JP2017183328A - Electronic device and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device excellent in durability.SOLUTION: An electronic device 100 includes a substrate 20 containing a first elastomer, a relaxation member 70 containing a second elastomer, wiring 10 containing a third elastomer and a conductive filler, and a hard member 60 having an electrode 62. On the first principal surface 201 of the substrate 20, the wiring 10 and hard member 60 are provided. At least one side 104 of the first surface 601 of the hard member 60 where the electrode 62 is provided, and the wiring 10 are crossing in the plan view, and the relaxation member 70 is interposed between the side 104 and wiring 10.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device and a method for manufacturing the electronic device.

  In recent years, wearable devices that can be worn on a human body or the like have been actively developed, and in connection with this, there is a demand for improvement in functions of electronic devices using a wiring board having elasticity.

  Regarding a wiring board having stretchability, Patent Document 1 discloses that an elastomer, a conductive layer filled in the elastomer, a conductive layer, and an elastomer made to cover the conductive layer are arranged. A conductive film comprising a protective layer is disclosed. According to the description of Patent Document 1, it is shown that the conductive film is less likely to increase in electrical resistance even when stretched and is less likely to break.

JP 2010-153821 A

  However, there is an increasing demand for further downsizing the entire device, and there is a demand for further improvement in durability of electronic devices, particularly wiring.

  The present invention has been made in view of the above circumstances, and provides an electronic device having excellent durability.

According to the present invention,
A substrate comprising a first elastomer;
A relaxation member comprising a second elastomer;
A wiring comprising a third elastomer and a conductive filler;
A hard member having an electrode,
The wiring and the hard member are provided on the first main surface of the substrate,
At least one side of the first surface of the hard member on which the electrode is provided and the wiring intersect with each other in plan view,
The relaxation member is interposed between the side and the wiring,
An electronic device is provided.

According to the present invention,
Providing a substrate comprising a first elastomer;
Arranging a hard member having an electrode on the first main surface of the substrate;
Forming a relaxation member comprising a second elastomer;
Forming a wiring including a third elastomer and a conductive filler on the first main surface of the substrate,
At least one side of the first surface of the hard member on which the electrode is provided and the wiring are formed so as to intersect in plan view,
An electronic device manufacturing method is provided in which the relaxation member is formed so as to be interposed between the side and the wiring.

According to the present invention,
Providing a structure including a substrate including a first elastomer, and a hard member having an electrode and having a hard member at least partially embedded in the first main surface of the substrate;
Forming a relaxation member comprising a second elastomer;
Forming a wiring including a third elastomer and a conductive filler on the first main surface of the substrate in this order,
At least one side of the first surface of the hard member on which the electrode is provided and the wiring are formed so as to intersect in plan view,
An electronic device manufacturing method is provided in which the relaxation member is formed so as to be interposed between the side and the wiring.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device excellent in durability can be provided.

It is a figure which shows the structure of the electronic device which concerns on 1st Embodiment. It is a figure which shows the structure of the electronic device which concerns on 1st Embodiment. (A) is a figure showing an example of composition of an electronic device which does not have a relaxation member. (B) is a figure which shows the state of the electronic device which did not have a relaxation member and the fracture | rupture part produced. It is a figure which shows the structure of the electronic device which concerns on 2nd Embodiment. It is a figure which shows the structure of the electronic device which concerns on 3rd Embodiment. It is a figure which shows the structure of the electronic device which concerns on 4th Embodiment. It is a figure which shows the structure of the electronic device which concerns on 5th Embodiment. It is a figure which shows the modification of the structure of the electronic device which concerns on 5th Embodiment. It is a figure which shows the structure of the electronic device which concerns on 6th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  In addition, in the following, for the sake of simplicity of explanation, the positional relationship (vertical relationship and the like) of each component of the electronic device 100 may be described as the relationship illustrated in each drawing. However, the positional relationship in this description is irrelevant to the positional relationship when the electronic device 100 is used or manufactured.

  “˜” represents “from” to “below” unless otherwise specified.

(First embodiment)
1 and 2 are diagrams showing a configuration of the electronic device 100 according to the present embodiment. 2 is a plan view of the electronic device 100, and FIG. 1 is a cross-sectional view taken along the line AA ′ of FIG. In the following, the plan view refers to a case when viewed from a direction perpendicular to the main surface of the substrate 20.

  The electronic device 100 according to the first embodiment includes a substrate 20 including a first elastomer, a relaxation member 70 including a second elastomer, a wiring 10 including a third elastomer and a conductive filler, and a hard having an electrode 62. A member 60 is provided. The wiring 10 and the hard member 60 are provided on the first main surface 201 of the substrate 20. At least one side 104 of the first surface 601 of the hard member 60 on which the electrode 62 is provided intersects the wiring 10 in plan view, and the relaxation member 70 is between the side 104 and the wiring 10. Is intervening. Details will be described below.

  Since the substrate 20, the relaxation member 70, and the wiring 10 according to the present embodiment all include an elastomer, they each have elasticity, and the electronic device 100 is suitably used as a flexible device, particularly a wearable device.

  In the present embodiment, the hard member 60 is a member having a higher hardness than both the substrate 20 and the wiring 10, and is, for example, an electronic component or a connector. What is necessary is just to select suitably from well-known components as an electronic component according to a use. Specifically, a semiconductor element, a resistor other than the semiconductor element, a capacitor, and the like can be given. Examples of semiconductor elements include transistors, diodes, LEDs, capacitors, and the like. The hard member 60 is disposed on the substrate 20.

  An electrode 62 is provided on the first surface 601 of the hard member 60, and the wiring 10 is connected to the electrode 62. The hard member 60 is electrically connected to other electronic components, connectors, and the like (not shown) in the electronic device 100 via the wiring 10 to form a circuit and the like. In the electronic device 100 according to the present embodiment, as shown in FIGS. 1 and 2, the electrode 62 is formed only on the first surface 601 of the hard member 60, and the other surface of the hard member 60 is made of an insulating material. ing. However, the electrode 62 may be formed on a plurality of surfaces of the hard member 60. The wiring 10 is formed from the first main surface 201 of the substrate 20 to the first surface 601 of the hard member 60 in order to be connected to the electrode 62. In the example of this figure, the wiring 10 is in contact with the first main surface 201 of the substrate 20, the side surface 603 of the hard member 60, and the first surface 601 of the hard member 60.

  In the electronic device 100 according to the present embodiment, the hard member 60 has a first surface 601 and a second surface 602. The second surface 602 and the first surface 601 are opposite surfaces. In the present embodiment, the second surface 602 of the hard member 60 is approximately parallel to the first main surface 201 of the substrate 20 and faces the substrate 20. The side 104 is at least one of the sides constituting the first surface 601 of the hard member 60.

  FIG. 2 shows an example in which a plurality of electrodes 62 are provided on the hard member 60, a plurality of wirings 10 intersect each other at the side 104, and the wirings 10 are connected to the respective electrodes 62. However, the number of electrodes 62 provided on the hard member 60 is not particularly limited, and may be one.

  Here, the main surface of the substrate 20 refers to a surface constituting the main surface of the sheet-like substrate 20. The substrate 20 has a first main surface 201 and a second main surface 202. The first main surface 201 and the second main surface 202 are surfaces opposite to each other. In the electronic device 100, the hard member 60 only needs to be provided on at least one main surface of the substrate 20. That is, the hard member 60 may be provided not only on the first main surface 201 of the substrate 20 but also on the second main surface 202.

The electronic device 100 according to the present embodiment has excellent durability by including the relaxation member 70.
FIG. 3A is a diagram illustrating a configuration example of an electronic device having no relaxation member. FIG. 3B is a diagram illustrating a state of the electronic device that does not have the relaxing member and in which the fracture portion 812 is generated. In the electronic device, it is necessary to connect the wiring 810 to the electrode 862 of the hard member 860 such as an electronic component disposed on the substrate 820. The wiring 810 extends from the stretchable substrate 820 to the hard member 860 having no stretchability. Formed over. Here, when the electronic device is used, forces such as a tensile force, a compressive force, and a bending stress are applied as indicated by arrows in the drawing, and the substrate 820 and the wiring 810 are expanded and contracted, curved, and the like accordingly. On the other hand, since the hard member 860 does not follow such deformation, a relatively large force is applied to the wiring 810 at the boundary between the substrate 820 and the hard member 860. When the wiring 810 intersects the corner α of the hard member 860 as shown in FIG. 3A, the thickness of the wiring 810 is often relatively thin at the corner α. Therefore, as shown in FIG. 3B, there is a problem that a broken portion 812 is generated in the wiring 810 and the electrical connection between the wiring 810 and the electrode 862 is impaired.

  On the other hand, returning to FIG. 1, in the electronic device 100 according to the present embodiment, the side 104 is covered with the elastic relaxation member 70, so that the stress in the wiring 10 can be relaxed and the breakage of the wiring 10 can be suppressed. . As a result, the electronic device 100 with excellent durability can be realized.

  The thickness of the substrate 20 is preferably 0.5 μm or more, and more preferably 10 μm or more, from the viewpoint of the balance between stretchability and durability. Further, from the same viewpoint, it is preferably 3000 μm or less, and more preferably 1000 μm or less.

In the electronic device 100 according to the present embodiment, when the hardness of the substrate 20 is H _b , the hardness of the wiring 10 is H _l , the hardness of the hard member 60 is H _h , and the hardness of the relaxation member 70 is H _r , for example, H The relationship _b <H ₁ <H _h and H _r <H ₁ is established. That is, when the substrate 20 is softer than the wiring 10, the relaxation member 70 softer than the wiring 10 can be used effectively. Here, each hardness can be measured by durometer A at 25 ° C.

  In the present embodiment, the width of the wiring 10 is not particularly limited and can be set as appropriate. The wiring width is, for example, 0.1 mm or more, and more preferably 0.3 mm or more. By doing so, high electrical conductivity is obtained. Further, the width of the wiring 10 is, for example, 5 mm or less, preferably 2 mm or less, more preferably 1 mm or less, and further preferably 0.8 mm or less. By doing so, the electronic device can be miniaturized. Since the electronic device 100 according to this embodiment includes the relaxation member 70, even when the wire is thinned, the electronic device 100 suppresses breakage and is excellent in durability.

