JP2017146586A - フレキシブル表示装置、ウインドー部材の製造方法、及びハードコーティング組成物 - Google Patents
フレキシブル表示装置、ウインドー部材の製造方法、及びハードコーティング組成物 Download PDFInfo
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- JP2017146586A JP2017146586A JP2016228383A JP2016228383A JP2017146586A JP 2017146586 A JP2017146586 A JP 2017146586A JP 2016228383 A JP2016228383 A JP 2016228383A JP 2016228383 A JP2016228383 A JP 2016228383A JP 2017146586 A JP2017146586 A JP 2017146586A
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- 230000009975 flexible effect Effects 0.000 title claims abstract description 62
- 239000008199 coating composition Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000011247 coating layer Substances 0.000 claims abstract description 85
- 239000011248 coating agent Substances 0.000 claims abstract description 41
- 238000000576 coating method Methods 0.000 claims abstract description 41
- 239000004971 Cross linker Substances 0.000 claims abstract description 38
- 239000000126 substance Substances 0.000 claims description 79
- 125000004432 carbon atom Chemical group C* 0.000 claims description 57
- 125000003545 alkoxy group Chemical group 0.000 claims description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 26
- 125000003118 aryl group Chemical group 0.000 claims description 26
- 239000000178 monomer Substances 0.000 claims description 21
- 239000007787 solid Substances 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 18
- 229910052799 carbon Inorganic materials 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 150000001721 carbon Chemical class 0.000 claims description 12
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 7
- 229920001400 block copolymer Polymers 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 239000005543 nano-size silicon particle Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- SOTITVLSZNPNPS-UHFFFAOYSA-N 4-(1,3-dioxolan-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound O1CCOC1C1CC2OC2CC1 SOTITVLSZNPNPS-UHFFFAOYSA-N 0.000 claims description 5
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 claims description 5
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 claims description 5
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 claims description 5
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cis-cyclohexene Natural products C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 125000001033 ether group Chemical group 0.000 claims description 4
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 150000007942 carboxylates Chemical class 0.000 claims description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- KQLQFQGDHGMZDF-UHFFFAOYSA-N 6-(7-oxabicyclo[4.1.0]heptan-1-ylmethoxy)-6-oxohexanoic acid Chemical compound C1CCC2(C(C1)O2)COC(=O)CCCCC(=O)O KQLQFQGDHGMZDF-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 94
- 235000019589 hardness Nutrition 0.000 description 22
- 239000010409 thin film Substances 0.000 description 18
- 238000005452 bending Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 12
