JP2017174882A - Mounting device, method of raising lead component and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To load other component adjacently to a lead component loaded previously, regardless of the posture thereof.SOLUTION: A mounting device for securing the loading position of other component (L2) adjacent to a lead component (L1) by raising the lead component, includes a nozzle (29) for holding other component, a movement mechanism (21, 28) for lifting/lowering and horizontally moving the nozzle, and a control section (41) for controlling the movement mechanism to perform raising operation of the lead component. In the raising operation of the lead component, the control section lowers the nozzle in front of the loading position of other component, and then moves the nozzle horizontally to the loading position (P0) without changing the height of the nozzle.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a mounting apparatus for mounting a lead component on a substrate, a method for raising the lead component, and a program.

  As a mounting device, there is known a device that mounts a lead component on a substrate by inserting a lead terminal of the lead component into a through hole of the substrate (for example, see Patent Document 1). In the mounting apparatus described in Patent Document 1, the position of the through hole on the substrate is recognized by the imaging device, and the lead component held by the nozzle is conveyed toward the through hole. Then, the lead component is lowered vertically toward the through hole of the substrate while being kept in the upright posture, so that the lead terminal is inserted straight into the through hole. Thereafter, the lead terminal is soldered to the substrate, and the lead component is fixed to the substrate.

JP2013-093536A

  In the mounting apparatus described in Patent Document 1, the lead component is mounted on the substrate in an upright posture by the nozzle, but when the holding of the nozzle is released after the lead component is mounted, the lead component continues to stand upright on the substrate. There is a case where it can't be done and it tilts. If there is a place where another part is mounted in the vicinity of the lead part, the place where the other part is mounted is covered depending on the inclination of the lead part. For this reason, the lead component previously mounted on the substrate may interfere with the mounting operation of other components mounted later on the substrate.

  The present invention has been made in view of the above points, and a mounting apparatus and a lead that can mount other components next to or around the lead component without depending on the posture of the lead component previously mounted. An object is to provide a method and a program for raising parts.

  A mounting apparatus according to the present invention is a mounting apparatus that secures a mounting position of another component next to the lead component by raising a lead component, and a nozzle that holds the other component, and moves the nozzle up and down. A moving mechanism that horizontally moves; and a control unit that controls the moving mechanism to perform the raising operation of the lead component. In the raising operation of the lead component, the control unit is positioned before the mounting position of the other components. After the nozzle is lowered, the nozzle is horizontally moved to the mounting position without changing the height of the nozzle.

  The method for raising a lead component according to the present invention is a method for raising a lead component by a mounting device that secures a mounting position of another component next to the lead component by raising the lead component, and the other component is a nozzle. A step of holding, a step of lowering the nozzle before the mounting position of the other component, and a step of horizontally moving the nozzle to the mounting position without changing the height of the nozzle. To do.

  According to these configurations, even if the tilted lead component protrudes to the mounting position of other components, the nozzle can be approached from the lateral direction with respect to the mounting position. The parts held in contact with the side. As a result, the lead component is raised by being pushed away from the mounting position of the other component, and the mounting position of the other component is secured next to the lead component. Since the movement of the nozzle to the mounting position is not hindered by the lead component previously mounted on the substrate, other components can be mounted next to the lead component regardless of the posture of the lead component.

  In the mounting device, in the raising operation of the lead component, the control unit lowers the other component held by the nozzle before the mounting position, and then changes the height of the other component without changing the height of the other component. Other parts are moved horizontally to the mounting position. According to this configuration, if the nozzle can hold another component with a sufficient holding force, the raising operation of the lead component can be performed using the other component held by the nozzle.

  In the mounting apparatus, the control unit performs the mounting operation of the other component at the mounting position following the raising operation of the lead component. According to this configuration, since the raising operation of the lead component is performed using the other components mounted at the mounting position in the mounting operation, the time required for the mounting operation of the other components can be shortened.

  In the mounting apparatus, the other component is another lead component, and in the mounting operation of the other lead component, the control unit lowers the nozzle at the mounting position to lead the other lead component. The terminal is inserted into the through hole at the mounting position. According to this configuration, another lead component can be mounted side by side next to the lead component.

