CN106992253B - Packaging structure, thin-film solar cell and organic light-emitting display device - Google Patents

Abstract

The invention provides a packaging structure, a thin film solar cell and an organic light emitting display device. The packaging structure comprises: the flexible substrate layer is provided with a first surface and a second surface which are oppositely arranged; the water vapor blocking layer is arranged on the first surface of the flexible substrate layer; and the fluoride layer is arranged on the second surface of the flexible base material layer. The packaging structure comprises the flexible substrate layer, the water vapor blocking layer and the fluoride layer, so that the packaging material has flexibility while having water vapor blocking performance and aging resistance; simultaneously, compare with traditional steam barrier layer and fluoride layer set up in the packaging structure of flexible substrate layer one side, because flexible substrate layer sets up between steam barrier layer and fluoride layer, and flexible substrate layer has great thickness to can protect the steam barrier layer more effectively, and then improved packaging structure's ageing-resistant performance and kept packaging structure's steam separation performance effectively.

Description

Package structure, thin film solar cell and organic light emitting display device

technical field

The present invention relates to the technical field of materials, and in particular, to a packaging structure, a thin-film solar cell and an organic light-emitting display device.

Background technique

In recent years, due to the increasingly prominent problems of traditional energy, new energy has developed rapidly. Among them, solar energy, as a relatively important renewable energy, has attracted more and more attention and is used on a large scale. At present, the traditional solar power generation technology is crystalline silicon cell technology, which converts sunlight energy into electrical energy by forming crystalline silicon solar power generation panels. However, crystalline silicon cell technology also has some shortcomings, mainly because its photoelectric conversion efficiency is approaching its theoretical limit, and there is not much room for improvement. In addition, the brittle nature of silicon materials also makes it impossible to become flexible and be used in large-scale building walls. and lightweight roofs.

Thin-film solar cells have the advantages of light weight, are easy to be flexible, and can be well combined with lightweight roofs and walls. Therefore, thin-film solar cells have attracted the attention of the industry.

At present, thin-film solar cells mainly fall into the following categories: (1) CIGS cells, (2) organic solar cells (OPV), (3) dye-sensitized cells (DSSC), and (4) perovskite solar cells (Perovskite). The core materials in these types of batteries are very sensitive to water vapor, and it is extremely prone to the attenuation of power generation efficiency when exposed to the atmospheric environment. Therefore, a packaging structure that blocks the penetration of water vapor is required to protect them.

A more effective material for blocking water vapor and ensuring that the power generation efficiency of the battery is not attenuated is glass, but glass cannot ensure the flexibility of battery components, and it is very bulky as a material for packaging batteries, which is not very suitable for flexible thin-film batteries. . Therefore, there is an urgent need in the prior art to provide a packaging material that has both barrier properties, aging resistance and flexibility.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide an encapsulation structure, a thin film solar cell and an organic light-emitting display device, so as to solve the problem that the encapsulation materials in the prior art cannot achieve flexibility while having moisture barrier properties and aging resistance properties.

In order to achieve the above object, according to an aspect of the present invention, a package structure is provided, comprising: a flexible substrate layer having a first surface and a second surface arranged oppositely; a flexible substrate layer having a first surface arranged oppositely and a second surface; a fluoride layer disposed on the second surface of the flexible substrate layer.

Further, the flexible substrate layer is a transparent polymer layer, preferably a PET layer or a PEN layer.

Further, the transparent polymer layer is a transparent polymer layer whose surface has undergone discharge treatment, flame pretreatment and/or chemical pretreatment.

Further, the fluoride layer is arranged in direct contact with the surface of the flexible substrate layer, and the material for forming the fluoride layer is preferably tetrafluoroethylene and/or vinylidene fluoride; or the encapsulation structure further comprises a layer disposed on the fluoride layer and the flexible substrate layer. The adhesive layer between, preferably the material forming the fluoride layer is selected from one or more of ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, ethylene chlorotrifluoroethylene copolymer and polyvinylidene fluoride .

Further, the water vapor barrier layer is an inorganic oxide layer, preferably silicon oxide, titanium oxide or aluminum oxide.

Further, the package structure further includes a pretreatment layer disposed in contact with the first surface, and the pretreatment layer is used to fill the depressions and voids on the surface of the flexible substrate layer.

Further, the pretreatment layer is an acrylic resin layer.