  Further, the thickness of the wiring 10 is not particularly limited and can be set as appropriate. The thickness of the wiring 10 is, for example, 100 μm or more, and more preferably 200 μm or more. By doing so, high electrical conductivity is obtained. Moreover, the thickness of the wiring 10 is, for example, 1 mm or less, more preferably 500 μm or less, and further preferably 300 μm or less. By doing so, the electronic device 100 can be miniaturized. Since the electronic device 100 according to this embodiment includes the relaxation member 70, even when the thickness of the wiring 10 is reduced, the breakage is suppressed and the durability is excellent.

  Here, the width and thickness of the wiring 10 are average values measured in a region where the width and thickness of the wiring 10 are approximately constant at a position sufficiently separated from the hard member 60 on the first main surface 201. Say.

  2 shows an example in which independent relaxation members 70 are provided for each of the plurality of wirings 10, but the present invention is not limited to this. One continuous relaxation member 70 may be provided for the plurality of wirings 10. Further, the relaxation member 70 may be provided so as to cover at least the portion of the side 104 where the wiring 10 intersects. Other portions may be provided with the relaxation member 70 or may not be provided.

  Further, the relaxing member 70 may be further provided between the substrate 20 and the wiring 10 in at least a part of the region, not only between the hard member 60 and the wiring 10.

  The board | substrate 20, the relaxation member 70, and the wiring 10 which concern on this embodiment are comprised by the resin composition containing a 1st, 2nd, and 3rd elastomer, respectively. Below, each resin composition is demonstrated.

  As the first and second elastomers, for example, silicone rubber, fluorine rubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, ethylene propylene rubber, urethane rubber and the like can be used. Among these, it is preferable to include silicone rubber because it is excellent in stretchability, heat resistance and chemical stability and has biocompatibility. Especially, it is preferable that the 1st elastomer contained in the board | substrate 20 contains silicone rubber especially. Since the electronic device 100 according to the present embodiment includes the relaxation member 70, even when the first elastomer includes silicone rubber and the stretchability is high, damage to the wiring is suppressed and high durability can be ensured.

  The first elastomer, the second elastomer, and the third elastomer may all be the same, or only two of them may be the same, or all may be different from each other.

  An example in which the substrate 20 and the relaxation member 70 according to the present embodiment are formed of a silicone rubber-based curable composition containing silicone rubber as the first and second elastomers will be described below.

(Elastomer (A))
The silicone rubber-based curable composition contains silicone rubber as the elastomer (A).

As the silicone rubber, for example, one having a siloxane structure in the molecule is used.
In the present embodiment, among such silicone rubbers, a silicone rubber obtained by crosslinking a vinyl group-containing linear organopolysiloxane (A-1) with an organohydrogenpolysiloxane (A-2) is preferably used. It is done.

<Vinyl group linear-containing organopolysiloxane (A-1)>
The vinyl group linear-containing organopolysiloxane (A-1) has a linear structure and contains a vinyl group, and this vinyl group becomes a crosslinking point at the time of curing.

  The vinyl group content of this vinyl group-containing linear organopolysiloxane (A-1) is not particularly limited, but it has two or more vinyl groups in the molecule, and the vinyl group content is 15 mol. % Or less is preferable, and 0.01 to 12 mol% is more preferable. Thereby, the quantity of the vinyl group in vinyl group containing linear organopolysiloxane (A-1) is optimized, and formation of a network with each component can be performed reliably.

  In addition, in this specification, content of a vinyl group is the mol of a vinyl group containing siloxane unit when all the units which comprise a vinyl group containing linear organopolysiloxane (A-1) are 100 mol%. %. However, the calculation is performed assuming that one vinyl group-containing siloxane unit has one vinyl group.

  The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A-1) is not particularly limited, but is preferably in the range of 3000 to 10000, more preferably 3000 to 8000.

  Furthermore, the specific gravity of the vinyl group-containing linear organopolysiloxane (A-1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

  By using a vinyl group-containing linear organopolysiloxane (A-1) having a polymerization degree and specific gravity within the above ranges, heat resistance and flame retardancy of the resulting silicone rubber-based curable composition Improvement in chemical properties, chemical stability, and the like.

  The vinyl group-containing linear organopolysiloxane (A-1) is particularly preferably one having a structure represented by the following formula (1).

In formula (1), R ¹ is a substituted or unsubstituted alkyl group, alkenyl group, aryl group having 1 to 10 carbon atoms, or a hydrocarbon group obtained by combining these. As a C1-C10 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. As a C1-C10 alkenyl group, a vinyl group, an allyl group, a butenyl group etc. are mentioned, for example, Among these, a vinyl group is preferable. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

R ² is a substituted or unsubstituted alkyl group, alkenyl group, aryl group having 1 to 10 carbon atoms, or a hydrocarbon group obtained by combining these. As a C1-C10 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

R ³ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group obtained by combining these. As a C1-C8 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group.

Furthermore, examples of the substituent for R ¹ and R ² in formula (1) include a methyl group and a vinyl group. Examples of the substituent for R ³ include a methyl group.

In the formula (1), a plurality of R ¹ are independent from each other and may be different from each other or the same. The same applies to R ² and R ³ .

  Further, m and n are the number of repeating units constituting the vinyl group-containing linear organopolysiloxane (A-1) represented by the formula (1), m is an integer of 1 to 2000, and n is 3000. It is an integer of 10000. m is preferably 1-1000, and n is preferably 3000-8000.

  Moreover, as a more specific structure of vinyl group containing linear organopolysiloxane (A-1) represented by Formula (1), what is represented, for example by following formula (1-1) is mentioned.

In formula (1-1), R ¹ and R ² are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

  Further, the vinyl group-containing linear organopolysiloxane (A-1) as described above has two or more vinyl groups in the molecule, and the vinyl group content is 0.2 mol% or less. The first vinyl group-containing linear organopolysiloxane (A-1 (a)) and the second vinyl group-containing linear organopolysiloxane (A) having a vinyl group content of 0.28 to 15 mol% -1 (b)). As the elastomer (A), a first vinyl group-containing linear organopolysiloxane (A-1 (a)) having a general vinyl group content and a second vinyl group-containing polymer having a high vinyl group content By combining with the chain organopolysiloxane (A-1 (b)), vinyl groups can be unevenly distributed, and the crosslink density can be more effectively formed in the crosslinked network of silicone rubber. it can. As a result, the tear strength of the silicone rubber can be increased more effectively. Thereby, the durability as a cured product of the silicone rubber-based curable composition can be remarkably improved.

Specifically, as the vinyl group-containing linear organopolysiloxane (A-1), for example, in the above formula (1-1), R ¹ is a vinyl group and / or R ² is a vinyl group. A first vinyl group-containing linear organopolysiloxane (A-1 (a)) having two or more units in the molecule and containing 0.2 mol% or less, a unit in which R ¹ is a vinyl group, and It is preferable to use a second vinyl group-containing linear organopolysiloxane (A-1 (b)) containing 0.28 to 15 mol% of units in which R ² is a vinyl group.

  The first vinyl group-containing linear organopolysiloxane (A-1 (a)) preferably has a vinyl group content of 0.01 to 0.15 mol%. The second vinyl group-containing linear organopolysiloxane (A-1 (b)) preferably has a vinyl group content of 0.28 to 12 mol%.

  Further, when the first vinyl group-containing linear organopolysiloxane (A-1 (a)) and the second vinyl group-containing linear organopolysiloxane (A-1 (b)) are combined and blended The ratio of (A-1 (a)) to (A-1 (b)) is not particularly limited, but usually (A-1 (a)) :( A-1 (b)) is 50 by mass ratio. : 50 to 95: 5 is preferable, and 80:20 to 90:10 is more preferable.

  Each of the first and second vinyl group-containing linear organopolysiloxanes (A-1 (a)) and (A-1 (b)) may be used alone or in combination of two or more. May be used in combination.

<Organic hydrogen polysiloxane (A-2)>
The organohydrogenpolysiloxane (A-2) includes a linear organohydrogenpolysiloxane having a linear structure (A-2 (a)) and a branched organohydrogenpolysiloxane having a branched structure (A-2 ( b)), and in this embodiment, only the linear organohydrogenpolysiloxane (A-2 (a)) may be used, or only the branched organohydrogenpolysiloxane (A-2 (b)). Alternatively, both the linear organohydrogenpolysiloxane (A-2 (a)) and the branched organohydrogenpolysiloxane (A-2 (b)) may be included.

  The straight-chain organohydrogenpolysiloxane (A-2 (a)) has a straight-chain structure and a structure in which hydrogen is directly bonded to Si (≡Si—H), and a vinyl group-containing straight-chain In addition to the vinyl group of the organopolysiloxane (A-1), it is a polymer that acts on the reactive groups of the components blended in the silicone rubber-based curable composition and crosslinks these components.

  The molecular weight of the linear organohydrogenpolysiloxane (A-2 (a)) is not particularly limited, but the weight average molecular weight is preferably 20000 or less, and more preferably 1000 or more and 10,000 or less.

  In addition, the weight average molecular weight of linear organohydrogen polysiloxane (A-2 (a)) can be measured by GPC (gel permeation chromatography).

  Moreover, it is preferable that linear organohydrogenpolysiloxane (A-2 (a)) does not have a vinyl group. Thereby, it can prevent exactly that a crosslinking reaction advances in the molecule | numerator of linear organohydrogen polysiloxane (A-2 (a)).

  As the above linear organohydrogenpolysiloxane (A-2 (a)), for example, those having a structure represented by the following formula (2) are preferably used.