  In the mounting apparatus, the nozzle holds a dedicated jig for raising the lead component. In the raising operation of the lead component, the control unit holds the dedicated jig held by the nozzle before the mounting position. After being lowered, the dedicated jig is horizontally moved to the mounting position without changing the height of the dedicated jig. According to this configuration, when the nozzle cannot hold another component with a sufficient holding force, the raising operation of the lead component can be performed by using the dedicated jig held by the nozzle.

  In the mounting apparatus, the control unit performs the mounting operation of the other component at the mounting position after replacing the dedicated jig held by the nozzle with the other component, following the raising operation of the lead component. carry out. According to this configuration, after performing the raising operation of the lead component using the dedicated jig, another component that the nozzle cannot hold with a sufficient holding force can be mounted at the mounting position.

  The program of the present invention is a program for a mounting apparatus that secures a mounting position of another component next to the lead component by raising a lead component, the step of holding the other component with a nozzle, and the other The mounting apparatus is configured to execute the step of lowering the nozzle before the component mounting position and the step of horizontally moving the nozzle to the mounting position without changing the height of the nozzle. According to this configuration, by installing a program in the mounting apparatus, a function for causing a lead component can be added to the mounting apparatus.

  According to the present invention, after the nozzle is lowered before the mounting position of other components, the nozzle is horizontally moved to the mounting position without changing the height of the nozzle, so that the tilted lead component is placed on the substrate. It is possible to secure the mounting position of other parts next to or around the lead parts. Therefore, other components can be mounted next to the lead component without depending on the posture of the lead component previously mounted.

It is a schematic diagram which shows the whole mounting apparatus of this Embodiment. It is operation | movement explanatory drawing which shows an example of the mounting operation of a comparative example. It is a figure which shows an example of the operation setting of this Embodiment. It is a figure which shows an example of the raising operation | movement and mounting operation | movement of this Embodiment. It is a figure which shows another example of the raising operation | movement of this Embodiment.

  Hereinafter, the mounting apparatus of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the entire mounting apparatus of the present embodiment. FIG. 2 is an operation explanatory diagram illustrating an example of the mounting operation of the comparative example. In addition, the mounting apparatus of this Embodiment is only an example, and can be changed suitably.

  As illustrated in FIG. 1, the mounting apparatus 1 is configured to mount various components supplied from a component supply device 16 such as a tape feeder on a mounting surface of a substrate W by a mounting head 26. A substrate transport unit 11 that transports the substrate W in the X-axis direction is disposed at substantially the center of the base 10 of the mounting apparatus 1. The board transport unit 11 loads and positions the board W before component mounting from one end side in the X-axis direction below the mounting head 26, and carries the board W after component mounting to the other end side in the X-axis direction. Yes. On the base 10, a large number of component supply devices 16 are arranged side by side in the X-axis direction on both sides of the board conveyance unit 11.

  A tape reel 17 is detachably mounted on the component supply device 16, and a carrier tape that packages various components is wound around the tape reel 17. Each component supply device 16 sequentially delivers components toward a delivery position where the component is picked up by the mounting head 26 by the rotation of a sprocket wheel provided in the device. At the delivery position of the mounting head 26, the cover tape on the surface is peeled from the carrier tape, and the components in the pocket of the carrier tape are exposed to the outside. In the present embodiment, the tape feeder is exemplified as the component supply device 16, but the component supply device 16 may be composed of another component supply device 16 such as a ball feeder. Moreover, if a component is mounted with respect to the board | substrate W, it will not be specifically limited to an electronic component.

  A horizontal movement mechanism 21 that horizontally moves the mounting head 26 in the X-axis direction and the Y-axis direction is provided on the base 10. The horizontal movement mechanism 21 has a pair of Y-axis drive units 22 extending in the Y-axis direction and an X-axis drive unit 23 extending in the X-axis direction. The pair of Y-axis drive units 22 are supported by support units (not shown) erected at the four corners of the base 10, and the X-axis drive unit 23 is movable in the Y-axis direction on the pair of Y-axis drive units 22. Is installed. A mounting head 26 is installed on the X-axis driving unit 23 so as to be movable in the X-axis direction. The mounting head 26 is connected to the component supply device 16 and the board by the X-axis driving unit 23 and the Y-axis driving unit 22. It is reciprocated between W.