- 239000000654 additive Substances 0.000 description 9
- 238000004132 cross linking Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 8
- 229920001688 coating polymer Polymers 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 0 CC(C)(*)*NCCC(C)(C)N Chemical compound CC(C)(*)*NCCC(C)(C)N 0.000 description 4
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- JYBNOVKZOPMUFI-UHFFFAOYSA-N n-(3-hydroxy-2-methyl-3,4-diphenylbutyl)-n-methylpropanamide Chemical compound C=1C=CC=CC=1C(O)(C(C)CN(C)C(=O)CC)CC1=CC=CC=C1 JYBNOVKZOPMUFI-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- -1 3,4-epoxycyclohexyl Chemical group 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 102100035647 BRISC and BRCA1-A complex member 1 Human genes 0.000 description 2
- 101000874547 Homo sapiens BRISC and BRCA1-A complex member 1 Proteins 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- ROTNQFPVXVZSRL-UHFFFAOYSA-N 4,4,6-trimethyl-7-oxabicyclo[4.1.0]heptan-2-one Chemical compound C1C(C)(C)CC(=O)C2OC21C ROTNQFPVXVZSRL-UHFFFAOYSA-N 0.000 description 1
- DZRNHAKGOZZQFA-UHFFFAOYSA-N COCCCCO.C(C)O Chemical compound COCCCCO.C(C)O DZRNHAKGOZZQFA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DRSFVGQMPYTGJY-GNSLJVCWSA-N Deprodone propionate Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@@](C(C)=O)(OC(=O)CC)[C@@]1(C)C[C@@H]2O DRSFVGQMPYTGJY-GNSLJVCWSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- QSUOUTCLQQHYCM-UHFFFAOYSA-N O=C(C1CC(C2)OC2C1)OCC1CC2OC2CC1 Chemical compound O=C(C1CC(C2)OC2C1)OCC1CC2OC2CC1 QSUOUTCLQQHYCM-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 101710157310 Tegument protein UL47 homolog Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003666 anti-fingerprint Effects 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- IZDROVVXIHRYMH-UHFFFAOYSA-N methanesulfonic anhydride Chemical compound CS(=O)(=O)OS(C)(=O)=O IZDROVVXIHRYMH-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- UOBSVARXACCLLH-UHFFFAOYSA-N monomethyl adipate Chemical compound COC(=O)CCCCC(O)=O UOBSVARXACCLLH-UHFFFAOYSA-N 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000005017 substituted alkenyl group Chemical group 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
-
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/16—Chemical modification with polymerisable compounds
- C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
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- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
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Abstract
Description
化学式1においてYは下記の化学式3で表示される。
WM−BS ベース部材
WM−BM ベゼル層
WM−HC ハードコーティング層
TS タッチスクリーン
DP 表示パネル
Claims (25)
- フレキシブル表示パネルと、
前記フレキシブル表示パネル上に配置されたウインドー部材と、
を含み、
前記ウインドー部材は、
フレキシブルベース部材と、
前記ベース部材上に配置されたハードコーティング層と、を含み、
前記ハードコーティング層は、光開始剤及び下記の化学式1で表示される高分子を含む、フレキシブル表示装置。
前記化学式1においてYは、下記の化学式3で表示され、
前記化学式1において前記Zは、クロスリンカーである。 - 前記光開始反応基は、
エポキシ基又はアルケニル基を含む置換基で置換されたエーテル基と、
エポキシ基又はアルケニル基を含む置換基で置換された炭素数1以上20以下のアルキル基と、
置換又は非置換された炭素数1以上20以下のアルケニル基と、
