the first to third masks generated by the correction rule generating device.
Fig. 10 is a flowchart for explaining a height measurement method performed by the height measurement device.
Description of the symbols
10: measurement height correction rule generation means 20: height measuring device
30: the image acquisition device 40: judging the object
50: datum plane
Detailed Description
While the invention is susceptible to various modifications and alternative embodiments, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. . The effects and features of the present invention and the methods for achieving the same will be more apparent with reference to the drawings and the embodiments described in detail. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings, and in the description with reference to the drawings, the same reference numerals will be given to the same or corresponding components, and the repetitive description thereof will be omitted.
In the following embodiments, the terms "first", "second", and the like are not intended to have a limiting meaning, but are used to distinguish one constituent element from another constituent element. In the following embodiments, expressions in the singular number include expressions in the plural number when there is no explicit other meaning. In the following embodiments, terms such as "include (include)", "have (include)" and the like indicate the presence of the feature or the constituent element described in the specification, and do not exclude the possibility of addition of one or more other features or constituent elements in advance. In the drawings, the sizes of the constituent elements may be exaggerated or reduced for convenience of explanation. For example, since each component shown in the drawings is represented in an arbitrary size or form, the present invention is not necessarily limited to the size or form shown in the drawings.
< first embodiment >: measuring height correction rule generating device and method
Fig. 1 is a diagram showing a chip mounter system equipped with a measurement height correction rule generation device 10 according to an embodiment of the present invention.
In the present invention, a Chip Mounter System (Chip Mounter System) may represent various systems for automatically mounting surface mount type components on a printed circuit wiring board. Accordingly, the mounter system according to the present invention may include the following general constituent elements: a component supply section (not shown) for supplying components to be mounted on the printed wiring board; a driving section (not shown) that actually places the components on the printed wiring board. The present invention relates to the measurement height correction rule generating apparatus 10 provided in the mounter system, and therefore, a detailed description of the above-described general configuration will be omitted.
A mounter system according to an embodiment of the present invention may include: a measurement height correction rule generation device 10, a height measurement device 20, an image acquisition device 30, a determination target object 40, and a reference surface 50.
The image acquisition apparatus 30 according to an embodiment of the present invention may be various means for acquiring an image containing distance information of the determination target object 40. For example, the image acquisition device 30 may be a Stereo Camera (Stereo Camera) including two image acquisition units as shown in fig. 1. In this case, the image acquisition device 30 may output distance information from a specific position of the determination target object 40 based on the images acquired by the two image acquisition units. At this time, the two image capturing units of the image capturing apparatus 30 may be arranged based on any one of a parallel type, a vertical type, a horizontal type, a cross type, and a horizontal movement type.
In addition, the image acquisition device 30 may be a distance Camera (Depth Camera) for outputting distances from the Camera to all positions in the photographed scene. In this case, the image acquisition device 30 may output distance information as a distance to the subject photographed in each pixel (pixel).
The two types of image capturing apparatuses 30 described above are merely examples, and the concept of the present invention is not limited to this, and may be used without limitation as long as it is a means capable of outputting distance information on a plurality of positions on the determination target 40.
The height measuring device 20 according to an embodiment of the present invention may generate the height information of the determination target object 40 based on the distance information acquired by the image acquisition device 30.
For example, the height measuring device 20 may calculate a difference between the distance between the reference surface 50 and the image acquiring device 30 and the distance between the image acquiring device 30 and the determination target object 40, and generate the height information of the determination target object 40.
Further, the height measuring device 20 may extract only the distance information for the region that needs to be determined from the distance information acquired by the image acquisition device 30, and supply the extracted distance information to the measurement height correction rule generation device 10 described below.
As described above, the height measuring device 20 generates the height information of the determination target object 40 based on the distance information acquired by the image acquisition device 30, and supplies it to the correction rule generation device 10.
The height measuring device 20 may correct the height information according to one or more correction rules generated by the measurement height correction rule generating device 10 described below, and generate corrected height information for the determination target object 40. This will be described in more detail in the second embodiment below.
In an embodiment of the present invention, the determination target object 40 may be a variety of objects for which height information needs to be acquired. For example, the determination target object 40 may be a printed circuit board on which components are mounted. The determination target object 40 may be a sample (sample) having a known height for causing the measurement height correction rule generation device 10 to generate the correction rule. In addition, the reference surface 50 is a surface on which the determination target object 40 is placed, and may be a reference surface for measuring the height of the determination target object 40.
