CN107538338A - 研磨装置、研磨方法、及研磨控制程序 - Google Patents

研磨装置、研磨方法、及研磨控制程序 Download PDF

Info

Publication number
CN107538338A
CN107538338A CN201710498753.3A CN201710498753A CN107538338A CN 107538338 A CN107538338 A CN 107538338A CN 201710498753 A CN201710498753 A CN 201710498753A CN 107538338 A CN107538338 A CN 107538338A
Authority
CN
China
Prior art keywords
thickness
measure
grinding
data
moment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710498753.3A
Other languages
English (en)
Chinese (zh)
Inventor
中村显
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN107538338A publication Critical patent/CN107538338A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201710498753.3A 2016-06-28 2017-06-27 研磨装置、研磨方法、及研磨控制程序 Pending CN107538338A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-127611 2016-06-28
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

Publications (1)

Publication Number Publication Date
CN107538338A true CN107538338A (zh) 2018-01-05

Family

ID=60675235

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710498753.3A Pending CN107538338A (zh) 2016-06-28 2017-06-27 研磨装置、研磨方法、及研磨控制程序

Country Status (5)

Country Link
US (1) US20170368661A1 (enExample)
JP (1) JP2018001296A (enExample)
KR (1) KR20180002024A (enExample)
CN (1) CN107538338A (enExample)
TW (1) TW201800183A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107363730A (zh) * 2017-09-11 2017-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 涡流检测装置及系统

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
AU2020253350A1 (en) 2019-03-29 2021-10-28 Saint-Gobain Abrasives, Inc. Performance grinding solutions
EP3946809A4 (en) 2019-04-03 2022-12-07 Saint-Gobain Abrasives, Inc. ABRASIVE ARTICLE, ABRASIVE SYSTEM AND METHOD OF USING AND FORMING THE SAME
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
CN102138109A (zh) * 2008-09-01 2011-07-27 Avl里斯脱有限公司 控制具有重复工作周期的控制对象的方法和控制装置
CN103205665A (zh) * 2012-01-13 2013-07-17 鞍钢股份有限公司 一种连续热镀锌线锌层厚度自动控制方法
CN104570729A (zh) * 2014-11-24 2015-04-29 东北林业大学 一种改进型的Smith预估控制器
CN104741388A (zh) * 2015-04-15 2015-07-01 东北大学 一种热连轧精轧厚度控制方法
CN104907920A (zh) * 2014-03-12 2015-09-16 株式会社荏原制作所 膜厚测定值的补正方法、膜厚补正器、及涡流传感器
CN104907921A (zh) * 2010-03-02 2015-09-16 株式会社荏原制作所 研磨监视方法、研磨方法、研磨监视装置及研磨装置
CN105316613A (zh) * 2015-10-13 2016-02-10 浙江中控研究院有限公司 一种基于变时滞偏差校正技术的锌层厚度控制方法和系统
CN105428229A (zh) * 2014-09-17 2016-03-23 株式会社荏原制作所 膜厚信号处理装置、研磨装置、膜厚信号处理方法、及研磨方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP5365091B2 (ja) * 2008-08-18 2013-12-11 富士通株式会社 メッキ厚算出プログラム、メッキ厚算出装置およびメッキ厚算出方法
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
JP5941763B2 (ja) * 2012-06-15 2016-06-29 株式会社荏原製作所 研磨方法
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP2013252613A (ja) * 2013-09-26 2013-12-19 Nikon Corp 終点検出装置および研磨装置
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
JP6423600B2 (ja) * 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
US20160074988A1 (en) * 2014-09-11 2016-03-17 Ebara Corporation Processing module, processing apparatus, and processing method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
CN102138109A (zh) * 2008-09-01 2011-07-27 Avl里斯脱有限公司 控制具有重复工作周期的控制对象的方法和控制装置
CN104907921A (zh) * 2010-03-02 2015-09-16 株式会社荏原制作所 研磨监视方法、研磨方法、研磨监视装置及研磨装置
CN103205665A (zh) * 2012-01-13 2013-07-17 鞍钢股份有限公司 一种连续热镀锌线锌层厚度自动控制方法
CN104907920A (zh) * 2014-03-12 2015-09-16 株式会社荏原制作所 膜厚测定值的补正方法、膜厚补正器、及涡流传感器
CN105428229A (zh) * 2014-09-17 2016-03-23 株式会社荏原制作所 膜厚信号处理装置、研磨装置、膜厚信号处理方法、及研磨方法
CN104570729A (zh) * 2014-11-24 2015-04-29 东北林业大学 一种改进型的Smith预估控制器
CN104741388A (zh) * 2015-04-15 2015-07-01 东北大学 一种热连轧精轧厚度控制方法
CN105316613A (zh) * 2015-10-13 2016-02-10 浙江中控研究院有限公司 一种基于变时滞偏差校正技术的锌层厚度控制方法和系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107363730A (zh) * 2017-09-11 2017-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 涡流检测装置及系统

Also Published As

Publication number Publication date
TW201800183A (zh) 2018-01-01
US20170368661A1 (en) 2017-12-28
JP2018001296A (ja) 2018-01-11
KR20180002024A (ko) 2018-01-05

Similar Documents

Publication Publication Date Title
CN107538338A (zh) 研磨装置、研磨方法、及研磨控制程序
JP7693728B2 (ja) インシトゥ監視からの測定値の、抵抗率に基づく調整
JP7696982B2 (ja) インシトゥ電磁誘導監視のためのエッジ再構成における基板ドーピングの補正
US8408965B2 (en) Eddy current gain compensation
CN106062933B (zh) 调整涡流测量
US9573245B2 (en) Polishing method
US20200016722A1 (en) Polishing apparatus and calibration method
TWI828706B (zh) 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
US20040152310A1 (en) Signal improvement in eddy current sensing
CN101456151B (zh) 化学机械研磨及其终点检测方法
CN107538339A (zh) 膜厚信号处理装置、研磨装置、膜厚信号处理方法及研磨方法
US20180147687A1 (en) Polishing apparatus and polishing method
CN106197249A (zh) Cmp过程中铜层厚度在线测量系统及其控制方法
CN112233975B (zh) 一种研磨时间控制方法、装置、设备及可读存储介质
CN114633203B (zh) 在原位电磁感应监测中对浆料组成的补偿
JP6263445B2 (ja) 研磨装置および研磨方法
CN119153351A (zh) 金属膜厚度测量方法、装置、设备、抛光方法和存储介质
CN120962533A (zh) 用于电涡流传感器的大量程标定方法、测量方法及设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180105