CN106992253A - Encapsulating structure, thin-film solar cells and organic light-emitting display device - Google Patents
Encapsulating structure, thin-film solar cells and organic light-emitting display device Download PDFInfo
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- CN106992253A CN106992253A CN201610031099.0A CN201610031099A CN106992253A CN 106992253 A CN106992253 A CN 106992253A CN 201610031099 A CN201610031099 A CN 201610031099A CN 106992253 A CN106992253 A CN 106992253A
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- encapsulating structure
- flexible substrate
- substrate layer
- fluoride
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- 239000010409 thin film Substances 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 84
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 56
- 238000000926 separation method Methods 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims description 273
- 238000007781 pre-processing Methods 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 19
- 229920000642 polymer Polymers 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 239000011241 protective layer Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 13
- 239000004925 Acrylic resin Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 9
- 238000005524 ceramic coating Methods 0.000 claims description 7
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 6
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 238000003682 fluorination reaction Methods 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 claims 1
- CHJAYYWUZLWNSQ-UHFFFAOYSA-N 1-chloro-1,2,2-trifluoroethene;ethene Chemical group C=C.FC(F)=C(F)Cl CHJAYYWUZLWNSQ-UHFFFAOYSA-N 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 20
- 230000004888 barrier function Effects 0.000 abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 14
- -1 such as PI Polymers 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
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- 238000005516 engineering process Methods 0.000 description 7
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
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- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
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- 229920009441 perflouroethylene propylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000011527 polyurethane coating Substances 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DNLGANFGDVMBEB-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.OC(CCCCC)(O)O Chemical compound C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.OC(CCCCC)(O)O DNLGANFGDVMBEB-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006135 semi-crystalline thermoplastic polymer Polymers 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a kind of encapsulating structure, thin-film solar cells and organic light-emitting display device.The encapsulating structure includes：Flexible substrate layer, with the first surface and second surface being oppositely arranged；Aqueous vapor separation layer, is arranged on the first surface of flexible substrate layer；Fluoride layer, is arranged on the second surface of flexible substrate layer.Because the encapsulating structure includes flexible substrate layer, aqueous vapor separation layer and fluoride layer, so that encapsulating material can also possess flexibility while can possess barrier steam performance and ageing-resistant performance；Simultaneously; compared with traditional aqueous vapor separation layer and fluoride layer are arranged at the encapsulating structure of flexible substrate layer side; because flexible substrate layer is arranged between aqueous vapor separation layer and fluoride layer; and flexible substrate layer has larger thickness; so as to more effectively protect aqueous vapor separation layer, and then improve the ageing-resistant performance of encapsulating structure and effectively maintain the water vapor rejection performance of encapsulating structure.
Description
Technical field
The present invention relates to field of material technology, in particular to a kind of encapsulating structure, thin-film solar cells and organic light emission
Display device.
Background technology
In recent years, because traditional energy problem is outstanding day by day, therefore new energy is quickly grown, and wherein solar energy compares as one kind
Important regenerative resource, is increasingly valued by people, and by large-scale use.Solar energy generation technology traditional at present
It is crystal silicon battery technology, solar energy is converted into electric energy by forming crystal silicon solar generating panel.But crystal silicon battery technology
There is also some shortcomings, mainly its electricity conversion is soon close to its theoretical limit, and the rising space is little, in addition silicon material
The crisp characteristic of material also causes it can not become flexible and apply on a large scale on building wall and lightweight roof.
Thin-film solar cells has the advantages that lightweight, is easy to flexibility, can be combined well with light roof and metope, its
Electricity conversion is also constantly lifted, and can be compared favourably with the crystal silicon battery of main flow.Therefore thin-film solar cells receives production
The attention of industry.
Current thin film solar cell mainly has following a few classes：(1) CIGS batteries, (2) organic matter solar cell (OPV),
(3) dye-sensitized cell (DSSC), (4) Ca-Ti ore type solar cell (Perovskite).Core in this few class battery
Material is all very sensitive to steam, the decay that generating efficiency all extremely easily occurs in atmospheric environment, therefore requires
The encapsulating structure of barrier steam infiltration carries out protection processing to it.
