CN106992253B - Packaging structure, thin-film solar cell and organic light-emitting display device - Google Patents
Packaging structure, thin-film solar cell and organic light-emitting display device Download PDFInfo
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- CN106992253B CN106992253B CN201610031099.0A CN201610031099A CN106992253B CN 106992253 B CN106992253 B CN 106992253B CN 201610031099 A CN201610031099 A CN 201610031099A CN 106992253 B CN106992253 B CN 106992253B
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a packaging structure, a thin film solar cell and an organic light emitting display device. The packaging structure comprises: the flexible substrate layer is provided with a first surface and a second surface which are oppositely arranged; the water vapor blocking layer is arranged on the first surface of the flexible substrate layer; and the fluoride layer is arranged on the second surface of the flexible base material layer. The packaging structure comprises the flexible substrate layer, the water vapor blocking layer and the fluoride layer, so that the packaging material has flexibility while having water vapor blocking performance and aging resistance; simultaneously, compare with traditional steam barrier layer and fluoride layer set up in the packaging structure of flexible substrate layer one side, because flexible substrate layer sets up between steam barrier layer and fluoride layer, and flexible substrate layer has great thickness to can protect the steam barrier layer more effectively, and then improved packaging structure's ageing-resistant performance and kept packaging structure's steam separation performance effectively.
Description
Technical Field
The invention relates to the technical field of materials, in particular to a packaging structure, a thin-film solar cell and an organic light-emitting display device.
Background
In recent years, new energy is rapidly developed due to the fact that the traditional energy problem is highlighted, and among the new energy, solar energy is more and more emphasized as a relatively important renewable energy source and is used on a large scale. The traditional solar power generation technology is a crystalline silicon battery technology, and solar energy is converted into electric energy by forming a crystalline silicon solar power generation panel. However, the crystalline silicon cell technology has some disadvantages, mainly that the photoelectric conversion efficiency of the crystalline silicon cell technology is close to the theoretical limit, the rising space is not large, and in addition, the brittle characteristic of the silicon material also makes the crystalline silicon cell technology incapable of being changed into flexible and applied to building walls and light roofs on a large scale.
The thin-film solar cell has the advantages of light weight, convenience and flexibility, can be well combined with a light roof and a wall surface, and can continuously improve the photoelectric conversion efficiency and be comparable to a mainstream crystalline silicon cell. Therefore, thin film solar cells are receiving attention from the industry.
At present, the thin-film solar cells mainly comprise the following types: (1) CIGS cells, (2) organic solar cells (OPV), (3) dye-sensitized cells (DSSC), (4) Perovskite-type solar cells (Perovskite). The core materials in these batteries are very sensitive to water vapor, and the power generation efficiency is very easy to be attenuated when the batteries are exposed to the atmospheric environment, so that a packaging structure for blocking water vapor permeation is required to protect the batteries.
The material which is effectively used for blocking water vapor and can ensure that the generating efficiency of the battery is not attenuated is glass, but the glass cannot ensure the flexibility of the battery component, and the material used for packaging the battery is very heavy and is not very suitable for the flexible thin-film battery. Therefore, there is a need in the art to provide a packaging material with barrier properties, aging resistance and flexibility.
Disclosure of Invention
The invention mainly aims to provide a packaging structure, a thin-film solar cell and an organic light-emitting display device, and aims to solve the problem that a packaging material in the prior art cannot achieve flexibility while having water vapor blocking performance and aging resistance.
In order to achieve the above object, according to an aspect of the present invention, there is provided a package structure including: the flexible substrate layer is provided with a first surface and a second surface which are oppositely arranged; the flexible substrate layer is provided with a first surface and a second surface which are oppositely arranged; and the fluoride layer is arranged on the second surface of the flexible base material layer.
Further, the flexible substrate layer is a transparent polymer layer, preferably a PET layer or a PEN layer.
Further, the transparent polymer layer is a transparent polymer layer whose surface is subjected to discharge treatment, flame pretreatment and/or chemical pretreatment.
