JP2018001296A5 - - Google Patents

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JP2018001296A5
JP2018001296A5 JP2016127611A JP2016127611A JP2018001296A5 JP 2018001296 A5 JP2018001296 A5 JP 2018001296A5 JP 2016127611 A JP2016127611 A JP 2016127611A JP 2016127611 A JP2016127611 A JP 2016127611A JP 2018001296 A5 JP2018001296 A5 JP 2018001296A5
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Japan
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JP2016127611A
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Japanese (ja)
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JP2018001296A (ja
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Priority to JP2016127611A priority Critical patent/JP2018001296A/ja
Priority claimed from JP2016127611A external-priority patent/JP2018001296A/ja
Priority to TW106117866A priority patent/TW201800183A/zh
Priority to KR1020170077095A priority patent/KR20180002024A/ko
Priority to US15/633,464 priority patent/US20170368661A1/en
Priority to CN201710498753.3A priority patent/CN107538338A/zh
Publication of JP2018001296A publication Critical patent/JP2018001296A/ja
Publication of JP2018001296A5 publication Critical patent/JP2018001296A5/ja
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JP2016127611A 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム Pending JP2018001296A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム
TW106117866A TW201800183A (zh) 2016-06-28 2017-05-31 研磨裝置、研磨方法、及研磨控制程式
KR1020170077095A KR20180002024A (ko) 2016-06-28 2017-06-19 연마 장치, 연마 방법 및 연마 제어 프로그램
US15/633,464 US20170368661A1 (en) 2016-06-28 2017-06-26 Polishing apparatus, polishing method and polishing control program
CN201710498753.3A CN107538338A (zh) 2016-06-28 2017-06-27 研磨装置、研磨方法、及研磨控制程序

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

Publications (2)

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JP2018001296A JP2018001296A (ja) 2018-01-11
JP2018001296A5 true JP2018001296A5 (enExample) 2019-08-15

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Family Applications (1)

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JP2016127611A Pending JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

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US (1) US20170368661A1 (enExample)
JP (1) JP2018001296A (enExample)
KR (1) KR20180002024A (enExample)
CN (1) CN107538338A (enExample)
TW (1) TW201800183A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107363730A (zh) * 2017-09-11 2017-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 涡流检测装置及系统
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
BR112021019580A2 (pt) 2019-03-29 2021-12-14 Saint Gobain Abrasifs Sa Desempenho de soluções de retificação
CA3135979C (en) 2019-04-03 2023-12-19 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP5365091B2 (ja) * 2008-08-18 2013-12-11 富士通株式会社 メッキ厚算出プログラム、メッキ厚算出装置およびメッキ厚算出方法
AT10301U3 (de) * 2008-09-01 2009-09-15 Avl List Gmbh Verfahren und regelanordnung zur regelung einer regelstrecke mit sich wiederholendem arbeitszyklus
JP5728239B2 (ja) * 2010-03-02 2015-06-03 株式会社荏原製作所 研磨監視方法、研磨方法、研磨監視装置、および研磨装置
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
CN103205665B (zh) * 2012-01-13 2015-05-06 鞍钢股份有限公司 一种连续热镀锌线锌层厚度自动控制方法
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
JP5941763B2 (ja) * 2012-06-15 2016-06-29 株式会社荏原製作所 研磨方法
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP2013252613A (ja) * 2013-09-26 2013-12-19 Nikon Corp 終点検出装置および研磨装置
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
JP6423600B2 (ja) * 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
US20160074988A1 (en) * 2014-09-11 2016-03-17 Ebara Corporation Processing module, processing apparatus, and processing method
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
CN104570729A (zh) * 2014-11-24 2015-04-29 东北林业大学 一种改进型的Smith预估控制器
CN104741388B (zh) * 2015-04-15 2016-10-19 东北大学 一种热连轧精轧厚度控制方法
CN105316613B (zh) * 2015-10-13 2017-11-21 浙江中控研究院有限公司 一种基于变时滞偏差校正技术的锌层厚度控制方法和系统

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