JP2017144593A - Method for producing gas barrier film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a gas barrier film with very high gas barrier performance which can withstand a use such as a use in electronic paper, an organic EL display, or an illuminator.SOLUTION: The method for producing a gas barrier film is a method for producing a barrier film including an organic coating 3 on one surface or both surfaces of a substrate film 1 and a barrier layer 2 on one side of the organic coating layer. The method includes: a step of forming the organic coating layer on the one surface or both surfaces of the substrate film; a step of forming the gas barrier layer on the one side of the organic coating layer; and a step of performing heat treatment to thermally shrink the gas barrier film so that the thermal shrinkage of the gas barrier film (after heating at 150°C for 30 minutes) becomes less than 0.5%.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for producing a gas barrier film having extremely excellent gas barrier performance used for packaging for foods, pharmaceuticals, etc., and for electronic device members such as solar cells, electronic paper, organic EL displays and lighting.

  In general, a gas barrier film is formed on the surface of a plastic film as a base material by a physical vapor deposition method (PVD method) such as a vacuum deposition method, a sputtering method, an ion plating method, a plasma chemical vapor deposition method, or a thermochemical vapor deposition method. Metal oxides such as aluminum oxide, silicon oxide and magnesium oxide, nitrides such as aluminum nitride and silicon nitride, and carbonization using chemical vapor deposition (CVD) such as photochemical vapor deposition and photochemical vapor deposition A gas barrier layer which is an inorganic compound thin film such as a carbide such as silicon is formed.

  As a technology for producing a gas barrier film having particularly excellent gas barrier properties, for example, silicon oxide is mainly used by a plasma CVD method using a gas containing an organic silicon compound vapor and oxygen on a base film, and carbon, hydrogen, A method of improving gas barrier properties while maintaining transparency by forming a compound containing at least one kind of silicon and oxygen has been used (Patent Document 1).

  On the other hand, such a gas barrier film uses a sealing material and an adhesive, packaging materials such as foods and pharmaceuticals that require blocking of water vapor and oxygen, and electronic devices that require high moisture resistance (for example, organic thin films, Used for sealing CIGS-based flexible solar cells, organic EL displays, organic EL lighting, electronic paper, and the like.

  In the sealing step, an epoxy resin adhesive, an olefin hot melt material, or the like is used as the sealing material. Since this sealing process involves thermal lamination, crosslinking by UV irradiation after coating of the sealing material, and thermal crosslinking process, a thermal load is generated on the gas barrier film. In particular, in a gas barrier film that uses a plastic film produced through a heating and stretching process as a base material, when such a heat load is generated, the gas barrier film is in a state of being thermally contracted.

  Due to this shrinkage stress, there is a problem that distortion is generated in the entire sealing body, or stress cracking occurs in the barrier layer, which is a collection of minute inorganic compound crystals, resulting in a decrease in barrier properties. In addition, a stress difference due to a shrinkage difference between a base film having a large heat shrinkage and a gas barrier layer having a small heat shrinkage is generated, resulting in a problem that the interlayer adhesion strength is lowered.

JP 2011-201302 A

  The present invention aims to provide a method for producing a gas barrier film having an extremely high gas barrier performance that can withstand use in electronic paper, organic EL displays, lighting applications, and the like, and a sealing process with a thermal load using the gas barrier film The purpose of the invention is to prevent deformation of the sealing body due to heat shrinkage of the gas barrier film, reduction in gas barrier properties, and reduction in interlayer adhesion strength between the base film and the gas barrier layer.

  In order to solve the above problems, the present invention has the following configuration.

  1st invention is a manufacturing method of the barrier film which has an organic coating layer on the single side | surface or both surfaces of a base film, and has a barrier layer on one organic coating layer, Comprising: On the single side | surface or both surfaces of a base film The step (A) of forming an organic coating layer, the step (B) of forming a barrier layer on one organic coating layer, and the heat shrinkage rate of the gas barrier film after heat treatment (after heating at 150 ° C. for 30 minutes) And a step (C) of thermally shrinking to be less than 0.5%.