Further, the encapsulation structure further includes a hardened coating layer disposed between the flexible substrate layer and the water vapor barrier layer.

Further, the material for forming the hard coating is selected from one or more of polyurethane coatings, inorganic nano-ceramic coatings and radiation curing coatings.

Further, the encapsulation structure further includes a protective layer covering the surface of the water vapor barrier layer on the side away from the flexible substrate layer, preferably the protective layer is an acrylic resin layer.

According to another aspect of the present invention, a thin film solar cell is provided, comprising an encapsulation structure, and the encapsulation structure is the aforementioned encapsulation structure.

According to another aspect of the present invention, an organic light-emitting display device is provided, including an encapsulation structure, and the encapsulation structure is the aforementioned encapsulation structure.

By applying the technical solution of the present invention, the present invention provides a packaging structure, because the packaging structure includes a flexible substrate layer, a water vapor barrier layer and a fluoride layer, so that the packaging material can have water vapor barrier properties and anti-aging properties at the same time. It can also be flexible; at the same time, compared with the traditional packaging structure in which the water vapor barrier layer and the fluoride layer are arranged on one side of the flexible substrate layer, since the flexible substrate layer is arranged between the water vapor barrier layer and the fluoride layer, and the flexibility The base material layer has a larger thickness, so that the water vapor barrier layer can be more effectively protected, thereby improving the aging resistance of the package structure and effectively maintaining the water vapor barrier property of the package structure; It not only ensures the flexibility of the thin-film solar cell, but also avoids the damage of the thin-film solar cell due to the entry of water vapor or oxygen, improves the reliability of the thin-film solar cell, and also improves the aging resistance of the thin-film solar cell. In addition, when the above-mentioned packaging structure is arranged in the organic light-emitting display device, not only the damage of the organic light-emitting display device due to the entry of water vapor or oxygen is avoided, the reliability of the organic light-emitting display device is improved, but also the organic light-emitting display device is improved. flexible application value.

In addition to the objects, features and advantages described above, the present invention has other objects, features and advantages. The present invention will be described in further detail below with reference to the drawings.

Description of drawings

The accompanying drawings forming a part of the present invention are used to provide further understanding of the present invention, and the exemplary embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute an improper limitation of the present invention. In the attached image:

FIG. 1 shows a schematic cross-sectional structure diagram of a package structure provided by an embodiment of the present invention;

FIG. 2 shows a schematic cross-sectional structure diagram of a package structure in which the fluoride layer and the surface of the water vapor barrier layer are provided in direct contact with each other according to an embodiment of the present invention; and

3 shows a schematic cross-sectional structure diagram of an example of a package structure including an adhesive layer disposed between a flexible substrate layer and a fluoride layer provided by an embodiment of the present invention.

Detailed ways

It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition of no conflict. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

In order to make those skilled in the art better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only Embodiments are part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that the terms "first", "second" and the like in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances for the embodiments of the invention described herein. Furthermore, the terms "comprising" and "having" and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those expressly listed Rather, those steps or units may include other steps or units not expressly listed or inherent to these processes, methods, products or devices.

It can be known from the background art that there is an urgent need in the prior art to provide an encapsulation material having both barrier performance, aging resistance and flexibility. The inventors of the present invention have studied the above problems and provided a package structure, as shown in FIGS. 1 to 3 , comprising: a flexible substrate layer 10 having a first surface and a second surface disposed oppositely; a water vapor barrier layer 40 , is disposed on the first surface of the flexible base material layer 10 ; the fluoride layer 50 is disposed on the second surface of the flexible base material layer 10 .

The above-mentioned packaging structure of the present invention includes the flexible base material layer 10, the water vapor barrier layer 40 and the fluoride layer 50, so that the packaging material can have both water vapor barrier properties and aging resistance properties while being flexible; Compared with the package structure in which the water vapor barrier layer is arranged on one side of the flexible substrate layer, since the flexible substrate layer 10 is arranged between the water vapor barrier layer 40 and the fluoride layer 50 in the present invention, and the flexible substrate layer 10 With a larger thickness, the water vapor barrier layer 40 can be more effectively protected, thereby improving the aging resistance of the package structure and effectively maintaining the water vapor barrier property of the package structure.