Further, the fluoride layer is arranged in direct contact with the surface of the flexible base material layer, and preferably, the material forming the fluoride layer is tetrafluoroethylene and/or vinylidene fluoride; or the packaging structure further comprises a bonding layer arranged between the fluoride layer and the flexible substrate layer, and the material forming the fluoride layer is preferably selected from one or more of ethylene-tetrafluoroethylene copolymer, fluorinated ethylene-propylene copolymer, ethylene chlorotrifluoroethylene copolymer and polyvinylidene fluoride.
Further, the moisture barrier layer is an inorganic oxide layer, preferably silicon oxide, titanium oxide, or aluminum oxide.
Furthermore, the packaging structure also comprises a pretreatment layer which is arranged in contact with the first surface and is used for filling the recess and the gap on the surface of the flexible substrate layer.
Further, the pretreatment layer is an acrylic resin layer.
Further, the packaging structure further comprises a hardening coating layer arranged between the flexible substrate layer and the water vapor barrier layer.
Further, the material forming the hardened coating is selected from one or more of polyurethane coating, inorganic nano ceramic coating and radiation curing coating.
Further, the packaging structure further comprises a protective layer covering the surface of the side, far away from the flexible base material layer, of the water vapor barrier layer, and the protective layer is preferably an acrylic resin layer.
According to another aspect of the present invention, a thin film solar cell is provided, which includes a package structure, and the package structure is the above package structure.
According to another aspect of the present invention, there is provided an organic light emitting display device, including an encapsulation structure, the encapsulation structure being the above-mentioned encapsulation structure.
By applying the technical scheme, the invention provides the packaging structure, and the packaging structure comprises the flexible substrate layer, the water vapor barrier layer and the fluoride layer, so that the packaging material can have flexibility while having water vapor barrier performance and ageing resistance; meanwhile, compared with the traditional packaging structure in which the water vapor blocking layer and the fluoride layer are arranged on one side of the flexible substrate layer, the flexible substrate layer is arranged between the water vapor blocking layer and the fluoride layer and has larger thickness, so that the water vapor blocking layer can be more effectively protected, the aging resistance of the packaging structure is improved, and the water vapor blocking performance of the packaging structure is effectively maintained; when the packaging structure is arranged in the thin-film solar cell, the flexibility of the thin-film solar cell is ensured, the thin-film solar cell is prevented from being damaged due to the entry of water vapor or oxygen, the reliability of the thin-film solar cell is improved, and the aging resistance of the thin-film solar cell is also improved; in addition, when the packaging structure is arranged in the organic light-emitting display device, the damage of the organic light-emitting display device caused by the entrance of water vapor or oxygen is avoided, the reliability of the organic light-emitting display device is improved, and the flexible application value of the organic light-emitting display device is also improved.
In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic cross-sectional view illustrating a package structure according to an embodiment of the invention;
fig. 2 is a schematic cross-sectional view of a package structure in which a fluoride layer is disposed in direct contact with a surface of a moisture barrier layer according to an embodiment of the present invention; and
fig. 3 is a schematic cross-sectional view illustrating an example of a package structure including a bonding layer disposed between a flexible substrate layer and a fluoride layer according to an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As can be seen from the background art, there is a need in the art to provide a packaging material with barrier properties, aging resistance and flexibility. The inventors of the present invention have studied the above-mentioned problems and have provided a package structure, as shown in fig. 1 to 3, comprising: a flexible substrate layer 10 having a first surface and a second surface disposed opposite to each other; a water vapor barrier layer 40 disposed on the first surface of the flexible substrate layer 10; and the fluoride layer 50 is arranged on the second surface of the flexible base material layer 10.