Fig. 2 schematically shows a configuration in which the height of the sample 40A is measured in order to generate the correction rule in the mounter system according to an embodiment of the present invention.
In the present invention, the sample 40A may represent a judgment target object whose height h1 is known with reference to the reference surface 50 as described above. For example, sample 40A may be a uniform flake (sheet) form object with a height of 40 μm. Further, the height of the position of the sample 40A corresponding to the position where the component is mounted is the same and 80 μm, and the remaining position where the component is not mounted may be an object of a general sheet form.
In the case of fig. 2, the purpose of the height measurement device 20 measuring the height of the sample 40A is to cause the measurement height correction rule generation device 10 to generate the correction rule, and is not to measure the height of the sample 40A itself.
The measurement height correction rule generation device 10 according to an embodiment of the present invention may include a first control unit 110 and a first memory 120 for generating a correction rule for height information of a determination target object.
The first control portion 110 according to an embodiment may include all kinds of devices such as a processor (processor) that can process data. Here, the "processor" may mean a data processing apparatus built in hardware, which is provided with a circuit having a physical structure in order to execute a function indicated by a code or a command included in a program. As described above, an example of the data processing apparatus incorporated in hardware may include: a microprocessor (microprocessor), a Central Processing Unit (CPU), a processor core (processor core), a multiprocessor (multiprocessor), an application-specific integrated circuit (ASIC), a Field Programmable Gate Array (FPGA), or other processing devices, but the scope of the present invention is not limited thereto.
The first memory 120 according to an embodiment performs a function of temporarily or permanently storing data, a command (instruction), a program code, or a combination thereof, which are processed by the first control unit 110. In addition, the first memory 120 may temporarily and/or permanently store the height information of the determination target object acquired from the height measuring device 20. In addition, the first memory 120 may temporarily and/or permanently store the generated first Mask (Mask) to third Mask. First memory 120 may comprise a magnetic storage medium (magnetic storage medium) or a flash storage medium (flash storage medium), although the scope of the present invention is not limited in this respect.
Although fig. 1, 2, and 8 show the case where the measurement height correction rule generating device 10 and the height measuring device 20 are provided separately from each other, the purpose is merely for convenience of description, and the measurement height correction rule generating device 10 and the height measuring device 20 may be configured by integrating them into one height measuring device. Hereinafter, a process of generating the correction rule by the measurement height correction rule generating device 10 according to an embodiment of the present invention using the measurement height of the sample 40A will be described.
The first control part 110 according to an embodiment of the present invention may acquire first data including the height of one or more positions of the sample from the reference surface from the height measuring device 20.
Fig. 3 is an example of first data generated by the height measuring device 20.
Referring to fig. 3, the height measuring device 20 may measure the height of more than one position of the sample 40A from the reference surface. Here, the reference surface 50 may be a floor surface. For example, the height measuring device 20 may measure the height for 16 positions of the sample 40A.
The height measuring device 20 may generate the first data 111 in a table (table) or matrix (matrix) form using the measured heights of the plurality of positions in consideration of the positions corresponding to the respective heights. For example, a height for any one location 41 may be stored at the location 112 corresponding to that location 41 in the table.
In the present invention, the "position" indicates a position as a height measurement target of the height measurement device 20, and may indicate any position in a three-dimensional space. For example, in the case where the sample 40A is located on the X-Y plane, a certain position may be any one point in a three-dimensional space that can be expressed as (X, Y, Z). At this time, the height of the position may be Z.
The first control part 110 according to an embodiment of the present invention may generate a first mask including a scale factor (scale factor) for the height of the first position, wherein the scale factor (scale factor) for the height of the first position is determined based on a relative relationship between the height of the first position and a reference height. In this case, the first position may be any one of one or more positions of the sample (40A).
In the present invention, when the sample 40A is an ideal object in a sheet form having a predetermined thickness and a uniform height of the upper surface, "reference height" may mean a height from the reference surface 50 to the upper surface. As described above, since the sample 40A can represent the object to be determined whose height (h 1 in fig. 2) based on the reference surface 50 is known, it is possible to determine how much error the measured height includes by comparing the reference height and the measured height of the sample 40A. When the sample 40A is a highly uniform sheet-shaped object, the reference height as described above may be the same value for all positions; when the sample 40A is an object having a different height at a part of the positions, the reference height as described above may have a different value at each position.
Fig. 4 schematically illustrates a process in which the first control part 110 generates the first mask 210 and the second data 220 using the first mask 210 for the first data 111A according to an embodiment of the present invention.
