JP2017188546A - 硬化性樹脂シート、電気回路用可撓性基材、可撓性電気回路体及び半導体装置 - Google Patents
硬化性樹脂シート、電気回路用可撓性基材、可撓性電気回路体及び半導体装置 Download PDFInfo
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- JP2017188546A JP2017188546A JP2016075665A JP2016075665A JP2017188546A JP 2017188546 A JP2017188546 A JP 2017188546A JP 2016075665 A JP2016075665 A JP 2016075665A JP 2016075665 A JP2016075665 A JP 2016075665A JP 2017188546 A JP2017188546 A JP 2017188546A
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Abstract
Description
まず、可撓性基材11上に電気回路12を形成する。電気回路の形成方法としては特に限定されないが、エッチング、めっき、印刷、転写等の方法が挙げられる。
次に、可撓性基材11及び電気回路12を被覆する電気回路保護材1を設ける。例えば、フィルム状の電気回路保護材を加熱プレス、ロールラミネート、真空ラミネート等の方法によって積層すること、又は、液状の電気回路保護材をコーティング、ディッピング、ディスペンスなどの塗布方法によって塗布してもよい。
次に、電気回路保護材1を硬化して、可撓性を有する電気回路保護層13を形成させる。本工程が必要ない場合は、これを省略できる。これにより図2に示される電気回路体200が得られる。硬化方法としては、加熱による熱硬化、又は、露光による光硬化を用いることができる。工程の簡易化のためには、熱硬化であれば低温で硬化する電気回路保護材が好ましい。また、室温で硬化できる観点から、光硬化する電気回路保護材が好ましい。
[樹脂ワニスVA11の調合]
(A)成分として水素添加型スチレンブタジエンゴム(スチレン系エラストマ、JSR(株)「ダイナロン2324P」)80質量部、(B)成分としてブタンジオールジアクリレート(日立化成(株)製「ファンクリルFA−124AS」)20質量部、(C)成分としてビス(2,4,6−トリメチルベンゾイル)フェニルホスフィンオキシド(BASF社製「イルガキュア819」)1.5質量部、及び溶剤としてトルエン125質量部を攪拌しながら混合し樹脂ワニスVA11を得た。
基材フィルムとして離型処理ポリエチレンテレフタレート(PET)フィルム(帝人デュポンフィルム(株)製「ピューレックスA31」、厚み25μm)を準備した。このPETフィルムの離型処理面上にナイフコータ((株)康井精機製「SNC−350」を用いて樹脂ワニスVA11を塗布した。塗膜を乾燥機((株)二葉科学製「MSO−80TPS」)中100℃で20分乾燥して、硬化性樹脂シートを形成させた。形成された硬化性樹脂シートに、基材フィルムと同じ離型処理PETフィルムを、離型処理面が硬化性樹脂シート側になる向きで保護フィルムとして貼付けて、積層フィルムFA11を得た。硬化後の硬化性樹脂シート(可撓性基材)の厚さが100μmとなるように塗工機のギャップを調節した。
実施例1と同様の方法で、表1に示す配合比に従って樹脂ワニスを調合し、積層フィルムFA12〜FA17を作製した。比較例2としてシリコーンゴム製のシート状フィルムFS18(厚さ100μm)を準備した。
各硬化性樹脂シートに、紫外線露光機(ミカサ(株)「ML−320FSAT」)によって紫外線(波長365nm)を5000mJ/cm2照射して、可撓性基材を形成させた。その後、長さ40mm、幅10mmの大きさに積層フィルムを切り出し、保護フィルム及び基材フィルムを除去して、可撓性基材の測定用サンプルを得た。測定用サンプルの応力−ひずみ曲線を、オートグラフ((株)島津製作所「EZ−S」)を用いて測定し、その応力−ひずみ曲線から弾性率及び伸び率を求めた。測定時のチャック間距離は20mm、引っ張り速度は50mm/minとした。荷重0.5から1.0Nにおける応力とひずみの関係から弾性率を求めた。サンプルが破断した際の時点のひずみから求められる伸び率を破断伸び率とした。