The packaging structure comprises the flexible substrate layer 10, the water vapor barrier layer 40 and the fluoride layer 50, so that the packaging material has flexibility while having water vapor barrier performance and aging resistance; meanwhile, compared with the traditional packaging structure in which the water vapor blocking layer and the fluoride layer are arranged on one side of the flexible substrate layer, the flexible substrate layer 10 is arranged between the water vapor blocking layer 40 and the fluoride layer 50, and the flexible substrate layer 10 has larger thickness, so that the water vapor blocking layer 40 can be more effectively protected, the aging resistance of the packaging structure is improved, and the water vapor blocking performance of the packaging structure is effectively maintained.
In the package structure provided by the present invention, preferably, the flexible substrate layer 10 is a transparent polymer layer. The transparent polymer layer may be a semi-crystalline thermoplastic polymer, an amorphous polymer, and an amorphous high glass transition temperature polymer, such as PI, PET, and PEN, among others. More preferably, the transparent polymer layer is a PET layer or a PEN layer, and since the polyester PET or PEN as a semi-crystalline thermoplastic polymer has good flexibility and mechanical properties and a simple processing process, and the optical transmittance is above 90%, the flexible substrate layer 10 can have high flexibility while having high light transmittance by selecting the PET layer or PEN layer.
When the flexible base material layer 10 is a transparent polymer layer, the transparent polymer layer may be a transparent polymer layer subjected to surface treatment such as overdischarge treatment, flame pretreatment, and/or chemical pretreatment. Electrical discharge, chemical pretreatment, or flame pretreatment under suitable reactive or non-reactive atmospheric conditions can provide a transparent polymer layer with higher adhesion. In a preferred embodiment, the chemical pretreatment comprises: by blending KMnO4And the strong acid is mainly solution of hydrochloric acid, sulfuric acid, nitric acid and the like, and reacts with the surface of the transparent polymer layer at a certain temperature to form active groups on the surface of the transparent polymer layer, so that the adhesive force of the surface of the transparent polymer layer is improved.
In the package structure provided by the invention, the water vapor blocking layer 40 mainly functions to block water vapor and oxygen, so as to block the external environment and prevent the photovoltaic device from being damaged by external water vapor and oxygen. Preferably, the moisture barrier layer 40 is an inorganic oxide layer, preferably silicon oxide, titanium oxide, or aluminum oxide. The inorganic oxide is selected to prepare the water vapor barrier layer 40, so that a good water vapor barrier effect can be achieved. The inorganic oxide layer may be formed by evaporation, sputtering, or chemical vapor phase-matched deposition.
In the packaging structure provided by the invention, the fluoride layer 50 serves as a weather-resistant layer and is used for improving the outdoor aging resistance of the packaging structure. In a preferred embodiment, the fluoride layer 50 may be provided in contact with the surface of the flexible base material layer 10, and in this case, the material forming the fluoride layer 50 is preferably tetrafluoroethylene and/or vinylidene fluoride. And directly coating a layer of fluoride coating on the flexible base material layer 10 by a coating method to form the fluoride layer 50. One method for preparing the fluoride layer 50 includes: the fluorine resin layer 50 is obtained by mixing a fluorine resin solution and an isonitrile ester curing agent to prepare a fluorine resin coating liquid for a fluorine resin layer, coating the flexible substrate layer 10 to a desired thickness using a coater, and then drying the coating liquid coated on the flexible substrate layer 10 at a high temperature.
In another preferred embodiment, the package structure may further include an adhesive layer 60 disposed between the fluoride layer 50 and the flexible substrate layer 10, that is, the fluoride layer 50 is attached to the flexible substrate layer 10 through the adhesive layer 60, in this case, the material forming the fluoride layer 50 is preferably one or more selected from the group consisting of ethylene-tetrafluoroethylene copolymer, fluorinated ethylene-propylene copolymer, ethylene chlorotrifluoroethylene copolymer, and polyvinylidene fluoride, and the material forming the adhesive layer 60 may be acrylic resin, polyurethane, epoxy resin, or the like. The fluoride film is resistant to aging and self-cleaning aging longer than that of the fluororesin coating liquid.