Referring to fig. 4, the first control part 110 may determine the scale factor of the first position in such a manner that the product of the height of the first position and the scale factor corresponds to the reference height. In this case, the first position may be any one of one or more positions on the sample (40A in fig. 3).
Assuming that the reference height is 1.0 and the height 112A of the first position is 1.5, the first control part 110 may determine the scale factor 211 to be 0.6 such that the product of the height 112A of the first position, i.e., 1.5, and the scale factor 211 becomes the reference height, i.e., 1.0. In this case, the height may be in units of μm, nm, or the like.
The first control portion 110 may generate a first mask 210 including a scale factor for each of one or more locations. In other words, the first control part 110 may determine a scale factor for each location and generate the first mask 210 including the determined plurality of scale factors.
In addition, the first control part 110 may acquire the second data 220 including the more accurate height by using the generated first mask 210 for the first data 111A. For example, the height 112A of the first position included in the first data is 1.5, whereas the height 221 of the first position included in the second data 220 is 0.9, whereby it can be confirmed that the height 221 of the first position in the second data 220 is closer to 1.0 as the reference height of the sample (40A in fig. 3).
In the present invention, "to apply a B mask to a data" may mean to apply an operation rule included in the B mask for each position to the a data. For example, since the first mask includes a scale factor for each position, the first mask may be used to mean that the height of each position is multiplied by the scale factor corresponding to the height. The following use of the second mask and the third mask may mean that the calculation rule included for each position in each mask is applied to the height value of each position.
As described above, the present invention can obtain a more accurate height measurement result by performing ratio correction for the measured height. Generally, the height measuring devices 20 have the same tendency to have the same error for the same position. Accordingly, a first mask reflecting such an error tilt can be generated and applied to the measurement data, thereby enabling more accurate height measurement to be performed.
The first control part 110 according to an embodiment of the present invention may generate the second mask including a first correction rule for the altitude of the first position, the first correction rule for the altitude of the first position being determined based on a relative relationship between the altitude of the first position and the altitudes of one or more second positions adjacent to the first position.
In the present invention, the second position may represent various positions adjacent to the first position. For example, the second position may include two positions adjacent to the first position along the first direction and the reverse direction of the first direction, and two positions adjacent to the first position along the second direction and the reverse direction of the second direction. In this case, the first direction and the second direction may be perpendicular to each other.
In the present invention, the "correction rule" may indicate an operation rule for a certain height value. For example, the correction rule may be a rule in which the height value of the corresponding position is replaced with a preset value.
Fig. 5 schematically illustrates a process in which the first control part 110 generates the second mask 310 and the third data 320 using the second mask 310 for the second data 220A according to an embodiment of the present invention.
First, the first control unit 110 may calculate an average height, which is an average height of the heights of the one or more second positions 222A, 223A, 224A, and 225A. For example, as described above, when the second positions 222A, 223A, 224A, and 225A represent four positions adjacent to the first position 221A in the cross state, the first control portion 110 may calculate an average value of the heights of the four positions as an average height. For the first position 221A of fig. 5, the average height may be 1.0.
Thereafter, when the difference between the height of the first position 221A and the average height is equal to or greater than the critical difference, the first control portion 110 may generate a first correction rule in which the height of the first position is replaced with the average height. For example, as in the above example, in the case where the average height of the first positions 221A is 1.0, the height of the first positions 221A is 7.0, and the critical difference is 3.0, it may correspond to the case where the difference between the height of the first positions 221A and the average height is the critical difference or more. In this case, the first control portion 110 may generate the first correction rule 312 that replaces the height of the first position 221A with the average height.
The first control unit 110 may generate the second mask 310 including the first correction rule for each of the one or more positions. In other words, the first control part 110 may generate the first correction rule for each location and generate the second mask 310 including the first correction rule generated for each location.
The first control unit 110 acquires the third data 320 including the more accurate height by applying the generated second mask 310 to the second data 220A. For example, the height of the first position 221A included in the second data 220A is 7.0, whereas the height 332 of the first position included in the third data 320 is 1.0, whereby it can be confirmed that the height 322 of the first position included in the third data 320 is closer to 1.0 as the reference height of the sample 40A.
As described above, the present invention can perform correction based on the relative relationship between the measured height and the height of the adjacent position with respect to the measured height, thereby obtaining a more accurate height measurement result.
The first control part 110 according to an embodiment of the present invention calculates a ratio of a height of the first position to a height of a third position in a preset relationship with the first position, and generates a third mask including a second correction rule for the height of the first position, which is determined based on a relative relationship between the calculated ratio and the average ratio.