  2nd invention is the said invention, Comprising: A process (A) includes a process (C), It is characterized by the above-mentioned.

  3rd invention is said 1st or 2nd invention, Comprising: It has a process (C) after a process (B), It is characterized by the above-mentioned.

  4th invention is the invention in any one of said 1st-3rd, Comprising: The process (A1) which forms the organic coating layer (a1) in one surface of a base film, Step (A2) for forming an organic coating layer (a2) on the other surface of the base film in this order, and either or both of step (A1) and step (A2) include step (C) It is characterized by that.

  5th invention is 4th invention, Comprising: A process (A2) has the process of apply | coating an organic coating layer (a2), and the process of heat-drying, The said heat-drying process has a process (C). It is also characterized by serving.

  6th invention is 5th invention, Comprising: A process (A2) has an ultraviolet curing process after a heat-drying process, It is characterized by the above-mentioned.

  The seventh invention is any one of the first to sixth inventions, wherein the arithmetic average roughness (Ra1) of the organic coating layer (a1) is less than 1.5 nm, and the arithmetic of the organic coating layer (a2) The average roughness (Ra2) is 1.5 nm or more.

  The eighth invention is any one of the first to seventh inventions, and is characterized by having a barrier layer on the organic coating layer (a1).

  The ninth invention is any one of the first to eighth inventions, characterized in that the organic coating layers (a1, a2) are ultraviolet curable resin layers.

  A tenth invention is any one of the first to ninth inventions, wherein the barrier layer is a layer composed of a coexisting phase of zinc oxide, silicon dioxide, and aluminum oxide, and is measured by ICP emission spectroscopy. It is characterized by comprising a composition having an atomic concentration of 20 to 40 at%, a silicon atom concentration of 5 to 20 at%, an aluminum atom concentration of 0.5 to 5 at%, and an oxygen atom concentration of 35 to 70 at%.

  The present invention provides a method for producing a gas barrier film suitable for use in organic thin film solar cells, electronic paper, organic EL displays, lighting applications, etc., and the gas barrier film is used in a sealing process with a thermal load using the gas barrier film. It is possible to prevent deformation of the sealing body due to thermal contraction of the resin, a decrease in gas barrier properties, and a decrease in interlayer adhesion strength between the base film and the gas barrier layer.

Sectional configuration 1 of the gas barrier film. Sectional configuration 2 of the gas barrier film.

  First, an embodiment of a method for producing a gas barrier film according to the first invention is shown. Moreover, the example of the cross-sectional structure of the gas barrier film formed by this invention is shown to FIG.

  The present invention relates to a method for producing a barrier film having an organic coating layer on one side or both sides of a base film, and having a barrier layer on one organic coating layer. The base film is not particularly limited as long as it is a film made of an organic polymer compound. For example, polyolefin such as polyethylene or polypropylene, polyester such as polyethylene terephthalate or polyethylene naphthalate, polyamide, polycarbonate, polystyrene, polyvinyl alcohol, ethylene vinyl acetate A film made of various polymers such as a saponified copolymer, polyacrylonitrile, polyacetal and the like can be used. A film made of polyethylene terephthalate and polypropylene is preferable, and polyethylene terephthalate is most preferable in terms of transparency, toughness, and versatility. The polymer constituting the base film may be either a homopolymer or a copolymer, and may be used alone or blended. Although the film thickness can be arbitrarily selected up to about 3 to 188 μm, a thickness of 50 to 100 μm is suitable as a sealing application for electronic devices. In addition, the organic coating layer formed on one or both sides of the base film improves the smoothness of the base film surface, prevents film defects in the barrier layer, and improves the adhesion between the base film and the barrier layer. It is provided for the purpose or for the purpose of preventing oligomer precipitation from the substrate film. It is preferable to use a coating material such as epoxy, acrylic, polyester, or urethane as a material, and a thermosetting resin may be used, but an ultraviolet curable resin is preferable. As the diluent, an organic solvent such as IPA, MEK, or ethyl acetate can be used.