It is relatively effective to be used to obstruct steam and can guarantee that the unattenuated material of the generating efficiency of battery is glass, but glass can not
Ensure the flexibility of battery component, and seem very heavy as the material of encapsulation battery, be not for flexible hull cell
It is very applicable.Therefore, need badly in the prior art and a kind of encapsulating material for having barrier property, ageing-resistant performance and flexibility concurrently is provided.
The content of the invention
It is a primary object of the present invention to provide a kind of encapsulating structure, thin-film solar cells and organic light-emitting display device, to solve
Encapsulating material certainly of the prior art can not be realized asks while possessing barrier steam performance and ageing-resistant performance but also with flexible
Topic.
To achieve these goals, according to an aspect of the invention, there is provided a kind of encapsulating structure, including：Flexible substrate layer,
With the first surface and second surface being oppositely arranged；Flexible substrate layer, with the first surface and second surface being oppositely arranged；
Fluoride layer, is arranged on the second surface of flexible substrate layer.
Further, flexible substrate layer is transparent polymer layer, preferably pet layer or PEN layer.
Further, transparent high score of the transparent polymer layer for surface by discharge process, flame pretreatment and/or Chemical Pretreatment
Sublayer.
Further, fluoride layer directly contacts setting with the surface of flexible substrate layer, and the material for being preferably formed as fluoride layer is four
PVF and/or vinylidene；It is excellent or encapsulating structure is also including the tack coat being arranged between fluoride layer and flexible substrate layer
Form slection is selected from ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, ethene CTFE into the material of fluoride layer and is total to
One or more in polymers and Kynoar.
Further, aqueous vapor separation layer is inorganic oxide layer, preferably silica, titanium oxide or aluminum oxide.
Further, encapsulating structure also includes contacting the preprocessing layer set with first surface, and preprocessing layer is used for filling flexible
Substrate layer depression in the surface and space.
Further, preprocessing layer is acrylic resin.
Further, encapsulating structure also includes the hardening coat being arranged between flexible substrate layer and aqueous vapor separation layer.
Further, the material of hardening coat is formed in polyurethane coating, inorganic nano ceramic coating and radiation curable coating
One or more.
Further, encapsulating structure also includes the protective layer being covered on a side surface of the remote flexible substrate layer of aqueous vapor separation layer,
It is preferred that protective layer is acrylic resin.
According to another aspect of the present invention there is provided a kind of thin-film solar cells, including encapsulating structure, the encapsulating structure is upper
The encapsulating structure stated.
According to another aspect of the present invention there is provided a kind of organic light-emitting display device, including encapsulating structure, the encapsulating structure is
Above-mentioned encapsulating structure.
Apply the technical scheme of the present invention, the invention provides a kind of encapsulating structure, due to the encapsulating structure include flexible substrate layer,
Aqueous vapor separation layer and fluoride layer, so that encapsulating material can also while can possess barrier steam performance and ageing-resistant performance
Enough possesses flexibility；Meanwhile, compared with traditional aqueous vapor separation layer and fluoride layer are arranged at the encapsulating structure of flexible substrate layer side,
Because flexible substrate layer is arranged between aqueous vapor separation layer and fluoride layer, and flexible substrate layer has larger thickness, so as to
It is enough more effectively to protect aqueous vapor separation layer, and then improve the ageing-resistant performance of encapsulating structure and effectively maintain encapsulating structure
Water vapor rejection performance；Also, when above-mentioned encapsulating structure is arranged in thin-film solar cells, it not only ensure that thin film solar
The flexibility of battery, and thin-film solar cells is avoided due to being damaged caused by steam or oxygen entrance, improve film
The reliability of solar cell, also improves the ageing-resistant performance of thin-film solar cells；Separately above-mentioned encapsulating structure is arranged on
When in organic light-emitting display device, organic light-emitting display device is not only avoid due to being damaged caused by steam or oxygen entrance,
The reliability of organic light-emitting display device is improved, and also improves the flexible application value of organic light-emitting display device.
In addition to objects, features and advantages described above, the present invention also has other objects, features and advantages.Below
By reference picture, the present invention is further detailed explanation.
Brief description of the drawings
The Figure of description for constituting the part of the present invention is used for providing a further understanding of the present invention, schematic reality of the invention
Apply example and its illustrate to be used to explain the present invention, do not constitute inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 shows a kind of cross-sectional view for encapsulating structure that embodiment of the present invention is provided；
Fig. 2 shows that the fluoride layer that embodiment of the present invention is provided directly contacts the encapsulation of setting with the surface of aqueous vapor separation layer
The cross-sectional view of structure；And
Fig. 3 shows the tack coat for including being arranged between flexible substrate layer and fluoride layer that embodiment of the present invention is provided
The cross-sectional view of the embodiment of encapsulating structure.
