JP2017528006A5 - - Google Patents

Download PDF

Info

Publication number
JP2017528006A5
JP2017528006A5 JP2017527190A JP2017527190A JP2017528006A5 JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5 JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5
Authority
JP
Japan
Prior art keywords
discrete component
handle
ultra
substrate
release layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017527190A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017528006A (ja
JP6480583B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/043550 external-priority patent/WO2016022528A1/en
Publication of JP2017528006A publication Critical patent/JP2017528006A/ja
Publication of JP2017528006A5 publication Critical patent/JP2017528006A5/ja
Application granted granted Critical
Publication of JP6480583B2 publication Critical patent/JP6480583B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017527190A 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成 Active JP6480583B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
PCT/US2015/043550 WO2016022528A1 (en) 2014-08-05 2015-08-04 Setting up ultra-small or ultra-thin discrete components for easy assembly

Publications (3)

Publication Number Publication Date
JP2017528006A JP2017528006A (ja) 2017-09-21
JP2017528006A5 true JP2017528006A5 (https=) 2018-09-13
JP6480583B2 JP6480583B2 (ja) 2019-03-13

Family

ID=55264414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017527190A Active JP6480583B2 (ja) 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成

Country Status (6)

Country Link
US (4) US10529614B2 (https=)
EP (1) EP3177463A4 (https=)
JP (1) JP6480583B2 (https=)
KR (3) KR102403580B1 (https=)
CN (2) CN113715458A (https=)
WO (1) WO2016022528A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
US10242892B2 (en) * 2014-10-17 2019-03-26 Intel Corporation Micro pick and bond assembly
TW202524641A (zh) * 2016-01-15 2025-06-16 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
CN117393441A (zh) 2016-04-29 2024-01-12 库利克和索夫工业公司 将电子组件连接至基板
JP6720333B2 (ja) 2017-06-12 2020-07-08 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
DE102018009472A1 (de) * 2018-12-03 2020-06-04 Giesecke+Devrient Currency Technology Gmbh Aufbringung und Befestigung einer bestimmten Anzahl von Einzelelementen auf einer Substratbahn
CN113924639B (zh) 2019-02-15 2025-10-10 库力索法荷兰有限公司 用于组装离散组件的动态释放带
CN115004350B (zh) 2019-06-11 2025-10-28 库力索法荷兰有限公司 利用光学系统特性的调整的分立组件装配体的位置误差补偿
JP2023507966A (ja) 2019-12-17 2023-02-28 キューリック・アンド・ソファ・ネザーランズ・ベーフェー 個別構成要素を受け入れるための接着テープ
EP3933902B1 (en) 2020-06-29 2023-05-03 IMEC vzw A method for positioning components on a substrate
TWI859583B (zh) * 2021-11-30 2024-10-21 群創光電股份有限公司 電子裝置的製造方法
GB2633617A (en) * 2023-09-15 2025-03-19 Pragmatic Semiconductor Ltd Methods and apparatus for facilitating manufacture of an integrated circuit
WO2026017271A1 (en) * 2024-07-19 2026-01-22 Nexperia B.V. A method for mounting an electronics component at a particular placement location on a carrier as well as a pick-and-place apparatus for mounting an electronics component at a particular placement location on a carrier.