Preferably, the method of attaching the fluoride layer 50 to the flexible substrate layer 10 includes: forming a layer of monomer or oligomer of a material capable of forming the adhesive layer 60 on the flexible base material layer 10 by flash evaporation or vapor deposition, and then crosslinking the monomer using an electron beam device, a UV light source, or a discharge device to form a polymer, thereby obtaining the above adhesive layer 60; the above-described fluoride layer 50 is obtained by applying a fluoride film on the adhesive layer 60 using a lamination process, and loading the flexible base layer 10 coated with the adhesive layer 60 and the fluoride film into the same roll-to-roll laminator, bringing the two films into contact by a rubber-to-steel nip roller system, and controlling the tension of each film using a spring brake to flatten the resulting laminate.
In the packaging structure provided by the invention, the packaging structure further comprises a pretreatment layer 20 which is in contact with the first surface of the flexible substrate layer 10, and the pretreatment layer 20 is used for filling the depressions and the gaps on the surface of the flexible substrate layer 10 so as to improve the smoothness of the surface of the flexible substrate layer 10, so that the flexible substrate layer 10 provided with the pretreatment layer 20 can be more closely connected with other layers, the reduction of the bonding force between the layers due to the existence of the gaps is avoided, the surface smoothness of the whole packaging structure is also improved, the packaging structure can be more firmly arranged on a battery matrix and is not easy to fall off, and the packaging and protecting effects of the packaging structure on the battery matrix are ensured. The pretreatment layer 20 may be formed on the surface of the flexible substrate layer 10 by a coating process, and the pretreatment layer 20 may be an acrylic resin layer, in which case the coating process may include: the monomer or oligomer of the acrylic resin is applied by a coating method such as roll coating or spray coating, the monomer or polymer is polymerized, and then the solvent is removed using a conventional technique to form the above-mentioned pre-treatment layer 20.
Further, the pre-treatment layer 20 may be planarized, the planarization of the pre-treatment layer 20 may have an important effect on the deposition of the water vapor barrier layer 40, and the better the planarization is, the denser the deposited water vapor barrier layer 40 is, the fewer defects are, and the better the barrier performance is; meanwhile, because the water vapor barrier layer 40 is mainly made of an inorganic material, the pretreatment layer can improve the flexibility and the bending property of the water vapor barrier layer 40.
When the pre-treatment layer 20 is an acrylic resin layer, the acrylic resin is preferably one of 2-hydroxyethyl methacrylate, 1, 6-hexanediol dimethacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, p-neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpentane trimethacrylate, trimethylolpropane pentaerythritol triacrylate, or a combination thereof, and the flexibility and barrier properties of the package structure can be further improved by using the above-mentioned preferred materials.
In the package structure provided by the present invention, the thickness of the pretreatment layer 20 is preferably nanometer, and more preferably 75 to 90 nm. Because the surface of the flexible substrate layer 10 has small undulations and gaps, which are usually in the nanometer scale, the thickness of the pretreatment layer 20 is limited within the micrometer scale range, and the pretreatment layer 20 can be ensured to have a small thickness, so that the undulations and the gaps on the surface of the flexible substrate layer 10 can be effectively filled, the adhesion of the pretreatment layer 20 to the flexible substrate layer 10 can be improved, and the overall thickness of the packaging material can be reduced.
In the packaging structure provided by the invention, the pretreatment layer 20 can be directly arranged in contact with the water vapor barrier layer 40, and the packaging structure further comprises a hardening coating 30 arranged between the flexible substrate layer 10 and the water vapor barrier layer 40. The hardened coating 30 serves to planarize the surface of the flexible substrate layer 10 as the pretreatment layer 20, and also to ensure an improvement in the high temperature resistance of the package structure, thereby enhancing the surface hardness and mechanical strength of the package structure. The material forming the hardened coating 30 described above may be selected from one or more of a polyurethane coating, an inorganic nanoceramic coating, and a radiation-curable coating. The inorganic nanoceramic coating or radiation curable coating may be applied directly and cured to form the hardened coating 30 described above, or a monomer solution of a polyurethane coating may be applied, then crosslinked by exposure to visible light, ultraviolet light and/or electron beam radiation, and finally cured to form the hardened coating 30 on the pretreatment layer 20, which may be roll coating (e.g., gravure roll coating), spray coating, curtain coating, die coating, and the like.
