JP2017212155A - ヒータユニット - Google Patents
ヒータユニット Download PDFInfo
- Publication number
- JP2017212155A JP2017212155A JP2016105815A JP2016105815A JP2017212155A JP 2017212155 A JP2017212155 A JP 2017212155A JP 2016105815 A JP2016105815 A JP 2016105815A JP 2016105815 A JP2016105815 A JP 2016105815A JP 2017212155 A JP2017212155 A JP 2017212155A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- mounting table
- layer
- wiring layer
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 32
- 230000020169 heat generation Effects 0.000 claims description 15
- 238000009429 electrical wiring Methods 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 62
- 238000001816 cooling Methods 0.000 description 51
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000010408 film Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Surface Heating Bodies (AREA)
- Control Of Resistance Heating (AREA)
Abstract
Description
1a ウエハ載置面
2 支持板
3 発熱ユニット
4 測温センサ(測温素子)
6 冷却モジュール
9 介在層
10 容器
11 脚部
31 発熱層
32 中間電気絶縁フィルム
33 電気配線層
34 上側電気絶縁フィルム
35 下側電気絶縁フィルム
60 可動式冷却プレート(冷却板)
61 固定式冷却ステージ
61a 冷媒流路
62 ザグリ溝
63 金属製パイプ
64a 板状部材
64b 板状部材
64c 板状部材
64d 板状部材
65 流路
66 昇降機構
Claims (2)
- 被処理物を載置する載置面を備えた載置台と、前記載置台を支持する支持板と、前記載置台と前記支持板との間に挟持され且つ測温素子が実装されたフィルム状の発熱ユニットとを有するヒータユニットであって、前記発熱ユニットは発熱層と、前記発熱層に対して電気的に絶縁された電気配線層とを有しており、前記電気配線層の回路の一方の終端部が前記測温素子に結線していることを特徴とするヒータユニット。
- 前記電気配線層の回路は前記一方の終端部から前記発熱層の有効発熱領域外の取り出し位置に向かって放射状に延在している、請求項1に記載のヒータユニット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016105815A JP6260645B2 (ja) | 2016-05-27 | 2016-05-27 | ヒータユニット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016105815A JP6260645B2 (ja) | 2016-05-27 | 2016-05-27 | ヒータユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017212155A true JP2017212155A (ja) | 2017-11-30 |
JP6260645B2 JP6260645B2 (ja) | 2018-01-17 |
Family
ID=60476941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016105815A Active JP6260645B2 (ja) | 2016-05-27 | 2016-05-27 | ヒータユニット |
Country Status (1)
Country | Link |
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JP (1) | JP6260645B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09189613A (ja) * | 1996-01-08 | 1997-07-22 | Tokyo Electron Ltd | 温度測定装置、処理装置及び処理方法 |
WO2010053173A1 (ja) * | 2008-11-10 | 2010-05-14 | 株式会社Kelk | 半導体ウェーハの温度制御装置および温度制御方法 |
JP2012251964A (ja) * | 2011-06-07 | 2012-12-20 | Nikon Corp | 温度検出方法、基板貼り合わせ方法、重ね合わせ基板、及び、温度検出装置 |
-
2016
- 2016-05-27 JP JP2016105815A patent/JP6260645B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09189613A (ja) * | 1996-01-08 | 1997-07-22 | Tokyo Electron Ltd | 温度測定装置、処理装置及び処理方法 |
WO2010053173A1 (ja) * | 2008-11-10 | 2010-05-14 | 株式会社Kelk | 半導体ウェーハの温度制御装置および温度制御方法 |
JP2012251964A (ja) * | 2011-06-07 | 2012-12-20 | Nikon Corp | 温度検出方法、基板貼り合わせ方法、重ね合わせ基板、及び、温度検出装置 |
Also Published As
Publication number | Publication date |
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JP6260645B2 (ja) | 2018-01-17 |
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