In the package structure provided by the present invention, preferably, the flexible substrate layer 10 is a transparent polymer layer. Wherein, the transparent polymer layer can be semi-crystalline thermoplastic polymer, amorphous polymer and amorphous high glass transition temperature polymer, such as PI, PET and PEN. More preferably, the transparent polymer layer is a PET layer or a PEN layer, because polyester PET or PEN as a semi-crystalline thermoplastic polymer has good dynamic flexibility, mechanical properties and simple processing, and the optical transmittance is 90%. As above, therefore, selecting the PET layer or the PEN layer enables the flexible base material layer 10 to have higher flexibility while having higher light transmittance.

When the above-mentioned flexible substrate layer 10 is a transparent polymer layer, the transparent polymer layer may be a transparent polymer layer that has undergone surface treatment such as discharge treatment, flame pretreatment and/or chemical pretreatment. Discharge, chemical pretreatment, or flame pretreatment in the presence of a suitable reactive or non-reactive atmospheric environment can result in higher adhesion of the transparent polymer layer. In a preferred embodiment, the above-mentioned chemical pretreatment includes: by preparing KMnO ₄ and strong acid to form a mixed solution, the strong acid is mainly solutions such as hydrochloric acid, sulfuric acid and nitric acid, and reacts with the surface of the transparent polymer layer at a certain temperature , so that the surface of the transparent polymer layer forms active groups, thereby improving the adhesion of its surface.

In the package structure provided by the present invention, the main function of the water vapor barrier layer 40 is to block water vapor and oxygen, and function as a barrier to the external environment to prevent the photovoltaic device from being damaged by external water vapor and oxygen. Preferably, the water vapor barrier layer 40 is an inorganic oxide layer, preferably silicon oxide, titanium oxide or aluminum oxide. Selecting an inorganic oxide to prepare the water vapor barrier layer 40 can have a good water vapor barrier effect. The inorganic oxide layer can be formed by evaporation, sputtering or chemical vapor deposition.

In the package structure provided by the present invention, the fluoride layer 50 is used as a weather-resistant layer to improve the outdoor aging resistance of the package structure. In a preferred embodiment, the above-mentioned fluoride layer 50 may be disposed in contact with the surface of the flexible substrate layer 10. In this case, the material for forming the fluoride layer 50 is preferably tetrafluoroethylene and/or vinylidene fluoride. and directly coating a layer of fluoride paint on the flexible substrate layer 10 by means of coating to form the above-mentioned fluoride layer 50 . Among them, a method for preparing the above-mentioned fluoride layer 50 includes: mixing a fluorine-containing resin solution and an isocyanate curing agent, preparing a fluorine resin coating solution for the fluorine resin layer, and using a coating machine to apply a coating on a flexible substrate The material layer 10 is coated with a desired thickness, and then the coating solution coated on the flexible base material layer 10 is dried at a high temperature, thereby obtaining the above-mentioned fluoride layer 50 .

In another preferred embodiment, the above-mentioned package structure may further include an adhesive layer 60 disposed between the fluoride layer 50 and the flexible substrate layer 10 , that is, the fluoride layer 50 is connected to the flexible substrate through the adhesive layer 60 . The layer 10 is adhered and arranged, and the material for forming the fluoride layer 50 is preferably one selected from the group consisting of ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, ethylene chlorotrifluoroethylene copolymer and polyvinylidene fluoride. Alternatively, the material for forming the adhesive layer 60 may be acrylic resin, polyurethane or epoxy resin. The above-mentioned fluoride film is resistant to aging, and the self-cleaning time is longer than that of the fluororesin coating solution.

Preferably, the method of attaching the fluoride layer 50 to the flexible substrate layer 10 includes: forming a monomer or oligomer of a material capable of forming the adhesive layer 60 on the flexible substrate layer 10 by flash evaporation or vapor deposition and then use electron beam device, UV light source or discharge device to cross-link the monomer to form a polymer, so as to obtain the above-mentioned adhesive layer 60; the fluoride film is applied on the adhesive layer 60 using a lamination process, and the The flexible substrate layer 10 coated with the adhesive layer 60 and the fluoride film were loaded into the same roll-to-roll laminator, the two films were brought into contact by a rubber-to-steel nip roll system, using spring brakes to control each The tension of the film was adjusted to flatten the resulting laminate, thereby obtaining the fluoride layer 50 described above.