In the packaging structure provided by the present invention, the packaging structure may further include a protection layer 70 covering a surface of the moisture barrier layer 40 on a side far away from the flexible substrate layer 10, and the protection layer 70 may function to support and protect the moisture barrier layer 40. The protective layer 70 is an acrylic resin layer, preferably, the material forming the protective layer 70 is one of or a combination of 2-hydroxyethyl methacrylate, acrylamide, triethylene glycol diacrylate, tripropylene glycol diacrylate, p-neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane pentaerythritol triacrylate; the step of forming the above-mentioned protective layer 70 at this time may include: a solution of at least one acrylic monomer is applied to the surface of the water vapor barrier layer 40 using conventional coating methods such as roll coating (e.g., gravure roll coating), spray coating (e.g., electrostatic spray coating), curtain coating, die coating, etc., and then crosslinked by exposure to visible light, ultraviolet light, and/or electron beam radiation to form the protective layer 70.
In the packaging structure provided by the invention, the thickness of each layer can be selected according to actual requirements, when the thickness of the flexible substrate layer 10 is 25-100 μm, the thickness of the fluoride layer 50 is preferably 50 μm, the thickness of the water vapor barrier layer 40 is preferably 9-90 nm, the thickness of the pretreatment layer 20 is preferably 75-90 nm, the thickness of the hardening coating layer 30 is preferably 3-5 μm, the thickness of the bonding layer 60 is preferably 30-70 μm, and the thickness of the protective layer 70 is preferably 10 μm. The thickness enables each layer to effectively exhibit its own function without affecting the flexibility of the package structure.
In a preferred embodiment, the packaging structure is composed of a protective layer 70, a water vapor barrier layer 40, a hardened coating layer 30, a pretreatment layer 20, a flexible substrate layer 10 and a fluoride layer 50 which are sequentially laminated, and the structure is shown in fig. 2; in another preferred embodiment, the package structure is composed of a protective layer 70, a moisture barrier layer 40, a hardened coating layer 30, a pretreatment layer 20, a flexible substrate layer 10, a bonding layer 60 and a fluoride layer 50, which are sequentially stacked, and the structure thereof is shown in fig. 3. Above-mentioned flexible substrate layer 10 makes packaging structure have the compliance, pretreatment layer 20 makes flexible substrate layer 10's surfacing smooth, and the sclerosis coating 30 makes packaging structure have higher high temperature resistance, surface hardness and mechanical strength, and steam barrier layer 40 is used for separation vapor and oxygen, and above-mentioned steam barrier layer 40 fluoride layer 50 makes packaging structure have outdoor ageing-resistant performance to the messenger has the solar cell of above-mentioned structure higher compliance and reliability.
According to another aspect of the present invention, there is provided a thin film solar cell including the above encapsulation structure. The packaging structure comprises the flexible substrate layer and the water vapor blocking layer, so that the packaging material can have water vapor blocking performance and flexibility, the thin-film solar cell is prevented from being damaged due to water vapor or oxygen, the reliability of the thin-film solar cell is improved, and the flexibility of the thin-film solar cell is ensured; meanwhile, the packaging structure further comprises a fluoride layer arranged on the surface of one side of the flexible substrate layer, and the fluoride layer can improve the outdoor aging-resistant performance of the packaging structure, so that the packaging structure can be more firmly arranged on the cell base body, and the aging-resistant performance of the thin-film solar cell is further improved. The thin film solar cell can be applied to an object having an arched or parabolic wall surface, and thus can be installed on a dome-shaped building, a sound insulation wall of a highway, or the like.
