JP2017535772A5 - - Google Patents

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JP2017535772A5
JP2017535772A5 JP2017525565A JP2017525565A JP2017535772A5 JP 2017535772 A5 JP2017535772 A5 JP 2017535772A5 JP 2017525565 A JP2017525565 A JP 2017525565A JP 2017525565 A JP2017525565 A JP 2017525565A JP 2017535772 A5 JP2017535772 A5 JP 2017535772A5
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Japan
Prior art keywords
illumination
arm
sample
lenses
source
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JP2017525565A
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JP6712591B2 (ja
JP2017535772A (ja
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Priority claimed from US14/937,409 external-priority patent/US9734422B2/en
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一実施形態において、光学サブシステム１０６は、照明アーム１０７および集合アーム１０９を含む。照明アーム１０７は、サンプル１０４の表面に照明源１０２からの照明を導きかつ／または照明源１０２からの照明を調節するための１つ以上の照明光学素子を含んでもよい。たとえば、光学サブシステム１０６の照明アーム１０７の１つ以上の光学素子は、１つ以上のレンズ、１つ以上のビームスプリッタ、１つ以上の瞳マスク、１つ以上のミラー、１つ以上のフィルタまたは１つ以上の偏光子を含んでもよいが、これらに限定されない。一実施形態において、照明アーム１０７の１つ以上の照明光学部品は、対物レンズ１１４を通してサンプル１０４に照明源１０２からの照明を導くように配置される。たとえば、照明アーム１０７は、対物レンズ１１０を通してサンプル１０４の選択される部分上に光を集束させ、かつ導くための１つ以上のレンズ１１４およびビームスプリッタ１１２を含んでもよい。
JP2017525565A 2014-11-12 2015-11-11 デジタル整合フィルタによる強化欠陥検出のためのシステムおよび方法 Active JP6712591B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462078802P 2014-11-12 2014-11-12
US62/078,802 2014-11-12
US14/937,409 US9734422B2 (en) 2014-11-12 2015-11-10 System and method for enhanced defect detection with a digital matched filter
US14/937,409 2015-11-10
PCT/US2015/060207 WO2016077487A1 (en) 2014-11-12 2015-11-11 System and method for enhanced defect detection with a digital matched filter

Publications (3)

Publication Number Publication Date
JP2017535772A JP2017535772A (ja) 2017-11-30
JP2017535772A5 true JP2017535772A5 (ja) 2018-12-20
JP6712591B2 JP6712591B2 (ja) 2020-06-24

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ID=55955002

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JP2017525565A Active JP6712591B2 (ja) 2014-11-12 2015-11-11 デジタル整合フィルタによる強化欠陥検出のためのシステムおよび方法

Country Status (7)

Country Link
US (1) US9734422B2 (ja)
JP (1) JP6712591B2 (ja)
KR (1) KR102312850B1 (ja)
CN (1) CN107077733B (ja)
SG (1) SG11201703564PA (ja)
TW (1) TWI646505B (ja)
WO (1) WO2016077487A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10043265B2 (en) * 2016-03-17 2018-08-07 Kla-Tencor Corporation System, method and computer program product for identifying fabricated component defects using a local adaptive threshold
EP3482192A4 (en) * 2016-07-08 2020-08-05 ATS Automation Tooling Systems Inc. SYSTEM AND PROCEDURE FOR COMBINED AUTOMATIC AND MANUAL INSPECTION
US10082470B2 (en) * 2016-09-27 2018-09-25 Kla-Tencor Corporation Defect marking for semiconductor wafer inspection
JP7087792B2 (ja) * 2018-07-31 2022-06-21 株式会社リコー 画像データ生成装置、画像データ生成方法およびプログラム
US11151707B2 (en) * 2018-12-07 2021-10-19 Kla Corporation System and method for difference filter and aperture selection using shallow deep learning
CN112229853B (zh) * 2019-06-26 2022-11-29 长鑫存储技术有限公司 液滴型缺陷的检测方法和检测系统
US11087449B2 (en) * 2019-10-24 2021-08-10 KLA Corp. Deep learning networks for nuisance filtering
US11557031B2 (en) * 2019-11-21 2023-01-17 Kla Corporation Integrated multi-tool reticle inspection
US20220383470A1 (en) * 2021-05-21 2022-12-01 Kla Corporation System and method for optical wafer characterization with image up-sampling
WO2023018919A1 (en) * 2021-08-11 2023-02-16 Bedrock Surgical, Inc Methods for monitoring and tracking sterile processing of surgical instruments
CN116934746B (zh) * 2023-09-14 2023-12-01 常州微亿智造科技有限公司 划伤缺陷检测方法、系统、设备及其介质

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5805278A (en) 1995-02-09 1998-09-08 Inspex, Inc. Particle detection method and apparatus
JP4765387B2 (ja) * 2005-04-27 2011-09-07 株式会社ニコン ノイズ抑制装置、電子カメラおよびノイズ抑制プログラム
JP4928862B2 (ja) 2006-08-04 2012-05-09 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
US7664608B2 (en) * 2006-07-14 2010-02-16 Hitachi High-Technologies Corporation Defect inspection method and apparatus
JP4943304B2 (ja) 2006-12-05 2012-05-30 株式会社 Ｎｇｒ パターン検査装置および方法
DE102008002753B4 (de) 2007-12-19 2010-03-25 Vistec Semiconductor Systems Gmbh Verfahren zur optischen Inspektion, Detektion und Visualisierung von Defekten auf scheibenförmigen Objekten
SG164293A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
US8605275B2 (en) 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
US8723789B1 (en) * 2011-02-11 2014-05-13 Imimtek, Inc. Two-dimensional method and system enabling three-dimensional user interaction with a device
JP2014035326A (ja) 2012-08-10 2014-02-24 Toshiba Corp 欠陥検査装置
JP5921990B2 (ja) * 2012-08-23 2016-05-24 株式会社ニューフレアテクノロジー 欠陥検出方法
US10290092B2 (en) * 2014-05-15 2019-05-14 Applied Materials Israel, Ltd System, a method and a computer program product for fitting based defect detection

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