Fig. 6 schematically illustrates a process in which the first control part 110 generates the third mask 410 and the fourth data 420 employing the third mask 410 to the third data 320A according to an embodiment of the present invention.
First, the first control portion 110 may calculate a ratio of the height of the first position 321A and the height of the third position 322A, which is a position in a preset relationship with the first position 321A. At this time, the third position 322A may be a position line-symmetrical to the first position 321A with reference to the reference line 350 in the first direction or the second direction on the sample. For example, for the case of fig. 6, the ratio of the height of the first location 321A to the height of the third location 322A may be 3(3.0/1.0 ═ 3).
Then, when the difference between the calculated ratio and the average ratio is equal to or greater than the threshold difference, the first control portion 110 may calculate the correction height based on the average ratio and the height of the third position.
At this time, the average ratio may be an average of ratios of heights of a plurality of symmetric pairs that are symmetric with reference to the reference line 350 in the first direction or the second direction. For example, in the case of fig. 6, eight symmetric pairs are formed with reference to the reference line 350, and the average ratio value thereof is 1.25((1x7+ 3)/8). In other words, for the case of fig. 6, the average ratio may be 1.25. At this time, if the critical difference is assumed to be 1, the ratio of the height of the first position 321A to the height of the third position 322A is 3, and the average ratio is 1.25, so that the difference between the two is equal to or greater than the critical difference. In this case, the first control portion 110 may calculate the product of the average ratio 1.25 and the height 1.0 of the third position 322A, i.e., 1.25, as the corrected height (1.25 × 1.0).
In addition, when the calculated ratio, that is, the difference between the average ratio and the ratio of the height of the first position 321A to the height of the third position 322A is equal to or greater than the critical difference, the first control portion 110 may generate the second correction rule in which the height of the first position is replaced with the calculated correction height. That is, in the case of fig. 6, the first control portion 110 may generate the second correction rule replacing the height 3.0 of the first position 321A with the correction height 1.25.
Finally, the first control unit 110 may generate a third mask 410 including a second correction rule for each of one or more positions. In other words, the first control part 110 generates the second correction rule for each location, and may generate the third mask 410 including the second correction rule generated for each location.
Further, the first control portion 110 may acquire the fourth data 420 including the more accurate height by using the generated third mask 410 for the third data 320A. For example, the height 321A of the first position included in the third data 320A is 3.0, and conversely, the height 421 of the first position included in the fourth data 420 is 1.25, whereby it can be confirmed that the height 421 of the first position included in the fourth data 420 is closer to 1.0 which is the reference height of the sample 40A.
As described above, the present invention can perform correction based on the relative relationship between the measured height and the height of the symmetrical position with respect to the measured height, thereby obtaining a more accurate height measurement result.
In addition, the above-described contents are intended to generate the correction rule, and it is obvious that, in the case of generating the correction rule through the above-described procedure, the measurement height correction rule generating apparatus 10 can measure the heights of various objects such as the wiring board in addition to the sample 40A.
Fig. 7 is a flowchart for explaining a measurement height correction rule generation method executed by the correction rule generation device 10. Hereinafter, detailed description of contents overlapping with those described in fig. 1 to 6 will be omitted.
The first control part 110 according to an embodiment of the present invention may acquire first data including heights of one or more positions on the sample from the reference surface from the height measuring device 20 (S710).
In the present invention, "position" refers to a position that is a height measurement target of the height measurement device 20, and may represent any position in a three-dimensional space. For example, in the case where the sample 40A is placed on the X-Y plane, a certain position may be any one point on a three-dimensional space that can be expressed as (X, Y, Z). At this time, the height of the position may be Z.
The first control part 110 according to an embodiment of the present invention may generate a first mask including a scale factor (scale factor) for the height of the first position, wherein the scale factor (scale factor) for the height of the first position is determined based on a relative relationship between the height of the first position and a reference height (S720). At this time, the first position may be any one of more than one position on the sample 40A. In addition, the "reference height" in the present invention may mean a height from the reference surface 50 of the sample 40A. As described above, since the sample 40A can represent a determination target object whose height is known with respect to the reference surface 50, it is possible to determine how much error the measured height includes by comparing the reference height of the sample 40A with the measured height.