According to still another aspect of the present invention, there is provided an organic light emitting display device including the above encapsulation structure. The packaging structure comprises the flexible substrate layer and the water vapor blocking layer, so that the packaging material can have water vapor blocking performance and flexibility, the organic light-emitting display device is prevented from being damaged due to water vapor or oxygen, the reliability of the organic light-emitting display device is improved, and the flexibility of the organic light-emitting display device is ensured; meanwhile, the packaging structure further comprises a fluoride layer arranged on the surface of one side of the flexible substrate layer, and the fluoride layer can improve the outdoor aging-resistant performance of the packaging structure, so that the packaging structure can be more firmly arranged on the battery base body, and the aging-resistant performance of the organic light-emitting display device is improved. The organic light emitting display device can be applied to an object having an arched or parabolic wall surface, and thus can be installed in a dome-shaped building, a sound insulation wall of a highway, or the like.
The package structure provided in the present application will be further described with reference to examples and comparative examples.
Example 1
The packaging structure provided by the embodiment is as shown in fig. 1, and comprises a water vapor barrier layer with a thickness of 50nm, a flexible substrate layer with a thickness of 50 μm, and a fluoride layer with a thickness of 50 μm, which are sequentially stacked; the water vapor blocking layer is a silicon oxide layer, the flexible base material layer is a PET layer, and the material for forming the fluoride layer is tetrafluoroethylene.
Example 2
The packaging structure provided by the embodiment comprises a water vapor barrier layer with the thickness of 50nm, a hardening coating layer with the thickness of 4 microns, a pretreatment layer with the thickness of 80nm, a flexible base material layer with the thickness of 50 microns and a fluoride layer with the thickness of 50 microns which are sequentially stacked; the water vapor barrier layer is a silicon oxide layer, the hardening coating layer is an inorganic nano ceramic coating, the pretreatment layer is a glycol diacrylate layer, the flexible base material layer is a PET layer, and the material for forming the fluoride layer is tetrafluoroethylene.
Example 3
The packaging structure provided by the embodiment comprises a water vapor barrier layer with the thickness of 50nm, a hardening coating layer with the thickness of 4 microns, a pretreatment layer with the thickness of 80nm, a flexible base material layer with the thickness of 50 microns, a bonding layer with the thickness of 50 microns and a fluoride layer with the thickness of 50 microns which are sequentially stacked; the water vapor barrier layer is a silicon oxide layer, the hardening coating layer is an inorganic nano ceramic coating, the pretreatment layer is a glycol diacrylate layer, the flexible substrate layer is a PET (polyethylene terephthalate) layer, the material for forming the bonding layer is polyurethane, and the fluoride layer is an ethylene-tetrafluoroethylene copolymer film.
Example 4
The packaging structure provided by the embodiment includes, as shown in fig. 2, a protective layer with a thickness of 10 μm, a water vapor barrier layer with a thickness of 50nm, a hardened coating layer with a thickness of 4 μm, a pretreatment layer with a thickness of 80nm, a flexible substrate layer with a thickness of 50 μm, and a fluoride layer with a thickness of 50 μm, which are sequentially stacked; the material for forming the protective layer is acrylamide monomer and triethylene glycol diacrylate monomer, the water vapor barrier layer is a silicon oxide layer, the hardened coating is inorganic nano ceramic paint, the pretreatment layer is a ethylene glycol diacrylate layer, the flexible substrate layer is a PET layer, and the material for forming the fluoride layer is tetrafluoroethylene.
Comparative example 1
The packaging structure provided by the comparative example comprises a flexible substrate layer with the thickness of 50 mu m, a water vapor barrier layer with the thickness of 50nm and a fluoride layer with the thickness of 50 mu m which are sequentially stacked; the flexible substrate layer is a PET layer, the water vapor blocking layer is a silicon oxide layer, and the material for forming the fluoride layer is tetrafluoroethylene.
