JP2017503670A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017503670A5 JP2017503670A5 JP2016548074A JP2016548074A JP2017503670A5 JP 2017503670 A5 JP2017503670 A5 JP 2017503670A5 JP 2016548074 A JP2016548074 A JP 2016548074A JP 2016548074 A JP2016548074 A JP 2016548074A JP 2017503670 A5 JP2017503670 A5 JP 2017503670A5
- Authority
- JP
- Japan
- Prior art keywords
- treatment
- structured surface
- group
- fluorine
- vapor deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 6
- 229910052731 fluorine Inorganic materials 0.000 claims 6
- 239000011737 fluorine Substances 0.000 claims 6
- 239000003082 abrasive agent Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 238000005229 chemical vapour deposition Methods 0.000 claims 2
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- 238000009832 plasma treatment Methods 0.000 claims 2
- 238000004381 surface treatment Methods 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461931136P | 2014-01-24 | 2014-01-24 | |
| US61/931,136 | 2014-01-24 | ||
| PCT/US2015/012158 WO2015112540A1 (en) | 2014-01-24 | 2015-01-21 | Abrasive material having a structured surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017503670A JP2017503670A (ja) | 2017-02-02 |
| JP2017503670A5 true JP2017503670A5 (pl) | 2018-03-01 |
Family
ID=53681879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016548074A Withdrawn JP2017503670A (ja) | 2014-01-24 | 2015-01-21 | 構造化表面を有する研磨材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170008143A1 (pl) |
| JP (1) | JP2017503670A (pl) |
| KR (1) | KR20160114627A (pl) |
| CN (1) | CN106413986A (pl) |
| TW (1) | TW201538272A (pl) |
| WO (1) | WO2015112540A1 (pl) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3168002B1 (en) * | 2014-07-07 | 2022-03-23 | Bando Chemical Industries, Ltd. | Polishing film |
| CN109415584B (zh) * | 2016-06-30 | 2022-06-03 | 3M创新有限公司 | 氟碳化合物剥离涂层 |
| JP6925699B2 (ja) * | 2016-10-04 | 2021-08-25 | 株式会社ディスコ | 平面研削砥石 |
| SG11202000259RA (en) * | 2017-07-11 | 2020-02-27 | 3M Innovative Properties Co | Abrasive articles including conformable coatings and polishing system therefrom |
| US20200172780A1 (en) * | 2017-07-11 | 2020-06-04 | 3M Innovative Properties Company | Abrasive articles including conformable coatings and polishing system therefrom |
| CN110869206B (zh) * | 2017-07-11 | 2023-06-30 | 3M创新有限公司 | 包括可适形涂层的磨料制品和由此形成的抛光系统 |
| CN111032285B (zh) * | 2017-08-25 | 2022-07-19 | 3M创新有限公司 | 表面突起抛光垫 |
| TWI649775B (zh) * | 2018-01-02 | 2019-02-01 | 台灣積體電路製造股份有限公司 | 離子佈植機及離子佈植機腔室的製造方法 |
| CN110065011A (zh) * | 2018-01-23 | 2019-07-30 | 项刚 | 金刚石砂轮及其制备方法 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| CN110530313B (zh) * | 2019-07-26 | 2021-05-28 | 西安交通大学 | 一种跨量级多尺度线宽标准器及其制备方法 |
| US20210040608A1 (en) * | 2019-08-05 | 2021-02-11 | GM Global Technology Operations LLC | Method for bonding a polymeric material to a substrate |
| KR102287923B1 (ko) * | 2019-10-30 | 2021-08-09 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR102298114B1 (ko) * | 2019-11-05 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
| TWI761921B (zh) | 2019-10-30 | 2022-04-21 | 南韓商Ｓｋｃ索密思股份有限公司 | 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法 |
| US20220178017A1 (en) * | 2020-12-03 | 2022-06-09 | Applied Materials, Inc. | Cfx layer to protect aluminum surface from over-oxidation |
| TWI779728B (zh) * | 2021-07-20 | 2022-10-01 | 大陸商廈門佳品金剛石工業有限公司 | 鑽石修整碟及其製造方法 |
| CN116652825B (zh) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | 一种金刚石cmp抛光垫修整器及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6015597A (en) * | 1997-11-26 | 2000-01-18 | 3M Innovative Properties Company | Method for coating diamond-like networks onto particles |
| US6458018B1 (en) | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
| JP4519970B2 (ja) | 1999-12-21 | 2010-08-04 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨層が立体構造を有する研磨材料 |
| US6821189B1 (en) * | 2000-10-13 | 2004-11-23 | 3M Innovative Properties Company | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| US20050025973A1 (en) | 2003-07-25 | 2005-02-03 | Slutz David E. | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| US8080073B2 (en) * | 2007-12-20 | 2011-12-20 | 3M Innovative Properties Company | Abrasive article having a plurality of precisely-shaped abrasive composites |
| JP5597140B2 (ja) * | 2007-12-31 | 2014-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | プラズマ処理された研磨物品及び同物品の作製方法 |
-
2015
- 2015-01-21 JP JP2016548074A patent/JP2017503670A/ja not_active Withdrawn
- 2015-01-21 KR KR1020167022667A patent/KR20160114627A/ko not_active Application Discontinuation
- 2015-01-21 US US15/113,244 patent/US20170008143A1/en not_active Abandoned
- 2015-01-21 WO PCT/US2015/012158 patent/WO2015112540A1/en active Application Filing
- 2015-01-21 CN CN201580005532.7A patent/CN106413986A/zh active Pending
- 2015-01-23 TW TW104102413A patent/TW201538272A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017503670A5 (pl) | ||
| JP7449900B2 (ja) | フルオロアニーリング膜でコーティングされた物品 | |
| JP2016197680A5 (pl) | ||
| JP2015042788A5 (pl) | ||
| JP2019522113A5 (pl) | ||
| JP2016066658A5 (pl) | ||
| JP2012104847A5 (pl) | ||
| TW201614106A (en) | Plasma-free metal etch | |
| JP2015122486A5 (ja) | アンダーコートを形成する方法および反応チャンバ | |
| JP2015154047A5 (pl) | ||
| JP2015133481A5 (ja) | 剥離方法 | |
| JP2012004549A5 (ja) | 半導体装置 | |
| JP2018046216A5 (pl) | ||
| JP2017117941A5 (pl) | ||
| JP2016192483A5 (pl) | ||
| JP2016095504A5 (pl) | ||
| JP2017125837A5 (pl) | ||
| JP2015517214A5 (pl) | ||
| JP2015079945A5 (pl) | ||
| JP2012004273A5 (pl) | ||
| JP2017117943A5 (pl) | ||
| JP2016046530A5 (ja) | 半導体装置の作製方法 | |
| JP2017515301A5 (pl) | ||
| JP2016181630A5 (pl) | ||
| JP2007258634A5 (pl) |