Embodiment
It should be noted that in the case where not conflicting, the embodiment in the present invention and the feature in embodiment can be mutually combined.
Describe the present invention in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the accompanying drawing in the embodiment of the present invention,
Technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only the present invention
The embodiment of a part, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
There is the every other embodiment made and obtained under the premise of creative work, should all belong to the scope of protection of the invention.
It should be noted that term " first ", " second " in description and claims of this specification and above-mentioned accompanying drawing etc.
It is for distinguishing similar object, without for describing specific order or precedence.It should be appreciated that the data so used
It can exchange in the appropriate case, so as to embodiments of the invention described herein.In addition, term " comprising " and " having "
And their any deformation, it is intended that covering is non-exclusive to be included, for example, contain the process of series of steps or unit,
Method, system, product or equipment are not necessarily limited to those steps clearly listed or unit, but may include not arrange clearly
It is going out or for the intrinsic other steps of these processes, method, product or equipment or unit.
From background technology, need badly in the prior art and a kind of package material for having barrier property, ageing-resistant performance and flexibility concurrently is provided
Material.The present inventor is studied there is provided a kind of encapsulating structure regarding to the issue above, as shown in Figures 1 to 3, including：
Flexible substrate layer 10, with the first surface and second surface being oppositely arranged；Aqueous vapor separation layer 40, is arranged at the flexible parent metal
On the first surface of layer 10；On fluoride layer 50, the second surface for being arranged at the flexible substrate layer 10.
The above-mentioned encapsulating structure of the present invention due to including flexible substrate layer 10, aqueous vapor separation layer 40 and fluoride layer 50 so that
Encapsulating material can also possess flexibility while can possess barrier steam performance and ageing-resistant performance；Meanwhile, with traditional water
The encapsulating structure that vapor barrier coatings are arranged at flexible substrate layer side with fluoride layer is compared, because flexible substrate layer 10 is set in the present invention
It is placed between aqueous vapor separation layer 40 and fluoride layer 50, and flexible substrate layer 10 has larger thickness, so as to more effective
Aqueous vapor separation layer 40 is protected on ground, and then is improved the ageing-resistant performance of encapsulating structure and effectively maintained the steam resistance of encapsulating structure
Separating performance.
In the encapsulating structure that the present invention is provided, it is preferable that flexible substrate layer 10 is transparent polymer layer.Wherein, transparent high score
Sublayer can be semi-crystalline thermoplastic polymer, non-crystalline polymer and noncrystalline high glass transition temperature polymers, such as PI,
PET and PEN.It is further preferable that transparent polymer layer is pet layer or PEN layer, because polyester PET or PEN are used as partly
Crystallization thermoplastic polymer has well dynamic flexibility, mechanical property and a simple process, and optical transmittance 90% with
On, therefore, selection pet layer or PEN layers can make flexible substrate layer 10 while with higher light transmittance, additionally it is possible to have
There is higher flexibility.
When above-mentioned flexible substrate layer 10 is transparent polymer layer, transparent polymer layer can be to locate in advance by discharge process, flame
The transparent polymer layer of the surface treatment such as reason and/or Chemical Pretreatment.In the situation of suitable reactive or non-reacted atmospheric environment
Electric discharge, Chemical Pretreatment or the flame pretreatment of lower progress can make transparent polymer layer have higher cohesive force.In one kind
In preferred embodiment, above-mentioned Chemical Pretreatment includes：By allocating KMnO4Mixed solution is formed with strong acid, strong acid is main
For solution such as hydrochloric acid, sulfuric acid and nitric acid, the surface with transparent polymer layer is reacted at a certain temperature so that transparent height
The surface of molecular layer forms active group, so as to improve the adhesive force on its surface.