Comparative example 2
The packaging structure provided by the comparative example comprises a flexible substrate layer with the thickness of 50 mu m, a pretreatment layer with the thickness of 80nm, a hardening coating with the thickness of 4 mu m, a water vapor barrier layer with the thickness of 50nm and a fluoride layer with the thickness of 50 mu m which are sequentially stacked; the flexible substrate layer is a PET layer, the pretreatment layer is an ethylene glycol diacrylate layer, the hardening coating is inorganic nano ceramic paint, the water vapor barrier layer is a silicon oxide layer, and the material for forming the fluoride layer is tetrafluoroethylene.
The package structures of examples 1 to 4 and comparative examples 1 and 2 were tested for water vapor transmission rate by Mocon method under the following test conditions: the temperature was 37.8 ℃ and the relative humidity was 100%, the test results are shown in the following table:
as can be seen from the above test results, the moisture permeability of the package structure in example 1 is lower than that of the package structure in comparative example 1, and the moisture permeability of the package structures in examples 2 to 4 is lower than that of the package structure in comparative example 2, and it can be seen that in the package structure, the middle fluoride layer and the moisture barrier layer are respectively disposed on both sides of the flexible substrate layer, so that the moisture barrier property of the package structure can be improved; in addition, the moisture permeability of the package structure in embodiment 4 is lower than that of the package structure in embodiment 3, and it can be seen that the moisture barrier property of the package structure can be further improved by arranging the protective layer in the package structure.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
1. the packaging structure comprises a flexible substrate layer, a water vapor blocking layer and a fluoride layer, so that the packaging material can have flexibility while having water vapor blocking performance and aging resistance;
2. compared with the traditional packaging structure in which the water vapor blocking layer and the fluoride layer are arranged on one side of the flexible substrate layer, the flexible substrate layer is arranged between the water vapor blocking layer and the fluoride layer and has larger thickness, so that the water vapor blocking layer can be more effectively protected, the aging resistance of the packaging structure is improved, and the water vapor blocking performance of the packaging structure is effectively maintained;
3. the packaging structure also comprises a pretreatment layer, wherein the pretreatment layer can fill depressions and gaps on the surface of the flexible base material layer to ensure that the surface of the flexible base material layer is smooth and flat, so that the surface flatness of the whole packaging structure is improved;
4. the packaging structure also comprises a hardening coating, wherein the hardening coating not only can flatten the surface of the flexible substrate layer, but also can ensure that the high-temperature resistance of the packaging structure is improved, and the surface hardness and the mechanical strength of the packaging structure are enhanced;
5. when the packaging structure is formed into the thin-film solar cell, the thin-film solar cell is prevented from being damaged due to the entry of water vapor or oxygen, the reliability of the thin-film solar cell is improved, the flexibility of the thin-film solar cell is ensured, and the aging resistance of the thin-film solar cell is improved;
6. the thin film solar cell can be adapted to an object having an arched or parabolic wall surface, and thus can be installed on a dome-shaped building, a sound insulation wall of a highway, or the like;
7. when the packaging structure is used for forming the organic light-emitting display device, the damage of the organic light-emitting display device caused by the entrance of water vapor or oxygen is avoided, the reliability of the organic light-emitting display device is improved, and the flexible application value of the organic light-emitting display device is also improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (15)
1. A package structure, comprising:
a flexible substrate layer (10) having a first surface and a second surface disposed opposite each other;
a water vapor barrier layer (40) disposed on the first surface of the flexible substrate layer (10);
a fluoride layer (50) disposed on a second surface of the flexible substrate layer (10),
the packaging structure also comprises a pretreatment layer (20) which is in contact with the first surface, the pretreatment layer (20) is used for filling the depressions and the gaps on the surface of the flexible base material layer (10),
the water vapor barrier layer (40) is formed on one side of the pretreatment layer (20) far away from the flexible substrate layer (10) through chemical vapor deposition of inorganic oxide,
the thickness of the pretreatment layer is nano-scale.
