JP2017186673A - 高強度・高導電率電鋳銅合金及び製造方法 - Google Patents
高強度・高導電率電鋳銅合金及び製造方法 Download PDFInfo
- Publication number
- JP2017186673A JP2017186673A JP2017074719A JP2017074719A JP2017186673A JP 2017186673 A JP2017186673 A JP 2017186673A JP 2017074719 A JP2017074719 A JP 2017074719A JP 2017074719 A JP2017074719 A JP 2017074719A JP 2017186673 A JP2017186673 A JP 2017186673A
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- Prior art keywords
- alloy
- binary
- ions
- copper
- conductivity
- Prior art date
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- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 197
- 150000002500 ions Chemical class 0.000 claims abstract description 104
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 88
- 239000000956 alloy Substances 0.000 claims abstract description 88
- 239000003792 electrolyte Substances 0.000 claims abstract description 80
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 19
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 19
- 229910052742 iron Inorganic materials 0.000 claims abstract description 17
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 17
- 229910052796 boron Inorganic materials 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 9
- 229910002056 binary alloy Inorganic materials 0.000 claims description 104
- 239000002245 particle Substances 0.000 claims description 85
- 238000000034 method Methods 0.000 claims description 67
- 239000000203 mixture Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 description 44
- 238000005323 electroforming Methods 0.000 description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
- 239000011701 zinc Substances 0.000 description 23
- 239000002738 chelating agent Substances 0.000 description 22
- 239000011651 chromium Substances 0.000 description 21
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 21
- 238000005275 alloying Methods 0.000 description 20
- 238000007747 plating Methods 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000000151 deposition Methods 0.000 description 14
- 238000004881 precipitation hardening Methods 0.000 description 13
- 229910052725 zinc Inorganic materials 0.000 description 13
- 239000000654 additive Substances 0.000 description 12
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000002131 composite material Substances 0.000 description 10
- 229910001431 copper ion Inorganic materials 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 10
- 238000005272 metallurgy Methods 0.000 description 10
- 238000007792 addition Methods 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 9
- -1 but not limited to Substances 0.000 description 8
- 229910052793 cadmium Inorganic materials 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 238000000975 co-precipitation Methods 0.000 description 6
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 239000006104 solid solution Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 5
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 5
- 238000006555 catalytic reaction Methods 0.000 description 5
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 5
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 5
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 5
- MRYMYQPDGZIGDM-UHFFFAOYSA-L copper;4-methylbenzenesulfonate Chemical compound [Cu+2].CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 MRYMYQPDGZIGDM-UHFFFAOYSA-L 0.000 description 5
- RIOSFUBRIQHOMS-UHFFFAOYSA-L copper;benzenesulfonate Chemical compound [Cu+2].[O-]S(=O)(=O)C1=CC=CC=C1.[O-]S(=O)(=O)C1=CC=CC=C1 RIOSFUBRIQHOMS-UHFFFAOYSA-L 0.000 description 5
