JP2017224700A - 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 - Google Patents
半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 92
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 213
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 148
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 56
- 239000010703 silicon Substances 0.000 claims abstract description 56
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- 229910052814 silicon oxide Inorganic materials 0.000 claims description 42
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- 229910052788 barium Inorganic materials 0.000 claims description 4
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 4
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- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
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- 108091006146 Channels Proteins 0.000 description 11
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
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- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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Abstract
【解決手段】実施形態の半導体装置は、炭化珪素層と、アルミニウムを含有するp型の炭化珪素領域を含むゲート電極と、酸化シリコン又は酸窒化シリコンを含む第1の領域と、第1の領域とゲート電極との間に位置しアルミニウムを含有する酸化物を含む第2の領域とを有し、炭化珪素層とゲート電極との間に位置するゲート絶縁層と、を備える。
【選択図】図1
Description
本実施形態の半導体装置は、炭化珪素層と、アルミニウムを含有するp型の炭化珪素領域を含むゲート電極と、酸化シリコン又は酸窒化シリコンを含む第1の領域と、第1の領域とゲート電極との間に位置しアルミニウムを含有する酸化物を含む第2の領域とを有し、炭化珪素層とゲート電極との間に位置するゲート絶縁層と、を備える。
第2の領域がシリコンを含有し、アルミニウムの原子数とシリコンの原子数の和に対するアルミニウムの原子数が、0.08以上1未満であること以外は、第1の実施形態と同様である。したがって、第1の実施形態と重複する内容については、記述を省略する。
本実施形態の半導体装置は、炭化珪素領域が3C−SiCを含む点で、第1の実施形態と異なる。以下、第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、炭化珪素層とゲート絶縁層との間に位置し、バリウム(Ba)、ストロンチウム(Sr)、ランタン(La)、及び、イットリウム(Y)から成る群の少なくとも一つの元素の酸化物を含む酸化物層を、更に備える点で、第1の実施形態と異なる。以下、第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、トレンチゲート構造のMOSFETである点で第1の実施形態と異なる。第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、IGBT(Inulated Gate Bipolar Transistor)である点で第1の実施形態と異なる。第1の実施形態と重複する内容については記述を省略する。
本実施形態のインバータ回路及び駆動装置は、第1の実施形態の半導体装置を備える駆動装置である。
本実施形態の車両は、第1の実施形態の半導体装置を備える車両である。
本実施形態の車両は、第1の実施形態の半導体装置を備える車両である。
本実施形態の昇降機は、第1の実施形態の半導体装置を備える昇降機である。
16 ゲート絶縁層
16a 第1の領域
16b 第2の領域
18 ゲート電極
18a 炭化珪素領域
18b シリコン領域
50 酸化物層
100 MOSFET(半導体装置)
150 インバータ回路
200 MOSFET(半導体装置)
300 MOSFET(半導体装置)
400 IGBT(半導体装置)
500 駆動装置
600 車両
700 車両
800 昇降機
Claims (14)
- 炭化珪素層と、
アルミニウムを含有するp型の炭化珪素領域を含むゲート電極と、
酸化シリコン又は酸窒化シリコンを含む第1の領域と、前記第1の領域と前記ゲート電極との間に位置しアルミニウムを含有する酸化物を含む第2の領域とを有し、前記炭化珪素層と前記ゲート電極との間に位置するゲート絶縁層と、
を備える半導体装置。 - 前記炭化珪素領域のアルミニウム濃度が1×1019cm−3以上である請求項1記載の半導体装置。
- 前記炭化珪素領域の厚さが10nm以上30nm以下である請求項1又は請求項2記載の半導体装置。
- 前記第2の領域がシリコンを含有し、アルミニウムの原子数とシリコンの原子数の和に対するアルミニウムの原子数が、0.08以上である請求項1乃至請求項3いずれか一項記載の半導体装置。
- 前記ゲート電極が、前記ゲート絶縁層との間に前記炭化珪素領域を挟み、前記炭化珪素領域よりも厚さの厚いn型又はp型のシリコン領域を有する請求項1乃至請求項4いずれか一項記載の半導体装置。
- 前記炭化珪素領域は3C−SiCを含む請求項1乃至請求項5いずれか一項記載の半導体装置。
- 前記炭化珪素領域中の3C−SiCの体積が、前記炭化珪素領域中の4H−SiCの体積よりも大きい請求項6記載の半導体装置。
- 前記炭化珪素層と前記ゲート絶縁層との間に位置し、バリウム、ストロンチウム、ランタン、及び、イットリウムから成る群の少なくとも一つの元素の酸化物を含む酸化物層を、更に備える請求項1乃至請求項7いずれか一項記載の半導体装置。
- 前記炭化珪素層は4H−SiCである請求項1乃至請求項8いずれか一項記載の半導体装置。
- 前記炭化珪素層がアルミニウムを含有するp型である請求項1乃至請求項9いずれか一項記載の半導体装置。
- 請求項1乃至請求項10いずれか一項記載の半導体装置を備えるインバータ回路。
- 請求項1乃至請求項10いずれか一項記載の半導体装置を備える駆動装置。
- 請求項1乃至請求項10いずれか一項記載の半導体装置を備える車両。
- 請求項1乃至請求項10いずれか一項記載の半導体装置を備える昇降機。
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JP2016118566A JP6606020B2 (ja) | 2016-06-15 | 2016-06-15 | 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 |
US15/440,389 US20170365664A1 (en) | 2016-06-15 | 2017-02-23 | Semiconductor device, inverter circuit, driving device, vehicle, and elevator |
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US11563101B2 (en) * | 2020-07-07 | 2023-01-24 | Wolfspeed, Inc. | Power semiconductor devices having multilayer gate dielectric layers that include an etch stop/field control layer and methods of forming such devices |
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JP2007035736A (ja) * | 2005-07-25 | 2007-02-08 | Matsushita Electric Ind Co Ltd | 半導体装置および電気機器 |
JP2009524239A (ja) * | 2006-01-20 | 2009-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 金属不純物の導入による導電性電極の仕事関数を変更する方法(およびその半導体構造体) |
JP2011100967A (ja) * | 2009-07-21 | 2011-05-19 | Rohm Co Ltd | 半導体装置 |
JP2011151366A (ja) * | 2009-12-26 | 2011-08-04 | Canon Anelva Corp | 誘電体膜の製造方法 |
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JP2016048758A (ja) * | 2014-08-28 | 2016-04-07 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
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