JP2017175059A5 - - Google Patents

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Publication number
JP2017175059A5
JP2017175059A5 JP2016061870A JP2016061870A JP2017175059A5 JP 2017175059 A5 JP2017175059 A5 JP 2017175059A5 JP 2016061870 A JP2016061870 A JP 2016061870A JP 2016061870 A JP2016061870 A JP 2016061870A JP 2017175059 A5 JP2017175059 A5 JP 2017175059A5
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JP
Japan
Prior art keywords
substrate
guide
pair
die
die bonder
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JP2016061870A
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English (en)
Japanese (ja)
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JP2017175059A (ja
JP6660219B2 (ja
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Publication of JP2017175059A5 publication Critical patent/JP2017175059A5/ja
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JP2016061870A 2016-03-25 2016-03-25 ダイボンダ Active JP6660219B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016061870A JP6660219B2 (ja) 2016-03-25 2016-03-25 ダイボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016061870A JP6660219B2 (ja) 2016-03-25 2016-03-25 ダイボンダ

Publications (3)

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JP2017175059A JP2017175059A (ja) 2017-09-28
JP2017175059A5 true JP2017175059A5 (cg-RX-API-DMAC7.html) 2019-04-18
JP6660219B2 JP6660219B2 (ja) 2020-03-11

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JP2016061870A Active JP6660219B2 (ja) 2016-03-25 2016-03-25 ダイボンダ

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JP (1) JP6660219B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022004170A1 (ja) * 2020-07-03 2022-01-06 キヤノン株式会社 物品の製造装置、物品の製造方法、プログラム、記録媒体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3395644B2 (ja) * 1998-04-13 2003-04-14 松下電器産業株式会社 リードフレームの搬送装置
JP2012069733A (ja) * 2010-09-24 2012-04-05 Hitachi High-Tech Instruments Co Ltd ダイボンダの治工具管理方法、および、ダイボンダ
JP5889537B2 (ja) * 2011-03-23 2016-03-22 ファスフォードテクノロジ株式会社 ダイボンダ

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