In formula (2), R ⁴ represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, a hydrocarbon group combining these, or a hydride group. As a C1-C10 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. As a C1-C10 alkenyl group, a vinyl group, an allyl group, a butenyl group etc. are mentioned, for example. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

R ⁵ is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, a hydrocarbon group combining these, or a hydride group. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among them, a methyl group is preferable. As a C1-C10 alkenyl group, a vinyl group, an allyl group, a butenyl group etc. are mentioned, for example. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

In the formula (2), the plurality of R ⁴ are independent from each other and may be different from each other or the same. The same is true for R ^5. However, at least two of the plurality of R ⁴ and R ⁵ are hydride groups.

R ⁶ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group obtained by combining these. As a C1-C8 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. The plurality of R ⁶ are independent from each other and may be different from each other or the same.

In addition, as a substituent of R < ⁴ >, R < ⁵ >, R < ⁶ > in Formula (2), a methyl group, a vinyl group etc. are mentioned, for example, and a methyl group is preferable from a viewpoint of preventing the crosslinking reaction in a molecule | numerator.

  Further, m and n are the number of repeating units constituting the linear organohydrogenpolysiloxane (A-2 (a)) represented by the formula (2), m is an integer of 2 to 500, n Is an integer from 2 to 500. Preferably, m is an integer of 2 to 150, and n is an integer of 2 to 150.

  In addition, linear organohydrogen polysiloxane (A-2 (a)) may be used individually by 1 type, and may be used in combination of 2 or more type.

  Since the branched organohydrogenpolysiloxane (A-2 (b)) has a branched structure, it forms a region with a high crosslinking density, and is a component that greatly contributes to the formation of a dense structure with a crosslinking density in the system of silicone rubber. is there. Further, like the above linear organohydrogenpolysiloxane (A-2 (a)), it has a structure in which hydrogen is directly bonded to Si (≡Si—H), and contains a vinyl group-containing linear organopolysiloxane (A It is a polymer that acts on the reactive group of each component blended in the silicone rubber-based curable composition in addition to the vinyl group of -1) and crosslinks these components.

  The specific gravity of the branched organohydrogenpolysiloxane (A-2 (b)) is in the range of 0.9 to 0.95.

  Furthermore, it is preferable that the branched organohydrogenpolysiloxane (A-2 (b)) usually has no vinyl group. Thereby, it is possible to accurately prevent the crosslinking reaction from proceeding in the molecule of the branched organohydrogenpolysiloxane (A-2 (b)).

  Moreover, as branched organohydrogen polysiloxane (A-2 (b)), what is shown by the following average compositional formula (c) is preferable.

Average composition formula (c)
(H _a (R ⁷ ) _3-a SiO _1/2 ) _m (SiO _4/2 ) _n
(In the formula (c), R ⁷ is a monovalent organic group, a is an integer in the range of 1 to 3, m is the number of H _a (R ⁷ ) _3-a SiO _1/2 units, and n is SiO _{4 / 2} units).

In the formula (c), R ⁷ is a monovalent organic group, preferably a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an aryl group, or a hydrocarbon group obtained by combining these. As a C1-C10 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

  In the formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si), an integer in the range of 1 to 3, and preferably 1.

In the formula (c), m is the number of H _a (R ⁷ ) _3-a SiO _1/2 units, and n is the number of SiO _4/2 units.

  The branched organohydrogenpolysiloxane (A-2 (b)) has a branched structure. The linear organohydrogenpolysiloxane (A-2 (a)) differs from the branched organohydrogenpolysiloxane (A-2 (b)) in that the structure is linear or branched. The number of alkyl groups R bonded to Si (R / Si) when the number of is 1 is 1.8 to 2.1 for linear organohydrogenpolysiloxane (A-2 (a)), branched In the case of the organohydrogenpolysiloxane (A-2 (b)), the range is from 0.8 to 1.7.

  Since the branched organohydrogenpolysiloxane (A-2 (b)) has a branched structure, for example, a residue when heated to 1000 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere. The amount is 5% or more. On the other hand, since linear organohydrogenpolysiloxane (A-2 (a)) is linear, the amount of residue after heating on the said conditions becomes substantially zero.

  Specific examples of the branched organohydrogenpolysiloxane (A-2 (b)) include those having a structure represented by the following formula (3).

In Formula (3), R ⁷ is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, a hydrocarbon group obtained by combining these, or a hydrogen atom. As a C1-C8 alkyl group, a methyl group, an ethyl group, a propyl group etc. are mentioned, for example, Among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. Examples of the substituent for R ⁷ include a methyl group.

In formula (3), a plurality of R ⁷ are independent from each other and may be different from each other or the same.

  In Formula (3), “—O—Si≡” represents that Si has a branched structure spreading in three dimensions.

  The branched organohydrogenpolysiloxane (A-2 (b)) may be used alone or in combination of two or more.

  In the linear organohydrogenpolysiloxane (A-2 (a)) and the branched organohydrogenpolysiloxane (A-2 (b)), the amount of hydrogen atoms (hydride groups) directly bonded to Si is Each is not particularly limited. However, in this embodiment, the linear organohydrogenpolysiloxane (A-2 (a)) and the branched organo are used with respect to 1 mol of the vinyl group in the vinyl group-containing linear organopolysiloxane (A-1). The total amount of hydride groups of hydrogen polysiloxane (A-2 (b)) is preferably 0.5 to 5 mol, more preferably 1 to 3.5 mol. As a result, the linear organohydrogenpolysiloxane (A-2 (a)) and the branched organohydrogenpolysiloxane (A-2 (b)) and the vinyl group-containing linear organopolysiloxane (A-1) )), A crosslinked network can be reliably formed.

  Further, linear organohydrogenpolysiloxane (A-2 (a)) and branched organohydrogenpolysiloxane (A-2 (b)) are usually linear organohydrogenpolysiloxane (A- 2 (a)) is contained as the main agent, and the branched organohydrogenpolysiloxane (A-2 (b)) is added when forming a region having a higher crosslink density in the silicone rubber as described above. . Therefore, when a combination of a linear organohydrogenpolysiloxane (A-2 (a)) and a branched organohydrogenpolysiloxane (A-2 (b)) is combined (A-2 (a)) And (A-2 (b)) is preferably (A-2 (a)) :( A-2 (b)) in a weight ratio of 1: 0.1 to 1: 1, more preferably It is set to 1: 0.2 to 1: 0.5.

In the present embodiment, the content of the elastomer (A) in the silicone rubber-based curable composition is preferably 30% by mass or more with respect to the entire solid content of the silicone rubber-based curable composition, and is 50% by mass. % Or more is more preferable, and it is further more preferable that it is 55 mass% or more. The content of the elastomer (A) in the silicone rubber-based curable composition is preferably 95% by mass or less and 93% by mass or less based on the entire solid content of the silicone rubber-based curable composition. More preferably, it is more preferably 90% by mass or less.
By making content of an elastomer (A) more than the said lower limit, the hardened | cured material of a silicone rubber type curable composition can have moderate softness | flexibility. Moreover, improvement of the mechanical strength of hardened | cured material can be aimed at by making content of an elastomer (A) below into the said upper limit.
In the present specification, the term “solid content” refers to the entire component from which volatile components such as water and organic solvents have been removed. Add up as solids.
Hereinafter, the same applies to each component.

(Silica particles (B))
The silicone rubber-based curable composition of the present embodiment may contain silica particles (B) as necessary. By including the silica particles (B), it is possible to improve the hardness and mechanical strength of the cured product formed from the silicone rubber-based curable composition.

The silica particles (B) preferably have a specific surface area of 10 to 400 m ² / g, and more preferably ^{20 to} 400 m ² / g. Further, it is preferred that the median diameter _{D 50} is 1 to 100 nm, more preferably 5 to 20 nm.

By using what is in the range of this specific surface area and median diameter as a silica particle (B), the function as a silica particle (B) mentioned above can be exhibited notably.
The silica particles (B) have a particle size of, for example, 200 silicone particles selected arbitrarily by observing the silicone rubber-based curable composition or the cured product with a transmission electron microscope or the like and performing image analysis. It can be defined as an average value.

Although it does not specifically limit as a silica particle (B), For example, fumed silica, baked silica, precipitated silica, etc. can be used.
In addition, a silica particle (B) may be used individually by 1 type, and may be used in combination of 2 or more type.

In the present embodiment, the content of the silica particles (B) in the silicone rubber-based curable composition is such that the silicone rubber-based curable composition contains a vinyl group-containing linear organopolysiloxane (A-1). The amount is preferably 5 parts by weight or more, more preferably 10 parts by weight or more, and more preferably 20 parts by weight or more with respect to 100 parts by weight of the vinyl group-containing linear organopolysiloxane (A-1). Further preferred. The content of the silica particles (B) in the silicone rubber-based curable composition is such that the silicone rubber-based curable composition contains a vinyl group when the silicone rubber-based curable composition contains a vinyl group-containing linear organopolysiloxane (A-1). The amount is preferably 100 parts by weight or less, more preferably 80 parts by weight or less, and still more preferably 70 parts by weight or less with respect to 100 parts by weight of the linear organopolysiloxane (A-1).
By setting the content of the silica particles (B) to the above lower limit value or more and the upper limit value or less, the cured product of the silicone rubber-based curable composition can have an appropriate mechanical strength.

(Silane coupling agent (C))
The silicone rubber-based curable composition of the present embodiment may contain a silane coupling agent (C). The silane coupling agent (C) has a hydrolyzable group, and the hydrolyzable group is hydrolyzed with water to form a hydroxyl group, and this hydroxyl group dehydrates and condenses with the hydroxyl group on the surface of the silica particles (B). By doing so, the surface modification | reformation of a silica particle (B) can be performed.
In addition, even when the silica particles (B) are not present, the effect of improving the mutual adhesion of the wiring 10, the substrate 20, and the relaxing member 70 can be exhibited.

  Moreover, what has a hydrophobic group can be used for this silane coupling agent (C). Thereby, since this hydrophobic group is imparted to the surface of the silica particles (B), the cohesive force of the silica particles (B) is reduced in the silicone rubber-based curable composition, and as a result, in the composition The dispersibility of the silica particles is improved. Thereby, the mechanical strength of the cured product of the silicone rubber-based curable composition is further improved.