2. The encapsulation structure according to claim 1, characterized in that the flexible substrate layer (10) is a transparent polymer layer.
3. The encapsulation structure according to claim 2, characterized in that the flexible substrate layer (10) is a PET layer or a PEN layer.
4. The encapsulation structure according to claim 2 or 3, wherein the transparent polymer layer is a transparent polymer layer whose surface is subjected to discharge treatment, flame pretreatment, and/or chemical pretreatment.
5. The package structure of claim 1,
the fluoride layer (50) is arranged in direct contact with the surface of the flexible base material layer (10); or
The packaging structure further comprises a bonding layer (60) arranged between the fluoride layer (50) and the flexible substrate layer (10).
6. The encapsulation structure according to claim 5, characterized in that the material forming the fluoride layer (50) is tetrafluoroethylene and/or vinylidene fluoride.
7. The encapsulation structure according to claim 5, wherein the fluoride layer (50) is formed from a material selected from one or more of ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, ethylene chlorotrifluoroethylene copolymer, and polyvinylidene fluoride.
8. The encapsulation structure of claim 1, wherein the moisture barrier layer (40) is silicon oxide, titanium oxide, or aluminum oxide.
9. The encapsulation structure according to claim 1, wherein the pre-treatment layer (20) is an acrylic resin layer.
10. The packaging structure according to claim 1, further comprising a hardened coating (30) disposed between the flexible substrate layer (10) and the moisture barrier layer (40).
11. The encapsulation structure according to claim 10, wherein the material forming the hardened coating (30) is selected from one or more of polyurethane paint, inorganic nanoceramic paint, and radiation-cured paint.
12. The packaging structure according to claim 1, further comprising a protective layer (70) covering a surface of the moisture barrier layer (40) on a side remote from the flexible substrate layer (10).
13. The encapsulation structure according to claim 12, wherein the protective layer (70) is an acrylic resin layer.
14. A thin film solar cell comprising an encapsulation structure, characterized in that the encapsulation structure is according to any one of claims 1 to 13.
15. An organic light emitting display device comprising an encapsulation structure, wherein the encapsulation structure is according to any one of claims 1 to 13.
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| US10985344B2 (en) | 2017-10-27 | 2021-04-20 | Applied Materials, Inc. | Flexible cover lens films |
| KR20200142594A (en) | 2018-05-10 | 2020-12-22 | 어플라이드 머티어리얼스, 인코포레이티드 | Interchangeable cover lenses for flexible displays |
| CN110776660A (en) * | 2018-07-13 | 2020-02-11 | 北京铂阳顶荣光伏科技有限公司 | Thin film, thin film solar cell and preparation method thereof |
| CN112601835A (en) | 2018-08-14 | 2021-04-02 | 应用材料公司 | Multilayer wet-dry hard coating for flexible cover lenses |
| CN110890437A (en) * | 2018-08-16 | 2020-03-17 | 汉能移动能源控股集团有限公司 | Front plate manufacturing method, front plate and solar module |
| CN109065655A (en) * | 2018-09-25 | 2018-12-21 | 汉能移动能源控股集团有限公司 | A kind of encapsulation foreboard and its preparation process |
| CN109087963A (en) * | 2018-09-25 | 2018-12-25 | 汉能移动能源控股集团有限公司 | A kind of encapsulation foreboard and its preparation process |
| CN109817096A (en) * | 2019-01-14 | 2019-05-28 | 深圳市德彩光电有限公司 | A kind of flexible LED display screen and preparation method thereof |
| CN118522220A (en) | 2019-06-26 | 2024-08-20 | 应用材料公司 | Flexible multilayer overlay lens stack for foldable display |
| CN112701227B (en) * | 2021-01-27 | 2023-04-07 | 华中科技大学鄂州工业技术研究院 | Perovskite solar cell device and packaging method thereof |
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