- BSXVKCJAIJZTAV-UHFFFAOYSA-L copper;methanesulfonate Chemical compound [Cu+2].CS([O-])(=O)=O.CS([O-])(=O)=O BSXVKCJAIJZTAV-UHFFFAOYSA-L 0.000 description 5
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 5
- 238000004070 electrodeposition Methods 0.000 description 5
- 239000002608 ionic liquid Substances 0.000 description 5
- 229940044652 phenolsulfonate Drugs 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- 238000009499 grossing Methods 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 4
- 229910017813 Cu—Cr Inorganic materials 0.000 description 3
- 229910017827 Cu—Fe Inorganic materials 0.000 description 3
- 229910001182 Mo alloy Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 2
- XNCSCQSQSGDGES-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C(C)CN(CC(O)=O)CC(O)=O XNCSCQSQSGDGES-UHFFFAOYSA-N 0.000 description 2
- OQEBIHBLFRADNM-YUPRTTJUSA-N 2-hydroxymethyl-pyrrolidine-3,4-diol Chemical compound OC[C@@H]1NC[C@H](O)[C@H]1O OQEBIHBLFRADNM-YUPRTTJUSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 2
- WJPZDRIJJYYRAH-UHFFFAOYSA-N [Zn].[Mo] Chemical compound [Zn].[Mo] WJPZDRIJJYYRAH-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 235000015165 citric acid Nutrition 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005078 molybdenum compound Substances 0.000 description 2
- 150000002752 molybdenum compounds Chemical class 0.000 description 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000011593 sulfur Chemical group 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- UZVUJVFQFNHRSY-OUTKXMMCSA-J tetrasodium;(2s)-2-[bis(carboxylatomethyl)amino]pentanedioate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CC[C@@H](C([O-])=O)N(CC([O-])=O)CC([O-])=O UZVUJVFQFNHRSY-OUTKXMMCSA-J 0.000 description 2
- LHBPLFWXEXNIJU-UHFFFAOYSA-H trizinc;trioxido(oxo)-$l^{5}-arsane Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-][As]([O-])([O-])=O.[O-][As]([O-])([O-])=O LHBPLFWXEXNIJU-UHFFFAOYSA-H 0.000 description 2
- XHXZYMKBDDMBAO-UHFFFAOYSA-N trizinc;trioxidoarsane Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-][As]([O-])[O-].[O-][As]([O-])[O-] XHXZYMKBDDMBAO-UHFFFAOYSA-N 0.000 description 2
- 150000003751 zinc Chemical class 0.000 description 2
- GTQFPPIXGLYKCZ-UHFFFAOYSA-L zinc chlorate Chemical compound [Zn+2].[O-]Cl(=O)=O.[O-]Cl(=O)=O GTQFPPIXGLYKCZ-UHFFFAOYSA-L 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 2
- 241001274216 Naso Species 0.000 description 1
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- RYPRIXSYXLDSOA-UHFFFAOYSA-L chromium(2+);sulfate Chemical compound [Cr+2].[O-]S([O-])(=O)=O RYPRIXSYXLDSOA-UHFFFAOYSA-L 0.000 description 1
- 229910000334 chromium(II) sulfate Inorganic materials 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- 229910000356 chromium(III) sulfate Inorganic materials 0.000 description 1
- 235000015217 chromium(III) sulphate Nutrition 0.000 description 1
- 239000011696 chromium(III) sulphate Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- LNDHQUDDOUZKQV-UHFFFAOYSA-J molybdenum tetrafluoride Chemical compound F[Mo](F)(F)F LNDHQUDDOUZKQV-UHFFFAOYSA-J 0.000 description 1
- PDKHNCYLMVRIFV-UHFFFAOYSA-H molybdenum;hexachloride Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Mo] PDKHNCYLMVRIFV-UHFFFAOYSA-H 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