In the encapsulating structure that the present invention is provided, the main function of aqueous vapor separation layer 40 is that steam and oxygen are obstructed, and is played
To the function of outside environmental barrier, prevent external moisture and oxygen from producing damage to photovoltaic device.Preferably, aqueous vapor separation layer 40
For inorganic oxide layer, preferably silica, titanium oxide or aluminum oxide.Selection inorganic oxide prepares the energy of aqueous vapor separation layer 40
Enough play good water vapor rejection effect.Forming the mode of inorganic oxide layer can claim to sink for evaporation, sputtering or chemical gaseous phase
Product.
In the encapsulating structure that provides of the present invention, fluoride layer 50 is as weathering layer, and effect is improve the encapsulating structure outdoor resistance to
The performance of aging.In a preferred embodiment, above-mentioned fluoride layer 50 can be contacted with the surface of flexible substrate layer 10
Set, the material for being now preferably formed as fluoride layer 50 is preferably tetrafluoroethene and/or vinylidene.And in flexible substrate layer 10
The upper mode using coating directly coats one layer of fluorochemicals coatings to form above-mentioned fluoride layer 50.Wherein, one kind prepares above-mentioned fluorine
The method of compound layer 50 includes：Fluorine resin solution and isocyanide ester class curing agent are mixed, the fluorine tree of fluororesin layer is formulated for
Fat coating fluid, and required thickness is coated with flexible substrate layer 10 using coating machine, it will be coated in flexible substrate layer 10 therewith
Coating fluid carry out high temperature drying, so as to obtain above-mentioned fluoride layer 50.
In another preferred embodiment, above-mentioned encapsulating structure can also include being arranged on fluoride layer 50 and flexible substrate layer
Tack coat 60 between 10, i.e. fluoride layer 50 are fitted setting by tack coat 60 with flexible substrate layer 10, now form fluorine
The material of compound layer 50 is preferably selected from ethylene-tetrafluoroethylene copolymer, fluorinated ethylene propylene copolymer, ethene CTFE and is total to
One or more in polymers and Kynoar, formed tack coat 60 material can for acrylic resin, polyurethane or
Epoxy resin etc..Above-mentioned fluoride films are ageing-resistant, and self-cleaning timeliness is longer than fluororesin-coated liquid.
Preferably, fluoride layer 50 is included with the method that flexible substrate layer 10 is fitted：By flashing or being vapor-deposited in flexibility
One layer of monomer or oligomer that can form the material of tack coat 60 is formed on substrate layer 10, then using electron beam device, UV
Light source or electric discharge device are monomer crosslinked to form polymer to make, so as to obtain above-mentioned tack coat 60；It will be fluorinated using lamination process
Thing film is applied on tack coat 60, and is coated with the flexible substrate layer 10 and fluoride films of tack coat 60 and is loaded into same volume
To in volume laminator, contacting two films to steel niproll system by rubber, each film being controlled using spring-loaded brake
Tension force, so that gained laminates are flat, so as to obtain above-mentioned fluoride layer 50.
In the encapsulating structure that the present invention is provided, the encapsulating structure also includes contacting setting with the first surface of flexible substrate layer 10
Preprocessing layer 20, and the preprocessing layer 20 be used for fill the depression in the surface of flexible substrate layer 10 and space, with improve
The flat smooth degree on the surface of flexible substrate layer 10, thus the flexible substrate layer 10 for not only enabling to be provided with preprocessing layer 20 and its
Its layer is more closely connected, it is to avoid because the cohesive force caused by the presence in space between layers declines, also improved
The surface smoothness of whole encapsulating structure, enables encapsulating structure to be more securely arranged in difficult for drop-off on cell matrix, it is ensured that
Encapsulation and protective effect of the encapsulating structure to cell matrix.It can be formed by coating process on the surface of flexible substrate layer 10
Preprocessing layer 20 is stated, above-mentioned preprocessing layer 20 can be acrylic resin, and now above-mentioned coating process can include：Use roller
The coating method such as painting or spraying applies the monomer or oligomer of acrylic resin, by monomer or polymer polymerizing, then using normal
Rule technology removes solvent to form above-mentioned preprocessing layer 20.
It is possible to further carry out to water after planarization process, the planarization process of preprocessing layer 20 to above-mentioned preprocessing layer 20
The deposition important of vapor barrier coatings 40, it is better to planarize, and the aqueous vapor separation layer 40 of deposition is finer and close, and defect is fewer,
Its barrier property is also better；Meanwhile, because aqueous vapor separation layer 40 is mainly inorganic material, preprocessing layer can improve the water vapor rejection
The pliability and flexible energy of layer 40.