In the package structure provided by the present invention, the package structure further includes a pretreatment layer 20 disposed in contact with the first surface of the flexible substrate layer 10 , and the pretreatment layer 20 is used to fill the flexible substrate layer 10 The depressions and voids on the surface can improve the flatness and smoothness of the surface of the flexible substrate layer 10, so that not only the flexible substrate layer 10 provided with the pretreatment layer 20 can be more closely connected with other layers, but also avoid the existence of voids. As a result, the adhesive force between the layers is reduced, and the surface flatness of the entire package structure is also improved, so that the package structure can be more firmly set on the battery base and not easy to fall off, ensuring the packaging structure to the battery base. and protection. The above-mentioned pre-treatment layer 20 can be formed on the surface of the flexible base material layer 10 by a coating process, and the above-mentioned pre-treatment layer 20 can be an acrylic resin layer. At this time, the above-mentioned coating process can include: using a coating method such as roller coating or spraying The monomer or oligomer of the acrylic resin is applied, the monomer or polymer is polymerized, and then the solvent is removed using conventional techniques to form the pretreatment layer 20 described above.

Further, the above-mentioned pre-treatment layer 20 can be planarized. After the pre-treatment layer 20 is planarized, it will have an important influence on the deposition of the water vapor barrier layer 40 . The smaller the amount, the better the barrier performance; at the same time, because the water vapor barrier layer 40 is mainly made of inorganic materials, the pretreatment layer can improve the flexibility and bendability of the water vapor barrier layer 40 .

When the pretreatment layer 20 is an acrylic resin layer, the acrylic resin is preferably 2-hydroxyethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol diacrylate, dimethacrylate Triethylene glycol acrylate, tripropylene glycol diacrylate, p-neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpentane trimethacrylate, trimethylolpropane pentaerythritol triacrylate One of vinegar or their combination, the above-mentioned preferred materials can further improve the flexibility and barrier properties of the packaging structure.

In the package structure provided by the present invention, preferably, the thickness of the above-mentioned pretreatment layer 20 is nanoscale, more preferably 75-90 nm. Since the undulations and voids on the surface of the flexible substrate layer 10 are relatively small, usually nanoscale, the thickness of the pretreatment layer 20 is limited to the range of micrometers, so that the above pretreatment layer 20 can be guaranteed to have a relatively small thickness. Therefore, not only can the undulations and voids on the surface of the flexible base material layer 10 be effectively filled, but also the adhesion of the pretreatment layer 20 to the flexible base material layer 10 can be improved, and the overall thickness of the packaging material can be reduced.

In the package structure provided by the present invention, the pretreatment layer 20 can be directly disposed in contact with the water vapor barrier layer 40 , and the package structure further includes a hardened coating 30 disposed between the flexible substrate layer 10 and the water vapor barrier layer 40 . In addition to flattening the surface of the flexible substrate layer 10 like the pretreatment layer 20, the above-mentioned hard coating layer 30 can also ensure that the high temperature resistance of the package structure can be improved, and the surface hardness and mechanical strength of the package structure can be enhanced. The materials for forming the above-mentioned hard coating 30 may be selected from one or more of polyurethane coatings, inorganic nano-ceramic coatings and radiation-curing coatings. Inorganic nano-ceramic coatings or radiation-curable coatings can be directly applied and cured to form the hardened coating 30 described above, or a monomer solution of polyurethane coatings can be applied and then cross-linked by exposure to visible light, ultraviolet, and/or electron beam radiation and finally curing to form a hardened coating 30 on the pretreatment layer 20. The coating method can be roll coating (eg gravure roll coating), spray coating, curtain coating, die coating and the like.

In the package structure provided by the present invention, the package structure may further include a protective layer 70 covering the surface of the water vapor barrier layer 40 on the side away from the flexible substrate layer 10 . The protective layer 70 can function as a The function of supporting and protecting the water vapor barrier layer 40 . The protective layer 70 is an acrylic resin layer. Preferably, the material for forming the protective layer 70 is 2-hydroxyethyl methacrylate, acrylamide, triethylene glycol diacrylate, tripropylene glycol diacrylate, and acrylic acid. One of pentanediol, trimethylolpropane triacrylate, trimethylolpentane trimethacrylate, trimethylolpropane pentaerythritol triacrylate, or a combination thereof; at this time, the above protection is formed The step of layer 70 may include: using conventional coating methods such as roller coating (eg, gravure roller coating), spraying (eg, electrostatic spraying), curtain coating, die coating, etc., coating the surface of the water vapor barrier layer 40 A solution of at least one acrylic resin monomer is then cross-linked by exposure to visible light, ultraviolet and/or electron beam radiation to form protective layer 70 .

