JP2017152555A5 - - Google Patents

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Publication number
JP2017152555A5
JP2017152555A5 JP2016033929A JP2016033929A JP2017152555A5 JP 2017152555 A5 JP2017152555 A5 JP 2017152555A5 JP 2016033929 A JP2016033929 A JP 2016033929A JP 2016033929 A JP2016033929 A JP 2016033929A JP 2017152555 A5 JP2017152555 A5 JP 2017152555A5
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JP
Japan
Prior art keywords
electronic component
unit
flow rate
ejection
gas
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Application number
JP2016033929A
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English (en)
Japanese (ja)
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JP6668816B2 (ja
JP2017152555A (ja
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Priority to JP2016033929A priority Critical patent/JP6668816B2/ja
Priority claimed from JP2016033929A external-priority patent/JP6668816B2/ja
Priority to TW106102837A priority patent/TWI625294B/zh
Priority to TW107108660A priority patent/TWI728237B/zh
Publication of JP2017152555A publication Critical patent/JP2017152555A/ja
Publication of JP2017152555A5 publication Critical patent/JP2017152555A5/ja
Application granted granted Critical
Publication of JP6668816B2 publication Critical patent/JP6668816B2/ja
Active legal-status Critical Current
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JP2016033929A 2016-01-28 2016-02-25 電子部品搬送装置および電子部品検査装置 Active JP6668816B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016033929A JP6668816B2 (ja) 2016-02-25 2016-02-25 電子部品搬送装置および電子部品検査装置
TW106102837A TWI625294B (zh) 2016-01-28 2017-01-25 Electronic component conveying device and electronic component inspection device
TW107108660A TWI728237B (zh) 2016-01-28 2017-01-25 電子零件搬送裝置及電子零件檢查裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016033929A JP6668816B2 (ja) 2016-02-25 2016-02-25 電子部品搬送装置および電子部品検査装置

Publications (3)

Publication Number Publication Date
JP2017152555A JP2017152555A (ja) 2017-08-31
JP2017152555A5 true JP2017152555A5 (cg-RX-API-DMAC10.html) 2019-01-24
JP6668816B2 JP6668816B2 (ja) 2020-03-18

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ID=59739807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016033929A Active JP6668816B2 (ja) 2016-01-28 2016-02-25 電子部品搬送装置および電子部品検査装置

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JP (1) JP6668816B2 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7841999B2 (ja) * 2022-09-26 2026-04-07 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR20260030441A (ko) * 2024-08-27 2026-03-06 한화세미텍 주식회사 부품 흡착 높이 보정 장치 및 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0612254B2 (ja) * 1985-08-29 1994-02-16 マツダ株式会社 穴の求心方法
JP2002277384A (ja) * 2001-03-19 2002-09-25 Ishikawajima Inspection & Instrumentation Co 欠陥検出方法及び装置
US8028100B2 (en) * 2006-05-05 2011-09-27 Data I/O Corporation Automated processing system employing intelligent module automatic recognition
JP5359801B2 (ja) * 2009-11-13 2013-12-04 セイコーエプソン株式会社 電子部品検査装置、および電子部品搬送装置

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