である請求項1に記載のフレキシブル表示装置。 - 前記クロスリンカーは、脂肪環族ジエポキシカルボキシレート(alicyclic diepoxy carboxylate)を含む請求項1〜3のいずれか1項に記載のフレキシブル表示装置。
- 前記クロスリンカーは、4−ビニールシクロヘキセンジオキサイド、シクロヘキセンビニールモノオキサイド、(3、4−エポキシシクロヘキシル)メチル3、4−エポキシシクロヘキシルカルボキシレート、3、4−エポキシシクロヘキシルメチルメタクリレート、ビス(3、4−エポキシシクロヘキシルメチル)アジペート、3、4−エポキシシクロヘキサンカルボキシレート、2−(3、4−エポキシシクロヘキシル)−1、3−ジオキソランのうちのいずれか1つである請求項1〜3のいずれか1項に記載のフレキシブル表示装置。
- 前記光開始剤は、互いに異なる波長の光によって開始される第1光開始剤及び第2光開始剤を含む請求項1〜6のいずれか1項に記載のフレキシブル表示装置。
- 光開始剤、第1オリゴマー、第2オリゴマー、及びクロスリンカーを含むハードコーティング固形分及び溶媒を含むハードコーティング組成物を準備する段階と、
フレキシブルベース部材上に予備ハードコーティング層が形成されるように前記ハードコーティング組成物を塗布する段階と、
前記溶媒が除去されるように前記予備ハードコーティング層を乾燥する段階と、
乾燥された前記予備ハードコーティング層を光硬化する段階と、
を含み、
前記第1オリゴマーの分子量は、2000〜6000であり、前記第2オリゴマーの分子量は、10000〜30000である、
ウインドー部材の製造方法。 - 前記第1オリゴマーの各々は、下記の化学式9で表示され、
前記第2オリゴマーの各々は、下記の化学式10で表示され、
- 前記ハードコーティング固形分は、前記ハードコーティング固形分100wt%に対して前記第1オリゴマー6wt%〜36wt%、前記第2オリゴマー36wt%〜70wt%、前記クロスリンカー10wt%〜20wt%、前記光開始剤1wt%〜4wt%を含む請求項9又は10に記載のウインドー部材の製造方法。
- 前記ハードコーティング組成物は、シリコンナノ粒子をさらに含む請求項9〜13のいずれか1項に記載のウインドー部材の製造方法。
- 前記ハードコーティング組成物は、ビスフェノール−A−エポキシ−シリコンブロック共重合体(bisphenol−A−epoxy−silicone block copolymer)をさらに含む請求項14に記載のウインドー部材の製造方法。
- 前記光開始剤は、互いに異なる波長の光によって開始される第1光開始剤及び第2光開始剤を含む請求項9〜15のいずれか1項に記載のウインドー部材の製造方法。
- 前記乾燥された予備ハードコーティング層を光硬化する段階は、
前記第1光開始剤を開始する第1波長範囲の光を前記乾燥された予備ハードコーティング層に照射する段階と、
前記第2光開始剤を開始する第2波長範囲の光を前記乾燥された予備ハードコーティング層に照射する段階と、
を含む請求項16に記載のウインドー部材の製造方法。 - 溶媒及びハードコーティング固形分を含み、
前記ハードコーティング固形分は、前記ハードコーティング固形分100wt%に対して、
6wt%〜36wt%の第1オリゴマーと、
36wt%〜70wt%の第2オリゴマーと、
10wt%〜20wt%のクロスリンカーと、
1wt%〜4wt%の光開始剤と、
をさらに含み、
前記第1オリゴマーの分子量は、2000〜6000であり、前記第2オリゴマーの分子量は、10000〜30000である、ハードコーティング組成物。 - 前記第1オリゴマーの各々は、下記の化学式14で表示され、
前記第2オリゴマーの各々は、下記の化学式15で表示され、
- 前記クロスリンカーは、4−ビニールシクロヘキセンジオキサイド、シクロヘキセンビニールモノオキサイド、(3、4−エポキシシクロヘキシル)メチル3、4−エポキシシクロヘキシルカルボキシレート、3、4−エポキシシクロヘキシルメチルメタクリレート、ビス(3、4−エポキシシクロヘキシルメチル)アジペート、3、4−エポキシシクロヘキサンカルボキシレート、2−(3、4−エポキシシクロヘキシル)−1、3−ジオキソランのうちのいずれか1つである請求項18〜20のいずれか1項に記載のハードコーティング組成物。
- シリコンナノ粒子をさらに含む請求項18〜22のいずれか1項に記載のハードコーティング組成物。
- ビスフェノール−A−エポキシ−シリコンブロック共重合体(bisphenol−A−epoxy−silicone block copolymer)をさらに含む請求項23に記載のハードコーティング組成物。
- 前記光開始剤は、互いに異なる波長の光によって開始される第1光開始剤及び第2光開始剤を含む請求項18〜24のいずれか1項に記載のハードコーティング組成物。
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EP (1) | EP3208297B1 (ja) |
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KR102562718B1 (ko) * | 2016-11-03 | 2023-08-02 | 삼성디스플레이 주식회사 | 표시 장치 |
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KR102260090B1 (ko) | 2017-12-14 | 2021-06-03 | 주식회사 엘지화학 | 폴더블 디스플레이의 자외선 경화형 블랙 잉크 조성물 및 이를 이용한 베젤패턴의 형성방법 |
KR20190087694A (ko) * | 2018-01-15 | 2019-07-25 | 삼성디스플레이 주식회사 | 표시 장치 및 그 표시 장치의 제조 방법 |
CN108922981B (zh) * | 2018-07-19 | 2021-02-23 | 上海天马微电子有限公司 | 显示面板和显示装置 |
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JP6771367B2 (ja) | 2020-10-21 |
US20170244052A1 (en) | 2017-08-24 |
CN107103841B (zh) | 2021-05-14 |
EP3208297A1 (en) | 2017-08-23 |
KR20170098353A (ko) | 2017-08-30 |
CN107103841A (zh) | 2017-08-29 |
EP3208297B1 (en) | 2019-01-30 |
US10403834B2 (en) | 2019-09-03 |
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