JP5982904B2 - Gas barrier laminate film and method for producing gas barrier laminate film - Google Patents

Description

  The present invention relates to a transparent gas barrier laminate film that is suitably used when high gas barrier properties are required in the fields of packaging of foods, daily necessities, pharmaceuticals, etc., and fields related to electronic devices. .

  Packaging materials used for packaging of food, daily necessities, pharmaceuticals, etc., and packaging materials used for electronic equipment-related materials, etc., to prevent deterioration of the contents and to retain their functions and properties even during packaging In addition, it is necessary to prevent the influence of gases such as oxygen and water vapor that permeate the packaging material, which alters the contents, and it is required to have gas barrier properties that block these gases.

  As packaging materials having ordinary gas barrier properties, vinylidene chloride resin films or films coated with vinylidene chloride resins that are relatively excellent in gas barrier properties have been often used. However, these packaging materials have high gas barrier properties. Cannot be used for packaging that requires Therefore, when a high gas barrier property is required, a packaging material in which a metal foil such as aluminum is laminated as a gas barrier layer has to be used.

  A packaging material in which a metal foil such as aluminum is laminated has almost no influence of temperature and humidity and has a high gas barrier property. However, these packaging materials have many disadvantages, such as being unable to see the contents through them, having to be disposed of as non-combustible materials after use, and being unable to use metal detectors to inspect the contents. Had.

  As a packaging material that overcomes these drawbacks, Patent Document 1 discloses that a gas barrier layer is formed by depositing a thin film layer of a transparent inorganic oxide such as silicon oxide, aluminum oxide, or magnesium oxide on a base layer made of a transparent plastic film. In addition, a laminated film obtained by laminating an appropriate gas barrier coating layer thereon is disclosed.

  In recent years, with the development of electronic paper and organic EL displays expected as next-generation FPDs (flat panel displays), there is a demand to replace glass substrates with plastic films in order to achieve flexibility in these FPDs. Is growing.

  The glass substrate has a gas barrier property required to suppress deterioration of internal elements due to oxygen and water vapor derived from the environment. However, the above-described gas barrier film for packaging materials does not reach the barrier level, and in electronic paper, organic EL display, etc. to which a plastic film can be applied, it is 100 to 10,000 times as large as a food packaging barrier film. It is said that gas barrier properties are necessary.

  In order to realize such a plastic film having a high gas barrier property, it is formed by a dry coating method such as a reactive vapor deposition method using electron beam vapor deposition or induction heating vapor deposition, a sputtering method, or a plasma chemical vapor deposition (CVD) method. Inorganic oxide thin films have been studied as those that can be expected to exhibit high gas barrier properties.

  However, even if the dry coating method is used, if a dense film is obtained in order to aim at high gas barrier properties, a high-temperature process is required, or the stress in the film tends to increase due to the denseness. is there. For this reason, it is difficult to obtain a dense film within the usable temperature range of the plastic film, or problems such as poor adhesion and cracking due to the large difference in thermal expansion coefficient between the plastic film and the inorganic oxide thin film. And high gas barrier properties are not easily developed.

  Among them, a silicon oxide thin film formed by a plasma CVD method using an organosilane compound has been studied as a barrier layer exhibiting a high gas barrier property. Patent Document 2 controls the carbon concentration and the composition of the silicon oxide thin film. As a result, it has been reported that adhesion and transparency are improved.

Japanese Patent Laid-Open No. 7-164591 Japanese Patent Laid-Open No. 11-322981

  However, the silicon oxide thin film described in Patent Document 2 is described as being slightly inferior in water vapor barrier properties, and is particularly suitable for FPDs such as electronic paper, LCD (liquid crystal display), and organic EL displays that require high gas barrier properties. As such, the gas barrier properties are insufficient.

An object of the present invention is to provide a transparent gas barrier laminated film that can be suitably used in the fields of packaging of foods, daily necessities, pharmaceuticals, etc. and fields related to electronic equipment, especially when high gas barrier properties are required. There is to do.
Furthermore, the object of the present invention is to solve the problem of insufficient gas barrier properties for FPDs such as the above-mentioned electronic paper, LCD, and organic EL display, and is a transparent gas barrier laminate having excellent water vapor barrier properties. To provide a film.