Furthermore, the silane coupling agent (C) preferably has a vinyl group. Thereby, when using silica particle (B), a vinyl group is introduce | transduced into the surface.
Thereby, for example, when the vinyl group-containing linear organopolysiloxane (A-1) and the organohydrogenpolysiloxane (A-2) are included as the elastomer (A), the following effects are exhibited. .
That is, when the silicone rubber-based curable composition is cured, that is, the vinyl group of the vinyl group-containing linear organopolysiloxane (A-1) and the hydride group of the organohydrogenpolysiloxane (A-2). And the hydrosilylation reaction to form a network (crosslinked structure) of these, the vinyl group of the silica particles (B) is also hydrosilylated with the hydride group of the organohydrogenpolysiloxane (A-2). Since it is involved in the crystallization reaction, the silica particles (B) are also taken into the network. Thereby, high hardness and high modulus of the hardened | cured material formed can be achieved.

  As such a silane coupling agent (C), what is represented by following formula (4) is mentioned, for example.

_{Y n -Si- (X) 4-} n ··· (4)
In said formula (4), n represents the integer of 1-3. Y represents a functional group of any one having a hydrophobic group, a hydrophilic group or a vinyl group. When n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of them is a hydrophobic group. It is a hydrophobic group. X represents a hydrolyzable group.

  The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group that is a combination thereof, and examples thereof include a methyl group, an ethyl group, a propyl group, and a phenyl group. A methyl group is preferred.

  Examples of the hydrophilic group include a hydroxyl group, a sulfonic acid group, a carboxyl group, and a carbonyl group. Among these, a hydroxyl group is particularly preferable. The hydrophilic group may be included as a functional group, but is preferably not included from the viewpoint of imparting hydrophobicity to the silane coupling agent (C).

Furthermore, examples of the hydrolyzable group include an alkoxy group such as a methoxy group and an ethoxy group, a chloro group, and a silazane group. Incidentally, those having a silazane group as hydrolyzable groups, the characteristics of its structure the formula (4) in the structure of (Y _n -Si-) comes to have two.

  Specific examples of the silane coupling agent (C) represented by the above formula (4) include, for example, those having a hydrophobic group as a functional group, such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltrimethoxysilane. Alkoxysilanes such as ethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane; methyltrichlorosilane Chlorosilanes such as dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; hexamethyldisilazane, and methacryloxypropyltriethoxysilane having a vinyl group as a functional group. , Alkoxysilanes such as methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane; vinyltrichlorosilane, vinylmethyl Chlorosilanes such as dichlorosilane; divinyltetramethyldisilazane can be mentioned. Among them, considering the above description, hexamethyldisilazane having a hydrophobic group and divinyltetramethyl having a vinyl group are particularly preferable. Disilazane is preferred.

In the present embodiment, the content of the silane coupling agent (C) in the silicone rubber-based curable composition is 5 parts by weight or more with respect to 100 parts by weight of the vinyl group-containing linear organopolysiloxane (A-1). The amount is preferably 100 parts by weight or less, and more preferably 5 parts by weight or more and 40 parts by weight or less.
By setting the content of the silane coupling agent (C) to the above lower limit value or more and the upper limit value or less, the wiring 10, the substrate 20, and the relaxation member 70 have appropriate adhesion to each other, and the silica particles (B) When used, it can contribute to the improvement of the mechanical strength of the cured product as a whole.

(Platinum or platinum compound (D))
The silicone rubber-based curable composition of the present embodiment can contain platinum or a platinum compound (D).
Platinum or a platinum compound (D) is a component that acts as a catalyst for curing the silicone rubber-based curable composition of the present embodiment.

As the platinum or platinum compound (D), known ones can be used. For example, platinum black, platinum supported on silica or carbon black, chloroplatinic acid or chloroplatinic acid alcohol solution, chloride Examples thereof include complex salts of platinum acid and olefins, complex salts of chloroplatinic acid and vinyl siloxane, and the like.
In addition, platinum or a platinum compound (D) may be used individually by 1 type, and may be used in combination of 2 or more type.

In the present embodiment, the content of platinum or the platinum compound (D) in the silicone rubber-based curable composition is 0.01 ppm or more with respect to the weight of the entire solid content of the silicone rubber-based curable composition. It is preferably 0.05 ppm or more, more preferably 0.1 ppm or more. The content of platinum or platinum compound (D) in the silicone rubber-based curable composition is preferably 1000 ppm or less, based on the weight of the entire solid content of the silicone rubber-based curable composition, and is 700 ppm. More preferably, it is more preferably 500 ppm or less.
By setting the content of platinum or the platinum compound (D) to the above lower limit value or more, the silicone rubber-based curable composition can be cured at an appropriate speed. Moreover, by making content of platinum or a platinum compound (D) below the said upper limit, it can contribute to the reduction of the cost at the time of producing a silicone rubber type curable composition.

(Water (E))
Moreover, water (E) may be contained in the electroconductive composition of this embodiment.
Thereby, the above-mentioned silane coupling agent (C) is hydrolyzed, and it becomes easy to express a desired effect.
The amount of water (E) added is arbitrary.

(Other ingredients)
Furthermore, the silicone rubber-based curable composition of the present embodiment may contain known components blended in the resin composition in addition to the components (A) to (E). Examples thereof include diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica. In addition, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, thermal conductivity improvers, and the like can be appropriately blended.
In addition, a reaction inhibitor can be appropriately added from the viewpoint of controlling the curability of the silicone rubber-based curable composition.

(Method for producing silicone rubber-based curable composition)
Then, the manufacturing method of the silicone rubber-type curable composition which concerns on this embodiment is demonstrated.
The silicone rubber-based curable composition of the present embodiment can be manufactured, for example, through the following steps.

  [1] First, a predetermined amount of vinyl group-containing linear organopolysiloxane (A-1), silica particles (B), and silane coupling agent (C) are weighed, and then, by an arbitrary kneading apparatus, By kneading, a kneaded product containing these components is obtained.

  This kneaded product is obtained by kneading the vinyl group-containing linear organopolysiloxane (A-1) and the silane coupling agent (C) in advance, and then kneading (mixing) the silica particles (B). Is preferred. Thereby, the dispersibility of a silica particle (B) improves more.

  Moreover, when obtaining this kneaded material, you may make it add water (E) to each component as needed.

  Here, the kneading of each component is preferably performed through a first step of heating at a first temperature and a second step of heating at a second temperature. Thereby, the surface of the silica particles (B) can be surface-treated with the silane coupling agent (C) in the first step, and the silica particles (B) and the silane coupling agent (C) in the second step. By-products produced by the reaction with can be reliably removed from the kneaded product.

  The first temperature is preferably about 40 to 120 ° C, and more preferably about 60 to 90 ° C. The second temperature is preferably about 130 to 210 ° C, and more preferably about 160 to 180 ° C.

  The atmosphere in the first step is preferably an inert atmosphere such as a nitrogen atmosphere, and the atmosphere in the second step is preferably a reduced pressure atmosphere.

  Furthermore, the time of the first step is preferably about 0.3 to 1.5 hours, and more preferably about 0.5 to 1.2 hours. The time for the second step is preferably about 0.7 to 3.0 hours, and more preferably about 1.0 to 2.0 hours.

  By setting the first step and the second step as described above, the effect can be obtained more remarkably.

  [2] Next, a predetermined amount of organohydrogenpolysiloxane (A-2) and platinum or platinum compound (D) were weighed, and then prepared in the above step [1] using an arbitrary kneading apparatus. A silicone rubber-based curable composition is obtained by kneading these components in the kneaded product.

  When kneading each component, the kneaded material prepared in advance in the step [1] and the organohydrogenpolysiloxane (A-2) are mixed with the kneaded material prepared in the step [1] and platinum or It is preferable to knead the platinum compound (D) and then knead each kneaded product. Thereby, each component can be reliably dispersed.

In this step [2], the temperature at the time of kneading is preferably about 10 to 70 ° C., more preferably about 25 to 30 ° C. as the roll setting temperature.
Furthermore, the kneading time is preferably about 5 minutes to 1 hour, and more preferably about 10 to 40 minutes.

  The kneading apparatus used in each of the steps [1] and [2] is not particularly limited, and for example, a kneader, two rolls, a Banbury mixer (continuous kneader), a pressure kneader, or the like can be used.

  In this step [2], a reaction inhibitor such as 1-ethynyl-1-cyclohexanol may be added to the kneaded product. Thereby, even if the temperature of the kneaded product is set to a relatively high temperature, the progress of the reaction of each component can be prevented or suppressed more accurately.

  A solution obtained by adding a solvent to the silicone rubber-based curable composition obtained as described above as necessary can be used as a resin composition for forming a relaxation member.

Specific examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, and tetradecane; benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride. Aromatic hydrocarbons such as: diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, tetrahydrofuran Ethers such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1 Examples include haloalkanes such as 1,1-trichloroethane and 1,1,2-trichloroethane; carboxylic acid amides such as N, N-dimethylformamide and N, N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide can do.
One of these solvents may be used alone, or two or more solvents may be mixed at an arbitrary ratio.

  The wiring 10 which concerns on this embodiment is comprised by the conductive resin composition containing a 3rd elastomer. As this third elastomer, for example, silicone rubber, fluorine rubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, ethylene propylene rubber, urethane rubber and the like can be used. Among these, it is preferable to contain silicone rubber from the viewpoint of being excellent in chemical stability and mechanical strength and from the viewpoint of improving stretchability. In that case, even if a large amount of conductive filler is contained, good stretchability and the like can be ensured, so that the wiring 10 having excellent conductivity can be formed. The conductive resin composition may be obtained by adding a conductive filler to the silicone rubber-based curable composition constituting the substrate 20 or the relaxation member 70.

  The conductive resin composition will be described below by taking as an example the case where the third elastomer contains silicone rubber.

