JP2017527100A - L字状ゲートを有するスプリットゲート型半導体装置 - Google Patents
L字状ゲートを有するスプリットゲート型半導体装置 Download PDFInfo
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Abstract
Description
Claims (14)
- 基板上に誘電体層を形成するステップと、
第1ゲート導体を有するとともに、この第1ゲート導体と前記誘電体層との間のゲート誘電体構造体を有するゲート積層体を形成するステップと、
前記ゲート積層体の側壁にゲート間誘電体構造体を形成するステップと、
L字状の第2ゲート導体を前記ゲート間誘電体構造体に隣接させ且つ前記誘電体層上に形成するステップと
を含む半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、前記L字状の第2ゲート導体を形成するステップが、
前記ゲート積層体及び前記ゲート間誘電体構造体上に多結晶シリコン(“ポリ”)層を形成するステップと、
前記ポリ層上に酸化物層を形成するステップと、
前記酸化物層を選択的にエッチングして、前記ゲート間誘電体構造体に隣接する前記ポリ層の部分上に酸化物スペーサを形成するステップと、
この酸化物スペーサをマスクとして用いて前記ポリ層をエッチングするステップと
を有する半導体装置の製造方法。 - 請求項2に記載の半導体装置の製造方法において、更に、前記酸化物スペーサを除去するステップを含む半導体装置の製造方法。
- 請求項1に記載の半導体装置の製造方法において、前記ゲート誘電体構造体を形成するステップが、窒化物誘電体フィルムと酸化物誘電体フィルムとの2つ以上の交互の層を形成するステップを有する半導体装置の製造方法。
- 請求項1に記載の半導体装置の製造方法において、前記誘電体層を形成するステップが、酸化物層を形成するステップを有する半導体装置の製造方法。
- 請求項1に記載の半導体装置の製造方法において、前記ゲート間誘電体構造体を形成するステップが、2つ以上の交互の酸化物誘電体フィルム及び窒化物誘電体フィルムを形成するステップを有する半導体装置の製造方法。
- 請求項1に記載の半導体装置の製造方法において、更に、前記第1ゲート導体をスプリットゲート型メモリセルのメモリゲートとして形成するステップを含む半導体装置の製造方法。
- 請求項1に記載の半導体装置の製造方法において、更に、前記L字状の第2ゲート導体をスプリットゲート型メモリセルの選択ゲートとして形成するステップを含む半導体装置の製造方法。
- 基板と、
この基板上の誘電体層と、
第1ゲート導体を有するとともに、この第1ゲート導体と前記誘電体層との間のゲート誘電体構造体を有しているゲート積層体と、
このゲート積層体の側壁におけるゲート間誘電体構造体と、
このゲート間誘電体構造体に隣接するとともに前記誘電体層上にあるL字状の第2ゲート導体と
を備える半導体装置。 - 請求項9に記載の半導体装置において、前記ゲート誘電体構造体が、窒化物誘電体フィルムと酸化物誘電体フィルムとの2つ以上の交互の層を有する半導体装置。
- 請求項9に記載の半導体装置において、前記誘電体層が酸化物層を有する半導体装置。
- 請求項9に記載の半導体装置において、前記ゲート間誘電体構造体が、酸化物誘電体フィルムと窒化物誘電体フィルムとの2つ以上の交互の層を有する半導体装置。
- 請求項9に記載の半導体装置において、前記第1ゲート導体がスプリットゲート型メモリセルのメモリゲートを有する半導体装置。
- 請求項9に記載の半導体装置において、前記L字状の第2ゲート導体がスプリットゲート型メモリセルの選択ゲートを有する半導体装置。
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US14/450,727 | 2014-08-04 | ||
US14/450,727 US9589805B2 (en) | 2014-08-04 | 2014-08-04 | Split-gate semiconductor device with L-shaped gate |
PCT/US2015/043237 WO2016022428A1 (en) | 2014-08-04 | 2015-07-31 | Split-gate semiconductor device with l-shaped gate |
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JP2017527100A true JP2017527100A (ja) | 2017-09-14 |
JP6310100B2 JP6310100B2 (ja) | 2018-04-11 |
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JP (1) | JP6310100B2 (ja) |
CN (1) | CN106663698B (ja) |
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US9431256B2 (en) * | 2013-07-11 | 2016-08-30 | United Microelectronics Corp. | Semiconductor device and manufacturing method thereof |
US9691883B2 (en) * | 2014-06-19 | 2017-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Asymmetric formation approach for a floating gate of a split gate flash memory structure |
US9589805B2 (en) | 2014-08-04 | 2017-03-07 | Cypress Semiconductor Corporation | Split-gate semiconductor device with L-shaped gate |
US9660106B2 (en) * | 2014-08-18 | 2017-05-23 | United Microelectronics Corp. | Flash memory and method of manufacturing the same |
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JP2002538608A (ja) * | 1999-02-23 | 2002-11-12 | アクトランズ システム インコーポレイテッド | 自己整列ゲートを有するフラッシュメモリセル及び製造方法 |
US20040077144A1 (en) * | 2002-10-16 | 2004-04-22 | Taiwan Semiconductor Manufacturing Company | Method to form self-aligned split gate flash with L-shaped wordline spacers |
JP2008288503A (ja) * | 2007-05-21 | 2008-11-27 | Renesas Technology Corp | 半導体装置 |
JP2014068049A (ja) * | 2014-01-24 | 2014-04-17 | Renesas Electronics Corp | 半導体装置の製造方法 |
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US20160035576A1 (en) | 2016-02-04 |
US20170162586A1 (en) | 2017-06-08 |
CN106663698B (zh) | 2021-08-31 |
CN106663698A (zh) | 2017-05-10 |
DE112015003603B4 (de) | 2023-11-02 |
US9589805B2 (en) | 2017-03-07 |
US10593688B2 (en) | 2020-03-17 |
DE112015003603T5 (de) | 2017-04-20 |
US20180358367A1 (en) | 2018-12-13 |
JP6310100B2 (ja) | 2018-04-11 |
US10020316B2 (en) | 2018-07-10 |
WO2016022428A1 (en) | 2016-02-11 |
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