  The mounting head 26 has a plurality (three in the present embodiment) of head portions 27 each having a nozzle 29. The head unit 27 moves the nozzle 29 up and down in the Z-axis direction by the up-and-down movement mechanism 28 (see FIG. 4A), and rotates the nozzle 29 around the Z-axis by a rotation mechanism (not shown). As described above, the moving mechanism of the nozzle 29 includes the horizontal moving mechanism 21 that horizontally moves the nozzle 29 together with the mounting head 26 and the up-and-down moving mechanism 28 that moves the nozzle 29 up and down. Further, the nozzle 29 of the mounting head 26 is not limited to the suction nozzle that sucks and holds the component by the suction force from the suction source, and may be constituted by other nozzles such as a gripper nozzle.

  The mounting head 26 is provided with a height sensor 31 that measures the height of the measurement target, and a laser recognition unit (not shown) that can recognize the shape dimensions, suction displacement, and the like of the component sucked by the nozzle 29. Yes. The height sensor 31 emits light from the light emitting element toward the measurement target, and measures the distance from the mounting head 26 to the measurement target by receiving the reflected light from the measurement target with the light receiving element. The laser recognizing unit makes a large number of light-emitting elements and light-receiving elements face each other in the horizontal direction, and moves the parts up and down so as to block the laser beams arranged in a horizontal row. It has recognized.

  The mounting head 26 is provided with a board imaging unit 32 that images a BOC (Board Offset Correction) mark on the substrate W and a nozzle imaging unit 33 that images a component mounting operation by the nozzle 29. The board imaging unit 32 recognizes the position, tilt, expansion and contraction, etc. of the board W based on the captured image of the BOC mark. The nozzle imaging unit 33 images the parts before and after being picked up by the nozzle 29 and also images the parts before and after being mounted on the substrate W and stores these images as traceability information. Further, the suction position of the component is recognized from the captured image of the component before suction by the nozzle 29.

  On the base 10 of the mounting apparatus 1, a component imaging unit 34 that captures an image of the component adsorbed by the nozzle 29 from directly below is provided. The component imaging unit 34 images the component being conveyed by the mounting head 26 and recognizes the inclination and height of the component according to the captured image. Further, an automatic changer (ATC: Automatic Tool Changer) 37 in which a plurality of types of nozzles 36 are prepared according to various components is provided on the base 10 of the mounting apparatus 1. By moving the mounting head 26 to the automatic changer 37, the mounting head 26 can remove the nozzle 29 being mounted and replace it with a new nozzle 36.

  Further, the mounting apparatus 1 is provided with a control unit 41 that performs overall control of each part of the apparatus. The control unit 41 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. In addition to the control program for the entire mounting apparatus 1, the memory stores various programs for performing a lead component raising operation and a lead component mounting operation, which will be described later. In the mounting apparatus 1 configured as described above, not only chip parts but also lead parts L1 such as film capacitors (see FIG. 2) are mounted on the substrate W.

  By the way, as shown in FIG. 2A, in the mounting apparatus, not only the chip component but also the lead component L1 is mounted on the substrate W. In the mounting operation of the lead component L1 on the general substrate W, the lead component L1 held by the nozzle 29 is moved to above the mounting position on the substrate W, so that the lead terminal 51 of the lead component L1 is a through hole on the substrate W. Position at O1. The lead terminal 51 is inserted into the through hole O1 by lowering the lead component L1 perpendicularly to the substrate W with the nozzle 29. However, when a lead component L1 having a narrow width and a high height such as a film capacitor is mounted on the substrate W, the lead component L1 may be inclined on the substrate W.

  As shown in FIG. 2B, when the lead component L1 is inclined on the substrate W, it is difficult to mount another lead component L2 at the mounting position adjacent to the lead component L1. More specifically, since the head of the lead component L1 is located directly above the through hole O2 of the lead component L2, the lead component L2 cannot be lowered directly toward the through hole O2 by the nozzle 29. The mounting operation of the lead component L2 on the substrate W is hindered by the lead component L1. Thus, if the lead component L1 previously mounted with respect to the board | substrate W inclines, another component may not be mounted next to this lead component L1.