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3006866B2 (ja) * 1990-10-18 2000-02-07 大日本印刷株式会社 転写箔
JP3197788B2 (ja) * 1995-05-18 2001-08-13 株式会社日立製作所 半導体装置の製造方法
EP1041620A3 (en) 1999-04-02 2005-01-05 Interuniversitair Microelektronica Centrum Vzw Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device
US6383833B1 (en) * 2000-05-23 2002-05-07 Silverbrook Research Pty Ltd. Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape
JP4597323B2 (ja) * 2000-07-07 2010-12-15 リンテック株式会社 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
US20040154733A1 (en) * 2001-02-08 2004-08-12 Thomas Morf Chip transfer method and apparatus
FR2823012B1 (fr) * 2001-04-03 2004-05-21 Commissariat Energie Atomique Procede de transfert selectif d'au moins un element d'un support initial sur un support final
WO2002084631A1 (en) * 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
WO2003014010A1 (en) * 2001-08-08 2003-02-20 Jsr Corporation Three-dimensional opto-electronic micro-system
US7535100B2 (en) * 2002-07-12 2009-05-19 The United States Of America As Represented By The Secretary Of The Navy Wafer bonding of thinned electronic materials and circuits to high performance substrates
AU2003300040A1 (en) * 2002-12-31 2004-07-29 Massachusetts Institute Of Technology Multi-layer integrated semiconductor structure having an electrical shielding portion
US7091108B2 (en) * 2003-09-11 2006-08-15 Intel Corporation Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
US7101620B1 (en) * 2004-09-07 2006-09-05 National Semiconductor Corporation Thermal release wafer mount tape with B-stage adhesive
JP5964005B2 (ja) * 2005-04-08 2016-08-03 パック テック−パッケージング テクノロジーズ ゲーエムベーハー チップを接触基板に移送する方法及び装置
US7300824B2 (en) * 2005-08-18 2007-11-27 James Sheats Method of packaging and interconnection of integrated circuits
JP5129939B2 (ja) * 2006-08-31 2013-01-30 沖電気工業株式会社 半導体装置の製造方法
JP2008258412A (ja) 2007-04-05 2008-10-23 Shinko Electric Ind Co Ltd シリコンウエハの個片化方法
KR101273871B1 (ko) * 2007-04-19 2013-06-11 세키스이가가쿠 고교가부시키가이샤 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법
US7802356B1 (en) * 2008-02-21 2010-09-28 Hrl Laboratories, Llc Method of fabricating an ultra thin quartz resonator component
TWI592996B (zh) * 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US8921168B2 (en) * 2009-07-15 2014-12-30 Silanna Semiconductor U.S.A., Inc. Thin integrated circuit chip-on-board assembly and method of making
US9064686B2 (en) * 2010-04-15 2015-06-23 Suss Microtec Lithography, Gmbh Method and apparatus for temporary bonding of ultra thin wafers
EP2434528A1 (en) 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
WO2012142177A2 (en) * 2011-04-11 2012-10-18 Ndsu Research Foundation Selective laser-assisted transfer of discrete components
JP5845775B2 (ja) * 2011-09-26 2016-01-20 住友電気工業株式会社 薄膜個片の接合方法
BR112015003455A2 (pt) * 2012-08-17 2017-07-04 Visual Physics Llc processo para transferir microestruturas para um substrato final
US9136173B2 (en) * 2012-11-07 2015-09-15 Semiconductor Components Industries, Llc Singulation method for semiconductor die having a layer of material along one major surface
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
US9209142B1 (en) * 2014-09-05 2015-12-08 Skorpios Technologies, Inc. Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal
US20160133486A1 (en) * 2014-11-07 2016-05-12 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems
US9496165B1 (en) * 2015-07-09 2016-11-15 International Business Machines Corporation Method of forming a flexible semiconductor layer and devices on a flexible carrier

Similar Documents

Publication Publication Date Title
JP2017528006A5 (https=)
JP2020518133A5 (https=)
JP6480583B2 (ja) 組み立てが容易な超小型または超薄型離散コンポーネントの構成
KR102915552B1 (ko) 초소형 또는 초박형 개별 컴포넌트 배치
TW201104732A (en) Thin wafer structure and method
JP6140194B2 (ja) 製品基板をキャリア基板に一時的に接合する方法
JP2015501356A5 (https=)
US20190189497A1 (en) Workpiece processing method
JP2016171261A5 (https=)
CN108475619B (zh) 用于装置加工的钻石底半导体晶圆的安装技术
JP2013524493A5 (https=)
Phommahaxay et al. Extremely low-force debonding of thinned CMOS substrate by laser release of a temporary bonding material
Wuensch et al. Temporary wafer bonding-key technology for MEMS devices
JP2010153645A5 (https=)
TW201624549A (zh) 用於塗覆一產品基板之方法與裝置
US11244971B2 (en) Method of transferring a thin film from a substrate to a flexible support
TH2001005361A (th) การยึดประสานแม่แบบกับเวเฟอร์โดยใช้ประโยชน์จากการพิมพ์แบบถ่ายโอนขนาดไมโคร
JP2016213282A (ja) 保護テープの剥離方法
CN104241092A (zh) 用于从晶片分离半导体器件的方法和设备
McCutcheon et al. Advanced processes and materials for temporary wafer bonding