When above-mentioned preprocessing layer 20 be acrylic resin when, acrylic resin be preferably methacrylic acid -2- hydroxy methacrylates,
Dimethacrylate -1,6-HD ester, ethylene glycol diacrylate, diacrylate triethyleneglycol ester, diacrylate tripropylene glycol ester,
Diacrylate is to DOPCP, trimethylolpropane trimethacrylate, trihydroxy methyl pentane trimethacrylate vinegar, three hydroxyl first
One kind or their compositions in the propylene vinegar of base propane pentaerythrite three, can further be improved using above-mentioned preferred material
The flexibility and barrier of encapsulating structure.
In the encapsulating structure that the present invention is provided, it is preferable that the thickness of above-mentioned preprocessing layer 20 is nanoscale, more preferably
75~90nm.Fluctuating and void size due to the surface of flexible substrate layer 10 is smaller, usually nanoscale, therefore, by pre-treatment
The thickness of layer 20 is limited in micron-sized scope, ensure that above-mentioned preprocessing layer 20 has less thickness, so that not only
Being capable of the effectively fluctuating on the surface of filling flexible substrate layer 10 and space, and preprocessing layer 20 can be improved to flexible substrate layer
10 adhesiveness, also reduces the integral thickness of encapsulating material.
In the encapsulating structure that the present invention is provided, preprocessing layer 20 can directly contact setting, encapsulation knot with aqueous vapor separation layer 40
Structure also includes the hardening coat 30 being arranged between flexible substrate layer 10 and aqueous vapor separation layer 40.The effect of above-mentioned hardening coat 30
In addition to making the surface planarisation of flexible substrate layer 10 except with above-mentioned preprocessing layer 20, moreover it is possible to ensure to improve the resistance to height of encapsulating structure
Warm nature energy, strengthens the case hardness and mechanical strength of encapsulating structure.Polyurethane can be selected from by forming the material of above-mentioned hardening coat 30
One or more in coating, inorganic nano ceramic coating and radiation curable coating.Can direct coating inorganic ceramic coating
Or radiation curable coating and carry out be cured to form above-mentioned hardening coat 30, the monomer solution of polyurethane coating can also be coated, so
Afterwards by being crosslinked exposed to visible ray, ultraviolet and/or electron beam irradiation, finally solidified with the shape in preprocessing layer 20
Into hardening coat 30, painting method is can be roller coat (such as intaglio plate roller coat), spraying, curtain, die coating.
In the encapsulating structure that the present invention is provided, the encapsulating structure can also include being covered in the remote of the aqueous vapor separation layer 40
Protective layer 70 on one side surface of the flexible substrate layer 10, above-mentioned protective layer 70 can play support and protection water vapor rejection
The effect of layer 40.Protective layer 70 is acrylic resin, it is preferable that the material for forming protective layer 70 is methacrylic acid -2-
Hydroxy methacrylate, propylene phthalein amine, diacrylate triethyleneglycol ester, diacrylate tripropylene glycol ester, diacrylate to DOPCP,
Trimethylolpropane trimethacrylate, trihydroxy methyl pentane trimethyl acrylic ester, the acrylic acid of trimethylolpropane pentaerythrite three
One kind or their compositions in ester；The step of now forming above-mentioned protective layer 70 can include：Using conventional painting method
Such as roller coat (such as intaglio plate roller coat), spraying (such as electrostatic spraying), curtain, die coating, in aqueous vapor separation layer 40
Surface coat the solution of at least one acrylic resin monomer, then by exposed to visible ray, ultraviolet and/or electron beam
Radiation is crosslinked to form protective layer 70.
In the encapsulating structure that the present invention is provided, the thickness of each layer can be selected according to the actual requirements, when above-mentioned flexible parent metal
When the thickness of layer 10 is 25~100 μm, the thickness of fluoride layer 50 is preferably 50 μm, and the thickness of aqueous vapor separation layer 40 is preferred
For 9~90nm, the thickness of preprocessing layer 20 is preferably 75~90nm, and the thickness of hardening coat 30 is preferably 3~5 μm, is bonded
The thickness of layer 60 is preferably 30~70 μm, and the thickness of protective layer 70 is preferably 10 μm.Above-mentioned thickness can make each layer in not shadow
While ringing the flexibility of encapsulating structure, additionally it is possible to effectively play respective effect.