  As means for solving the above problems, the invention according to claim 1 is characterized in that an anchor layer (hereinafter referred to as “first anchor layer”) and silicon oxide are formed on one side of a base material layer made of a plastic film. A gas barrier layer (hereinafter referred to as a “first gas barrier layer”), an anchor layer (hereinafter referred to as a “second anchor layer”) on the gas barrier layer, and a gas barrier layer (hereinafter referred to as “a second anchor layer”). The gas barrier laminate film is formed in order, and the arithmetic average roughness (Ra) of the surfaces of the first and second anchor layers is 5 nm or less. A coating layer containing an inorganic filler is provided on the surface of the layer on which the gas barrier layer is not laminated, and the arithmetic average roughness (Ra) of the surface of the coating layer is 100 nm or more.

  The invention according to claim 2 is the gas barrier laminate film according to claim 1, wherein the inorganic filler has a particle size of 30 nm to 300 nm, and the inorganic filler is 1.25% by mass in the coating layer. It is contained at a ratio of 25% by mass or less.

  The invention according to claim 3 is the gas barrier laminate film according to claim 1 or 2, wherein the thicknesses of the first and second anchor layers are 20 nm or more and 1000 nm or less, respectively. To do.

  The invention according to claim 4 is the gas barrier laminate film according to any one of claims 1 to 3, wherein the arithmetic average roughness (Ra) of the surfaces of the first and second anchor layers is as follows. Is 3 nm or less.

  The invention according to claim 5 is the gas barrier laminate film according to any one of claims 1 to 4, wherein the first and second anchor layers are formed of at least a polyol and an isocyanate compound. It is characterized by being made.

  The invention according to claim 6 is the gas barrier laminate film according to any one of claims 1 to 5, wherein the first and second gas barrier layers each have a thickness of 10 nm to 1000 nm. It is characterized by being.

  The invention according to claim 7 is the gas barrier laminate film according to any one of claims 1 to 6, wherein the spectral transmittance at 400 nm or more and 1000 nm or less is 85% or more. To do.

  In the invention according to claim 8, the first anchor layer, the first gas barrier layer made of silicon oxide, and the second gas barrier layer are formed on one side of the base material layer made of a plastic film. In the method for producing a gas barrier laminate film in which the anchor layer and the second gas barrier layer made of silicon oxide are sequentially formed, the arithmetic average roughness (Ra) of the surface is 5 nm or less on one side of the base material layer. The step of forming the first anchor layer, the step of forming the first gas barrier layer on the surface of the first anchor layer, and the arithmetic average roughness (Ra) of the surface on the surface of the first gas barrier layer A step of forming a second anchor layer of 5 nm or less, a step of forming a second gas barrier layer on the surface of the second anchor layer, and a surface of the base material layer on which the gas barrier layer is not laminated, Co containing inorganic filler The coating agent, the arithmetic average roughness (Ra), characterized in that it comprises a step of forming a coating layer is 100nm or more.

  The invention according to claim 9 is the method for producing a gas barrier laminate film according to claim 8, wherein the particle size of the inorganic filler is 30 nm or more and 300 nm or less, and the inorganic filler is 0 with respect to the coating agent. It is contained in the ratio of 5 mass% or more and 10 mass% or less.

  The invention according to claim 10 is the method for producing a gas barrier laminate film according to claim 8 or 9, wherein the first and second anchor layers, the first and second gas barrier layers, and the coating layer are provided. Is formed by a roll-to-roll method.

  The invention according to claim 11 is the method for producing a gas barrier laminate film according to any one of claims 8 to 10, wherein the first and second anchor layers are at least a polyol and an isocyanate compound. It is characterized by being formed by applying an anchor agent containing

  The invention according to claim 12 is the method for producing a gas barrier laminate film according to any one of claims 8 to 11, wherein the first and second gas barrier layers are formed by plasma chemical vapor deposition (CVD). It is formed by the law.

