JP2017186623A5 - - Google Patents
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- JP2017186623A5 JP2017186623A5 JP2016076902A JP2016076902A JP2017186623A5 JP 2017186623 A5 JP2017186623 A5 JP 2017186623A5 JP 2016076902 A JP2016076902 A JP 2016076902A JP 2016076902 A JP2016076902 A JP 2016076902A JP 2017186623 A5 JP2017186623 A5 JP 2017186623A5
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- JP
- Japan
- Prior art keywords
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- Prior art date
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- 239000012535 impurity Substances 0.000 claims description 9
- 239000003381 stabilizer Substances 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims 3
- 239000011159 matrix material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052711 selenium Inorganic materials 0.000 claims 1
- 239000002887 superconductor Substances 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016076902A JP6299804B2 (ja) | 2016-04-06 | 2016-04-06 | 超伝導安定化材、超伝導線及び超伝導コイル |
| EP17779089.6A EP3441485B1 (en) | 2016-04-06 | 2017-04-03 | Stabilizer material for superconductor, superconducting wire and superconducting coil |
| US16/090,775 US20200002787A1 (en) | 2016-04-06 | 2017-04-03 | Superconducting stabilizer, superconducting wire and superconducting coil |
| KR1020187025129A KR102300981B1 (ko) | 2016-04-06 | 2017-04-03 | 초전도 안정화재, 초전도선 및 초전도 코일 |
| PCT/JP2017/013926 WO2017175711A1 (ja) | 2016-04-06 | 2017-04-03 | 超伝導安定化材、超伝導線及び超伝導コイル |
| CN201780015156.9A CN109072339B (zh) | 2016-04-06 | 2017-04-03 | 超导稳定化材料、超导线以及超导线圈 |
| TW106111411A TWI707962B (zh) | 2016-04-06 | 2017-04-05 | 超導安定化材料、超導線及超導線圈 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016076902A JP6299804B2 (ja) | 2016-04-06 | 2016-04-06 | 超伝導安定化材、超伝導線及び超伝導コイル |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017186623A JP2017186623A (ja) | 2017-10-12 |
| JP2017186623A5 true JP2017186623A5 (https=) | 2018-01-18 |
| JP6299804B2 JP6299804B2 (ja) | 2018-03-28 |
Family
ID=60001171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016076902A Active JP6299804B2 (ja) | 2016-04-06 | 2016-04-06 | 超伝導安定化材、超伝導線及び超伝導コイル |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20200002787A1 (https=) |
| EP (1) | EP3441485B1 (https=) |
| JP (1) | JP6299804B2 (https=) |
| KR (1) | KR102300981B1 (https=) |
| CN (1) | CN109072339B (https=) |
| TW (1) | TWI707962B (https=) |
| WO (1) | WO2017175711A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021022508A (ja) * | 2019-07-29 | 2021-02-18 | 三菱マテリアル株式会社 | 絶縁性超電導線材、絶縁性超電導線材の製造方法および超電導コイル |
| JP2021022505A (ja) * | 2019-07-29 | 2021-02-18 | 三菱マテリアル株式会社 | 絶縁性超電導線材、絶縁性超電導線材の製造方法、超電導コイルおよび絶縁性超電導線材用のチャネル |
| CN111549254A (zh) * | 2020-04-29 | 2020-08-18 | 铜陵有色金属集团股份有限公司金威铜业分公司 | 一种无氧铜基微合金及其制备方法和应用 |
| EP4174198A4 (en) * | 2020-06-30 | 2025-01-15 | Mitsubishi Materials Corporation | COPPER ALLOY, PLASTIC WORKED COPPER ALLOY MATERIAL, COMPONENT FOR ELECTRONIC OR ELECTRICAL DEVICE, TERMINAL, BUS BAR, CONNECTION FRAME AND HEAT DISSIPATION SUBSTRATE |
| EP4174197A4 (en) * | 2020-06-30 | 2025-01-15 | Mitsubishi Materials Corporation | Plastic copper alloy working material, copper alloy wire material, component for electronic and electrical equipment, and terminal |
| JP7136157B2 (ja) * | 2020-06-30 | 2022-09-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子 |
| JP7446975B2 (ja) * | 2020-10-29 | 2024-03-11 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板 |
| EP4174199B1 (en) * | 2020-06-30 | 2025-12-03 | Mitsubishi Materials Corporation | Copper alloy, copper alloy plastic working material, component for electronic/electrical devices, terminal, bus bar, lead frame and heat dissipation substrate |
| JP7604935B2 (ja) | 2021-02-16 | 2024-12-24 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04224662A (ja) * | 1990-12-26 | 1992-08-13 | Hitachi Cable Ltd | 高残留抵抗比銅材の製造方法 |
| JP3047540B2 (ja) * | 1991-07-23 | 2000-05-29 | 三菱マテリアル株式会社 | 高い残留抵抗比を有する超電導安定化材用高純度Ｃｕ合金 |
| JP3509432B2 (ja) * | 1996-11-20 | 2004-03-22 | 日立電線株式会社 | 無酸素銅の熱処理方法 |
| JP3851593B2 (ja) * | 2002-07-02 | 2006-11-29 | 株式会社神戸製鋼所 | Ｎｂ３Ｓｎ系超電導線材用ブロンズ材およびこれを用いた超電導線材用複合材、並びに超電導線材 |
| US20040266628A1 (en) * | 2003-06-27 | 2004-12-30 | Superpower, Inc. | Novel superconducting articles, and methods for forming and using same |
| WO2007136406A2 (en) * | 2005-11-08 | 2007-11-29 | Supramagnetics, Inc. | Composite conductors with improved structural and electrical properties |
| JP4709296B2 (ja) * | 2009-04-17 | 2011-06-22 | 日立電線株式会社 | 希薄銅合金材料の製造方法 |
| JP5717236B2 (ja) | 2010-05-12 | 2015-05-13 | 三菱マテリアル株式会社 | 粒子加速器 |
| JP5589753B2 (ja) * | 2010-10-20 | 2014-09-17 | 日立金属株式会社 | 溶接部材、及びその製造方法 |
| SG190482A1 (en) * | 2011-12-01 | 2013-06-28 | Heraeus Materials Tech Gmbh | Doped 4n copper wire for bonding in microelectronics device |
-
2016
- 2016-04-06 JP JP2016076902A patent/JP6299804B2/ja active Active
-
2017
- 2017-04-03 EP EP17779089.6A patent/EP3441485B1/en active Active
- 2017-04-03 KR KR1020187025129A patent/KR102300981B1/ko active Active
- 2017-04-03 US US16/090,775 patent/US20200002787A1/en not_active Abandoned
- 2017-04-03 CN CN201780015156.9A patent/CN109072339B/zh active Active
- 2017-04-03 WO PCT/JP2017/013926 patent/WO2017175711A1/ja not_active Ceased
- 2017-04-05 TW TW106111411A patent/TWI707962B/zh active
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