(Elastomer (A))
As the elastomer (A) contained in the conductive resin composition, those exemplified as the elastomer (A) contained in the silicone rubber-based curable composition can be used. Also, preferable conditions are the same as those of the elastomer (A) contained in the silicone rubber-based curable composition except for the points described below.

In the present embodiment, the content of the elastomer (A) in the conductive resin composition is preferably 3% by mass or more, and preferably 5% by mass or more with respect to the entire solid content of the conductive resin composition. More preferably, it is more preferably 7% by mass or more. Moreover, it is preferable that content of the elastomer (A) in a conductive resin composition is 30 mass% or less with respect to the whole solid content of a conductive resin composition, and it is more preferable that it is 25 mass% or less. Preferably, it is 20 mass% or less.
By making content of an elastomer (A) more than the said lower limit, the hardened | cured material of a conductive resin composition can have moderate softness | flexibility. Moreover, improvement of the mechanical strength of hardened | cured material can be aimed at by making content of an elastomer (A) below into the said upper limit.

(Silica particles (B))
The conductive resin composition of the present embodiment may contain silica particles (B) as necessary. By including the silica particles (B), it is possible to improve the hardness and mechanical strength of a cured product formed from the conductive resin composition. As the silica particles (B) contained in the conductive resin composition, those exemplified as the silica particles (B) contained in the silicone rubber-based curable composition can be used. Moreover, also about preferable conditions, except the point demonstrated below, it is the same as the silica particle (B) contained in a silicone rubber-type curable composition.

In this embodiment, it is preferable that content of the silica particle (B) in a conductive resin composition is 1 mass% or more with respect to the whole solid content of a conductive resin composition, and it is 2 mass% or more. More preferably, it is more preferably 3% by mass or more. Moreover, it is preferable that content of the silica particle (B) in a conductive resin composition is 15 mass% or less with respect to the whole solid content of a conductive resin composition, and it is 12 mass% or less. More preferably, it is more preferably 10% by mass or less.
By making content of a silica particle (B) more than the said lower limit and below an upper limit, the hardened | cured material of an electroconductive resin composition can have moderate mechanical strength. Moreover, hardened | cured material can have a moderate electroconductive characteristic by making content of a silica particle (B) below into the said upper limit.

(Silane coupling agent (C))
The conductive resin composition of the present embodiment may contain a silane coupling agent (C). The silane coupling agent (C) has a hydrolyzable group, and the hydrolyzable group is hydrolyzed with water to form a hydroxyl group, and this hydroxyl group dehydrates and condenses with the hydroxyl group on the surface of the silica particles (B). By doing so, the surface modification | reformation of a silica particle (B) can be performed.
In addition, even when the silica particles (B) are not present, the effect of improving the adhesion between the wiring 10 and the substrate 20 and the relaxing member 70 can be exhibited.
As the silane coupling agent (C) contained in the conductive resin composition, those exemplified as the silane coupling agent (C) contained in the silicone rubber-based curable composition can be used. Also, preferable conditions are the same as the silane coupling agent (C) contained in the silicone rubber-based curable composition except for the points described below.

In the present embodiment, the content of the silane coupling agent (C) in the conductive resin composition is preferably 0.1% by mass or more based on the entire solid content of the conductive resin composition. It is more preferably 3% by mass or more, and further preferably 0.5% by mass or more. Moreover, it is preferable that content of the silane coupling agent (C) in a conductive resin composition is 5 mass% or less with respect to the whole solid content of a conductive resin composition, and is 4 mass% or less. More preferred is 3% by mass or less.
By setting the content of the silane coupling agent (C) to the above lower limit value or more and the upper limit value or less, the wiring 10 has appropriate adhesion to the relaxation member 70 and the substrate 20, and the silica particles (B) are used. In some cases, it can contribute to the improvement of the mechanical strength of the entire cured product. Moreover, the wiring 10 which is hardened | cured material can have a moderate electroconductive characteristic by making content of a silane coupling agent (C) below into the said upper limit.

(Platinum or platinum compound (D))
The conductive resin composition of this embodiment can contain platinum or a platinum compound (D).
Platinum or a platinum compound (D) is a component that acts as a catalyst for curing the conductive resin composition of the present embodiment. As platinum or platinum compound (D) contained in the conductive resin composition, those exemplified as platinum or platinum compound (D) contained in the silicone rubber-based curable composition can be used. Moreover, also about preferable conditions, except the point demonstrated below, it is the same as the platinum or platinum compound (D) contained in a silicone rubber-type curable composition.

In the present embodiment, the content of platinum or the platinum compound (D) in the conductive resin composition is preferably 0.001 ppm or more with respect to the weight of the entire solid content of the conductive resin composition. It is more preferably 0.005 ppm or more, and further preferably 0.01 ppm or more. In addition, the content of platinum or the platinum compound (D) in the conductive resin composition is preferably 2000 ppm or less, and preferably 1000 ppm or less, based on the weight of the entire solid content of the conductive resin composition. Is more preferable, and it is further more preferable that it is 500 ppm or less.
By setting the content of platinum or the platinum compound (D) to the above lower limit value or more, the conductive resin composition can be cured at an appropriate speed. Moreover, it can contribute to the reduction of the cost at the time of producing a conductive resin composition by making content of platinum or a platinum compound (D) below the said upper limit.

(Water (E))
Moreover, water (E) may be contained in the electroconductive composition of this embodiment.
Thereby, the above-mentioned silane coupling agent (C) is hydrolyzed, and it becomes easy to express a desired effect.
The amount of water (E) added is arbitrary.

(Conductive filler)
The conductive resin composition of this embodiment contains a conductive filler.
The conductive filler is not particularly limited. For example, among copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, or metal powders obtained by alloying these, conductive organic compounds, and conductive carbon materials. At least one of these, or two or more of these may be included.

Among these, it is preferable that the conductive filler contains silver or copper, that is, contains silver powder or copper powder from the viewpoint of high conductivity and high availability.
These conductive fillers can be coated with other kinds of metals.

  In the present embodiment, the shape of the conductive filler is not limited, but conventionally used ones such as a dendritic shape, a spherical shape, and a flake shape can be used.

In the present embodiment, the content of the conductive filler in the conductive resin composition is preferably 60% by mass or more, and 65% by mass or more based on the entire solid content of the conductive resin composition. Is more preferable, and it is still more preferable that it is 70 mass% or more. In addition, the content of the conductive filler in the conductive resin composition is preferably 90% by mass or less, more preferably 88% by mass or less, based on the entire solid content of the conductive resin composition. More preferably, it is 85 mass% or less.
By making content of an electroconductive filler more than the said lower limit, the hardened | cured material of an electroconductive resin composition can have a moderate electroconductive characteristic. Moreover, hardened | cured material can have moderate softness | flexibility by making content of an electroconductive filler below the said upper limit.

(Other ingredients)
Furthermore, the conductive resin composition of the present embodiment may contain known components blended in the resin composition in addition to the components (A) to (E). Examples thereof include diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica. In addition, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, thermal conductivity improvers, and the like can be appropriately blended.
In addition, a reaction inhibitor can be appropriately added from the viewpoint of controlling the curability of the conductive resin composition.

(Method for producing conductive resin composition)
Then, the manufacturing method of the conductive resin composition which concerns on this embodiment is demonstrated.
The conductive resin composition of the present embodiment can be produced, for example, through the following steps.

  First, a silicone-based curable composition is obtained in the same manner as in steps [1] and [2] of the method for producing a silicone-based curable composition described above. The preferable conditions in each step of the method for producing a conductive resin composition are the same as those described in the method for producing a silicone-based curable composition.

A conductive resin composition can be obtained by dissolving the obtained silicone rubber-based curable composition in a solvent and adding a conductive filler.
What is necessary is just to select the solvent used here suitably from the solvent which can melt | dissolve thru | or disperse | distribute said compound uniformly.

Specific examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, and tetradecane; benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride. Aromatic hydrocarbons such as: diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, tetrahydrofuran Ethers such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1 Examples include haloalkanes such as 1,1-trichloroethane and 1,1,2-trichloroethane; carboxylic acid amides such as N, N-dimethylformamide and N, N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide can do.
One of these solvents may be used alone, or two or more solvents may be mixed at an arbitrary ratio.

  In this embodiment, the method for producing a conductive resin composition using a silicone rubber-based curable resin composition has been described. However, the present invention is not limited to this, and a known method may be used depending on the type of elastomer used. It can be used as appropriate.

  For example, when urethane rubber is used as the third elastomer, a conductive resin composition can be produced by adding a conductive filler to an aqueous dispersion of urethane elastomer particles.

  When a plurality of the wiring 10, the substrate 20, and the relaxation member 70 are formed using a silicone rubber-based curable composition, the silicone rubber-based curable composition used for each component has the same composition. Alternatively, the compositions may be different from each other.

  Of the first elastomer, the second elastomer, and the third elastomer, at least one preferably contains a cross-linked product (a) of the vinyl group-containing linear organopolysiloxane (A-1). The first elastomer preferably contains a crosslinked product (a) of a vinyl group-containing linear organopolysiloxane (A-1). Moreover, it is more preferable that the first elastomer, the second elastomer, and the third elastomer all contain a cross-linked product (a) of the vinyl group-containing linear organopolysiloxane (A-1).

  Further, the crosslinked product (a) is more preferably a crosslinked product of a vinyl group-containing linear organopolysiloxane (A-1) and an organohydrogenpolysiloxane (A-2).

  In addition, it is preferable that at least one of the first elastomer, the second elastomer, and the third elastomer includes silica particles (B), and the first elastomer, the second elastomer, and the third elastomer. It is more preferable that all contain silica particles (B).

Moreover, the resistivity of the wiring 10 in the non-stretched state according to the present embodiment can be set by adjusting the above composition. The resistivity is, for example, 1 × 10 ⁻² Ω · cm or less, and more preferably 5 × 10 ⁻³ Ω · cm or less. The resistivity is, for example, 1 × 10 ⁻⁶ Ω · cm or more. By doing so, it is possible to improve the reliability of the electronic device 100 and to save energy. The resistivity can be measured as follows, for example. That is, first, the resistance value between the electrode provided on the hard member 60 and the electrode pad provided on the wiring 10 is measured. Then, the measured resistance value is multiplied by a cross-sectional area perpendicular to the length direction of the wiring pattern between the electrode and the electrode pad, and further divided by the value of the length of the wiring pattern between the electrode and the electrode pad. And get the resistivity.