  The gas barrier laminate film of the present invention and the production method thereof are provided on one side of a base material layer made of a plastic film, on a first anchor layer, a first gas barrier layer made of silicon oxide, and further on the first gas barrier layer. By comprising the structure in which the second anchor layer and the second gas barrier layer made of silicon oxide are sequentially formed, the small defect in the single gas barrier layer is complemented, and the gas barrier layer is protected, A gas barrier laminate film having a high gas barrier property that can be adapted to FPD applications can be obtained.

  At this time, by setting the arithmetic average roughness (Ra) of the surfaces of the first and second anchor layers to 5 nm or less, it is possible to obtain a gas barrier laminate film that stably exhibits excellent gas barrier properties. it can.

  Furthermore, a coating layer containing an inorganic filler formed by applying a coating containing 0.5 to 10% by mass of an inorganic filler having a particle size of 30 to 300 nm on the surface of the base material layer on which the gas barrier layer is not formed The arithmetic average roughness (Ra) of the surface of the coating layer is set to 100 nm, so that the front and back surfaces of the film can be prevented from blocking during the intermediate process and can be stably produced. In particular, when the inorganic filler having a particle size of 30 nm to 300 nm is contained in the coating layer at a ratio of (0.5) mass% to (10) mass%, the above effect is further exhibited.

  Further, when the thicknesses of the first and second anchor layers are set to 20 nm or more and 1000 nm or less, respectively, it is possible to ensure that the Ra of the coated surface of the anchor layer is stably reduced, and an excessive film thickness. There is an effect of preventing the resulting decrease in adhesion.

  Further, when the arithmetic average roughness (Ra) of the surfaces of the first and second anchor layers is 3 nm or less, there is an effect of further improving the gas barrier property of the gas barrier layer.

  Further, when the first and second anchor layers are formed by applying an anchor agent containing at least a polyol and an isocyanate compound, excellent gas barrier properties are stably exhibited.

  Further, when the thicknesses of the first and second gas barrier layers are 10 nm or more and 1000 nm or less, excellent gas barrier properties are stably exhibited.

  Further, when the spectral transmittance at 400 nm or more and 1000 nm or less is 85% or more, the visible light transmittance is good, and it can also be used for applications requiring transparency.

  In addition, when the first and second anchor layers, the first and second gas barrier layers, and the coating layer are formed by a roll-to-roll method, production efficiency is good. Stable quality gas barrier laminate films can be produced efficiently.

  Further, when the first and second gas barrier layers are formed by a plasma chemical vapor deposition (CVD) method, excellent gas barrier properties are stably exhibited.

FIG. 1 is a schematic cross-sectional view showing a cross-sectional configuration in one embodiment of a gas barrier laminate film according to the present invention.

  Hereinafter, the best mode for carrying out a gas barrier laminate film according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a cross-sectional configuration in one embodiment of a gas barrier laminate film according to the present invention. On the base material layer (1), a first anchor layer (2), a first gas barrier layer (3) made of silicon oxide, a second anchor layer (4), and a second gas barrier layer made of silicon oxide. (5) are sequentially stacked. Moreover, the coating layer (7) is laminated | stacked on the side which does not laminate | stack the 1st gas barrier layer (3) and the 2nd anchor layer (4) of a base material layer (1).

[Substrate layer (1)]
In the gas barrier laminate film (6) of the present invention, the substrate layer (1) is made of a transparent plastic film. Examples of transparent plastic films include polyester films such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyolefin films such as polyethylene and polypropylene, polyether sulfone (PES), polystyrene films, polyamide films, and polyvinyl chloride. Films, polycarbonate films, polyacrylonitrile films, polyimide films, biodegradable plastic films such as polylactic acid, and the like are used.

  These transparent plastic films may be either stretched or unstretched, but those having excellent mechanical strength and dimensional stability are preferred. In particular, from the viewpoints of heat resistance and dimensional stability, polyethylene terephthalate stretched biaxially is preferably used as the packaging material.

  Furthermore, polyethylene naphthalate, polyether sulfone, polycarbonate, and the like are preferably used for FPDs such as LCDs and organic EL displays that require high heat resistance and dimensional stability.