In the package structure provided by the present invention, the thickness of each layer can be selected according to actual needs. When the thickness of the flexible substrate layer 10 is 25-100 μm, the thickness of the fluoride layer 50 is preferably 50 μm, and the thickness of the water vapor barrier layer 40 is preferably 50 μm. The thickness is preferably 9 to 90 nm, the thickness of the pretreatment layer 20 is preferably 75 to 90 nm, the thickness of the hardened coating layer 30 is preferably 3 to 5 μm, the thickness of the adhesive layer 60 is preferably 30 to 70 μm, and the thickness of the protective layer 70 is preferably 10μm. The above-mentioned thickness enables each layer to effectively play its respective role without affecting the flexibility of the package structure.

In a preferred embodiment, the encapsulation structure is composed of a protective layer 70, a water vapor barrier layer 40, a hardened coating 30, a pretreatment layer 20, a flexible substrate layer 10 and a fluoride layer 50, which are sequentially stacked, as shown in the figure. 2; in another preferred embodiment, the encapsulation structure consists of a protective layer 70, a water vapor barrier layer 40, a hard coating 30, a pretreatment layer 20, a flexible substrate layer 10, an adhesive layer 60 and The fluoride layer 50 is composed, and its structure is shown in FIG. 3 . The above-mentioned flexible base material layer 10 makes the package structure have flexibility, the pretreatment layer 20 makes the surface of the flexible base material layer 10 smooth and smooth, and the hardened coating 30 makes the package structure have higher high temperature resistance, surface hardness and mechanical strength, water vapor. The barrier layer 40 is used to block water vapor and oxygen, and the fluoride layer 50 of the water vapor barrier layer 40 makes the encapsulation structure have outdoor aging resistance, so that the film solar cell with the above structure has high flexibility and reliability.

According to another aspect of the present invention, there is provided a thin film solar cell including the above-mentioned encapsulation structure. Since the above-mentioned encapsulation structure includes a flexible substrate layer and a water vapor barrier layer, the encapsulation material can not only have the property of blocking water vapor, but also have flexibility, thereby not only avoiding the damage of the thin film solar cell due to the entry of water vapor or oxygen, but also improving the The reliability of the thin-film solar cell is improved, and the flexibility of the thin-film solar cell is also ensured; at the same time, since the package structure also includes a fluoride layer disposed on one side surface of the flexible substrate layer, the fluoride layer can improve the package structure. The outdoor aging resistance of the structure enables the encapsulation structure to be more firmly arranged on the battery substrate, thereby improving the aging resistance of the thin film solar cell. In addition, the thin-film solar cell described above can be adapted to an object having an arch-shaped or parabolic-shaped wall surface, whereby it can be installed in a dome-shaped building, a soundproof wall of an expressway, or the like.

According to yet another aspect of the present invention, there is provided an organic light emitting display device including the above-mentioned package structure. Since the above-mentioned encapsulation structure includes a flexible substrate layer and a water vapor barrier layer, the encapsulation material can not only have the property of blocking water vapor but also have flexibility, thereby not only avoiding the damage of the organic light emitting display device due to the entry of water vapor or oxygen, The reliability of the organic light-emitting display device is improved, and the flexibility of the organic light-emitting display device is also ensured; at the same time, since the package structure further includes a fluoride layer disposed on one side surface of the flexible base material layer, the above-mentioned fluoride layer can The outdoor aging resistance performance of the package structure is improved, so that the package structure can be more firmly arranged on the battery substrate, thereby improving the aging resistance performance of the organic light emitting display device. In addition, the above-mentioned organic light-emitting display device can be adapted to an object having an arch-shaped or parabolic-shaped wall surface, and thus can be installed in a dome-shaped building, a soundproof wall of a highway, and the like.

The encapsulation structure provided by the present application will be further described below with reference to the embodiments and comparative examples.

Example 1

The package structure provided in this embodiment is shown in FIG. 1 , including a water vapor barrier layer with a thickness of 50 nm, a flexible substrate layer with a thickness of 50 μm and a fluoride layer with a thickness of 50 μm, which are sequentially stacked; wherein, the water vapor barrier layer is silicon oxide. layer, the flexible substrate layer is a PET layer, and the material forming the fluoride layer is tetrafluoroethylene.