  The barrier layer formed in the present invention is preferably a metal or metal oxide, and is composed of at least one of zinc, silicon, aluminum, copper, tin, zinc oxide, silicon oxide, and aluminum oxide, but others But it can be used. In particular, it is a layer comprising a coexisting phase of zinc oxide, silicon dioxide and aluminum oxide, and the zinc atom concentration measured by ICP emission spectroscopy is 20 to 40 at%, the silicon atom concentration is 5 to 20 at%, and the aluminum atom concentration is A composition composed of 0.5 to 5 at% and an oxygen atom concentration of 35 to 70 at% is preferable. The reason why the above is preferable is that a very flexible and transparent amorphous barrier film can be formed, and the barrier layer can also expand and contract in response to the external force due to expansion and contraction of the base film itself.

  In the present invention, the step (A) of forming an organic coating layer on one or both sides of a base film means a step of forming an organic coating layer with a wet coating apparatus, and drying and curing of the coating material is heated. Although what consists only of a process may be sufficient, what is comprised by hardening with an ultraviolet irradiation process is the most desirable.

  As a means for applying the coating material, means such as gravure, reverse gravure, microgravure, and slit die are suitable.

  The step (B) of forming a barrier layer indicates a step of manufacturing the barrier layer 2 made of metal or metal oxide, and is processed by a dry coating apparatus having a vacuum exhaust equipment. CVD or multi-source deposition equipment is suitable, but a sputtering apparatus can be most preferably used.

  The thickness of the barrier layer formed in the barrier layer forming step (B) is preferably about 50 to 300 nm, and most preferably 100 to 200 nm. When the film thickness is thinner than 50 nm, the barrier property becomes unstable, and when it is thicker than 300 nm, the processing cost becomes high and the barrier film tends to be easily broken by bending.

  The step (C) of heat-shrinking so that the heat-shrink rate of the gas barrier film (after heating at 150 ° C. for 30 minutes) is less than 0.5% may be any step that can heat the film, and is wet. This is a coating process drying process, a process using an oven, a winding device having a heating furnace, or the like. The heat treatment temperature is in the range of 100 to 200 ° C, and the heating time is preferably in the range of about 1 second to 300 seconds, and more preferably in the range of about 150 seconds to 180 ° C and about 30 seconds to 120 seconds. The heat shrinkage rate (150 ° C., 30 minutes) of the barrier film after heating is preferably less than 0.5% in both the film running direction (MD direction) and the film width direction (TD direction).

  Next, an embodiment of the second invention is shown.

  The step (A) includes the step (C), and the heat treatment which is the step (C) is performed using the drying step of the wet coating apparatus included in the step (A). That is, the drying process temperature is set to a range of 100 to 200 ° C., and the drying process time is set to a range of about 1 second to 300 seconds. Further, the drying process temperature is preferably 150 to 180 ° C. and the drying process time is in the range of about 30 seconds to 120 seconds.

  Next, an embodiment of the third invention is shown.

  The step (C) is provided after the step (B). After the barrier layer is formed in the step (B), a heating step of the step (C) is provided again. The embodiment in each step is as in the first invention. The reason why this step is suitable is that a very flexible amorphous barrier film can be formed in step (B), and the barrier layer also expands and contracts in response to the external force due to the expansion and contraction of the base film itself. This is because it is possible.

  Next, an embodiment of the fourth invention is shown.

  This invention is a manufacturing method of the gas barrier film in any one of the above, Comprising: The process (A) forms the organic coating layer (a1) in one surface of a base film, A base film A step (A2) of forming an organic coating layer (a2) on the other surface of the substrate in this order, and either or both of the step (A1) and the step (A2) include the step (C). And

  According to the present invention, there is provided a method for producing a barrier film having the cross-sectional structure of FIG. 2, wherein the organic coating layers (a1) and (a2) are formed on both sides of the base film using the step (A) described in the first invention. And (a1) and (a2), respectively, and in the drying step of the wet coating equipment in step (A1) and step (A2), either or both of them are described in the first invention. And a heat treatment step according to step (C).