The first control part 110 may determine the scale factor of the first position in such a manner that the product of the height of the first position and the scale factor corresponds to the reference height. For example, when the reference height is 1 and the height of the first position is 1.5, the first control unit 110 may determine the scale factor to be 0.6 so that the product of the height of the first position 1.5 and the scale factor is 1, that is, the reference height. The first control unit 110 may generate a first mask including a scale factor for each of one or more positions.
The first control unit 110 may acquire the second data including the more accurate height by using the generated first mask with respect to the first data. As described above, the present invention can obtain a more accurate height measurement result by performing ratio correction for the measured height. Generally, the height measuring devices 20 have a tendency to exhibit the same error for the same position. Accordingly, a first mask reflecting such an error tendency is generated and applied to the measurement data, so that more accurate height measurement can be performed.
The first control part 110 according to an embodiment of the present invention may generate a second mask including a first correction rule for the altitude of the first position, the first correction rule for the altitude of the first position being determined based on a relative relationship between the altitude of the first position and the altitudes of one or more second positions adjacent to the first position (S730). Specifically, the first control unit 110 may calculate an average height, which is an average height of heights of one or more second positions. For example, as described above, the second position may represent four positions adjacent to the first position in a cross-shaped state, and in this case, the first control part 110 may calculate an average value of heights of the four positions as an average height.
Thereafter, when the difference between the height of the first position and the average height is equal to or greater than the critical difference, the first control portion 110 may generate a first correction rule in which the height of the first position is replaced with the average height. The first control unit 110 may generate a first mask including a first correction rule for each of one or more positions. In other words, the first control part 110 may generate the first correction rule for each location and generate the second mask 310 including the first correction rule generated for each location.
In addition, the first control portion 110 may acquire third data including a more accurate height by using the generated second mask for the second data. As described above, the present invention can perform correction based on the relative relationship between the measured height and the height of the adjacent position with respect to the measured height, thereby obtaining a more accurate height measurement result.
The first control part 110 according to an embodiment of the present invention calculates a ratio of a height of the first position to a height of a third position in a preset relationship with the first position, and generates a third mask including a second correction rule for the height of the first position, which is determined based on a relative relationship between the calculated ratio and the average ratio (S740).
First, the first control part 110 may calculate a ratio of the height of the first position and the height of the third position. At this time, the third position may be a position line-symmetrical to the first position with reference to a reference line in the first direction or the second direction on the sample 40A.
Then, when the difference between the calculated ratio and the average ratio is equal to or greater than the threshold difference, the first control portion 110 may calculate the correction height based on the average ratio and the height of the third position. At this time, the average ratio may be an average of height ratios of a plurality of symmetric pairs that are symmetric with reference to the reference line of the first direction or the second direction on the sample 40A.
Further, the first control unit 110 may generate the second correction rule by replacing the height of the first position with the calculated correction height when the difference between the calculated ratio and the average ratio is equal to or greater than a threshold difference.
Finally, the first control unit 110 may generate a third mask 310 including a second correction rule for each of one or more positions. In other words, the first control part 110 may generate the second correction rule for each location and generate the third mask 310 including the second correction rule generated for each location.
In addition, the first control portion 110 may acquire fourth data including a more accurate height by applying the generated third mask to the third data. As described above, the present invention can perform correction based on the relative relationship between the measured height and the height of the symmetrical position with respect to the measured height, thereby obtaining a more accurate height measurement result.
< second embodiment >: height measuring device and method
The first embodiment described above describes a method of generating the correction rule by measuring the height of a sample having a known height by the measured height correction rule generating device 10.
In the present embodiment, a method of generating corrected height information by the height measuring device 20 based on the correction rule generated by the correction rule generating device 10 will be described.
Fig. 8 is a diagram for explaining a process in which the height-sidedness measuring device 20 measures the height of the printed wiring board 40B according to an embodiment of the present invention.
The height measuring device 20 according to an embodiment of the present invention may include a second control section 250 and a second memory 260 for generating height information of the printed wiring board 40B and corrected height information of the printed wiring board 40B.
The second control part 250 according to an embodiment may include all kinds of devices capable of processing data, such as a processor (processor). Here, the "processor" may mean, for example, a data processing apparatus built in hardware, which is provided with a circuit having a physical structure in order to execute a function expressed as a code or a command included in a program. As described above, an example of the data processing apparatus incorporated in hardware may include: a microprocessor (microprocessor), a Central Processing Unit (CPU), a processor core (processor core), a multiprocessor (multiprocessor), an application-specific integrated circuit (ASIC), a Field Programmable Gate Array (FPGA), or other processing devices, but the scope of the present invention is not limited thereto.