【解決手段】Cu及びXを含む二元系銅合金であって、Xは、Cr、Fe、W、Mo、B、Co、Ag、及びPから選択され、少なくとも600MPaの降伏強度及び少なくとも20%IACSの導電率を有する電鋳二元系銅合金を製造する方法。Cu及びXのイオンを含み、Xが、Cr、Fe、W、Mo、B、Co、Ag、及びPから選択される、電解質浴内にカソードのプリフォームの少なくとも一部分を浸漬することと、Cu−X二元合金を形成するために、前記Cu及びXのイオンを前記カソードのプリフォームの一部分上に析出させるように、前記電解質浴に電流を印加することと、Cu−X二元合金の強度増大のため、一定時間、少なくとも100℃の温度で、Cu−X二元合金を加熱することと、を含む製造方法。
【選択図】図1A
Description
本出願は、2015年12月11日出願の「High Strength,High Conductivity Electroformed Copper Alloys and Methods of Making」と題された米国特許仮出願第62/266,502号の米国特許法第119条(e)による利益を主張し、本明細書に参照によりその全体を援用する。
σy=σ0+d−1/2
しかし、強度は、粒度の減少に伴い単調には増大しない。
(1)20msecの間、20ASD(平方デシメートルあたりアンペア)(Cu及びCrを共析出させることを可能にする)
(2)3msの間、−50ASD(これは分散及び脆弱に形成された種の除去に役立つ)
(3)5msecの間、電流なし(イオンが表面領域に移動するのを可能にする)
(4)20msecの間、2ASD(Cuが析出するのを可能にする)
(5)3msの間、−50ASD(これは分散及び脆弱に形成された種の除去に役立つ)
(6)5msecの間、電流なし(イオンが表面領域に移動するのを可能にする)
このシーケンスは、所望の量のCu及びXのイオンが析出されるまで、及び/又はめっき層が所望の厚さになるまで、連続的に繰り返すことができる。他の実施形態では、2つのパルスの時間及び電流密度は、調整することができ、それにより析出物内のX/Cuの比の制御が可能になる。
非限定的な実施例の合金
Cu−Cr合金
Cu−W合金
Cu−Fe合金
Cu−Mo合金
Claims (20)
- Cu及びXを含む二元系銅合金であって、Xは、Cr、Fe、W、Mo、B、Co、Ag、及びPからなる群から選択され、前記銅合金は、少なくとも600MPaの降伏強度及び少なくとも20%IACSの導電率を有する、合金。
- XがMoである、請求項1に記載の合金。
- Moが、0.1重量%から2.5重量%の範囲であり、前記二元系銅合金が、形成したままの前記合金の前記粒子の直径を測定すると、100nm未満の平均粒度を有する、請求項2に記載の合金。
- 前記降伏強度が、少なくとも800MPaである、請求項1に記載の合金。
- 前記導電率が、少なくとも30%IACSである、請求項1に記載の合金。
- 前記降伏強度が、900MPaと1700MPaとの間である、請求項1に記載の合金。
- 前記導電率が、30%IACSと70%IACSとの間である、請求項1に記載の合金。
- Xが、前記合金内の粒子相を構成する、請求項1に記載の合金。
- 前記粒内粒子が、前記合金の少なくとも0.1%体積分率を構成する、請求項6に記載の合金。
- 前記粒内粒子が、前記合金の少なくとも1%体積分率を構成する、請求項6に記載の合金。
- Xが、前記合金の少なくとも0.1重量%を構成する、請求項1に記載の合金。
- Xが、前記合金の少なくとも1重量%を構成する、請求項1に記載の合金。
- 電鋳二元系銅合金を製造する方法であって、
Cu及びXのイオンを含み、Xは、Cr、Fe、W、Mo、B、Co、Ag、及びPからなる群から選択される、電解質浴内にカソードのプリフォームの少なくとも一部分を浸漬することと、
Cu−X二元合金を形成するために、前記Cu及びXのイオンを前記カソードのプリフォームの一部分上に析出させるように、前記電解質浴に電流を印加することと、
前記Cu−X二元合金の硬度を増大するために一定時間少なくとも100℃の温度に、前記Cu−X二元合金を加熱することと、を含む方法。 - XがMoである、請求項13に記載の方法。
- 前記Cu−X二元合金を一定時間加熱することが、X及びCuyXzの少なくとも1つの粒子の析出を含む、請求項13に記載の方法。
- 前記電解質浴が、少なくとも0.1重量%のXイオンを含む、請求項13に記載の方法。
- 前記Cu−X二元合金を前記カソードのプリフォームから分離することを更に含む、請求項13に記載の方法。
- CuとXとの間の電極電位の差ΔVは、±0.3V未満である、請求項13に記載の方法。
- 前記電解質浴が、±0.5V未満である有効ΔVを有するための化学合成物を更に含む、請求項18に記載の方法。
- 少なくとも600MPaの降伏強度及び少なくとも20%IACSの導電率を有する、Cu及びXを含む電鋳二元系銅合金を含み、Xは、Cr、Fe、W、Mo、B、Co、Ag、Pからなる群から選択される、電気コネクタ。
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JP2020062825A (ja) * | 2018-10-18 | 2020-04-23 | アオイ電子株式会社 | サーマルヘッドおよびサーマルヘッドの製造方法 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006219705A (ja) * | 2005-02-09 | 2006-08-24 | Nikko Kinzoku Kk | 高強度高導電性銅合金の製造方法及び高強度高導電性銅合金 |
JP2009079281A (ja) * | 2007-09-27 | 2009-04-16 | Nikko Kinzoku Kk | 高強度高導電性二相銅合金 |
JP2011246802A (ja) * | 2010-04-28 | 2011-12-08 | Sumitomo Electric Ind Ltd | Cu−Ag合金線及びCu−Ag合金線の製造方法 |
JP2016069713A (ja) * | 2014-10-01 | 2016-05-09 | 住友電気工業株式会社 | 銅合金材、コネクタ端子、及び銅合金材の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02240230A (ja) * | 1989-03-15 | 1990-09-25 | Toshiba Corp | 高強度銅合金 |
JP2008069374A (ja) | 2006-09-12 | 2008-03-27 | Nippon Shokubai Co Ltd | 金属ナノ粒子分散体および金属被膜 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006219705A (ja) * | 2005-02-09 | 2006-08-24 | Nikko Kinzoku Kk | 高強度高導電性銅合金の製造方法及び高強度高導電性銅合金 |
JP2009079281A (ja) * | 2007-09-27 | 2009-04-16 | Nikko Kinzoku Kk | 高強度高導電性二相銅合金 |
JP2011246802A (ja) * | 2010-04-28 | 2011-12-08 | Sumitomo Electric Ind Ltd | Cu−Ag合金線及びCu−Ag合金線の製造方法 |
JP2016069713A (ja) * | 2014-10-01 | 2016-05-09 | 住友電気工業株式会社 | 銅合金材、コネクタ端子、及び銅合金材の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020059870A (ja) * | 2018-10-05 | 2020-04-16 | 株式会社エヌ・ティ・ティ・データ・エンジニアリングシステムズ | 銅合金造形物の製造方法および銅合金造形物 |
JP2020062825A (ja) * | 2018-10-18 | 2020-04-23 | アオイ電子株式会社 | サーマルヘッドおよびサーマルヘッドの製造方法 |
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