  In particular, the feature of this production method is that by providing organic coating layers (a1) and (a2) on both surfaces of the base film, oligomer precipitation from the base film can be prevented. It is possible to prevent the deterioration of sex.

  Next, an embodiment of the fifth invention is shown.

  This is because the step (A2) according to the fourth invention includes a step of applying the organic coating layer (a2) and a step of heating and drying, and the heating and drying step also serves as the step (C). The form of the step (A2) conforms to the step (A) in the first invention, and the conditions for the drying step are the forms of the step (C) in the first invention. In contrast to oligomer precipitation that is likely to occur during the heating process, the oligomer deposition can be particularly suppressed by carrying out the heating process of the process (C) in the process (A2) after the process (A1) has already been carried out. It is characterized by.

  Next, an embodiment of the sixth invention is shown.

This is a method for producing a gas barrier film according to the fifth invention, wherein the step (A2) has an ultraviolet curing step after the heat drying step. At this time, the drying process temperature is the heat treatment temperature of the process (C) described in the first invention. Thereafter, an ultraviolet lamp is irradiated in an ultraviolet curing step to cure the coating material of the organic coating layer. It is preferable to cure by irradiating in a range where the integrated light quantity is 0.01 to 10 J / cm ² . Even if the heat treatment of the step (C) is performed in the step (A2) by the present production method, the organic coating layer (a2) is not yet cured at the time of the heat shrinkage of the base film in the drying step. The organic coating layer (a2) can freely expand and contract in accordance with the film.

  Next, an embodiment of the seventh invention is shown.

  This is the invention according to any one of the first to sixth aspects, wherein the arithmetic average roughness (Ra1) of the organic coating layer (a1) is less than 1.5 nm, and the arithmetic average roughness of the organic coating layer (a2) (Ra2) is 1.5 nm or more. As a method for producing a gas barrier film, it has a surface having smoothness for exhibiting barrier properties and a surface having an increased surface roughness that can be stably wound up by eliminating the biting air layer during winding. Specifically, it is desirable to add inorganic particles such as spherical silica to the organic coating layer (a2) and not add it to the organic coating layer (a1).

  Next, an embodiment of the eighth invention is shown.

  This is any one of the first to seventh inventions, and is characterized in that a barrier layer is provided on the organic coating layer (a1), and the step (B) is performed on the smooth surface of the organic coating layer (a1). ), A good barrier layer can be stably obtained.

  Next, an embodiment of the ninth invention is shown.

  This is one of the first to eighth inventions, wherein the organic coating layers (a1, a2) are ultraviolet curable resin layers. The organic coating layer material is preferably formed using a resin coating material such as epoxy, acrylic, polyester, or urethane.

  Next, an embodiment of the tenth invention is shown.

  This is one of the first to ninth inventions, wherein the barrier layer is a layer composed of a coexisting phase of zinc oxide, silicon dioxide, and aluminum oxide, and the zinc atom concentration measured by ICP emission spectroscopy is It is characterized by comprising 20 to 40 at%, a silicon atom concentration of 5 to 20 at%, an aluminum atom concentration of 0.5 to 5 at%, and an oxygen atom concentration of 35 to 70 at%. Thereby, a very flexible and transparent amorphous barrier film can be formed. This is because the barrier layer can also expand and contract in response to the external force due to expansion and contraction of the base film itself.

  Hereinafter, although the specific example of the manufacturing method of the gas barrier film of this invention is demonstrated, this invention is not limited to these Examples.

(Evaluation method)
(1) Water vapor permeability of gas barrier film (g / m ² · 24h)
It was produced by the method for producing a gas barrier film of the present invention using a water vapor transmission rate measuring device “DELTATAPERM” manufactured by Technolox in the UK under conditions of a temperature of 40 ° C., a relative humidity of 90%, and a measurement area of 50 cm ² . The water vapor transmission rate of the gas barrier film was measured. The number of samples was 2 samples per level, the number of measurements was 5 times for each sample, and the average of the 10 points obtained was the water vapor transmission rate (g / m ² · 24 h).