  Moreover, the transparent plastic film may contain additives such as an antistatic agent, an ultraviolet ray preventing agent, a plasticizer, and a lubricant. Further, in the transparent plastic film, the surface on the side where other layers are laminated may be subjected to corona treatment, low temperature plasma treatment, ion bombardment treatment, chemical treatment, solvent treatment, etc. in order to improve adhesion. .

  The thickness of the base material layer (1) made of these transparent plastic films is not particularly limited. However, considering the suitability as a packaging material and the workability when other layers are laminated, it is practical. Specifically, it is preferably in the range of 3 μm or more and 200 μm or less, particularly in the range of 6 μm or more and 30 μm or less. It is preferably in the range of 25 μm or more and 200 μm or less.

[Coating layer (7)]
In the gas barrier laminate film (6) of the present invention, particularly when it is produced by a roll-to-roll method, if smooth surfaces with small arithmetic average roughness (Ra) of the surfaces come into contact with each other, blocking occurs and scratches or films There is a possibility of gas barrier deterioration due to peeling. In order to prevent blocking, Ra of the surface of the base material layer (1) that comes into contact with the first anchor layer (2) described later, that is, the surface of the base material layer (1) on the side where the gas barrier layer is not laminated is 100 nm or more. Preferably there is. Ra of the surface of the substrate (1) can be adjusted by applying a coating agent containing an inorganic filler to form the coating layer (7).

  The inorganic filler contained in the coating agent preferably has a particle size of 30 nm to 300 nm, more preferably 80 nm to 200 nm. If the particle size is smaller than 30 nm, it is difficult to adjust Ra of the surface of the base material layer (1) in contact with the first anchor layer (2) to 100 nm or more, so that the effect of preventing blocking becomes small. If it is larger than 300 nm, the transparency of the substrate layer (1) may be impaired.

  Moreover, it is preferable that the inorganic filler is contained in a ratio of 0.5% by mass or more and 10% by mass or less, more preferably 2% by mass or more and 6.5% by mass or less with respect to the coating agent. When the amount of the inorganic filler contained in the coating agent is less than 0.5% by mass, it is difficult to adjust the Ra of the surface of the base material layer (1) to 100 nm or more. When it is more than mass%, the transparency of the base material layer (1) may be impaired. When forming a coating layer (7) with this coating agent, it is preferable that an inorganic filler is contained in the coating layer (7) in the ratio of 1.25 mass% or more and 25 mass% or less. When the inorganic filler contained in the coating layer (7) is less than 1.25% by mass, it is difficult to adjust the Ra of the surface of the base material layer (1) to 100 nm or more, so the effect of preventing blocking is reduced. On the other hand, when it is more than 25% by mass, the transparency of the base material layer (1) may be impaired.

  As the inorganic filler, silicon oxide, aluminum oxide, calcium oxide, calcium carbide and the like are preferably used. In addition to the inorganic filler, the coating agent includes a known binder resin such as polyurethane resin and epoxy resin, and a known solvent such as toluene and MEK (methyl ethyl ketone).

  The coating layer (7) is coated on the substrate layer (1) using a known coating method such as dipping method, roll coating method, gravure coating method, die coating method, air knife coating method, comma coating method, etc. And the like, and the coating film is dried and cured. Since it is efficient and the production cost can be reduced, it is preferable to manufacture by a roll-to-roll method.

[About the first anchor layer (2) and the second anchor layer (4)]
The role of the first anchor layer (2) in the gas barrier laminate film (6) of the present invention is formed on the first anchor layer (2) by smoothing the surface of the base material layer (1). The first gas barrier layer (3) exhibits excellent gas barrier properties. The role of the second anchor layer (4) is to smooth the surface of the first gas barrier layer (3) to thereby form the second gas barrier layer (5) formed on the second anchor layer (4). Expresses excellent gas barrier properties.