In a preferred embodiment, encapsulating structure is by the protective layer 70, aqueous vapor separation layer 40, hardening coat that are sequentially laminated
30th, preprocessing layer 20, flexible substrate layer 10 and fluoride layer 50 are constituted, and its structure is as shown in Figure 2；Another preferred
In embodiment, encapsulating structure by the protective layer 70 being sequentially laminated, aqueous vapor separation layer 40, hardening coat 30, preprocessing layer 20,
Flexible substrate layer 10, tack coat 60 and fluoride layer 50 are constituted, and its structure is as shown in Figure 3.Above-mentioned flexible substrate layer 10 makes envelope
Assembling structure has flexibility, and preprocessing layer 20 makes the surfacing of flexible substrate layer 10 smooth, and hardening coat 30 makes encapsulating structure
With higher resistance to elevated temperatures, case hardness and mechanical strength, aqueous vapor separation layer 40 is used to obstruct vapor and oxygen, above-mentioned
The fluoride layer 50 of aqueous vapor separation layer 40 makes encapsulating structure have outdoor ageing-resistant performance, so that the film with said structure is too
Positive energy battery has higher flexibility and reliability.
Include the thin-film solar cells of above-mentioned encapsulating structure there is provided a kind of according to another aspect of the present invention.Due to above-mentioned envelope
Assembling structure includes flexible substrate layer and aqueous vapor separation layer, so that encapsulating material can also while can possess barrier steam performance
Enough possess flexibility, and then not only avoid thin-film solar cells due to being damaged caused by steam or oxygen entrance, improve
The reliability of thin-film solar cells, and also ensure that the flexibility of thin-film solar cells；Simultaneously as the encapsulating structure
Also include the fluoride layer for being arranged at a side surface of flexible substrate layer, above-mentioned fluoride layer can improve the open air of the encapsulating structure
Ageing-resistant performance, so that encapsulating structure more can be securely arranged on cell matrix, and then improves thin film solar
The ageing-resistant performance of battery.In addition, above-mentioned thin-film solar cells is adapted to arch, the wall of parabolic shape
Object, it is possible thereby to be arranged at the sound-proof wall of dome-shaped building, highway etc..
Include the organic light-emitting display device of above-mentioned encapsulating structure there is provided a kind of in accordance with a further aspect of the present invention.Due to above-mentioned
Encapsulating structure includes flexible substrate layer and aqueous vapor separation layer, so that encapsulating material is gone back while can possess barrier steam performance
Can possess flexibility, and then not only avoid organic light-emitting display device due to being damaged caused by steam or oxygen entrance, carry
The high reliability of organic light-emitting display device, and also ensure that the flexibility of organic light-emitting display device；Simultaneously as should
Encapsulating structure also includes the fluoride layer for being arranged at a side surface of flexible substrate layer, and above-mentioned fluoride layer can improve the encapsulation knot
The outdoor ageing-resistant performance of structure, so that encapsulating structure more can be securely arranged on cell matrix, and then has been improved
The ageing-resistant performance of machine luminous display unit.In addition, above-mentioned organic light-emitting display device is adapted to arch, parabolic
The object of the wall of wire, it is possible thereby to be arranged at the sound-proof wall of dome-shaped building, highway etc..
The encapsulating structure that the application is provided is further illustrated below in conjunction with embodiment and comparative example.
Embodiment 1
The encapsulating structure that the present embodiment is provided is as shown in figure 1, aqueous vapor separation layer, the thickness that the thickness including order stacking is 50nm
Flexible substrate layer and thickness for 50 μm are 50 μm of fluoride layer；Wherein, aqueous vapor separation layer is silicon oxide layer, flexible base
Material layer is pet layer, and the material for forming fluoride layer is tetrafluoroethene.
Embodiment 2
Aqueous vapor separation layer that the thickness that the encapsulating structure that the present embodiment is provided includes order stacking is 50nm, thickness are 4 μm hard
Change coating, the preprocessing layer that thickness is 80nm, the flexible substrate layer that thickness is 50 μm and fluoride layer that thickness is 50 μm；
Wherein, aqueous vapor separation layer is silicon oxide layer, and hardening coat is inorganic nano ceramic coating, and preprocessing layer is diacrylate ethylene glycol
Ester layer, flexible substrate layer is pet layer, and the material for forming fluoride layer is tetrafluoroethene.