(2) Evaluation and judgment After the barrier layer 2 is formed, the rate of change in the water vapor transmission rate after the heat treatment is less than 2 based on the water vapor transmission rate at the time of forming the barrier layer 2 for the heat treatment. A thing with the practical characteristic of the gas barrier film having passed the thing, and 2 or more were made unsuccessful. Moreover, what formed the barrier layer 2 after heat processing set the barrier value to 1 * 10 < ^-3 > g / m < ² > 24h or less to pass, and let the above be disqualified.

  Moreover, when the polyimide film was laminated using this barrier film and the heat shrink wrinkle was generated, the practical properties were rejected.

(Example 1)
Processed to form the cross-sectional structure of FIG. The base film 1 was a polyethylene terephthalate film (“Lumirror” (registered trademark) U48 manufactured by Toray Industries, Inc.) having a thickness of 100 μm. The organic coating layer 3 was gravure coated thereon with a wet coating coater to a thickness of 1 μm. The coating solution used was “Unidic” (registered trademark) RC29-124 (urethane acrylate-based UV curable film coating agent) manufactured by DIC Corporation, adjusted to 50% by mass of NV (solid content concentration) with MEK. After drying at 100 ° C. for 1 minute in the drying process, the film was cured by irradiation with an integrated light amount of 0.5 J / cm ² using an ultraviolet lamp in the curing process. The arithmetic average roughness of the organic coating layer 3 was Ra = 1.0 nm.
Thereafter, the barrier layer 2 was formed. The barrier layer 2 is formed using a sputtering apparatus holding a target obtained by sintering a mixture of zinc oxide / silicon dioxide / aluminum oxide, and the barrier film composition is a zinc atom concentration of 30.0 at% and a silicon atom concentration of 10. A film having 0 at%, aluminum atom concentration of 2.0 at%, and oxygen atom concentration of 58.0 at% was formed. The thickness of the barrier layer was 150 nm. The water vapor transmission rate in this state was 5 × 10 ⁻⁴ g / m ² · 24 h.

Next, the barrier film was again heat-treated at an environmental temperature of 180 ° C. for 30 seconds in the drying process of the wet coating coater, and then cooled to room temperature. The water vapor transmission rate thereafter was 5.5 × 10 ⁻⁴ g / m ² · 24 h (change rate 1.1), and the thermal shrinkage rate after the barrier film was treated at 150 ° C. for 30 minutes was a maximum of 0. 3%.

  Thereafter, the barrier film and a polyimide film (“Kapton” (registered trademark) 500V manufactured by Toray DuPont Co., Ltd.) simulating the object to be sealed were roll laminated using a hot melt. Asahi Chemical Synthesis Co., Ltd. Asahimelt TC10 was used as the hot melt, and the roll temperature was 150 ° C. As a result, the heat shrinkage wrinkle of the laminate film did not occur, and a flat and good laminate product was obtained.

(Example 2)
In the manufacturing process of Example 1, the drying process at the time of forming the organic coating layer 3 was performed under the condition of 180 ° C. and 30 seconds, and both drying and heat treatment were performed. Thereafter, the barrier film 2 was formed in the same manner as in Example 1, and the subsequent heating step was omitted. In this state, the water vapor transmission rate was 5 × 10 ⁻⁴ g / m ² · 24 h. Moreover, the heat shrinkage rate after processing at 150 ° C. for 30 minutes was 0.3% at the maximum. Thereafter, laminating was carried out in the same manner as in Example 1. However, heat shrinkage and wrinkle did not occur in the laminate film, and a flat and good laminate product was obtained.