The second memory 260 according to an embodiment performs a function of temporarily or permanently storing data, a command (instruction), a program code, or a combination of these processed by the second control unit 250. In addition, the second memory 260 may temporarily and/or permanently store height information of the printed wiring board 40B. In addition, the second memory 260 may temporarily and/or permanently store the first to third masks generated by the correction rule generation apparatus 10. Second memory 260 may include a magnetic storage medium (magnetic storage medium) or a flash memory medium (flash storage medium), although the scope of the present invention is not limited in this respect.
The second control section 250 according to an embodiment of the present invention may acquire fourth data including the height h2 of one or more components 42 on the printed wiring board 40B from the reference surface 50.
Further, the second control section 250 according to an embodiment of the present invention may generate fifth data using at least one mask of the first mask, the second mask, and the third mask generated by the correction rule generating apparatus 10 for the fourth data. For example, the second control unit 250 may generate fifth data by sequentially applying the first mask, the second mask, and the third mask to the fourth data.
The second control unit 250 may determine the height h2 of one or more components 42 from the reference surface 50 based on the generated fifth data.
According to the related art, since the mounter system is provided with only the height measuring device 20, there is a problem that even if there is an error in the height of the component 42 measured by the height measuring device 20, correction cannot be performed. Therefore, the system of the mounter may not sufficiently achieve the purpose of determining whether the component is accurately mounted.
The present invention can apply the first to third masks generated by the measurement height correction rule generation apparatus 10 to the height measurement values for the sample (40A of fig. 2) and correct the height values measured by the height measurement apparatus 20, thereby obtaining more accurate height measurement results.
Fig. 9 is a diagram for explaining a process of correcting the height value measured by the height measuring device 20 by using the first to third masks generated by the correction rule generating device 10.
Referring to fig. 9, it is assumed that a total of sixteen components 43 are attached to the printed wiring board 40B, and the height measuring device 20 measures the heights of the sixteen components 43 from the reference surface 50. Further, it is assumed that the measurement height correction rule generation apparatus 10 generates the first mask 210, the second mask 310, and the third mask 410 according to the method explained in the first embodiment.
Under these assumptions, the height measuring device 20 may generate the final data 600 by sequentially applying the first mask 210, the second mask 310, and the third mask 410 to the measurement data 500. The generated final data 600 is data reflecting compensation processing for errors caused by characteristics of the mounter system, and thus may have higher accuracy than the measurement data 500.
Fig. 10 is a flowchart for explaining a height measurement method performed by the height measurement device 20. Hereinafter, detailed description of contents overlapping with those described in fig. 8 to 9 will be omitted.
The height measuring device 20 according to an embodiment of the present invention may acquire fourth data including the height from the reference surface at which one or more positions on the target object are determined (S910).
Further, the height measuring device 20 according to an embodiment of the present invention may generate fifth data using at least one mask of the first mask, the second mask, and the third mask generated by the correction rule generating device 10 for the acquired fourth data (S920). For example, as shown in the figure, the height measuring device 20 may generate the fifth data by sequentially applying the first mask, the second mask, and the third mask to the fourth data.
The height measurement device 20 may determine the height of one or more positions from the reference surface based on the generated fifth data (S930).
According to the prior art, the chip mounter system is only provided with the height measuring device 20, so that the problem that even if the height of the component measured by the height measuring device 20 has an error, the component cannot be corrected exists. Accordingly, the system of the mounter may not sufficiently achieve the purpose of determining whether the component is accurately mounted.
The present invention can apply the first to third masks generated by the measurement height correction rule generation device 10 to the height measurement value for the sample (40A of fig. 2) and correct the height value measured by the height measurement device 20, thereby enabling to obtain a more accurate height measurement result.
The embodiments according to the present invention described above can be implemented in the form of a computer program that can be executed on a computer by various constituent elements, and such a computer program can be recorded in a computer-readable medium. Here, the medium may include: magnetic media such as hard disks, floppy disks, and magnetic tape; optical recording media such as CD-ROM and DVD; magneto-optical media (magneto-optical media) such as floptical disks (floptical disks); and hardware devices such as ROM, RAM, flash memory, etc. which are specially configured to store and execute program commands. Further, the medium may include an intangible medium embodied in a form that can be transmitted over a network, and may be, for example, a medium in the form of: the software or application program is embodied in the form of software or application program, and can be transmitted and circulated via a network.
The computer program may be a program designed and configured specifically for the purpose of the present invention, or may be a program that is known to those skilled in the art of computer software and can be used. Examples of the computer program include not only machine language codes (machine language codes) generated by a compiler but also high-level language codes that can be executed by a computer using an interpreter or the like.