A method for manufacturing the electronic device 100 according to the present embodiment will be described below.
The manufacturing method includes a step of preparing the substrate 20 including the first elastomer, a step of disposing the hard member 60 having the electrode 62 on the first main surface 201 of the substrate 20, and the relaxing member 70 including the second elastomer. Forming the wiring 10 including the third elastomer and the conductive filler. In the step of forming the wiring 10, the wiring 10 is formed on the first main surface 201 of the substrate 20. In addition, at least one side 104 of the first surface 601 of the hard member 60 on which the electrode 62 is provided and the wiring 10 are formed so as to intersect with each other in plan view. Further, the relaxation member 70 is formed so as to be interposed between the side 104 and the wiring 10. Details will be described below.

  First, in the step of preparing the substrate 20, the above-described silicone rubber-based curable composition is hot-pressed in a mold to form a sheet. In this hot press, for example, the heating temperature can be 100 ° C. or more and 250 ° C. or less, the pressure can be 0.5 MPa or more and 20 MPa or less, and the hot press time can be 1 minute or more and 30 minutes or less. Moreover, after shaping | molding by hot press, it can post-bake (secondary hardening) at 200 degreeC for 1-4 hours.

  Next, in the step of disposing the hard member 60, the hard member 60 is disposed on the first main surface 201 of the substrate 20 and fixed by bonding with an adhesive composition or an adhesive. As the bonding composition, for example, a solution can be used by adding a solvent to the uncured silicone rubber-based curable composition.

  Next, in the step of forming the relaxing member 70, the relaxing member 70 is selectively formed in a portion of the side 104 that intersects the wiring 10. The relaxing member 70 can be formed using the above-described resin composition for forming a relaxing member. Specifically, for example, after a step of selectively improving adhesion to a region serving as a base on which the relaxation member 70 is formed, a resin composition for forming the relaxation member is applied to a necessary region. Can be selectively applied. Examples of the step of improving the adhesion include application of an adhesion assistant or surface roughening that exhibits an anchor effect. Moreover, you may selectively apply | coat the resin composition for relaxation member formation to a required area | region using a mask or dispenser. In that case, the step of improving the adhesiveness is not necessarily performed. Thereafter, the relaxing member 70 can be formed by performing heat treatment at a heating temperature of, for example, 100 ° C. to 250 ° C. and a heating time of 1 minute to 60 minutes.

  Next, in the step of forming the wiring 10, the wiring 20 is formed on the substrate 20 and the hard member 60 using the above-described conductive resin composition as an ink by a known method such as screen printing, ink jet printing, gravure printing, or dispenser. Print and apply the pattern. The wiring 10 is formed by heating it in an oven. At this time, the heating temperature can be, for example, 100 ° C. or more and 300 ° C. or less. Further, the heating time can be, for example, 20 minutes or longer and 30 hours or shorter. In this way, the electronic device 100 is obtained.

  In addition, the manufacturing method of the electronic device 100 is not limited to the above. For example, a wiring board provided with the wiring 10 on the first surface 601 is prepared in advance, the hard member 60 is disposed on the wiring board, the relaxation member 70 is formed, and the wiring 10 and electrodes of the wiring board are further formed. The electronic device 100 may be manufactured by forming a portion of the wiring 10 that connects to 62.

  Next, the operation and effect of this embodiment will be described. According to the present embodiment, an electronic device having excellent durability can be realized.

(Second Embodiment)
FIG. 4 is a diagram illustrating the structure of the electronic device 100 according to the second embodiment. This figure corresponds to FIG. 1 of the first embodiment. In the electronic device 100 according to the present embodiment, the cross-section (corresponding to FIG. 4) parallel to the thickness direction of the substrate 20, the intersection 105 a between the side surface 603 of the hard member 60 and the first main surface 201, and the wiring 10. In addition, the electronic device 100 is the same as the electronic device 100 according to the first embodiment except that the relaxation member 70 is interposed.

  In the electronic device 100 according to the present embodiment, not only between the side 104 and the wiring 10 but also the intersection line 105b (in the thickness direction of the substrate 20) where the first main surface 201 of the substrate 20 and the side surface 603 of the hard member 60 intersect. The relaxation member 70 is also interposed between the wiring 10 and the intersection point 105a in the parallel section). More specifically, the intersection line 105b is a line where the first main surface 201 in a region where the hard member 60 is not provided and the side surface 603 of the hard member 60 intersects, and the side 104 and the intersection line 105b are side surfaces of the hard member 60. It is on the same plane including 603. When the hard member 60 is arranged without being embedded in the substrate 20, the intersection line 105 b is one side that forms a surface of the hard member 60 that faces the substrate. Here, the relaxing member 70 only needs to be provided so as to cover at least the portion of the intersection line 105b where the wiring 10 intersects. Other portions may be provided with the relaxation member 70 or may not be provided. In the example of this figure, the relaxation member 70 covers the entire region covered with the wiring 10 in the side surface 603. That is, the relaxing member 70 is continuously formed so as to contact the first surface 601, the side surface 603, and the first main surface 201. The relaxation member 70 may cover the entire side surface 603 of the hard member 60.

  Further, the relaxing member 70 may be further provided between the substrate 20 and the wiring 10 in at least a part of the region, not only between the hard member 60 and the wiring 10.

  In this embodiment, the same operation and effect as in the first embodiment can be obtained. In addition, it is possible to more effectively reinforce the wiring at the boundary portion between the substrate and the hard member where stress is concentrated, and to further improve the durability of the electronic device.

(Third embodiment)
FIG. 5 is a diagram illustrating a structure of the electronic device 100 according to the third embodiment. This figure corresponds to FIG. 1 of the first embodiment. The electronic device 100 according to the present embodiment is the same as the electronic device 100 according to the second embodiment except that a coating layer 30 that covers the wiring 10 and has elasticity is formed.

  In principle, the conductivity of the wiring can be increased by increasing the content of the conductive filler. On the other hand, the stretchability of the wiring is reduced by increasing the content of the conductive filler. Here, when the coating layer is not provided, the wiring cannot follow the elongation of the substrate, and the wiring, particularly the surface that does not contact the stretchable substrate is cracked, and the electrical resistance of the wiring is increased. May be easily impaired.

  On the other hand, in the electronic device 100 according to the present embodiment, since the coating layer 30 is formed so as to cover the wiring 10, it is possible to follow the elongation well. Further, even if the wiring 10 is damaged due to elongation and a physical defect is formed, the force to shrink the coating layer 30 acts in the direction of closing the defect, and the increase in electrical resistance in the non-stretched state is suppressed. it can.

  The covering layer 30 preferably covers the entire wiring 10 from the viewpoint of protecting the wiring 10. Further, from the same viewpoint, it is more preferable that the covering layer 30 covers all regions except for the surface contacting the substrate 20 and the connecting portion with the electronic component 60 among all the outer surfaces of the wiring 10.

  The covering layer 30 preferably covers the entire surface of the substrate 20. If it does so, the hard member 60 and the board | substrate 20 will be protected and durability of the electronic device 100 can be improved more. Alternatively, the covering layer 30 may cover a part or the whole of the region of the substrate 20 where the wiring 10 is not formed.

  The covering layer 30 preferably contains a silicone rubber that is excellent in stretchability. Then, even if the coating layer 30 is provided, sufficient stretchability of the entire electronic device 100 can be ensured.

  A method for manufacturing the electronic device 100 according to the present embodiment will be described below. First, similarly to the first embodiment, a step of preparing the substrate 20, a step of arranging the hard member 60, a step of forming the relaxation member 70, and a step of forming the wiring 10 are performed. Thereafter, the silicone rubber-based curable composition exemplified in the first embodiment is installed as a resin composition for forming a coating layer, and the coating layer 30 is formed by heating and pressing to cure. In this heating and pressurization, the heating temperature can be, for example, 100 ° C. or more and 250 ° C. or less, the pressure can be 0.5 MPa or more and 20 MPa or less, and the heating and pressing time can be 1 minute or more and 30 minutes or less.

  The thickness of the covering layer 30 is preferably 0.05 mm or more, and more preferably 0.3 mm or more, from the viewpoint of the balance between stretchability and improvement in wiring durability. Further, from the same viewpoint, it is preferably 2 mm or less, more preferably 1 mm or less, and further preferably 0.8 mm or less. The covering layer 30 may be a single layer or a plurality of different layers.

  In this embodiment, the same operation and effect as in the first embodiment can be obtained. In addition, the durability of the electronic device can be further improved by providing the coating layer. Moreover, many conductive fillers can be contained in the wiring, and the wiring resistance can be reduced.

(Fourth embodiment)
FIG. 6 is a diagram illustrating the structure of the electronic device 100 according to the fourth embodiment. This figure corresponds to FIG. 1 of the first embodiment. The electronic device 100 according to the present embodiment is the same as the electronic device 100 according to the second embodiment except that the side surface 603 of the hard member 60 is inclined with respect to the first main surface 201.

  In the electronic device 100 according to the present embodiment, the side surface 603 between the side 104 and the intersection line 105b is not perpendicular to the first main surface 201 but is oblique. Specifically, the side surface 603 is inclined so that the width of the hard member 60 becomes wider as it approaches the substrate 20 in a cross section perpendicular to the first main surface 201. For this reason, stress concentration on the wiring 10 is unlikely to occur at the side 104 or the intersection 105b. Further, thinning of the wiring 10 at the corners of the side 104 is also suppressed.

  In the electronic device 100 according to the present embodiment, the relaxation member 70 is provided only between the side 104 and the wiring 10 as in the first embodiment, and the relaxation member is provided between the intersection line 105b and the wiring 10. 70 may not be provided.