(Example 3)
A barrier film was processed in the configuration of FIG. A base film 1 similar to that in Example 1 was used, and an organic coating layer 3 similar to that in Example 1 was formed thereon. Subsequently, as an organic coating layer 4 on the opposite surface, a gravure coating was applied to a thickness of 1 μm using a coating material similar to the organic coating layer 3 to which 8% by mass of the following surface-treated silica particle dispersion was added in terms of solid content. The drying process and curing process conditions were the same. The arithmetic average roughness of the organic coating layer 4 obtained by this result was Ra = 5.0 nm. Thereafter, the barrier layer 2 was formed on the organic coating layer 3 in the same manner as in Example 1. In this state, the water vapor transmission rate was 5 × 10 ⁻⁴ g / m ² · 24 h. After the formation of the barrier layer 2, a heating process at 180 ° C. for 30 seconds was performed in the same manner as in Example 1 and cooled to room temperature. The water vapor transmission rate thereafter was 5.5 × 10 ⁻⁴ g / m ² · 24 h (change rate 1.1), and the thermal shrinkage rate after the barrier film was treated at 150 ° C. for 30 minutes was a maximum of 0. 3%. Thereafter, laminating was carried out in the same manner as in Example 1. However, heat shrinkage and wrinkle did not occur in the laminate film, and a flat and good laminate product was obtained.

<Surface treatment silica particle dispersion>
70 parts by weight of colloidal silica (“organosilica sol IPA-STZL” manufactured by Nissan Chemical Industries, Ltd.) is mixed with 13.7 parts by weight of methacryloxypropyltrimethoxysilane and 1.7 parts by weight of a 10% by weight formic acid aqueous solution. Stir at 1 ° C. for 1 hour. Then, fluorine compounds _{(H 2 C = CH-COO} -CH 2 - (CF 2) 8 F) After adding 13.8 parts by mass and 0.57 parts by weight of 2,2-azobisisobutyronitrile, 60 A dispersion was obtained by heating and stirring at 90 ° C. for minutes.

Example 4
In the manufacturing process of Example 3, the drying process condition of the organic coating layer 4 was 180 ° C. for 30 seconds, and the other processes until the formation of the barrier layer 2 were the same. The heat treatment after the formation of the barrier layer 2 was omitted. In this state, the water vapor transmission rate was 5 × 10 ⁻⁴ g / m ² · 24 h. Moreover, the heat shrinkage rate after processing at 150 ° C. for 30 minutes was 0.3% at the maximum. Thereafter, laminating was carried out in the same manner as in Example 1. However, heat shrinkage and wrinkle did not occur in the laminate film, and a flat and good laminate product was obtained.

(Example 5)
In the manufacturing process of Example 3, the drying process conditions for the machine coating layers 3 and 4 were 180 ° C. for 30 seconds, and the other processes until the formation of the barrier layer 2 were the same. The heat treatment after the formation of the barrier layer 2 was omitted. In this state, the water vapor transmission rate was 5 × 10 ⁻⁴ g / m ² · 24 h. Further, the heat shrinkage rate after treatment at 150 ° C. for 30 minutes was 0.2% at the maximum. Thereafter, laminating was carried out in the same manner as in Example 1. However, heat shrinkage and wrinkle did not occur in the laminate film, and a flat and good laminate product was obtained.

Example 6
In the manufacturing process of Example 1, the means for forming the barrier layer 2 was the same, the target material of the sputtering apparatus was zinc oxide, and the barrier layer 2 was a zinc oxide layer. The water vapor transmission rate measured in this state was 5 × 10 ⁻³ g / m ² · 24 h. Then, when the heat processing similar to Example 1 was implemented, the vapor | steam permeability | transmittance was 8 * 10 < ^-3 > g / m < ² > * 24h (change rate 1.6). Moreover, the heat shrinkage rate after processing at 150 ° C. for 30 minutes was 0.3% at the maximum. Thereafter, laminating was carried out in the same manner as in Example 1. However, heat shrinkage and wrinkle did not occur in the laminate film, and a flat and good laminate product was obtained.