  Therefore, in the mounting apparatus 1 (see FIG. 1) according to the present embodiment, when the lead component L1 that easily tilts is specified and another component (the lead component L2 in FIG. 2) is mounted next to the lead component L1. The raising operation is performed on the inclined lead component L1. As the lead component L1 tilted on the substrate W is raised by this raising operation, the lead component L1 is pushed away from the mounting position of other components. Therefore, it is possible to mount another component next to the lead component L1 without depending on the posture of the lead component L1 previously mounted on the substrate W.

  Hereinafter, the raising operation of the lead component according to the present embodiment will be described. FIG. 3 is a diagram illustrating an example of operation settings according to the present embodiment. FIG. 4 is a diagram illustrating an example of a raising operation and a mounting operation according to the present embodiment. FIG. 5 is a diagram illustrating another example of the raising operation of the present embodiment. In the following description, a lead component is first mounted on the substrate, and a configuration in which the lead component is mounted as another component next to or around the lead component is described. However, the present invention is not limited to this configuration. . The other components may be components mounted on the substrate, and are not limited to insertion mounting components such as lead components, but may be surface mounting components such as device chips.

  As shown in FIG. 3A, a setting box (offset) for a raising operation composed of an X coordinate, a Y coordinate, and a Z coordinate is displayed on the part data setting screen of the production program for the mounting apparatus. In the X and Y coordinate setting boxes, the X and Y coordinates of the operation start position P1 (see FIG. 3B) with the mounting position P0 (see FIG. 3B) as the origin on the substrate W are set. In the Z coordinate setting box, the Z coordinate of the descending height H1 (see FIG. 3C) of the lead component L2 with the upper surface of the substrate W set to the reference height H0 (see FIG. 3C) is set. The horizontal movement amount of the nozzle 29 is set by the X coordinate and the Y coordinate, and the vertical movement amount of the nozzle 29 is set by the Z coordinate.

  For example, in the example shown in FIG. 3A, 50 [mm] and 50 [mm] are set in the X coordinate and Y coordinate setting boxes. As a result, as shown in FIG. 3B, when the mounting position P0 is set as the origin, the operation start position P1 is set at a position separated by 50 [mm] in the X-axis direction and 50 [mm] in the Y-axis direction. . In the example shown in FIG. 3A, 9 [mm] is set in the Z coordinate setting box. As a result, as shown in FIG. 3C, when the upper surface of the substrate W is set to the reference height H0, the lowering height H1 of the lead component L2 is set at a position 9 mm higher than the upper surface of the substrate W. .

  Further, the transport route of the lead component L2 is set by the operation start position P1 and the descending height H1. Specifically, the conveyance route of the lead component L2 is set from the pickup position of the lead component L2 to the mounting position P0 via the operation start position P1 and the descending height H1. By such setting, the lead component L2 is moved down to the lowered position H1 at the operation start position P1 before the mounting position P0, and the nozzle 29 is moved from the operation start position P1 to the mounting position P0 without changing the height of the lead component L. Is moved horizontally. Note that the operation start position P1 and the descending height H1 may be changed as appropriate according to the type of components previously mounted on the substrate W.

  Note that the setting of coordinates in the setting box is not set for the component data of all components. A component such as a lead component that is relatively easy to tilt (lead component L1 in FIG. 3) is specified in advance, and component data of another component (lead component L2 in FIG. 3) to be mounted later next to the specific component. Set for. That is, the mounting apparatus 1 (see FIG. 1) is preset in a production program for mounting components. Note that the specific component that easily tilts may be automatically specified by the control unit 41 (see FIG. 1) according to the type of component, or may be specified manually by the operator. In the setting boxes for other components, coordinates may be automatically set by the control unit 41 (see FIG. 1), or coordinates may be set manually by an operator. Further, in a mounting line composed of a plurality of mounting devices and inspection devices, the substrate mounting state of the previous mounting device is inspected by the inspection device. At that time, the inspection apparatus may recognize the inclination of the component, send the information to the next mounting apparatus, and perform the raising operation of the component based on the information. Further, the mounting apparatus 1 may recognize the inclination of the component using the board imaging unit 32, the nozzle imaging unit 33, or the like before mounting or during component mounting.