  In this embodiment, the same operation and effect as in the first embodiment can be obtained. In addition, the stress concentration on the wiring at the boundary between the substrate and the hard member can be relaxed, and the durability of the electronic device can be further improved.

(Fifth embodiment)
FIG. 7 is a diagram illustrating a structure of an electronic device 100 according to the fifth embodiment. This figure corresponds to FIG. 1 of the first embodiment. The electronic device 100 according to the present embodiment is the same as the electronic device 100 according to the second embodiment, except that at least a part of the hard member 60 is embedded in the substrate 20.

  In the present embodiment, the second surface 602 of the hard member 60 is entirely in contact with the substrate 20, and at least a part of the side surface 603 is in contact with the substrate 20. In the electronic device 100 according to the present embodiment, since the hard member 60 is embedded in the substrate 20, the height h of the hard member 60 protruding from the first main surface 201 in the region where the hard member 60 is not provided. However, it becomes smaller than the case where it is not embedded. That is, a step generated in the base of the wiring 10 at the boundary between the substrate 20 and the hard member 60 is reduced. Therefore, the stress on the wiring 10 at the boundary portion when the substrate 20 is extended or the like is reduced. Further, thinning of the wiring 10 at the corners of the side 104 is also suppressed. Therefore, the durability of the electronic device 100 is further improved.

  FIG. 8 is a diagram illustrating a modification of the structure of the electronic device 100 according to the present embodiment. FIG. 7 shows an example in which only a part of the hard member 60 is embedded in the substrate 20, whereas in the present modification, the entire hard member 60 is embedded in the substrate 20. That is, the surface of the hard member 60 opposite to the surface facing the substrate 20 and the region of the first main surface 201 of the substrate 20 where the hard member 60 is not provided form the same plane. The hard member 60 is embedded in the substrate 20. In this modification, the second surface 602 and the side surface 603 of the hard member 60 are entirely in contact with the substrate 20. In this manner, the first surface 601 and the main surface 106 in the region where the hard member 60 is not provided form the same plane, that is, the side 104 is wired by being flush with each other. No corners as the base of 10. Therefore, the stress on the wiring 10 when the substrate 20 is extended is reduced, and the durability of the electronic device 100 is further improved. However, a slight level difference produced in manufacturing is allowed.

A method for manufacturing the electronic device 100 according to the present embodiment will be described below.
The manufacturing method includes a step of preparing a structure including a substrate 20 including a first elastomer, and a hard member 60 that includes an electrode 62 and is at least partially embedded in the first main surface 201 of the substrate 20; The step of forming the relaxing member 70 including the second elastomer and the step of forming the wiring 10 including the third elastomer and the conductive filler are included in this order. In the step of forming the wiring 10, the wiring 10 is formed on the first main surface 201 of the substrate 20. At least one side 104 of the first surface 601 provided with the electrode 62 of the hard member 60 and the wiring 10 are formed so as to intersect in plan view. The relaxation member 70 is formed so as to be interposed between the side 104 and the wiring 10. Details will be described below.

  First, in the step of preparing the structure, for example, the silicone rubber-based curable composition exemplified in the first embodiment is hot-pressed in a mold to form a semi-cured sheet. In this hot pressing, for example, the heating temperature can be 10 ° C. or higher and 40 ° C. or lower, the pressure can be 0.5 MPa or higher and 20 MPa or lower, and the hot pressing time can be 1 minute or longer and 30 minutes or shorter. Next, the hard member 60 is disposed on a semi-cured sheet and hot pressed in the stacking direction, whereby a structure in which the hard member 60 is embedded in the substrate 20 can be obtained. In this hot press, for example, the heating temperature is 100 ° C. or higher and 250 ° C. or lower, the pressure is 0.5 MPa or higher and 20 MPa or lower depending on the depth at which the hard member 60 is embedded, and the hot pressing time is 1 minute or longer and 30 minutes or shorter. Can do.

  Next, with respect to the obtained structure, the step of forming the relaxing member 70 and the step of forming the wiring 10 are the same as the step of forming the relaxing member 70 in the method for manufacturing the electronic device 100 according to the first embodiment, and the wiring The electronic device 100 is obtained by performing in the same manner as the step of forming 10.

  In this embodiment, the same operation and effect as in the first embodiment can be obtained. In addition, the stress concentration on the wiring at the boundary between the substrate and the hard member can be relaxed, and the durability of the electronic device can be further improved.

(Sixth embodiment)
FIG. 9 is a diagram illustrating a structure of an electronic device 100 according to the sixth embodiment. This figure corresponds to FIG. 1 of the first embodiment. The electronic device 100 according to the present embodiment is the same as the electronic device 100 according to the first embodiment except for the points described below.

  In the electronic apparatus 100 according to the present embodiment, the first surface 601 on which the electrode 62 of the hard member 60 is formed faces the first main surface 201 of the substrate 20. The wiring 10 is formed between the hard member 60 and the substrate 20 at a portion connected to the electrode 62. In the example of this figure, specifically, the first surface 601 is in contact with the substrate 20. In this embodiment, since the wiring 10 does not run on the first surface 601, the stress on the wiring 10 when the substrate 20 is extended is reduced, and the durability of the electronic device 100 is further improved.

  A method for manufacturing the electronic device 100 according to the present embodiment will be described below. In the manufacturing method, similarly to the manufacturing method of the electronic device 100 according to the first embodiment, the step of preparing the substrate 20 including the first elastomer, the electrode 62 on the first surface first main surface 201 of the substrate 20 are prepared. A step of disposing the hard member 60, a step of forming the relaxation member 70 including the second elastomer, and a step of forming the wiring 10 including the third elastomer and the conductive filler. In the step of forming the wiring 10, the wiring 10 is formed on the first main surface 201 of the substrate 20. In addition, at least one side 104 of the first surface 601 of the hard member 60 on which the electrode 62 is provided and the wiring 10 are formed so as to intersect with each other in plan view. Further, the relaxation member 70 is formed so as to be interposed between the side 104 and the wiring 10. Details will be described below.

  First, in the step of preparing the substrate 20, for example, the silicone rubber-based curable composition exemplified in the first embodiment is hot-pressed in a mold to form a semi-cured sheet. In this hot pressing, for example, the heating temperature can be 10 ° C. or higher and 40 ° C. or lower, the pressure can be 0.5 MPa or higher and 20 MPa or lower, and the hot pressing time can be 1 minute or longer and 30 minutes or shorter. Next, as in the first embodiment, a conductive resin composition is printed and applied onto a semi-cured sheet. Next, a structure in which the wiring 10 is embedded in the substrate 20 can be obtained by hot pressing. In this hot press, for example, the heating temperature can be 100 ° C. or more and 250 ° C. or less, the pressure can be 0.5 MPa or more and 20 MPa or less, and the hot press time can be 1 minute or more and 30 minutes or less. In this method, the step of preparing the substrate 20 and the step of forming the wiring 10 are performed simultaneously.

  Next, the step of forming the relaxation member 70 is performed in the same manner as in the first embodiment so that the relaxation member 70 is formed at a position corresponding to the side 104 of the hard member 60 on the first main surface 201 on which the wiring 10 is formed. . Thereafter, the hard member 60 is arranged on the first main surface 201 so that at least a part of the electrode 62 and the wiring 10 overlap when viewed from a direction perpendicular to the main surface of the substrate 20. At this time, for example, an adhesive composition is applied to a region other than the electrode 62 in the first surface 601 of the hard member 60. The hard member 60 is fixed to the substrate 20 by pressing the second surface 602 against the first main surface 201. Note that the hard member 60 may be disposed before performing the heat treatment in the step of forming the relaxing member 70.

  In this embodiment, the same operation and effect as in the first embodiment can be obtained. In addition, the stress concentration on the wiring at the boundary between the substrate and the hard member can be relaxed, and the durability of the electronic device can be further improved.

  Hereinafter, the present embodiment will be described in detail with reference to examples. In addition, this embodiment is not limited to description of these Examples at all.

(Example)
[Preparation of silicone rubber-based curable composition]
In this example, the materials used for preparing the silicone rubber-based curable composition are as follows.

First vinyl group-containing linear organopolysiloxane (A-1 (a)): A vinyl group-containing linear organopolysiloxane synthesized according to the following formula was used.

  That is, to a 300 mL separable flask having a cooling tube and a stirring blade substituted with Ar gas, 74.7 g (252 mmol) of octamethylcyclotetrasiloxane, 2,4,6,8-tetramethyl 2,4,6,8- 0.086 g (0.25 mmol) of tetravinylcyclotetrasiloxane and 0.1 g of potassium siliconate were added, the temperature was raised, and the mixture was stirred at 120 ° C. for 30 minutes. At this time, an increase in viscosity was confirmed.

  Thereafter, the temperature was raised to 155 ° C., and stirring was continued for 3 hours. After 3 hours, 0.1 g (0.6 mmol) of 1,3-divinyltetramethyldisiloxane was added, and the mixture was further stirred at 155 ° C. for 4 hours.

  Further, after 4 hours, the mixture was diluted with 250 mL of toluene and then washed with water three times. The washed organic layer was washed several times with 1.5 L of methanol, and purified by reprecipitation to separate the oligomer and polymer. The obtained polymer was dried under reduced pressure at 60 ° C. overnight to obtain a first vinyl group-containing linear organopolysiloxane (A-1 (a)) (vinyl group content 0.13 mol%, Mn = 277,734, Mw = 573,906, IV value (dl / g) = 0.89).

Second vinyl group-containing linear organopolysiloxane (A-1 (b)): 0.86 g (2,4,6,8-tetramethyl 2,4,6,8-tetravinylcyclotetrasiloxane) A vinyl group-containing linear organopolysiloxane synthesized in the same manner as in the above (A-1 (a)) was used except that 2.5 mmol) was used. (Vinyl group content: 0.92 mol%).