The particular implementations described herein are merely examples and are not intended to limit the scope of the invention in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functionality of the systems may be omitted. Note that the line connection or connection member between the constituent elements illustrated in the drawings exemplarily shows functional connection and/or physical connection or circuit connection, and may represent various functional connections, physical connections, or circuit connections that may be substituted or added in an actual device. In addition, if "necessary", "important", or the like is not specifically mentioned, it may not be a constituent element necessary for the application of the present invention.
Therefore, the idea of the present invention should not be limited to the above-described embodiments, and all the ranges of the claims and the range equivalent to the claims or the equivalent change of the claims are considered to be within the scope of the idea of the present invention.
Claims (20)
1. A measurement height correction rule generation method comprises the following steps:
obtaining first data comprising heights from a reference plane for more than one location on a sample;
generating a first mask including a scale factor for an altitude of a first location, wherein the scale factor for the altitude of the first location is determined based on a relative relationship between the altitude of the first location, which is any one of the one or more locations, and a reference altitude;
generating a second mask containing a first correction rule for the altitude of the first position, wherein the first correction rule for the altitude of the first position is determined based on a relative relationship between the altitude of the first position and the altitudes of one or more second positions adjacent to the first position;
calculating a ratio of a height of the first location and a height of a third location in a preset relationship with the first location, and generating a third mask including a second correction rule for the height of the first location, wherein the second correction rule for the height of the first location is determined based on a relative relationship between the calculated ratio and an average ratio.
2. The measurement height correction rule generation method according to claim 1,
in the step of generating the second mask, a second mask is generated for second data, the second data being data to which the first mask is applied to the first data.
3. The measurement height correction rule generation method according to claim 2,
in the step of generating the third mask, a third mask is generated for third data, the third data being data to which the second mask is applied to the second data.
4. The measurement height correction rule generation method according to claim 1,
the reference height is a height from a reference plane of the sample,
the step of generating the first mask includes the steps of:
determining a scale factor for the first location in such a way that the product of the height of the first location and the scale factor corresponds to the reference height; and
generating the first mask including the scaling factors for each of the one or more locations.
5. The measurement height correction rule generation method according to claim 1,
the step of generating the second mask comprises the steps of:
calculating an average height that is an average of the heights of the one or more second locations;
generating a first correction rule that replaces the height of the first location with the average height when the difference between the height of the first location and the average height is greater than or equal to a critical difference; and
generating the second mask including a first correction rule for each of the one or more locations.
6. The measurement height correction rule generation method according to claim 5,
the second position comprises: two positions adjacent to the first position along a first direction and a direction opposite to the first direction; and
two positions adjacent to the first position along the second direction and the direction opposite to the second direction,
in the step of calculating the average height,
calculating an average of heights of four positions included in the second position as the average height,
the first direction and the second direction are perpendicular to each other.
7. The measurement height correction rule generation method according to claim 1,
the step of generating the third mask includes the steps of:
calculating a ratio of a height of the first position to a height of a third position located at a position line-symmetrical to the first position, with reference to a reference line in a first direction or a second direction on the sample;
calculating a correction height based on the average ratio and a height of the third position when a difference between the calculated ratio and the average ratio is equal to or greater than a critical difference;
generating the second correction rule in which the height of the first position is replaced with the corrected height when the difference between the calculated ratio and the average ratio is equal to or larger than a critical difference;
generating the third mask including a second correction rule for each of the one or more positions.
8. The measurement height correction rule generation method according to claim 7,
the average ratio is an average of ratios of heights of a plurality of symmetrical pairs symmetrical with respect to a reference line in the first direction or the second direction on the sample.
9. A height measuring method comprising the steps of:
acquiring fourth data including a height from the reference surface at which one or more positions on the object to be determined are determined;
generating fifth data to which at least one of a first mask, a second mask, and a third mask is applied to the fourth data; and
determining a height of the one or more locations from the reference plane based on the fifth data,
the first mask includes a scale factor for the height of a first location, wherein the scale factor for the height of the first location is determined based on a relative relationship between the height of the first location, which is any one of the one or more locations, and a reference height;
the second mask includes a first correction rule for the height of the first position, wherein the first correction rule for the height of the first position is determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position;
the third mask includes a second correction rule for the height of the first position, wherein the second correction rule for the height of the first position is determined based on a relative relationship between the calculated ratio and an average ratio after calculating the ratio of the height of the first position to the height of a third position in a preset relationship with the first position.