  Ra of the surface of the first anchor layer (2) and the second anchor layer (4) is preferably 5 nm or less, and more preferably 3 nm or less. When the Ra of the surface of the first anchor layer (2) and the second anchor layer (4) is larger than 5 nm and a gas barrier layer is formed on a non-smooth surface, a uniform film cannot be formed and sufficient gas barrier properties are obtained. Not expressed. Therefore, when the surface of the base material layer (1) is smoothed by the first anchor layer (2), Ra needs to be 5 nm or less.

  In addition, it is surface smoothness of a micro area that contributes to the expression of excellent gas barrier properties, and the above-mentioned Ra is preferably measured in an area of several μm to several hundred μm. For example, using a scanning probe microscope, It can be measured in tapping mode.

  The film thicknesses of the first anchor layer (2) and the second anchor layer (4) are preferably 20 nm or more and 1000 nm or less. If the film thickness is less than 20 nm, it is difficult to form a uniform film and a sufficient smoothing function cannot be exhibited. On the other hand, when the film thickness exceeds 1000 nm, it becomes difficult to control the optical characteristics of the gas barrier laminate, and the internal stress at the time of curing the anchor layer works excessively, which may reduce the adhesion.

  The first anchor layer (2) and the second anchor layer (4) are formed using a known coating method such as a dipping method, a roll coating method, a gravure coating method, a die coating method, an air knife coating method, or a comma coating method. It can be obtained by coating the base material layer (1) or the first gas barrier layer (3), then removing the solvent and drying / curing the coating film. In particular, in order to form a smooth anchor layer, it is preferable to use a die coating method or a gravure coating method. In addition, since it is efficient and can reduce the production cost, it is preferable to manufacture by a roll-to-roll method.

  In the gas barrier laminate film (6) of the present invention, the first anchor layer (2) and the second anchor layer (4) are composed of polyols such as acrylic polyol and polyester polyol, TDI (tolylene diisocyanate), HDI ( An anchor agent in which an isocyanate compound such as hexamethylene diisocyanate) is mixed at an arbitrary mixing ratio is prepared, and the anchor agent is coated on the base layer (1) or the first gas barrier layer (3). The anchor agent may be diluted to an arbitrary concentration by adding a solvent such as toluene or MEK (methyl ethyl ketone).

[About the first gas barrier layer (3) and the second gas barrier layer (5)]
In the gas barrier laminate film (6) of the present invention, the first gas barrier layer (3) and the second gas barrier layer (5) preferably have a thickness of 10 nm or more and 100 nm or less, respectively. If the film thickness is less than 10 nm, the function as a gas barrier material cannot be sufficiently achieved, and if it exceeds 100 nm, the gas barrier layer tends to crack, and the optical properties of the gas barrier laminate film (6) are controlled. It becomes difficult.

  In the gas barrier laminate film (6) of the present invention, the method for forming the first gas barrier layer (3) and the second gas barrier layer (5) is not particularly limited, but the substrate layer (1) In order to form a gas barrier layer made of silicon oxide on the surface in vacuum and to exhibit high gas barrier properties, plasma chemical vapor deposition (CVD) is currently preferred, and one side of the base material layer made of the plastic film Or it can form into a film on both surfaces. Further, it is possible to perform continuous vapor deposition by a roll-to-roll method utilizing the characteristics of the plastic substrate, and it is preferable to use a roll-up vacuum deposition apparatus. As the plasma generator, a low-temperature plasma generator such as direct current (DC) plasma, low-frequency plasma, high-frequency plasma, pulse wave plasma, tripolar plasma, or microwave plasma is used.

  The gas barrier layer made of silicon oxide laminated by the plasma CVD method can be formed using a silane compound having carbon in the molecule and oxygen gas as raw materials, and can be formed by adding an inert gas to the raw materials. it can. Examples of silane compounds having carbon in the molecule include tetraethoxysilane (TEOS), tetramethoxysilane (TMOS), tetramethylsilane (TMS), hexamethyldisiloxane (HMDSO), tetramethyldisiloxane, and methyltrimethoxysilane. A relatively low molecular weight silane compound may be selected, and one or more of these silane compounds may be selected.