Embodiment 3
Aqueous vapor separation layer that the thickness that the encapsulating structure that the present embodiment is provided includes order stacking is 50nm, thickness are 4 μm hard
Change coating, the preprocessing layer that thickness is 80nm, the flexible substrate layer that thickness is 50 μm, the tack coat that thickness is 50 μm and
Thickness is 50 μm of fluoride layer；Wherein, aqueous vapor separation layer is silicon oxide layer, and hardening coat is inorganic nano ceramic coating,
Preprocessing layer is ethylene glycol diacrylate layer, and flexible substrate layer is pet layer, and the material for forming tack coat is polyurethane, fluorination
Nitride layer is ethylene-tetrafluoroethylene copolymer film.
Embodiment 4
The present embodiment provide encapsulating structure as shown in Fig. 2 including order stacking thickness be 10 μm protective layer, thickness be
50nm aqueous vapor separation layer, thickness be 4 μm hardening coat, thickness be 80nm preprocessing layer, thickness be 50 μm
Flexible substrate layer and the fluoride layer that thickness is 50 μm；Wherein, the material for forming protective layer is propylene phthalein amine monomers and two propylene
Sour triethyleneglycol ester monomer, aqueous vapor separation layer is silicon oxide layer, and hardening coat is inorganic nano ceramic coating, and preprocessing layer is dipropyl
Olefin(e) acid ethylene glycol ester layer, flexible substrate layer is pet layer, and the material for forming fluoride layer is tetrafluoroethene.
Comparative example 1
This comparative example provide encapsulating structure include order stacking thickness be 50 μm flexible substrate layer, thickness be 50nm's
Aqueous vapor separation layer and the fluoride layer that thickness is 50 μm；Wherein, flexible substrate layer is pet layer, and aqueous vapor separation layer is silica
Layer, the material for forming fluoride layer is tetrafluoroethene.
Comparative example 2
This comparative example provide encapsulating structure include order stacking thickness be 50 μm flexible substrate layer, thickness be 80nm's
Preprocessing layer, thickness are 4 μm of hardening coat, the aqueous vapor separation layer that thickness is 50nm and fluoride layer that thickness is 50 μm；
Wherein, flexible substrate layer is pet layer, and preprocessing layer is ethylene glycol diacrylate layer, and hardening coat is that inorganic nano ceramics are applied
Material, aqueous vapor separation layer is silicon oxide layer, and the material for forming fluoride layer is tetrafluoroethene.
The water vapor transmittance of encapsulating structure in embodiment 1 to 4 and comparative example 1,2 is tested, its method of testing is Mocon
Method, test condition：37.8 DEG C of temperature, relative humidity 100%, test result is as shown in the table：
The moisture permeability that can be seen that encapsulating structure in embodiment 1 from above-mentioned test result is less than encapsulating structure in comparative example 1
Water vapor transmittance, and the moisture permeability of encapsulating structure is below the steam of encapsulating structure in comparative example 2 in embodiment 2 to 4
Transmitance, it is seen that in encapsulating structure, the both sides that middle fluoride layer and aqueous vapor separation layer are respectively arranged at into flexible substrate layer can
Improve the water vapor barrier property of encapsulating structure；Also, the moisture permeability of encapsulating structure is less than in embodiment 3 and encapsulated in embodiment 4
The water vapor transmittance of structure, it is seen then that set protective layer further to improve the water vapor barrier property of encapsulating structure in encapsulating structure.