10. The height measuring method according to claim 9,
in the step of generating the fifth data, the first mask, the second mask, and the third mask are sequentially applied to the fourth data to generate the fifth data.
11. The height measuring method according to claim 9,
the object to be judged is a printed wiring board on which one or more components are mounted,
the one or more positions are positions where the one or more components are mounted.
12. A measurement height correction rule generation device comprising:
a control unit that generates at least one mask based on first data and a reference height, wherein the first data includes the height from the reference plane of at least one position on the sample,
the control section acquires the first data and generates a first mask including a scale factor for a height of a first position, the scale factor for the height of the first position being determined based on a relative relationship between the height of the first position as any one of the one or more positions and the reference height,
generating a second mask including a first correction rule for the altitude of the first location, wherein the first correction rule for the altitude of the first location is determined based on a relative relationship between the altitude of the first location and the altitudes of one or more second locations adjacent to the first location;
generating a third mask including a second correction rule for the height of the first position, wherein the second correction rule for the height of the first position is determined based on a relative relationship between the calculated ratio and an average ratio after calculating the ratio of the height of the first position and the height of a third position in a preset relationship with the first position.
13. The measurement height correction rule generation apparatus according to claim 12,
the control section generating a second mask for second data and generating a third mask for third data, the second data being data to which the first mask is applied to the first data; the third data is data to which the second mask is applied to the second data.
14. The measurement height correction rule generation apparatus according to claim 12,
the reference height is a height from a reference plane of the sample,
the control portion determines the scale factor of the first position such that a product of the height of the first position and the scale factor corresponds to the reference height,
and generating the first mask including the scaling factors for each of the one or more locations.
15. The measurement height correction rule generation apparatus according to claim 12,
the control unit calculates an average height that is an average of heights of the one or more second positions;
generating a first correction rule that replaces the height of the first location with the average height when the difference between the height of the first location and the average height is greater than or equal to a critical difference;
generating the second mask including a first correction rule for each of the one or more locations.
16. The measurement height correction rule generation apparatus according to claim 15,
the second position comprises: two positions adjacent to the first position along a first direction and a direction opposite to the first direction; and
two positions adjacent to the first position along the second direction and the direction opposite to the second direction,
the control section calculates an average of heights of four positions included in the second position as the average height,
the first direction and the second direction are perpendicular to each other.
17. The measurement height correction rule generation apparatus according to claim 12,
the control unit calculates a ratio of a height of the first position to a height of a third position located at a position line-symmetrical to the first position, with reference to a reference line in a first direction or a second direction on the sample;
calculating a correction height based on the average ratio and a height of the third position when a difference between the calculated ratio and the average ratio is equal to or greater than a critical difference;
generating the second correction rule in which the height of the first position is replaced with the corrected height when the difference between the calculated ratio and the average ratio is equal to or larger than a critical difference;
generating the third mask including a second correction rule for each of the one or more positions.
18. The measurement height correction rule generation apparatus according to claim 17,
the average ratio is an average of ratios of heights of a plurality of symmetrical pairs symmetrical with respect to a reference line in the first direction or the second direction on the sample.
19. A height measuring device comprising:
a control unit configured to acquire fourth data including a height from a reference surface of one or more positions on a determination target object, generate fifth data in which at least one of a first mask, a second mask, and a third mask is applied to the fourth data, and determine the height from the reference surface of the one or more positions based on the fifth data,
the first mask includes a scale factor for the height of a first location, wherein the scale factor for the height of the first location is determined based on a relative relationship between the height of the first location, which is any one of the one or more locations, and a reference height;
the second mask includes a first correction rule for the height of the first position, wherein the first correction rule for the height of the first position is determined based on a relative relationship between the height of the first position and the height of one or more second positions adjacent to the first position;
the third mask includes a second correction rule for the height of the first position, wherein the second correction rule for the height of the first position is determined based on a relative relationship between the calculated ratio and an average ratio after calculating the ratio of the height of the first position to the height of a third position in a preset relationship with the first position.
20. The height measuring device of claim 19,
the control unit applies the first mask, the second mask, and the third mask to the fourth data in this order to generate the fifth data.
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6768533B2 (en) | 2020-10-14 |
| CN107588747A (en) | 2018-01-16 |
| KR102477658B1 (en) | 2022-12-14 |
| KR20180005931A (en) | 2018-01-17 |
| JP2018004620A (en) | 2018-01-11 |
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