(Comparative Example 1)
Up to the barrier layer 2 was formed in the manufacturing process of Example 1. In this state, the water vapor transmission rate was 5 × 10 ⁻⁴ g / m ² · 24 h. Further, the heat shrinkage rate after treatment at 150 ° C. for 30 minutes was 1.0% at the maximum. After that, laminating was performed in the same manner as in Example 1 without performing heat treatment. As a result, heat shrinkage wrinkles were generated, and the laminate film was in a wavy state. Judgment failed (Comparative Example 2)
The barrier layer 2 was formed on the surface of the base film 1 without providing the organic coating layer 3 in the production process of Example 1. The arithmetic average roughness of the surface of the base film 1 was Ra = 50 nm. In this state, the water vapor transmission rate was 5 × 10 ⁻³ g / m ² · 24 h. Thereafter, was subjected to a similar heat treatment as in Example 1, a vapor transmittance was ^{5 × 10 -2 g / m 2} · 24h ( rate of change 10). Since the water vapor transmission rate was poor and the rate of change after heat treatment was 10, the determination was rejected.

  Since the metal or metal oxide laminated plastic film produced by the method of the present invention is excellent in gas barrier performance such as water vapor and oxygen, it can be used for display elements such as solar cells and organic EL displays. For example, in an organic thin-film solar cell, an organic thin-film solar cell with a small decrease in power generation performance is provided by sandwiching a light-emitting layer from one side or both sides with a metal or metal oxide laminated plastic film according to the present invention. Can do. Further, in the organic EL display, an organic EL display with a small decrease in light emission characteristics can be provided by sandwiching the light emitting layer from one side or both sides with the metal or metal oxide laminated plastic film according to the present invention.

1 Base film 2 Barrier layer 3 and 4 Organic coating layer

Claims (10)

A method for producing a barrier film having an organic coating layer on one or both sides of a base film and having a barrier layer on one organic coating layer, wherein the organic coating layer is formed on one or both sides of the base film The step (A), the step (B) of forming a barrier layer on one organic coating layer, and the heat shrinkage rate of the gas barrier film after heating (after heating at 150 ° C. for 30 minutes) is less than 0.5%. And a step (C) of thermally shrinking the gas barrier film. The method for producing a gas barrier film according to claim 1, wherein the step (A) includes the step (C). The manufacturing method of the gas barrier film of Claim 1 or 2 which has the said process (C) after the said process (B). The step (A) includes a step (A1) of forming an organic coating layer (a1) on one surface of the base film and a step (A2) of forming an organic coating layer (a2) on the other surface of the base film. The gas barrier film according to any one of claims 1 to 3, wherein any one or both of the step (A1) and the step (A2) include the step (C). Manufacturing method. The said process (A2) has the process of apply | coating an organic coating layer (a2), and the process of heat-drying, The said heat-drying process serves as the said process (C), It is characterized by the above-mentioned. Of manufacturing a gas barrier film. The method for producing a gas barrier film according to claim 5, wherein the step (A2) includes an ultraviolet curing step after the heat drying step. The arithmetic average roughness (Ra1) of the organic coating layer (a1) is less than 1.5 nm, and the arithmetic average roughness (Ra2) of the organic coating layer (a2) is 1.5 nm or more. The manufacturing method of the gas barrier film in any one of Claims 1-6. The method for producing a gas barrier film according to any one of claims 1 to 7, further comprising a barrier layer on the organic coating layer (a1). The method for producing a gas barrier film according to any one of claims 1 to 8, wherein the organic coating layer (a1, a2) is an ultraviolet curable resin layer. The barrier layer is a layer comprising a coexisting phase of zinc oxide, silicon dioxide, and aluminum oxide, and the zinc atom concentration measured by ICP emission spectroscopy is 20 to 40 at%, the silicon atom concentration is 5 to 20 at%, aluminum The method for producing a barrier film according to any one of claims 1 to 9, wherein the barrier film is composed of a composition having an atomic concentration of 0.5 to 5 at% and an oxygen atomic concentration of 35 to 70 at%.