JP2017528178A5 - - Google Patents

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Publication number
JP2017528178A5
JP2017528178A5 JP2017501646A JP2017501646A JP2017528178A5 JP 2017528178 A5 JP2017528178 A5 JP 2017528178A5 JP 2017501646 A JP2017501646 A JP 2017501646A JP 2017501646 A JP2017501646 A JP 2017501646A JP 2017528178 A5 JP2017528178 A5 JP 2017528178A5
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JP
Japan
Prior art keywords
ultrasonic transducer
transducer assembly
substrate island
ultrasonic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017501646A
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English (en)
Japanese (ja)
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JP6670292B2 (ja
JP2017528178A (ja
Filing date
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Application filed filed Critical
Priority claimed from PCT/EP2015/064365 external-priority patent/WO2016008690A1/en
Publication of JP2017528178A publication Critical patent/JP2017528178A/ja
Publication of JP2017528178A5 publication Critical patent/JP2017528178A5/ja
Application granted granted Critical
Publication of JP6670292B2 publication Critical patent/JP6670292B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017501646A 2014-07-17 2015-06-25 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム Expired - Fee Related JP6670292B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14177454 2014-07-17
EP14177454.7 2014-07-17
PCT/EP2015/064365 WO2016008690A1 (en) 2014-07-17 2015-06-25 Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019190035A Division JP6878546B2 (ja) 2014-07-17 2019-10-17 同軸ワイヤアセンブリ

Publications (3)

Publication Number Publication Date
JP2017528178A JP2017528178A (ja) 2017-09-28
JP2017528178A5 true JP2017528178A5 (https=) 2018-08-02
JP6670292B2 JP6670292B2 (ja) 2020-03-18

Family

ID=51211086

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017501646A Expired - Fee Related JP6670292B2 (ja) 2014-07-17 2015-06-25 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム
JP2019190035A Expired - Fee Related JP6878546B2 (ja) 2014-07-17 2019-10-17 同軸ワイヤアセンブリ
JP2021075645A Pending JP2021129996A (ja) 2014-07-17 2021-04-28 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2019190035A Expired - Fee Related JP6878546B2 (ja) 2014-07-17 2019-10-17 同軸ワイヤアセンブリ
JP2021075645A Pending JP2021129996A (ja) 2014-07-17 2021-04-28 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム

Country Status (5)

Country Link
US (2) US10828673B2 (https=)
EP (2) EP3169448A1 (https=)
JP (3) JP6670292B2 (https=)
CN (1) CN106536068B (https=)
WO (1) WO2016008690A1 (https=)

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US11963823B2 (en) 2016-10-03 2024-04-23 Koninklijke Philips N.V. Radiopaque arrangement of electronic components in intra-cardiac echocardiography (ICE) catheter
US10088642B2 (en) 2016-11-09 2018-10-02 International Business Machines Corporation Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture
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JP2021513398A (ja) * 2018-02-09 2021-05-27 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 腔内画像診断デバイスの可撓性支持部材、並びに関連するデバイス、システム、及び方法
US12453531B2 (en) * 2018-07-10 2025-10-28 Koninklijke Philips N.V. Electrical wire connection in ultrasound imaging devices, systems, and methods
CN109031259A (zh) * 2018-07-24 2018-12-18 常州波速传感器有限公司 超声波探头
WO2020097056A1 (en) * 2018-11-05 2020-05-14 Carnegie Mellon University High-density implantable neural probes
CN111447533B (zh) * 2019-01-16 2021-05-18 昆山康龙电子科技有限公司 利用金属料带成型的内部模块
EP3719841B1 (en) * 2019-04-01 2022-02-16 Detection Technology Oy Radiation sensor element and method
WO2021014222A2 (en) 2019-07-24 2021-01-28 Vermon Sa Panel transducer scale package and method of manufacturing the same
JP7713933B2 (ja) * 2019-10-10 2025-07-28 サニーブルック リサーチ インスティチュート 超音波トランスデューサ及び超音波トランスデューサアレイを冷却するためのシステム及び方法
US11207140B2 (en) * 2019-12-18 2021-12-28 GE Precision Healthcare LLC Ultrasound-enabled invasive medical device and method of manufacturing an ultrasound-enabled invasive medical device
EP4497390A3 (en) * 2020-07-24 2025-04-02 Koninklijke Philips N.V. Curved circuit substrate for intraluminal ultrasound imaging assembly
US12357267B2 (en) * 2021-10-22 2025-07-15 Veran Medical Technologies, Inc. Low profile ultrasound catheter and system
WO2024085880A1 (en) * 2022-10-21 2024-04-25 Veran Medical Technologies, Inc. Low profile ultrasound catheter and system
WO2025015451A1 (zh) * 2023-07-14 2025-01-23 声索生物科技(上海)有限公司 一种超声探头
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