As can be seen from the above description, the above embodiments of the present invention realize following technique effect：
1st, the encapsulating structure includes flexible substrate layer, aqueous vapor separation layer and fluoride layer, so that encapsulating material can possess resistance
Can also possess flexibility while water proof vapour performance and ageing-resistant performance；
2nd, compared with traditional aqueous vapor separation layer and fluoride layer are arranged at the encapsulating structure of flexible substrate layer side, due to flexible base
Material layer is arranged between aqueous vapor separation layer and fluoride layer, and flexible substrate layer has larger thickness, so as to more effectively
Aqueous vapor separation layer is protected, and then improves the ageing-resistant performance of encapsulating structure and effectively maintains the water vapor barrier property of encapsulating structure
Energy；
3rd, the encapsulating structure also include preprocessing layer, above-mentioned preprocessing layer can filling flexible substrate layer depression in the surface and space,
Make the surfacing of flexible substrate layer smooth, so as to improve the surface smoothness of whole encapsulating structure；
4th, the encapsulating structure also includes hardening coat, and above-mentioned hardening coat can not only make outside flexible substrate layer surface planarisation, also
The resistance to elevated temperatures for improving encapsulating structure is can ensure that, strengthens the case hardness and mechanical strength of encapsulating structure；
When the 5th, by above-mentioned encapsulating structure formation thin-film solar cells, thin-film solar cells is not only avoid due to steam or oxygen
Damaged caused by, improve the reliability of thin-film solar cells, and ensure that the flexibility of thin-film solar cells,
Also improve the ageing-resistant performance of thin-film solar cells；
6th, above-mentioned thin-film solar cells is adapted to the object of the wall with arch, parabolic shape, it is possible thereby to be arranged at
Dome-shaped building, sound-proof wall of highway etc.；
When the 7th, by above-mentioned encapsulating structure formation organic light-emitting display device, not only avoid organic light-emitting display device due to steam or
Oxygen is damaged caused by entering, and improves the reliability of organic light-emitting display device, and also improves organic light emitting display dress
The flexible application value put.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for those skilled in the art
For, the present invention can have various modifications and variations.Any modification within the spirit and principles of the invention, being made, etc.
With replacement, improvement etc., it should be included in the scope of the protection.
Claims (12)
1. a kind of encapsulating structure, it is characterised in that including：
Flexible substrate layer (10), with the first surface and second surface being oppositely arranged；
On aqueous vapor separation layer (40), the first surface for being arranged at the flexible substrate layer (10)；
On fluoride layer (50), the second surface for being arranged at the flexible substrate layer (10).
2. encapsulating structure according to claim 1, it is characterised in that the flexible substrate layer (10) is transparent polymer layer,
Preferably pet layer or PEN layer.
3. encapsulating structure according to claim 2, it is characterised in that the transparent polymer layer for surface by discharge process,
Flame pretreatment and/or the transparent polymer layer of Chemical Pretreatment.
4. encapsulating structure according to claim 1, it is characterised in that
The fluoride layer (50) directly contacts setting with the surface of flexible substrate layer (10), is preferably formed as the fluorination
The material of nitride layer (50) is tetrafluoroethene and/or vinylidene；Or
The encapsulating structure also includes being arranged on gluing between the fluoride layer (50) and the flexible substrate layer (10)
Layer (60) is tied, the material for being preferably formed as the fluoride layer (50) is selected from ethylene-tetrafluoroethylene copolymer, ethylene fluoride third
One or more in alkene copolymer, ethene chlorotrifluoroethylene and Kynoar.
5. encapsulating structure according to claim 1, it is characterised in that the aqueous vapor separation layer (40) is inorganic oxide layer,
Preferably silica, titanium oxide or aluminum oxide.
6. encapsulating structure according to claim 1, it is characterised in that the encapsulating structure also includes connecing with the first surface
The preprocessing layer (20) set is touched, and the preprocessing layer (20) is used to fill the flexible substrate layer (10) surface
Depression and space.
7. encapsulating structure according to claim 6, it is characterised in that the preprocessing layer (20) is acrylic resin.
8. encapsulating structure according to claim 1, it is characterised in that the encapsulating structure also includes being arranged at the flexible base
Hardening coat (30) between material layer (10) and the aqueous vapor separation layer (40).
9. encapsulating structure according to claim 8, it is characterised in that form the material of the hardening coat (30) selected from poly-
One or more in urethane coating, inorganic nano ceramic coating and radiation curable coating.
10. encapsulating structure according to claim 1, it is characterised in that the encapsulating structure also includes being covered in the steam resistance
Protective layer (70) on one side surface of the remote flexible substrate layer (10) of interlayer (40), preferably described protective layer
(70) it is acrylic resin.
11. a kind of thin-film solar cells, including encapsulating structure, it is characterised in that the encapsulating structure is in claim 1 to 10
Encapsulating structure described in any one.
12. a kind of organic light-emitting display device, including encapsulating structure, it is characterised in that the encapsulating structure is claim 1 to 10
Any one of encapsulating structure.
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