  In the film formation by the plasma CVD method, the silane compound vaporized and mixed with oxygen gas is introduced between the electrodes, and the plasma is formed by applying electric power with a low temperature plasma generator, and the first anchor layer (2). And a second anchor layer (4). Further, in the plasma CVD method, the film quality of the gas barrier layer made of silicon oxide can be changed by various methods, and the composition ratio of the oxygen component and the carbon component of the gas barrier layer can be relatively easily increased and decreased. Effective methods include changing the silane compound and the gas type, mixing ratio of the silane compound and oxygen gas, and increasing or decreasing the applied power.

  When the gas barrier laminate film (6) of the present invention is used for a surface protection sheet or FPD of a solar cell module, high light transmittance is required. Therefore, the spectral transmittance of the gas barrier laminate film at 400 nm to 1000 nm is 85% or more. It is preferable that it is 90% or more.

  Hereinafter, the gas barrier laminate film according to the present invention will be further described with reference to Examples and Comparative Examples, but the present invention is not limited to the following examples.

<Example 1>
As a base material layer (1), a coating agent containing 1.2% by mass of an inorganic filler made of silicon oxide having a particle size of 150 nm is applied on one side, and the other side is untreated polyethylene terephthalate (PET) having a thickness of 100 μm. A film was prepared. At this time, the surface arithmetic average roughness (Ra) of the coating layer (7) formed by coating was 700 nm. On the untreated surface of the film, acrylic polyol and hexamethylene diisocyanate (HDI) are mixed at an NCO ratio of 6: 4, and the anchor agent diluted to 10% solids with MEK (methyl ethyl ketone) is coated by the die coating method, then dried and cured Thus, a first anchor layer (2) having a thickness of 50 nm was formed. At this time, Ra of the first anchor layer (2) was 3 nm.

  Subsequently, using a plasma CVD method, a mixed gas of hexamethyldisiloxane (HMDSO) / oxygen = 10/100 sccm is introduced between the electrodes, electric power is applied to 0.5 kW to form plasma, and the first anchor layer (2) A first gas barrier layer (3) made of silicon oxide and having a thickness of 60 nm was formed thereon. Next, a second anchor layer (4) having a thickness of 50 nm was formed in the same manner as the first anchor layer (2). At this time, Ra of the second anchor layer (4) was 4 nm. Subsequently, a second gas barrier layer (5) having a thickness of 60 nm was formed in the same manner as the first gas barrier layer (3). In addition, it laminated | stacked using the rolling (Roll to Roll) system from the 1st anchor layer (2) to the 2nd gas barrier layer. Thus, the gas barrier laminate film of Example 1 was produced.

<Example 2>
In the gas barrier laminate film of Example 1, a first anchor layer (2) and a second anchor layer (4) having a thickness of 100 nm were formed. At this time, Ra of the first anchor layer (2) was 1 nm, and Ra of the second anchor layer (4) was 2 nm. Otherwise, the gas barrier laminate film of Example 2 was produced in the same manner as Example 1.

<Comparative Example 1>
In the gas barrier laminate film of Example 1, as a base material layer (1), a coating layer (7) was formed on one side, and the opposite side was used untreated polyethylene naphthalate (PEN) as a base material. In the same manner as in Example 1, a gas barrier laminate film of Comparative Example 1 was produced. At this time, Ra on the surface of the coating layer (7) was 20 nm.

<Comparative example 2>
The gas barrier property of Comparative Example 2 was the same as that of Comparative Example 1 except that polyethylene naphthalate (PEN) having a Ra of 5 nm on the surface of the coating layer (7) was used as the base material in the gas barrier laminated film of Comparative Example 1. A laminated film was produced.

<Comparative Example 3>
In the gas barrier laminate film of Example 1, a first anchor layer (2) and a second anchor layer (4) having a thickness of 10 nm were formed. At this time, Ra of the first anchor layer (2) and the second anchor layer (4) was 10 nm. Otherwise, the gas barrier laminate film of Comparative Example 3 was produced in the same manner as in Example 1.