Example 2

The package structure provided in this embodiment includes a water vapor barrier layer with a thickness of 50 nm, a hardened coating with a thickness of 4 μm, a pretreatment layer with a thickness of 80 nm, a flexible substrate layer with a thickness of 50 μm and a fluoride layer with a thickness of 50 μm, which are sequentially stacked The water vapor barrier layer is a silicon oxide layer, the hardened coating is an inorganic nano-ceramic coating, the pretreatment layer is an ethylene glycol diacrylate layer, the flexible substrate layer is a PET layer, and the material forming the fluoride layer is tetrafluoroethylene vinyl.

Example 3

The package structure provided in this embodiment includes a water vapor barrier layer with a thickness of 50 nm, a hardened coating with a thickness of 4 μm, a pretreatment layer with a thickness of 80 nm, a flexible substrate layer with a thickness of 50 μm, and a bonding layer with a thickness of 50 μm, which are sequentially stacked. layer and a fluoride layer with a thickness of 50 μm; wherein, the water vapor barrier layer is a silicon oxide layer, the hardened coating is an inorganic nano-ceramic coating, the pretreatment layer is an ethylene glycol diacrylate layer, and the flexible substrate layer is a PET layer. The material of the adhesive layer is polyurethane, and the fluoride layer is an ethylene-tetrafluoroethylene copolymer film.

Example 4

The package structure provided in this embodiment is shown in FIG. 2 , including a protective layer with a thickness of 10 μm, a water vapor barrier layer with a thickness of 50 nm, a hardened coating with a thickness of 4 μm, a pretreatment layer with a thickness of 80 nm, and a thickness of 80 nm. The flexible substrate layer with a thickness of 50 μm and a fluoride layer with a thickness of 50 μm; wherein, the materials forming the protective layer are acrylamide monomer and triethylene glycol diacrylate monomer, the water vapor barrier layer is a silicon oxide layer, and the hardened coating is Inorganic nano ceramic coating, the pretreatment layer is ethylene glycol diacrylate layer, the flexible substrate layer is PET layer, and the material forming the fluoride layer is tetrafluoroethylene.

Comparative Example 1

The package structure provided by this comparative example includes a flexible substrate layer with a thickness of 50 μm, a water vapor barrier layer with a thickness of 50 nm, and a fluoride layer with a thickness of 50 μm, which are sequentially stacked; wherein, the flexible substrate layer is a PET layer, and the water vapor barrier layer is The silicon oxide layer and the material forming the fluoride layer are tetrafluoroethylene.

Comparative Example 2

The package structure provided by this comparative example includes a flexible substrate layer with a thickness of 50 μm, a pretreatment layer with a thickness of 80 nm, a hard coating with a thickness of 4 μm, a water vapor barrier layer with a thickness of 50 nm and a fluoride layer with a thickness of 50 μm. Among them, the flexible substrate layer is a PET layer, the pretreatment layer is an ethylene glycol diacrylate layer, the hardened coating is an inorganic nano-ceramic coating, the water vapor barrier layer is a silicon oxide layer, and the material forming the fluoride layer is tetrafluoroethylene vinyl.

The water vapor transmission rates of the encapsulation structures in Examples 1 to 4 and Comparative Examples 1 and 2 were tested, and the test method was the Mocon method.

It can be seen from the above test results that the water vapor transmission rate of the package structure in Example 1 is lower than that of the package structure in Comparative Example 1, and the water vapor transmission rates of the package structures in Examples 2 to 4 are all It is lower than the water vapor transmission rate of the package structure in Comparative Example 2, it can be seen that in the package structure, disposing the middle fluoride layer and the water vapor barrier layer on both sides of the flexible substrate layer can improve the water vapor barrier property of the package structure; and, The water vapor permeability of the package structure in Example 4 is lower than that of the package structure in Example 3. It can be seen that providing a protective layer in the package structure can further improve the water vapor barrier property of the package structure.

