JP2017120781A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017120781A5 JP2017120781A5 JP2016251556A JP2016251556A JP2017120781A5 JP 2017120781 A5 JP2017120781 A5 JP 2017120781A5 JP 2016251556 A JP2016251556 A JP 2016251556A JP 2016251556 A JP2016251556 A JP 2016251556A JP 2017120781 A5 JP2017120781 A5 JP 2017120781A5
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical electrode
- processing apparatus
- plasma processing
- rotary table
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001939 inductive effect Effects 0.000 claims description 14
- 210000002381 Plasma Anatomy 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000003078 antioxidant Effects 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 230000002401 inhibitory effect Effects 0.000 claims 1
- 238000005121 nitriding Methods 0.000 claims 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105143327A TWI604758B (zh) | 2015-12-28 | 2016-12-27 | Plasma processing device |
CN201611242158.5A CN107012436B (zh) | 2015-12-28 | 2016-12-28 | 等离子体处理装置 |
KR1020160181293A KR102322816B1 (ko) | 2015-12-28 | 2016-12-28 | 플라즈마 처리 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015257353 | 2015-12-28 | ||
JP2015257353 | 2015-12-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017120781A JP2017120781A (ja) | 2017-07-06 |
JP2017120781A5 true JP2017120781A5 (es) | 2019-08-15 |
JP6800009B2 JP6800009B2 (ja) | 2020-12-16 |
Family
ID=59272139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016251556A Active JP6800009B2 (ja) | 2015-12-28 | 2016-12-26 | プラズマ処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6800009B2 (es) |
KR (1) | KR102322816B1 (es) |
CN (1) | CN107012436B (es) |
TW (1) | TWI604758B (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7111380B2 (ja) | 2020-04-01 | 2022-08-02 | 株式会社シンクロン | スパッタ装置及びこれを用いた成膜方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7000083B2 (ja) * | 2017-09-07 | 2022-01-19 | 芝浦メカトロニクス株式会社 | 成膜装置 |
JP7144219B2 (ja) * | 2018-03-22 | 2022-09-29 | 芝浦メカトロニクス株式会社 | 真空処理装置及びトレイ |
JP7141989B2 (ja) * | 2018-09-28 | 2022-09-26 | 芝浦メカトロニクス株式会社 | 成膜装置 |
CN109603450A (zh) * | 2019-02-20 | 2019-04-12 | 北京卓昱科技有限公司 | 一种智能电子烟气净化系统 |
WO2020246449A1 (ja) * | 2019-06-06 | 2020-12-10 | 芝浦メカトロニクス株式会社 | 成膜装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0663107B2 (ja) * | 1984-11-14 | 1994-08-17 | 東京エレクトロン山梨株式会社 | 平行平板型ドライエツチング装置 |
JP3371176B2 (ja) * | 1995-01-25 | 2003-01-27 | ソニー株式会社 | プラズマ処理装置および半導体装置の製造方法 |
US5716505A (en) * | 1996-02-23 | 1998-02-10 | Balzers Prozess-Systems Gmbh | Apparatus for coating substrates by cathode sputtering with a hollow target |
JP4212210B2 (ja) * | 1999-12-07 | 2009-01-21 | 株式会社小松製作所 | 表面処理装置 |
JP4428873B2 (ja) * | 2001-02-28 | 2010-03-10 | 芝浦メカトロニクス株式会社 | スパッタリング装置 |
US20090266703A1 (en) * | 2005-08-02 | 2009-10-29 | Nan Jiang | Plasma generating device and film deposition method in which the plasma generating device is used |
JP4854235B2 (ja) * | 2005-08-22 | 2012-01-18 | 芝浦メカトロニクス株式会社 | プラズマ処理装置 |
KR101247198B1 (ko) * | 2005-09-09 | 2013-03-25 | 가부시키가이샤 알박 | 이온원 및 플라스마 처리장치 |
US8066857B2 (en) * | 2008-12-12 | 2011-11-29 | Fujifilm Corporation | Shaped anode and anode-shield connection for vacuum physical vapor deposition |
JP5350043B2 (ja) * | 2009-03-31 | 2013-11-27 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
-
2016
- 2016-12-26 JP JP2016251556A patent/JP6800009B2/ja active Active
- 2016-12-27 TW TW105143327A patent/TWI604758B/zh active
- 2016-12-28 CN CN201611242158.5A patent/CN107012436B/zh active Active
- 2016-12-28 KR KR1020160181293A patent/KR102322816B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7111380B2 (ja) | 2020-04-01 | 2022-08-02 | 株式会社シンクロン | スパッタ装置及びこれを用いた成膜方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2017120781A5 (es) | ||
CN106356274B (zh) | 通过等离子体操作调节极端边缘鞘和晶片轮廓 | |
US9117630B2 (en) | Insulation structure of high voltage electrodes for ion implantation apparatus | |
JP5745519B2 (ja) | 高周波(rf)接地帰還構成 | |
JP2013045903A5 (es) | ||
US11373843B2 (en) | Capacitively coupled plasma etching apparatus | |
JP2020523785A5 (es) | ||
JP6800009B2 (ja) | プラズマ処理装置 | |
JP2011054781A (ja) | プラズマ処理装置 | |
JP6698502B2 (ja) | 載置台及びプラズマ処理装置 | |
JP2017172019A (ja) | プラズマ処理装置 | |
JP2017028111A5 (es) | ||
US20170301514A1 (en) | Plasma source and substrate treating apparatus including the same | |
TWI581328B (zh) | Inductively Coupled Plasma Paste Processing Device and Plasma Etch Etching Method | |
WO2019004183A1 (ja) | プラズマ処理装置 | |
TW201543610A (zh) | 靜電夾頭、載置台、電漿處理裝置、以及靜電夾頭之製造方法 | |
TWI421975B (zh) | 電漿處理裝置用基板載置台、電漿處理裝置及絕緣皮膜之成膜方法 | |
TW201324607A (zh) | 清潔晶片背面聚合物的裝置和方法 | |
JP2020096136A5 (es) | ||
JP6222624B2 (ja) | プラズマcvd装置 | |
JP5822133B2 (ja) | 誘導結合形プラズマ処理装置のマスク部材 | |
JP2009177190A5 (es) | ||
JP2009228032A (ja) | プラズマ処理方法及びプラズマ処理装置 | |
JP2020035556A (ja) | プラズマ処理装置 | |
JP2023127762A (ja) | プラズマ処理装置 |