<Comparison evaluation>
About the gas-barrier laminated films of Examples 1 and 2 and Comparative Examples 1, 2, and 3, using a water vapor permeability meter (MOCON PERMATRAN-W 3/31) manufactured by Modern Control Co., under a 40 ° C.-90% RH atmosphere. water vapor transmission rate ^(g / m 2 / 24h) was measured. The measurement results are shown in Table 1.

  As can be seen from Table 1, the gas barrier laminate films of Examples 1 and 2 had a low water vapor transmission rate. On the other hand, the gas barrier laminate films of Comparative Examples 1, 2, and 3 had higher water vapor permeability than Examples 1 and 2. When the gas barrier laminated films of Comparative Examples 1 and 2 were observed with an optical microscope, it was confirmed that the gas barrier layer was peeled off because the front and back surfaces of the film were blocked.

DESCRIPTION OF SYMBOLS 1 ... Base material layer 2 ... 1st anchor layer 3 ... 1st gas barrier layer 4 ... 2nd anchor layer 5 ... 2nd gas barrier layer 6 ... Gas barrier property lamination | stacking Film 7 ... coating layer

Claims (8)

A first anchor layer and a first gas barrier layer made of silicon oxide are formed on one surface of a base material layer made of a plastic film, and a second anchor layer and a first oxide made of silicon oxide are formed on the first gas barrier layer. In the gas barrier laminate film in which two gas barrier layers are sequentially formed,
It said first and second anchor layer is a cured layer of polyols and an isocyanate compound, an arithmetic mean roughness of the surface of the Katsuso (Ra) is, and a 5nm or less,
A coating having an inorganic filler on the surface of the base material layer on which the gas barrier layer is not laminated, the particle size of which is 30 nm or more and 300 nm or less, and is contained in the layer at a ratio of 1.25% by mass or more and 25% by mass or less. With layers,
A gas barrier laminate film, wherein the surface of the coating layer has an arithmetic average roughness (Ra) of 100 nm or more. The thickness of the said 1st and 2nd anchor layer is 20 nm or more and 1000 nm or less, respectively, The gas-barrier laminated film of Claim 1 characterized by the above-mentioned. The arithmetic average roughness of the first and the surface of the second anchor layer (Ra) is, the gas barrier laminate film according to claim 1 or 2, characterized in that a 3nm or less. Wherein the first and second gas barrier layer, the gas barrier laminate film according to any one of claims 1 to 3, wherein the thickness is 10nm or more 1000nm or less, respectively. Gas barrier laminate film according to claim 1, any one of 4 to spectral transmittance at 400nm or 1000nm or less, characterized in that 85% or more. A first anchor layer and a first gas barrier layer made of silicon oxide are formed on one surface of a base material layer made of a plastic film, and a second anchor layer and a first oxide made of silicon oxide are formed on the first gas barrier layer. In the method for producing a gas barrier laminated film in which two gas barrier layers are sequentially formed,
A coating containing an inorganic filler on the surface of the base material layer on which the gas barrier layer is not laminated, the particle size of which is 30 nm or more and 300 nm or less, and which is contained in the layer at a ratio of 1.25 mass% or more and 25 mass% or less. The step of forming a coating layer having an arithmetic average roughness (Ra) of 100 nm or more by an agent and a cured layer of polyols and an isocyanate compound on one side of the base material layer , and the arithmetic average roughness of the surface Forming the first anchor layer wherein (Ra) is 5 nm or less;
Forming the first gas barrier layer on the surface of the first anchor layer;
Forming the second anchor layer on the surface of the first gas barrier layer, comprising a hardened layer of polyols and an isocyanate compound, and having an arithmetic average roughness (Ra) of the surface of 5 nm or less;
Forming the second gas barrier layer on the surface of the second anchor layer ;
A method for producing a gas barrier laminate film, comprising: The said 1st and 2nd anchor layer, the said 1st and 2nd gas barrier layer, and a coating layer are formed by the roll-up (Roll to Roll) system, The Claim 6 characterized by the above-mentioned. A method for producing a gas barrier laminate film. The method for producing a gas barrier laminate film according to claim 6 or 7 , wherein the first and second gas barrier layers are formed by a plasma chemical vapor deposition (CVD) method.

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