  Next, the raising operation of the lead component L1 previously mounted on the substrate W and the mounting operation of the lead component L2 mounted on the substrate W later will be described. Here, it is assumed that the lead component L1 previously mounted is inclined on the substrate W toward the mounting position P0 of the lead component L2. As shown in FIG. 4A, the nozzle 29 is horizontally moved to the pickup position of the lead component L2 by the horizontal movement mechanism 21, and the nozzle 29 is lowered to the holding height of the lead component L2 by the lifting / lowering movement mechanism 28. And the lead component L2 is hold | maintained at the front-end | tip of the nozzle 29, and the lead component L2 is conveyed toward the operation | movement start position P1 (refer FIG. 4B) of raising operation | movement.

  As shown in FIG. 4B, when the nozzle 29 is moved to the operation start position P1, the controller 41 (see FIG. 1) moves up and down so that the lead component L2 held by the nozzle 29 is lowered to the lowered height H1. The mechanism 28 is controlled. Thereby, the lead component L2 is lowered before the mounting position P0 of the lead component L2, and the height of the lead component L2 is adjusted to a height position suitable for the raising operation. At this time, the lower end of the lead terminal 51 of the lead component L2 is higher than the upper surface of the substrate W, and the lower end 53 of the head 52 of the lead component L2 is lower than the upper end 54 of the head 52 of the lead component L1. The height of the lead component L2 is adjusted so as to be in the position.

  As shown in FIG. 4C, when the nozzle 29 is lowered to the lowered height H1, the horizontal movement mechanism 21 is controlled by the control unit 41 (see FIG. 1) so that the lead component L2 is horizontally moved to the mounting position P0. Thereby, the lead component L2 is horizontally moved to the mounting position P0 without changing the height of the lead component L2, and the lead component L2 is brought into contact with the lead component L1 previously mounted on the substrate W from the lateral direction. At this time, the head part 52 of the lead part L2 comes into contact with the head part 52 of the lead part L1 inclined obliquely, and the lead part L1 is pushed away by the lead part L2. As a result, the lead component L1 is raised, and the mounting position P0 of the lead component L2 is secured next to the lead component L1.

  As shown in FIG. 4D, when the lead component L1 is pushed away from the mounting position P0 and the raising operation of the lead component L1 is performed, the mounting operation of the lead component L2 on the mounting position P0 is subsequently performed. In this case, since the lead component L1 is already positioned at the mounting position P0, the lifting and lowering movement mechanism 28 is controlled by the control unit 41 (see FIG. 1) so that the lead component L2 is lowered toward the mounting position P0. . As a result, the lead component L2 is lowered vertically toward the mounting position P0 in an upright posture, and the lead terminal 51 of the lead component L2 is inserted straight into the through hole O2 at the mounting position P0.

  As described above, in the mounting apparatus 1 of the present embodiment, even if the inclined lead component L1 protrudes to the mounting position P0 of the adjacent lead component L2, the lead component L1 is moved from the mounting position P0 of the lead component L2. By being pushed away, the mounting position P0 of the lead component L2 is secured next to the lead component L1. Since the movement of the nozzle 29 to the mounting position P0 is not hindered by the lead component L1 previously mounted on the substrate W, the lead component L2 is mounted next to the lead component L1 regardless of the attitude of the lead component L1. can do.

  By the way, if other components such as the lead component L2 can be held with sufficient holding force by the nozzle 29, the raising operation of the lead component L1 can be performed using the other components held by the nozzle 29. However, if the other components cannot be held by the nozzle 29 with a sufficient holding force, the raising operation of the lead component L1 cannot be performed. That is, when another component held by the nozzle 29 comes into contact with the lead component L1, the other component may be detached from the nozzle 29. Therefore, when the nozzle 29 cannot hold other components with sufficient holding force, the lead component is raised by the dedicated jig 57 (see FIG. 5A) held by the nozzle 29.

  As shown in FIG. 5A, the nozzle 29 is moved to the storage location of the dedicated jig 57 for raising operation, and the dedicated jig 57 is held at the tip of the nozzle 29. At this time, the dedicated jig 57 is formed in a shape and weight that can obtain a sufficient holding force by the nozzle 29. After the dedicated jig 57 held by the nozzle 29 is lowered before the mounting position P0, the dedicated jig 57 is horizontally moved to the mounting position P0 without changing the height of the dedicated jig 57. As a result, the lead component L1 tilted on the substrate W is raised, and a mounting position for other components is secured next to the lead component L1. Thereafter, after the dedicated jig 57 held by the nozzle 29 is replaced with another part, the mounting operation of the other part is performed.