各硬化性樹脂シートに、紫外線露光機(ミカサ(株)「ML−320FSAT」)によって紫外線(波長365nm)を5000mJ/cm2照射して、可撓性基材を形成させた。その後、長さ70mm、幅5mmの大きさに積層フィルムを切り出し、保護フィルム及び基材フィルムを除去して、可撓性基材の測定用サンプルを得た。測定用サンプルの回復率を、マイクロフォース試験機(IllinoisTool Works Inc「Instron 5948」)を用いて測定した。
積層フィルムから保護フィルムを除去し、硬化性樹脂シートを、スライドガラス(松浪硝子工業(株)「S1111」)上に真空加圧式ラミネータ(ニチゴー・モートン(株)「V130」)を用いて、圧力0.5MPa、温度60℃及び加圧時間60秒の条件でラミネートした。ラミネートされた硬化性樹脂シートに、前記紫外線露光機にて紫外線(波長365nm)を5000mJ/cm2照射して、可撓性基材を形成させた。その後、基材フィルムを剥がし、可撓性基材の全光線透過率、YI及びヘイズを分光ヘイズメータ(日本電色工業(株)「SH7000」)を用いて測定した。
実施例3又は比較例2の硬化性樹脂フィルムから形成された可撓性基材について、JIS Z 0208 防湿包装材料の透湿度試験方法(カップ法)に準じて透湿度を測定した。試験温度は40℃、相対湿度は90%とした。
実施例3、比較例2及び比較例3の硬化性樹脂シートから形成された可撓性基材について、可撓性基材と銅回路の密着性を、90度ピール試験にて評価した。積層フィルムから保護フィルム及び基材フィルムを剥がし、可撓性基材上に厚さ6nmのCr層をスパッタリングで形成した。スパッタリングは、ロードロック式スパッタリング装置((株)アルバック社製、「SIH−350−T08」)を用いて、以下に示す条件1で行った。
(条件1)
パワー:500W
アルゴン流量:100SCCM
真空度:7.0×10−1Pa
基板温度:室温(25℃)
成膜レート:34nm/min
(条件2)
パワー:500W
アルゴン流量:100SCCM
真空度:7.0×10−1Pa
基板温度:室温(25℃)
処理時間:0.5分
(条件3)
(Cr)
パワー:500W
アルゴン流量:100SCCM
真空度:7.0×10−1Pa
基板温度:室温(25℃)
成膜レート:34nm/min
(銅)
パワー:500W
アルゴン流量:100SCCM
真空度:7.0×10−1Pa
基板温度:室温(25℃)
成膜レート:52nm/min
2)シリコーンゴムシート、タイガースポリマー(株)「SR−50」
3)ゴム変性ポリアミド(日本化薬(株)「カヤフレックスBPAM−155」、重量平均分子量:3.1×104
4)ブタンジオールジアクリレート(日立化成(株)「ファンクリルFA−124AS」)
5)ヘキサンジオールジアクリレート(日立化成(株)「ファンクリルFA−126AS」)
6)ノナンジオールジアクリレート(日立化成(株)「ファンクリルFA−129AS」)
7)ビス(2,4,6−トリメチルベンゾイル)フェニルホスフィンオキシド(BASFジャパン(株)「イルガキュア819」)
Claims (8)
- (A)スチレン系エラストマ、
(B)重合性モノマ、及び
(C)重合開始剤
を含有する、電気回路用可撓性基材を形成するために用いられる硬化性樹脂シート。 - 前記スチレン系エラストマが、水素添加型スチレン系エラストマである、請求項1に記載の硬化性樹脂シート。
- 前記重合性モノマがエチレン性不飽和基を有する、請求項1又は2に記載の硬化性樹脂シート。
- 前記重合開始剤が光ラジカル重合開始剤である、請求項1〜3のいずれか一項に記載の硬化性樹脂シート。
- 前記スチレン系エラストマの含有量が、前記スチレン系エラストマ及び前記重合性モノマの合計量に対して50〜90質量%であり、
前記重合性モノマの含有量が、前記スチレン系エラストマ及び前記重合性モノマの合計量に対して10〜50質量%であり、
前記重合開始剤の含有量が、前記スチレン系エラストマ及び前記重合性モノマの合計量100質量部に対して0.1〜10質量部である、請求項1〜4のいずれか一項に記載の硬化性樹脂シート。 - 請求項1〜5のいずれか一項に記載の硬化性樹脂シートの硬化物である、電気回路用可撓性基材。
- 請求項6に記載の電気回路用可撓性基材と、
前記可撓性基材上に形成された電気回路と、
を備える、可撓性電気回路体。 - 請求項7に記載の可撓性電気回路体と、
前記可撓性電気回路体に搭載された半導体素子と、
を具備する半導体装置。
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