From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:

1. The encapsulation structure includes a flexible substrate layer, a water vapor barrier layer and a fluoride layer, so that the encapsulation material can be flexible while having water vapor barrier properties and aging resistance properties;

2. Compared with the traditional packaging structure in which the water vapor barrier layer and the fluoride layer are arranged on one side of the flexible substrate layer, since the flexible substrate layer is arranged between the water vapor barrier layer and the fluoride layer, and the flexible substrate layer has relatively Large thickness, so that the water vapor barrier layer can be more effectively protected, thereby improving the aging resistance of the package structure and effectively maintaining the water vapor barrier performance of the package structure;

3. The package structure also includes a pretreatment layer, which can fill the depressions and voids on the surface of the flexible substrate layer, so that the surface of the flexible substrate layer is smooth and smooth, thereby improving the surface flatness of the entire package structure;

4. The package structure also includes a hardened coating, which can not only flatten the surface of the flexible substrate layer, but also ensure that the high temperature resistance of the package structure is improved, and the surface hardness and mechanical strength of the package structure are enhanced;

5. When the above-mentioned encapsulation structure is formed into a thin-film solar cell, it not only avoids the damage of the thin-film solar cell due to the entry of water vapor or oxygen, improves the reliability of the thin-film solar cell, but also ensures the flexibility of the thin-film solar cell. The aging resistance of thin film solar cells;

6. The above-mentioned thin-film solar cells can be adapted to objects with arched and parabolic wall surfaces, so that they can be installed in dome-shaped buildings, sound insulation walls of highways, etc.;

7. When the above-mentioned packaging structure is formed into an organic light-emitting display device, it not only avoids the damage of the organic light-emitting display device due to the entry of water vapor or oxygen, improves the reliability of the organic light-emitting display device, but also improves the flexibility of the organic light-emitting display device. Value.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims (15)

1. a package structure, is characterized in that, comprises: A flexible substrate layer (10) having oppositely disposed first and second surfaces; a water vapor barrier layer (40) disposed on the first surface of the flexible substrate layer (10); a fluoride layer (50) disposed on the second surface of the flexible substrate layer (10), The package structure further comprises a pretreatment layer (20) arranged in contact with the first surface, and the pretreatment layer (20) is used to fill the depressions and voids on the surface of the flexible substrate layer (10), The water vapor barrier layer (40) is formed on the side of the pretreatment layer (20) away from the flexible substrate layer (10) by chemical vapor deposition of inorganic oxides, The thickness of the pretreatment layer is nanometer. 2 . The package structure according to claim 1 , wherein the flexible substrate layer ( 10 ) is a transparent polymer layer. 3 . 3. The packaging structure according to claim 2, wherein the flexible substrate layer (10) is a PET layer or a PEN layer. 4. The package structure according to claim 2 or 3, wherein the transparent polymer layer is a transparent polymer layer whose surface has been subjected to discharge treatment, flame pretreatment and/or chemical pretreatment. 5. The package structure according to claim 1, wherein, The fluoride layer (50) is arranged in direct contact with the surface of the flexible substrate layer (10); or The encapsulation structure also includes an adhesive layer (60) disposed between the fluoride layer (50) and the flexible substrate layer (10). 6. The package structure according to claim 5, characterized in that, the material for forming the fluoride layer (50) is tetrafluoroethylene and/or vinylidene fluoride. 7. The package structure according to claim 5, characterized in that, the material for forming the fluoride layer (50) is selected from the group consisting of ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, and ethylene chlorotrifluoroethylene copolymer one or more of polyvinylidene fluoride and polyvinylidene fluoride. 8. The package structure according to claim 1, wherein the water vapor barrier layer (40) is silicon oxide, titanium oxide or aluminum oxide. 9. The package structure according to claim 1, wherein the pretreatment layer (20) is an acrylic resin layer. 10. The package structure according to claim 1, characterized in that, the package structure further comprises a hardened coating layer (30) disposed between the flexible substrate layer (10) and the water vapor barrier layer (40) ). 11. The package structure according to claim 10, characterized in that, the material for forming the hardened coating (30) is selected from one or more of polyurethane coating, inorganic nano-ceramic coating and radiation curing coating. 12. The package structure according to claim 1, characterized in that, the package structure further comprises a protection covering on the surface of the water vapor barrier layer (40) on the side away from the flexible substrate layer (10) layer (70). 13. The package structure according to claim 12, wherein the protective layer (70) is an acrylic resin layer. 14 . A thin film solar cell, comprising an encapsulation structure, wherein the encapsulation structure is the encapsulation structure according to any one of claims 1 to 13 . 15 . An organic light-emitting display device, comprising a package structure, wherein the package structure is the package structure according to any one of claims 1 to 13 .

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