  With this configuration, after performing the raising operation of the lead component L1 using the dedicated jig 57, other components that the nozzle 29 cannot hold with a sufficient holding force can be mounted at the mounting position. In this case, whether or not to use the dedicated jig 57 may be automatically determined by the control unit 41 (see FIG. 1) or may be manually determined by the operator depending on the type of component. Further, as shown in FIG. 5B, the raising operation may be performed by the nozzle 29 without using other components or the dedicated jig 57. Further, the raising operation using other components, the raising operation using the dedicated jig 57, and the raising operation by the nozzle 29 may be appropriately combined.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the present embodiment, a film capacitor is exemplified as the lead component L, but the present invention is not limited to this configuration. The lead component L may be a radial component that is mounted upright with respect to the substrate W, and may be, for example, a resistor, an LED (Light Emitting Diode), a connector, or a transistor.

  Moreover, in this Embodiment, the board | substrate W should just be what can mount various components, and is not limited to a printed circuit board, The flexible board mounted on the jig | tool board | substrate may be sufficient.

  Further, the program of the present invention causes the mounting device to execute the above-described raising operation of the lead terminal. The mounting apparatus 1 may incorporate a program capable of continuously performing the raising operation and the mounting operation, or may incorporate a program capable of performing only the raising operation alone.

  As described above, the present invention has an effect that other components can be mounted next to the lead component regardless of the posture of the previously mounted lead component. This is useful for a mounting apparatus for mounting components side by side, a method for raising a lead component, and a program.

1 Mounting equipment 21 Horizontal movement mechanism (movement mechanism)
28 Elevating and moving mechanism (moving mechanism)
29 Nozzle 41 Control unit 51 Lead terminal 57 Dedicated jig L1 Lead part L2 Lead part (other parts)
P0 mounting position P1 operation start position

Claims (8)

A mounting device that secures a mounting position of another component next to the lead component by raising the lead component,
A nozzle for holding the other component;
A moving mechanism for moving the nozzle up and down and horizontally;
A control unit that controls the moving mechanism to perform the raising operation of the lead component,
In the raising operation of the lead component, the control unit lowers the nozzle before the mounting position of the other components, and then horizontally moves the nozzle to the mounting position without changing the height of the nozzle. A mounting apparatus characterized by.   In the raising operation of the lead component, the control unit lowers the other component held by the nozzle before the mounting position, and then mounts the other component without changing the height of the other component. The mounting apparatus according to claim 1, wherein the mounting apparatus is horizontally moved to a position.   The mounting apparatus according to claim 2, wherein the control unit performs the mounting operation of the other component at the mounting position following the raising operation of the lead component. The other parts are other lead parts,
The mounting operation of the another lead component causes the control unit to lower the nozzle at the mounting position and insert a lead terminal of the other lead component into a through hole at the mounting position. 3. The mounting apparatus according to 3. The nozzle holds a dedicated jig for raising the lead component,
In the raising operation of the lead component, after the dedicated jig held by the control unit is lowered before the mounting position, the dedicated jig is mounted without changing the height of the dedicated jig. The mounting apparatus according to claim 1, wherein the mounting apparatus is horizontally moved to a position.   The control unit performs the mounting operation of the other component on the mounting position after exchanging the dedicated jig held by the nozzle with the other component following the raising operation of the lead component. The mounting apparatus according to claim 5. A method of raising a lead component by a mounting device that secures a mounting position of another component next to the lead component by raising the lead component,
Holding the other part with a nozzle;
Lowering the nozzle before the mounting position of the other parts;
And a step of horizontally moving the nozzle to the mounting position without changing the height of the nozzle. A mounting apparatus program for securing a mounting position of another component next to the lead component by raising the lead component,
Holding the other part with a nozzle;
Lowering the nozzle before the mounting position of the other parts;
A program causing the mounting apparatus to execute the step of horizontally moving the nozzle to the mounting position without changing the height of the nozzle.

Images