JP2018001296A - 研磨装置、研磨方法、及び研磨制御プログラム - Google Patents

研磨装置、研磨方法、及び研磨制御プログラム Download PDF

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Publication number
JP2018001296A
JP2018001296A JP2016127611A JP2016127611A JP2018001296A JP 2018001296 A JP2018001296 A JP 2018001296A JP 2016127611 A JP2016127611 A JP 2016127611A JP 2016127611 A JP2016127611 A JP 2016127611A JP 2018001296 A JP2018001296 A JP 2018001296A
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JP
Japan
Prior art keywords
polishing
film thickness
measurement
time
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016127611A
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English (en)
Japanese (ja)
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JP2018001296A5 (https=
Inventor
顕 中村
Akira Nakamura
顕 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2016127611A priority Critical patent/JP2018001296A/ja
Priority to TW106117866A priority patent/TW201800183A/zh
Priority to KR1020170077095A priority patent/KR20180002024A/ko
Priority to US15/633,464 priority patent/US20170368661A1/en
Priority to CN201710498753.3A priority patent/CN107538338A/zh
Publication of JP2018001296A publication Critical patent/JP2018001296A/ja
Publication of JP2018001296A5 publication Critical patent/JP2018001296A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016127611A 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム Pending JP2018001296A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム
TW106117866A TW201800183A (zh) 2016-06-28 2017-05-31 研磨裝置、研磨方法、及研磨控制程式
KR1020170077095A KR20180002024A (ko) 2016-06-28 2017-06-19 연마 장치, 연마 방법 및 연마 제어 프로그램
US15/633,464 US20170368661A1 (en) 2016-06-28 2017-06-26 Polishing apparatus, polishing method and polishing control program
CN201710498753.3A CN107538338A (zh) 2016-06-28 2017-06-27 研磨装置、研磨方法、及研磨控制程序

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

Publications (2)

Publication Number Publication Date
JP2018001296A true JP2018001296A (ja) 2018-01-11
JP2018001296A5 JP2018001296A5 (https=) 2019-08-15

Family

ID=60675235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016127611A Pending JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

Country Status (5)

Country Link
US (1) US20170368661A1 (https=)
JP (1) JP2018001296A (https=)
KR (1) KR20180002024A (https=)
CN (1) CN107538338A (https=)
TW (1) TW201800183A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11534886B2 (en) 2019-12-10 2022-12-27 Kioxia Corporation Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device
WO2026042276A1 (ja) * 2024-08-23 2026-02-26 株式会社日立ハイテク プラズマ処理装置、プラズマ処理方法及びエッチングシステム

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* Cited by examiner, † Cited by third party
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CN107363730A (zh) * 2017-09-11 2017-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 涡流检测装置及系统
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos

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JP2014003063A (ja) * 2012-06-15 2014-01-09 Ebara Corp 研磨方法
JP2015076449A (ja) * 2013-10-07 2015-04-20 株式会社荏原製作所 研磨方法
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KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
JP6423600B2 (ja) * 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
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JP2015519740A (ja) * 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
JP2014003063A (ja) * 2012-06-15 2014-01-09 Ebara Corp 研磨方法
JP2013252613A (ja) * 2013-09-26 2013-12-19 Nikon Corp 終点検出装置および研磨装置
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11534886B2 (en) 2019-12-10 2022-12-27 Kioxia Corporation Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device
WO2026042276A1 (ja) * 2024-08-23 2026-02-26 株式会社日立ハイテク プラズマ処理装置、プラズマ処理方法及びエッチングシステム
WO2026042407A1 (ja) * 2024-08-23 2026-02-26 株式会社日立ハイテク プラズマ処理装置、プラズマ処理方法及びエッチングシステム

Also Published As

Publication number Publication date
TW201800183A (zh) 2018-01-01
KR20180002024A (ko) 2018-01-05
US20170368661A1 (en) 2017-12-28
CN107538338A (zh) 2018-01-05

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