Linear organohydrogenpolysiloxane (A-2 (a)): organohydrogenpolysiloxane represented by the following formula (5) (manufactured by Performance Performance Materials LLC, trade name “88466”, formula (5) M = 14, n = 11)

Silica particles (B): manufactured by Nippon Aerosil Co., Ltd., trade name “AEROSIL300”, specific surface area: 300 m ² / g, median diameter D ₅₀ : 7 nm

Silane coupling agent (C): hexamethyldisilazane (manufactured by Gelest)

Platinum compound (D): PLATINUM DIVINYLTETRAMETHYLDISILOXAN COMPLEX (in xylen) (manufactured by Gelest, trade name “SIP6831.2”, platinum content: 2.1 to 2.4 wt%)

Water (E): Pure water

Reaction inhibitor: 1-ethynyl-1-cyclohexanol (manufactured by Tokyo Chemical Industry Co., Ltd.)

80 parts by weight of the first vinyl group-containing linear organopolysiloxane (A-1 (a)), 20 parts by weight of the second vinyl group-containing linear organopolysiloxane (A-1 (b)), 40 parts by weight of silica particles (B), 10.5 parts by weight of silane coupling agent (C), and 5.25 parts by weight of water (E) are weighed, and then a kneading apparatus (manufactured by Moriyama Co., Ltd.). And kneaded by a hydraulic pressure type kneader) to obtain a kneaded product containing these components.
The kneading here was carried out in a first step under a nitrogen atmosphere at 60 to 90 ° C. for 1 hour, and then in a second step under a reduced pressure atmosphere at 160 ° C. for 1 hour.

  Subsequently, 0.42 parts by weight of the linear organohydrogenpolysiloxane (A-2 (a)), 0.05 parts by weight of the platinum compound (D), and reaction inhibitor with respect to 100 parts by weight of the kneaded product. 0.1 parts by weight were weighed, and these components were further added to the kneaded product obtained above and kneaded using a kneading apparatus (manufactured by Kansai Roll Co., Ltd., roll machine). As a result, a silicone rubber-based composition 1 was obtained as a silicone rubber-based curable composition. At this time, the platinum content in the silicone rubber-based curable composition is 10 to 13 ppm with respect to the weight of the entire solid content of the silicone rubber-based curable composition.

[Preparation of conductive resin composition]
The silicone rubber-based composition 1 obtained above was immersed in 2.33 times the amount of tetradecane, and then stirred with a rotation / revolution mixer to form a solution. By adding silver powder (trade name “3-8F”, manufactured by DOWA Electronics Co., Ltd.) as the conductive filler 1 to this solution, the conductive resin composition 1 was obtained. At this time, the content of the solid content of the silicone rubber-based composition 1 was 15 parts by weight and the content of the conductive filler 1 was 85 parts by weight with respect to 100 parts by weight of the solid content of the conductive resin composition 1.

[Production of electronic devices]
Silicone rubber-based composition 1 was hot-pressed in a mold and sheeted to a size of 20 cm × 50 cm and a thickness of 0.5 mm to obtain a substrate. In this hot pressing, the heating temperature was 170 ° C., the pressure was 10 MPa, and the hot pressing time was 5 minutes. Thereafter, post-baking (secondary curing) was performed at 200 ° C. for 4 hours.

  Next, an integrated circuit chip was disposed as a hard member on the substrate, and was fixed by bonding with an adhesive composition obtained as follows. The adhesive composition was obtained as a solution by immersing the silicone rubber composition 1 in 2.33 times the amount of tetradecane and subsequently stirring with a rotation / revolution mixer.

  Next, a relaxation member was formed at a portion intersecting the wiring on one side constituting the upper surface (corresponding to the first surface 601 of the first embodiment) of the integrated circuit chip. Specifically, by applying a resin composition for forming a relaxation member selectively as follows using a dispenser, and then heat-treating at a heating temperature of 170 ° C. and a heating time of 30 minutes, A relaxation member was formed. The relaxing member-forming resin composition was obtained by immersing the silicone rubber composition 1 in 2.33 times the amount of tetradecane, and then stirring the mixture with a rotating / revolving mixer to obtain a solution.

  Next, a pattern to be a wiring was printed and applied to the main surface of the substrate and the upper surface of the integrated circuit chip using screen printing and a dispenser using the above-described conductive resin composition 1 as ink. This was heated in an oven to form a wiring connected to the electrodes of the integrated circuit chip. At this time, the heating temperature was 170 ° C. and the heating time was 1 hour. Further, the wiring had a width of 0.5 mm and a thickness of 250 μm, and an electrode pad was provided at a position where the wiring length was 30 mm from the electrode of the integrated circuit chip. Here, the width and thickness of the wiring are average values measured in a region where the width and thickness of the wiring are substantially constant at a position sufficiently away from the integrated circuit chip on the main surface of the substrate.

  Next, an electronic device was obtained by placing the silicone rubber-based composition 1 so as to cover the entire integrated circuit chip, the substrate, and the wiring, and heating and pressurizing to form a coating layer. In this heating and pressing, the heating temperature was 100 ° C., the pressure was 0.5 MPa, and the heating and pressing time was 15 minutes.

(Comparative example)
An electronic device was fabricated in the same manner as in the example except that the relaxation member was not formed.

[Evaluation of wiring board]
<Evaluation of hardness>
The hardness of each member was measured with the durometer A at 25 ° C. for the electronic device of the example. When the hardness of the substrate is H _b , the hardness of the wiring is H _l , the hardness of the integrated circuit chip is H _h , and the hardness of the relaxation member is H _r , the relationship of H _b <H _l <H _h and H _r <H _l It was confirmed that

<Durability evaluation>
Regarding the electronic devices of Examples and Comparative Examples, the relationship between the elongation ratio of the substrate and the electrical resistance was evaluated. The results are shown in Table 1. The elongation rate (%) of the substrate is expressed by ΔL / L × 100 (%), where L is the length of the substrate in the stretched state and ΔL is the difference between the length of L and the non-stretched substrate. The electrical resistance is an electrical resistance between the electrode of the integrated circuit chip and the electrode pad. The case of 10 MΩ or more is shown as “disconnection” in Table 1. In the example in which the relaxation member was formed, the conductivity of the wiring was maintained up to a higher elongation rate than in the comparative example that was not formed. Therefore, high durability was confirmed in the examples.

<Resistivity>
In the electronic device of the example, the resistivity of the wiring in the non-stretched state was evaluated as follows. First, the resistance value between the electrode of the integrated circuit chip and the electrode pad of the conductive pattern was measured using a DC voltage / current source / monitor (6241A) manufactured by ADC Co., Ltd. Then, the volume resistivity was obtained by multiplying the measured resistance value by the cross-sectional area perpendicular to the length direction of the wiring pattern and dividing by the value of the length of the wiring. As a result, the resistivity of the wiring was 1.5 × 10 ⁻⁴ Ω · m.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

10 wiring 20 substrate 30 covering layer 60 hard member 62 electrode 70 relaxation member 100 electronic device 104 side 105a intersection 105b intersection line 201 first main surface 202 second main surface 601 first surface 602 second surface 603 side surface 810 wiring 812 fracture portion 820 Substrate 860 Hard member 862 Electrode

Claims (13)

A substrate comprising a first elastomer;
A relaxation member comprising a second elastomer;
A wiring comprising a third elastomer and a conductive filler;
A hard member having an electrode,
The wiring and the hard member are provided on the first main surface of the substrate,
At least one side of the first surface of the hard member on which the electrode is provided and the wiring intersect with each other in plan view,
The relaxation member is interposed between the side and the wiring,
Electronic equipment. The electronic device according to claim 1,
When the hardness of the substrate measured at 25 ° C. with a durometer A is H _b , the hardness of the wiring is H _l , the hardness of the hard member is H _h , and the hardness of the relaxation member is H _r , H _b <H _l <holds the relationship of _{H h} and _H r _{<H l,}
Electronic equipment. The electronic device according to claim 1 or 2,
The wiring is connected to the electrode;
Electronic equipment. The electronic device according to any one of claims 1 to 3,
The hard member is at least partially embedded in the substrate.
Electronic equipment. The electronic device according to claim 4.
The surface of the hard member opposite to the surface facing the substrate and the region of the first main surface of the substrate where the hard member is not provided form the same plane. A member is embedded in the substrate;
Electronic equipment. The electronic device according to any one of claims 1 to 5,
In the cross section parallel to the thickness direction of the substrate, the relaxation member is interposed between the intersection of the side surface of the hard member and the first main surface, and the wiring.
Electronic equipment. The electronic device according to any one of claims 1 to 6,
The first elastomer comprises silicone rubber;
Electronic equipment. The electronic device according to claim 7.
The first elastomer includes a crosslinked product of a vinyl group-containing linear organopolysiloxane (A-1).
Electronic equipment. The electronic device according to any one of claims 1 to 8,
The resistivity of the wiring in a non-stretched state is 1.0 × 10 ⁻² Ω · cm or less.
Electronic equipment. The electronic device according to any one of claims 1 to 9,
The width of the wiring is 5 mm or less,
Electronic equipment. The electronic device according to any one of claims 1 to 10,
The hard member is an electronic component or a connector,
Electronic equipment. Providing a substrate comprising a first elastomer;
Arranging a hard member having an electrode on the first main surface of the substrate;
Forming a relaxation member comprising a second elastomer;
Forming a wiring including a third elastomer and a conductive filler on the first main surface of the substrate,
At least one side of the first surface of the hard member on which the electrode is provided and the wiring are formed so as to intersect in plan view,
The method of manufacturing an electronic device, wherein the relaxation member is formed so as to be interposed between the side and the wiring. Providing a structure including a substrate including a first elastomer, and a hard member having an electrode and having a hard member at least partially embedded in the first main surface of the substrate;
Forming a relaxation member comprising a second elastomer;
Forming a wiring including a third elastomer and a conductive filler on the first main surface of the substrate in this order,
At least one side of the first surface of the hard member on which the electrode is provided and the wiring are formed so as to intersect in plan view,
The method of manufacturing an electronic device, wherein the relaxation member is formed so as to be interposed between the side and the wiring.

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